CN217768376U - Chip-level packaged LED light source device - Google Patents
Chip-level packaged LED light source device Download PDFInfo
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- CN217768376U CN217768376U CN202222081377.7U CN202222081377U CN217768376U CN 217768376 U CN217768376 U CN 217768376U CN 202222081377 U CN202222081377 U CN 202222081377U CN 217768376 U CN217768376 U CN 217768376U
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Abstract
The application discloses chip level encapsulation LED light source device relates to the illumination field, includes: an LED support; the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip; the conducting wires are used for electrically connecting the normally installed LED chips and the LED bracket; and the fluorescent colloid is arranged on the surface of the normally-installed LED chip. The LED light source device is a chip in a normal installation mode, light is directly emitted upwards, and the light parameter efficiency and the brightness of the LED light source device can be improved; the surface of the normally-installed LED chip is coated with the fluorescent colloid, so that sputtering waste and multiple spraying caused by spraying of fluorescent powder can be avoided, the manufacturing cost is reduced, and the consistency of light is improved; fluorescent colloid can be avoided between the adjacent upright LED chips, so that the manufacturing cost is reduced; this application realizes just installing the chip level encapsulation of LED chip.
Description
Technical Field
The application relates to the technical field of lighting, in particular to a chip-scale packaging LED light source device.
Background
Light-Emitting Diode (LED) Light source devices are widely used in the fields of backlights, color screens, indoor lighting, and the like.
At present, an LED chip in an LED light source device has two packaging forms, one is a front-mounted package, and the other is a flip-chip package. When the LED chip adopts a flip-chip mode, emitted light is emitted downwards and then is reflected to be emitted upwards, and a part of light is lost, so that the optical parameter efficiency and the brightness of an LED light source device are low; when the LED chips are glued in the flip chip, the LED chips in a row are glued in a whole mode, the glue dispensing equipment moves from the first LED chip to the last LED chip all the time, fluorescent glue flows out of the glue dispensing equipment all the time in the moving process, and therefore gaps among the LED chips can also be filled with the fluorescent glue, and waste of the fluorescent glue is caused. When the LED chip adopts a normal installation mode, only the LED chip can be sprayed, the steel sheet provided with the through hole is placed above the LED chip, the through hole corresponds to the LED chip, fluorescent powder is sprayed by high-pressure spraying equipment, the whole surface is sprayed during spraying, the using amount of the fluorescent powder is large, and meanwhile, part of the fluorescent powder can be sputtered when the fluorescent powder passes through the through hole on the steel sheet and falls into an area between adjacent LED chips, so that the manufacturing cost of a device is increased due to the high price of the fluorescent powder; in addition, when the fluorescent powder is sprayed, multiple times of spraying are needed, and the light consistency ratio is poor.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a chip-scale packaging LED light source device to improve optical parameter efficiency and brightness and reduce manufacturing cost.
In order to solve the above technical problem, the present application provides a chip-scale package LED light source device, including:
an LED support;
the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip;
the conducting wires are used for electrically connecting the normally installed LED chips and the LED bracket;
and the fluorescent colloid is arranged on the surface of the normally installed LED chip.
Optionally, the number of the upright LED chips is multiple, and the upright LED chips are uniformly distributed on the LED support in an array form.
Optionally, the fluorescent colloid comprises at least two fluorescent colloids with different color temperatures.
Optionally, the fluorescent colloids with different color temperatures are arranged on the front-mounted LED chip;
correspondingly, the method also comprises the following steps:
and the transparent packaging body is arranged on the whole luminous surface of the LED support.
Optionally, the color temperature of the fluorescent colloid on each forward-mounted LED chip is different from the color temperature of the fluorescent colloid on the adjacent forward-mounted LED chip.
Optionally, the color temperature of the fluorescent colloid on the forward-mounted LED chip in the same row is the same, and is different from the color temperature of the fluorescent colloid on the forward-mounted LED chip in the adjacent row;
or the color temperature of the fluorescent colloid on the upright LED chips in the same row is the same and is different from that of the fluorescent colloid on the upright LED chips in the adjacent row.
Optionally, the fluorescent colloid except for the fluorescent colloid with the highest color temperature is arranged on the forward-mounted LED chip, and the fluorescent colloid with the highest color temperature is arranged on the whole light-emitting surface of the LED support.
Optionally, when the fluorescent colloid includes two kinds of fluorescent colloids with different color temperatures, the fluorescent colloids with low color temperatures are arranged on the normal LED chips in the same row or the same column.
Optionally, when the fluorescent colloid comprises two kinds of fluorescent colloids with different color temperatures, the fluorescent colloid is provided with a low color temperature, and the LED chips which are normally installed are distributed at intervals with the LED chips which are not provided with the low color temperature.
