CN217933834U

CN217933834U - LED light source packaging device and lighting device

Info

Publication number: CN217933834U
Application number: CN202220837329.3U
Authority: CN
Inventors: 黄志刚; 马亚辉
Original assignee: YLX Inc
Current assignee: YLX Inc
Priority date: 2022-04-08
Filing date: 2022-04-08
Publication date: 2022-11-29
Anticipated expiration: 2032-04-08

Abstract

The application discloses an LED light source packaging device. The LED light source packaging device comprises: an LED chip; the fluorescent layer is arranged on the light emitting side of the LED chip and used for carrying out wavelength conversion on light emitted by the LED chip; the glass sheet is arranged on one side of the fluorescent layer, which is far away from the LED chip, and is used for transmitting light after wavelength conversion; and the packaging layer is arranged on the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet and is used for packaging the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet. The invention also discloses a lighting device. By the above mode, the problem of low light emitting efficiency of the integrally formed fluorescent powder sheet or the fluorescent ceramic sheet can be improved, and the light emitting efficiency is improved.

Description

LED light source packaging device and lighting device

Technical Field

The application relates to the field of LED light source packaging devices, in particular to an LED light source packaging device and a lighting device.

Background

The traditional high-power LED light source packaging device eliminates stray light mainly through an integrally formed fluorescent powder sheet or a fluorescent ceramic sheet, but the integrally formed fluorescent powder sheet or the fluorescent ceramic sheet has the problems of low light emitting efficiency and complex cutting and forming process, and particularly the fluorescent ceramic sheet cannot be applied to high-display products.

Disclosure of Invention

The application provides a LED light source encapsulation device and lighting device can improve the light-emitting light efficiency.

In order to solve the technical problem, the technical scheme adopted by the application is as follows: an LED light source package device comprising: an LED chip; the fluorescent layer is arranged on the light emitting side of the LED chip and used for carrying out wavelength conversion on light emitted by the LED chip; the glass sheet is arranged on one side of the fluorescent layer, which is far away from the LED chip, and is used for transmitting light after wavelength conversion; and the packaging layer is arranged on the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet and is used for packaging the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet.

Wherein, LED light source packaging device still includes: the substrate is arranged on one side of the LED chip, which is far away from the fluorescent layer, and the substrate is arranged on one side of the packaging layer and used for supporting the LED chip, the fluorescent layer, the glass sheet and the packaging layer.

Wherein, the LED chip is perpendicular chip, and LED light source packaging device still includes: and the wires are electrically connected with the LED chip and the substrate.

Wherein the encapsulation layer further encapsulates the wires.

The projection of the glass sheet on the substrate is connected with the projection of the packaging layer on the substrate and is not overlapped.

And the packaging layer is flush with the glass sheet on the plane of one side of the glass sheet, which is far away from the fluorescent layer.

Wherein, the packaging layer is a white glue packaging layer.

The glass sheet is a coated glass sheet or an uncoated glass sheet, wherein the coating layer of the coated glass sheet is an AR film.

Wherein the fluorescent layer is a fluorescent glue layer; the substrate is a ceramic substrate or a PCB substrate.

In order to solve the technical problem, the technical scheme adopted by the application is as follows: a lighting device comprises the LED light source packaging device.

The beneficial effects of the embodiment of the application are that: through fixing the glass sheet on the fluorescent layer, then utilize the encapsulated layer to carry out the encapsulated mode to LED chip, fluorescent layer and glass sheet's side all around, replace the mode of integrated into one piece phosphor powder piece or fluorescent ceramic piece, can improve the shortcoming that the light-emitting light efficiency of integrated into one piece phosphor powder piece or fluorescent ceramic piece is low, improve the light-emitting light efficiency.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an LED light source package device according to the present application;

fig. 2 is a schematic structural diagram of another embodiment of an LED light source package device according to the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover an exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The present application provides an LED light source package device, as shown in fig. 1, fig. 1 is a schematic structural diagram of an embodiment of the LED light source package device of the present application, and the LED light source package device 10 of the present embodiment includes: LED chip 11, fluorescent layer 12, glass sheet 13 and encapsulation layer 14. Specifically, the fluorescent layer 12 is disposed on the light emitting side of the LED chip 11 and is used for performing wavelength conversion on light emitted by the LED chip; a glass sheet 13 disposed on a side of the fluorescent layer 12 away from the LED chip for transmitting the wavelength-converted light; and the packaging layer 14 is arranged on the peripheral side surfaces of the LED chip 11, the fluorescent layer 12 and the glass sheet 13 and is used for packaging the peripheral side surfaces of the LED chip 11, the fluorescent layer 12 and the glass sheet 13.

In the embodiment, the glass sheet is fixed on the fluorescent layer, and then the packaging layer is utilized to package the side surfaces around the LED chip, the fluorescent layer and the glass sheet, so that the mode of integrally forming the fluorescent powder sheet or the fluorescent ceramic sheet is replaced, the defect of low light emitting efficiency of the integrally formed fluorescent powder sheet or the fluorescent ceramic sheet can be improved, and the light emitting efficiency is improved.

The light emitted from the LED chip 11 passes through the fluorescent layer 12, and the fluorescent layer 12 has a special phosphor component, so that the light passing through the fluorescent layer 12 can be emitted as light with a corresponding wavelength, that is, light with a corresponding color.

Optionally, the fluorescent layer 12 of this embodiment may be a fluorescent glue layer, and the fluorescent glue layer not only can implement wavelength conversion of light, but also can be pasted with the LED chip 11 and the glass sheet 13 on both sides thereof, so as to improve stability between the fluorescent layer and the LED chip 11 and the glass sheet 13. The fluorescent adhesive layer can be made of a mixture of fluorescent powder and glue, and the specific process flow is not described herein.

Optionally, the glass sheet 13 may also be fixed on a side of the fluorescent layer 12 away from the LED chip by means of dispensing or mechanical fixing, where the LED chip 11, the fluorescent layer 12, and the glass sheet 13 are located in the same vertical direction, that is, stacked in the vertical direction; and the fluorescent layer 12 is located between the glass sheet 13 and the LED chip 11, and both the fluorescent layer 12 and the glass sheet 13 are located on the light-emitting side of the LED chip 11.

Alternatively, the LED chip 11 in this embodiment may be a vertical chip. The vertical chip can effectively improve the heat dissipation rate of the chip, and meanwhile, two electrodes of the vertical chip are respectively arranged on two sides of the LED epitaxial layer, so that the arrangement of a packaging structure is facilitated.

Optionally, the encapsulation layer 14 is flush with the glass sheet 13 in the plane of the side of the glass sheet 13 facing away from the fluorescent layer 12. The glass sheet 13 is a main optical element of the LED light source, and the height of the encapsulation layer is equal to the height of the glass sheet 13 during encapsulation, so that the loss caused by collision of the glass sheet 13 can be effectively reduced.

Optionally, the glass sheet 13 of this embodiment may be a coated glass sheet, or may be an uncoated glass sheet. Aiming at the requirements of different use scenes on the brightness, the corresponding glass sheet can be selected when the LED is packaged, so that the waste of resources is reduced, and the cost is reduced.

The coated glass sheet can be coated on two sides or one side, and the coating layer is an AR film. The glass sheet using the AR film can effectively reduce the reflectivity of the glass sheet, so that the light extraction rate of the glass sheet is improved.

Optionally, the encapsulating layer 14 of this embodiment is a white glue encapsulating layer, the material adopted by the encapsulating layer is white glue, after the LED chip 11, the fluorescent layer 12 and the glass sheet 13 are fixed in the above manner, the white glue is uniformly applied to the peripheral side surfaces of the LED chip 11, the fluorescent layer 12 and the glass sheet 13, the height of the white glue is equal to that of the glass sheet 13, then the white glue is baked and molded by baking, the side walls of the molded encapsulating layer 14 are perpendicular to the light emitting side of the LED chip 11, and the upper surface of the encapsulating layer 14 and the side surface of the glass sheet 13 departing from the fluorescent layer 12 are in the same plane.

In this embodiment, through the above mode, encapsulate LED light source device, can effectual protection main optical components and parts, through fixed glass piece on the fluorescent layer simultaneously, then utilize the encapsulated layer to carry out the encapsulated mode to LED chip, fluorescent layer and glass piece's side all around, replace the mode of integrated into one piece phosphor powder piece or fluorescent ceramic piece, can improve the shortcoming that the light-emitting light efficiency of integrated into one piece phosphor powder piece or fluorescent ceramic piece is low, improve light-emitting light efficiency.

The present application further proposes another embodiment of an LED light source package device 10, as shown in fig. 2, fig. 2 is a schematic structural diagram of the LED light source package device 10 according to an embodiment of the present application. The LED light source package device of the present embodiment further includes, on the basis of the above embodiments: a substrate 15. The substrate 15 is disposed on a side of the LED chip 11 away from the fluorescent layer 12 and a side of the encapsulation layer 14, and is used for supporting the LED chip 11, the fluorescent layer 12, the glass sheet 13 and the encapsulation layer 14.

When the LED packaging structure is installed, the LED chip 11 is fixed on one side of the substrate 15 in an eutectic or tin paste or silver paste mode, then the fluorescent layer 12 and the glass sheet 13 are installed in the mode, then the white glue is uniformly dispensed on the peripheral side faces of the LED chip 11, the fluorescent layer 12 and the glass sheet 13, the height of the white glue is equal to that of the glass sheet 13, then the white glue is baked and formed through baking, the side wall of the formed packaging layer 14 is perpendicular to the light emitting side of the LED chip 11, the bottom face of the packaging layer 14, namely the face deviating from the upper surface of the packaging layer, is attached to the side, where the LED chip 11 is fixed, of the substrate 15, and the side wall of the packaging layer 14 and the side wall of the substrate 15 are in the same vertical plane.