The application provides a chip level encapsulation LED light source device, includes: an LED support; the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip; the conducting wires are used for electrically connecting the normally installed LED chips and the LED bracket; and the fluorescent colloid is arranged on the surface of the normally-installed LED chip.
Therefore, the LED chip in the LED light source device is a chip in a normal installation mode, when light is emitted, the light is directly emitted upwards without being reflected, and the light parameter efficiency and the brightness of the LED light source device can be improved. The surface of the normally-installed LED chip is coated with the fluorescent powder instead of the fluorescent powder, and the fluorescent colloid is formed by dispensing on the surface of the normally-installed LED chip, so that the waste of fluorescent powder sputtering and multiple spraying caused by spraying the fluorescent powder can be avoided, the manufacturing cost is reduced, the consistency of light is improved, and meanwhile, the method is different from the dispensing of the flip LED chip in the prior art; in addition, the fluorescent colloid is arranged on the surface of the normally installed LED chip, so that the chip-scale packaging of the normally installed LED chip is realized.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip-scale package LED light source device according to an embodiment of the present disclosure;
fig. 2 is a top view of a chip scale package LED light source device provided in an embodiment of the present application;
FIG. 3 is a top view of another chip scale package LED light source device provided by the embodiments of the present application;
FIG. 4 is a top view of another chip scale package LED light source device provided by an embodiment of the present application;
FIG. 5 is a top view of another chip scale package LED light source device provided by the embodiments of the present application;
in the figure, 1 is an LED bracket, 2 is a front-mounted LED chip, 3 is a fluorescent colloid, 4 is an electrode, 5 is a lead, 31 is a first color temperature fluorescent colloid, and 32 is a second color temperature fluorescent colloid.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description is given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, other ways of implementing the invention may be devised different from those described herein, and it will be apparent to those skilled in the art that the invention can be practiced without departing from the spirit and scope of the invention.
As described in the background section, when flip LED chips are used in current LED light source devices, there are disadvantages of low optical parameter efficiency and low brightness, and when dispensing, there will be fluorescent glue in the gaps between the flip LED chips, which causes waste of the fluorescent glue. When the LED chip is inverted, powder can be sprayed only on the LED chip, and the problems of waste of fluorescent powder and poor light consistency exist.
In view of the above, the present application provides a chip scale package LED light source device, please refer to fig. 1, which includes:
an LED support 1;
the LED chip group is fixedly connected to the LED bracket 1 and comprises at least one normally installed LED chip 2;
the lead 5 is used for electrically connecting the normally installed LED chips 2 and the LED bracket 1;
and the fluorescent colloid 3 is arranged on the surface of the normally installed LED chip 2.
It should be noted that the chip scale package LED light source device further includes a dam disposed at the periphery of the LED chip set, and an area within the dam is a light emitting surface.
The number of the front-mounted LED chips 2 may be one, or may be plural (two or more), as the case may be. When the quantity of the LED chips 2 which are normally installed is multiple, in order to improve the uniformity of light intensity of different irradiation areas when the chip-scale packaged LED light source device emits light, the LED chips 2 which are normally installed are uniformly distributed on the LED support 1 in an array form.
When the number of the normally installed LED chips 2 is two or more, the lead 5 is connected to the electrode 4 of the normally installed LED chip 2 to realize the electrical connection between the normally installed LED chips 2; the electrode 4 of the normally installed LED chip 2 is connected with the bonding pad of the LED bracket 1 through a wire 5, so that the electrical connection is realized. The wires 5 may be gold wires or wires 5 made of other materials.
In the present application, the light emitting type of the front-mounted LED chip 2 is not limited, as the case may be. For example, the front-mounted LED chip 2 may be a blue chip, a red chip, or the like.
The fluorescent colloid 3 can be set according to the color temperature adjustment requirement of the chip-scale packaged LED light source device, for example, when multiple color temperature adjustments are not required, the fluorescent colloid 3 is a single kind of fluorescent colloid 3; when it is desired to achieve phase modulation between a plurality of color temperatures, the fluorescent gel 3 includes a plurality of fluorescent gels 3 having different color temperatures.
At present, the mode of spraying fluorescent powder can only be adopted for the normally-installed LED chips, the flip LED chips can be subjected to dispensing, but the dispensing of the flip LED chips is simultaneously performed on one row or one column of flip LED chips, dispensing equipment moves from the first LED chip to the last LED chip, fluorescent glue flows out of the dispensing equipment all the time in the moving process, the macroscopic dispensing belongs to the dispensing, and the fluorescent glue can also be distributed in gaps between the adjacent flip LED chips. In the present application, the forward-mounted LED chips 2 are dispensed by using a dispensing method, and it should be emphasized that the fluorescent colloid 3 is disposed on the surface of the forward-mounted LED chip 2, and the dispensing is performed on a single chip, so that the chip-scale package is realized, and no fluorescent colloid 3 may exist between adjacent forward-mounted LED chips 2.