Optionally, the projection of the glass sheet 13 on the substrate 15 is connected with and does not overlap the projection of the encapsulation layer 14 on the substrate 15, that is, it is ensured that the white glue is connected with the glass sheet when the white glue is used for dispensing, and it is ensured that the white glue cannot cover the surface of the glass sheet 13 facing away from the fluorescent layer 12. The glass sheet 13 is a main light-transmitting device, the white glue layer covers the side surface of the glass sheet, and the covering height of the white glue layer is equal to that of the side surface of the glass sheet, so that the glass sheet has a protection effect, and moreover, one side of the glass sheet 13, which is far away from the fluorescent layer 12, cannot be covered by the white glue, so that the light-emitting rate of the glass sheet is prevented from being influenced.

Optionally, the substrate 15 is a ceramic substrate or a PCB substrate. Both substrates are commonly used substrates at present and are not described herein.

Optionally, the LED light source package device of this embodiment further includes: and a wire 16. The wires 16 are electrically connected to the LED chip 11 and the substrate 15. The conductive wires 16 of the present embodiment may be gold wires.

Specifically, the lead 16 is LED out from the LED chip 11, the position where the lead 16 is LED out is on the side of the LED chip 11 away from the substrate 15, and the area where the lead 16 is LED out is far away from the projection area of the glass sheet 13 on the LED chip 11, wherein the lead 16 is electrically connected with the side of the substrate 15 close to the LED chip 11.

Wherein the encapsulation layer 14 further encapsulates the wires 16. When the LED chip is installed, the LED chip 11, the fluorescent layer 12 and the glass sheet 13 are installed according to the method, then the conducting wires 16 are connected according to the method, finally, white glue is uniformly dispensed on the peripheral side faces of the LED chip 11, the fluorescent layer 12 and the glass sheet 13, the conducting wires 16 are wrapped in the white glue, and then the white glue is baked and molded.

In the embodiment, the lead 16 is wrapped in the encapsulation layer 14, so that the lead 16 can be prevented from appearing in the light path region, and stray light generated by the lead from the light source can be effectively eliminated.

The present application further provides a lighting device, where the lighting device of this embodiment includes the LED light source package device disclosed in the above embodiments, and details are not repeated herein. The lighting device may be a flashlight, a car light (e.g., a general lighting, a car light, a flashlight, a stage light, etc.), or a beam light.

Be different from prior art, this application LED light source packaging device is through fixing the glass piece on the fluorescent layer, then utilizes the encapsulated layer to carry out the encapsulated mode to LED chip, fluorescent layer and glass piece's side all around, replaces the mode of integrated into one piece phosphor powder piece or fluorescent ceramic piece, can improve the shortcoming that the light-emitting light efficiency of integrated into one piece phosphor powder piece or fluorescent ceramic piece is low, improves light-emitting light efficiency.

Further, the LED light source packaging device wraps the conducting wires in the packaging layer, and stray light generated by the light source due to the conducting wires can be effectively eliminated.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. An LED light source package device, comprising:

an LED chip;

the fluorescent layer is arranged on the light emitting side of the LED chip and used for carrying out wavelength conversion on light emitted by the LED chip;

the glass sheet is arranged on one side, away from the LED chip, of the fluorescent layer and is used for transmitting light after wavelength conversion;

and the packaging layer is arranged on the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet and is used for packaging the peripheral side surfaces of the LED chip, the fluorescent layer and the glass sheet.

2. The LED light source package device of claim 1, further comprising:

the substrate is arranged on one side, away from the fluorescent layer, of the LED chip, and the substrate is arranged on one side of the packaging layer and used for supporting the LED chip, the fluorescent layer, the glass sheet and the packaging layer.

3. The LED light source package device of claim 2, wherein the LED chip is a vertical chip, the LED light source package device further comprising: and the lead is electrically connected with the LED chip and the substrate.

4. The LED light source package device of claim 3, wherein said encapsulation layer further encapsulates said wires.

5. The LED light source package device of claim 2, wherein a projection of the glass sheet on the substrate meets and does not overlap a projection of the encapsulation layer on the substrate.

6. The LED light source package device of claim 1, wherein the encapsulation layer is flush with the glass sheet in a plane of a side of the glass sheet facing away from the phosphor layer.

7. The LED light source package device of any of claims 1-6, wherein the encapsulant layer is a white glue encapsulant layer.

8. The LED light source package device of any of claims 1-6, wherein the glass sheet is a coated glass sheet or an uncoated glass sheet, and wherein the coating of the coated glass sheet is an AR film.

9. The LED light source package device of any of claims 1-6, wherein the phosphor layer is a phosphor glue layer;

the LED light source packaging device further comprises:

the substrate is a ceramic substrate or a PCB substrate.

10. A lighting device comprising the LED light source package device of any one of claims 1 to 9.