The LED chip is the chip of formal dress form among this application LED light source device, and when the light-emitting, light directly upwards launches, need not pass through the reflection, can increase LED light source device optical parameter efficiency and luminance. In the application, the surface of the normally-installed LED chip 2 is coated with not fluorescent powder, but the surface of the normally-installed LED chip 2 is dispensed with the fluorescent powder to form a fluorescent colloid 3, so that the waste of fluorescent powder sputtering and multiple spraying caused by spraying the fluorescent powder can be avoided, the manufacturing cost is reduced, the light consistency is improved, and meanwhile, the method is different from the dispensing of the flip LED chip in the prior art, the fluorescent colloid 3 does not exist between the adjacent normally-installed LED chips 2 in the application, the using amount of the fluorescent colloid 3 can be reduced, and the manufacturing cost is reduced; in addition, the fluorescent colloid 3 is arranged on the surface of the normally installed LED chip 2, so that the chip-level packaging of the normally installed LED chip 2 is realized.
When the LED chips 2 are uniformly distributed on the LED support 1 in an array mode, the LED light source device can be adjusted between different color temperatures in order to realize chip-scale packaging, and the diversified requirements of users are met, wherein the fluorescent colloid 3 comprises at least two fluorescent colloids with different color temperatures.
Further, when the fluorescent colloid 3 includes at least two kinds of fluorescent colloids with different color temperatures, the distribution mode of the fluorescent colloid 3 is not limited in the present application, and the fluorescent colloid can be set by itself.
As an implementation mode, the fluorescent colloids 3 with different color temperatures are arranged on the front-mounted LED chip 2; correspondingly, the chip scale package LED light source device further comprises: and the transparent packaging body is arranged on the whole luminous surface of the LED support 1. The transparent encapsulation may be a silicone gel.
It should be noted that, when the fluorescent colloids 3 with different color temperatures are all disposed on the front-mounted LED chip 2, the distribution manner of the fluorescent colloids 3 with different color temperatures is not limited in this application.
The color temperature of the fluorescent colloid 3 on the forward LED chip 2 in the same row is the same, and is different from the color temperature of the fluorescent colloid 3 on the forward LED chip 2 in the adjacent row, or the color temperature of the fluorescent colloid 3 on the forward LED chip 2 in the same row is the same, and is different from the color temperature of the fluorescent colloid 3 on the forward LED chip 2 in the adjacent row.
Taking two kinds of fluorescent colloids 3 with different color temperatures as an example, the fluorescent colloids 3 with two color temperatures are respectively referred to as a first color temperature fluorescent colloid 31 and a second color temperature fluorescent colloid 32. Two adjacent rows of LED chips 2 are arranged in a positive mode, a first color temperature fluorescent colloid 31 is arranged on one row of LED chips 2 in the positive mode, and a second color temperature fluorescent colloid 32 is arranged on the other row of LED chips 2 in the positive mode; alternatively, referring to fig. 2, two adjacent columns of LED chips 2 are normally mounted, a first color temperature fluorescent colloid 31 is disposed on one column of LED chips 2, and a second color temperature fluorescent colloid 32 is disposed on the other column of LED chips 2. The uniformity of the light emission at the same color temperature can be ensured. However, this is not limited in the present application, and the fluorescent colloids 3 on each row of the LED chips 2 in the left half part may be the first color temperature fluorescent colloids 31, and the fluorescent colloids 3 on each row of the LED chips 2 in the right half part may be the second color temperature fluorescent colloids 32; or, the fluorescent colloid 3 on each row of the top half normally installed LED chips 2 is the first color temperature fluorescent colloid 31, the fluorescent colloid 3 on each row of the bottom half normally installed LED chips 2 is the second color temperature fluorescent colloid 32, and so on.
The color temperature of the fluorescent colloid 3 on each forward-mounted LED chip 2 is different from the color temperature of the fluorescent colloid 3 on the adjacent forward-mounted LED chip 2. When there are two color temperatures, please refer to fig. 3, the fluorescent colloid on any one of the normally mounted LED chips 2 is the first color temperature fluorescent colloid 31, and the fluorescent colloids on the adjacent normally mounted LED chips 2 are the second color temperature fluorescent colloids 32. The uniformity of the light emitted under the same color temperature can be ensured.
As for the fluorescent colloid 3 in fig. 2 and 3, both are disposed on the forward-mounted LED chips 2, and the fluorescent colloid 3 is not distributed in the gap between the adjacent forward-mounted LED chips 2.
As another possible implementation manner, the fluorescent colloids 3 except the highest color temperature are all disposed on the front-mounted LED chip 2, and the fluorescent colloid 3 with the highest color temperature is disposed on the whole light emitting surface of the LED support 1.
It should be noted that, in this embodiment, the distribution manner of the fluorescent colloids 3 with different color temperatures is not limited. Which are separately described below.
When the fluorescent colloid 3 comprises two kinds of fluorescent colloids with different color temperatures, the fluorescent colloid with a low color temperature is arranged on the normal LED chip 2 in the same row or the same column, and the fluorescent colloid with a high color temperature is arranged on the whole light-emitting surface.
For convenience of description, for the two color temperature fluorescent colloids 3, the low color temperature fluorescent colloid is referred to as a first color temperature fluorescent colloid 31, and the high color temperature fluorescent colloid is referred to as a second color temperature fluorescent colloid 32.
In order to ensure uniformity of light emitted at the same color temperature, please refer to fig. 4, in any two adjacent rows, a first color temperature fluorescent colloid 31 is disposed on one row of the normally mounted LED chips 2, a fluorescent colloid 3 is not disposed on the other row of the normally mounted LED chips 2, and a second color temperature fluorescent colloid 32 is disposed on the whole light emitting surface. Or alternatively. In any two adjacent rows, the first color temperature fluorescent colloid 31 is arranged on one row of the normally installed LED chips 2, the fluorescent colloid 3 is not arranged on the other row of the normally installed LED chips 2, and the second color temperature fluorescent colloid 32 is arranged on the whole light-emitting surface.
When the fluorescent colloid 3 comprises two kinds of fluorescent colloids with different color temperatures, a low color temperature is arranged on the fluorescent colloid, the LED chips 2 are installed in the front of the fluorescent colloid, the LED chips 2 are distributed at intervals, and the fluorescent colloid with the high color temperature is arranged on the whole light-emitting surface. Referring to fig. 5, the front LED chip 2 with the first color temperature fluorescent colloid 31 and the front LED chip 2 without the first color temperature fluorescent colloid 31 are distributed at intervals, and the second color temperature fluorescent colloid 32 is disposed on the whole light emitting surface.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
The chip scale package LED light source device provided by the present application is described in detail above. The principle and the implementation of the present application are explained herein by using specific examples, and the above descriptions of the examples are only used to help understand the scheme and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (9)
1. A chip scale packaged LED light source device, comprising:
an LED support;
the LED chip group is fixedly connected to the LED bracket and comprises at least one normally-installed LED chip;
the wires are used for electrically connecting the normally installed LED chips and the LED bracket;
and the fluorescent colloid is arranged on the surface of the normally-installed LED chip.
2. The chip scale packaged LED light source device of claim 1, wherein the number of the front-mounted LED chips is plural and is uniformly distributed on the LED support in an array.
3. The chip scale package LED light source device of claim 2, wherein the phosphor paste comprises at least two phosphor pastes of different color temperatures.
4. The chip scale package LED light source device of claim 3, wherein the fluorescent colloids of different color temperatures are disposed on the front-mounted LED chip;
correspondingly, the method also comprises the following steps:
and the transparent packaging body is arranged on the whole luminous surface of the LED support.
5. The chip scale packaged LED light source device of claim 4, wherein the color temperature of the fluorescent gel on each of the forward mounted LED chips is different from the color temperature of the fluorescent gel on an adjacent forward mounted LED chip.
6. The chip scale packaged LED light source device of claim 4, wherein the color temperature of the fluorescent glue on the same row of the front-mounted LED chips is the same and different from the color temperature of the fluorescent glue on the adjacent row of the front-mounted LED chips;
or the color temperature of the fluorescent colloid on the normally installed LED chip in the same row is the same, and is different from that of the fluorescent colloid on the normally installed LED chip in the adjacent row.
7. The chip scale package LED light source device of claim 3, wherein the phosphors except for the highest color temperature are disposed on the front-mounted LED chip, and the phosphors with the highest color temperature are disposed on the entire light emitting surface of the LED support.
8. The chip scale package LED light source device of claim 7, wherein when the fluorescent gel comprises two different color temperature fluorescent gels, the forward-mounted LED chips in the same row or column are all provided with the low color temperature fluorescent gel.
9. The chip scale package LED light source device of claim 7, wherein when the phosphor gel comprises two phosphor gels with different color temperatures, the front-mounted LED chip with the phosphor gel having a low color temperature is spaced apart from the front-mounted LED chip without the phosphor gel having a low color temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222081377.7U CN217768376U (en) | 2022-08-08 | 2022-08-08 | Chip-level packaged LED light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222081377.7U CN217768376U (en) | 2022-08-08 | 2022-08-08 | Chip-level packaged LED light source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217768376U true CN217768376U (en) | 2022-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222081377.7U Active CN217768376U (en) | 2022-08-08 | 2022-08-08 | Chip-level packaged LED light source device |
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| CN (1) | CN217768376U (en) |
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- 2022-08-08 CN CN202222081377.7U patent/CN217768376U/en active Active
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