CN112310265A - Light source for plant illumination and manufacturing method thereof - Google Patents
Light source for plant illumination and manufacturing method thereof Download PDFInfo
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- CN112310265A CN112310265A CN202011189772.6A CN202011189772A CN112310265A CN 112310265 A CN112310265 A CN 112310265A CN 202011189772 A CN202011189772 A CN 202011189772A CN 112310265 A CN112310265 A CN 112310265A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G7/00—Botany in general
- A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
- A01G7/045—Electric or magnetic or acoustic treatment of plants for promoting growth with electric lighting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Abstract
The invention relates to a light source for plant illumination and a manufacturing method thereof, wherein the light source comprises a substrate, a circuit layer fixed on the substrate, a plurality of luminescent crystals and a silica gel dam, the luminescent crystals are positioned in an annular region surrounded by the silica gel dam, the luminescent crystals comprise blue luminescent crystals and purple luminescent crystals, the purple luminescent crystals are uniformly distributed in the middle of the annular region, the blue luminescent crystals are distributed at the periphery of the purple luminescent crystals, fluorescent colloid is uniformly coated and solidified on the luminescent crystals, the fluorescent colloid is prepared by uniformly mixing fluorescent powder, silica gel and gas-phase silica, and when the fluorescent colloid is solidified in the manufacturing method of the light source, high-temperature rapid solidification is firstly carried out and then baking solidification is carried out. The light source for plant illumination can excite continuous spectrum, thereby improving luminous efficiency and light intensity, promoting the rapid growth of plants when being used for plant illumination, and leading energy to be mainly concentrated on fruits or stems and leaves of the plants, thereby achieving the purposes of accelerating the growth and the rapid ripening.
Description
Technical Field
The invention relates to a light source for plant illumination and a manufacturing method thereof, and belongs to the technical field of LED manufacturing and packaging.
Background
The plant growth process needs photosynthesis, sunlight in nature only irradiates the ground for 12 hours on average, sunlight in the morning and evening is weak, energy required by plant photosynthesis cannot be provided, enough light irradiation intensity can be achieved for about 6-8 hours in one day, the plants with stems and leaves and fruits grow slowly, the environmental temperature in spring, autumn and winter is low, and the plants with stems and leaves and fruits cannot grow basically. Therefore, the mode of providing energy required by photosynthesis for plants by replacing sunlight with LED illumination is promoted, and the existing LED light source applied to plant illumination mainly adopts the following two modes: 1. adopting a blue light emitting wafer, and exciting white light by yellow or green fluorescent powder and red fluorescent powder; 2. and a blue light emitting wafer and a red light emitting wafer are mixed for illumination. The spectrum of the LED light source of above two kinds of modes is not comprehensive enough, and traditional packaging mode also leads to the light intensity that the light source sent not enough, causes vegetation slow to the waste of a large amount of losses of the energy has been caused.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the light source for plant illumination and the manufacturing method thereof, the light source can excite continuous spectrum, the luminous efficiency is high, and enough light intensity can be provided for the rapid growth of plants.
The technical scheme for realizing the aim of the invention is as follows: the light source for plant illumination comprises a substrate and a plurality of light-emitting crystals arranged on the substrate, wherein a fluorescent layer and a transparent colloid are further arranged on the substrate, the fluorescent layer covers the light-emitting crystals and is fixedly connected with the light-emitting crystals, the transparent colloid is fixedly connected with the fluorescent layer and is in a spherical segment shape with the middle part protruding outwards, and the light-emitting crystals comprise purple light crystals and blue light crystals.
The substrate may be provided with circuitry and wires for connection of the light emitting crystal circuitry according to the prior art, which may be gold wires or other suitable wires.
Preferably, the substrate is provided with a dam structure, the dam structure protrudes from the surface of the substrate and surrounds the fluorescent layer, the fluorescent layer is located in the dam structure, and the edge part of the fluorescent layer is fixedly connected with the dam.
The dam can be made of silicon dioxide materials and is fixedly connected to the substrate.
Preferably, the violet crystal is located in the middle of the distribution region of the luminescent crystal.
Preferably, the number ratio of the violet light emitting crystal to the blue light emitting crystal is less than 1/12.
Preferably, the light-emitting wavelength of the blue light-emitting crystal is 440-465nm, the light-emitting wavelength of the purple light-emitting crystal is 380-420nm, the PO value of the blue light-emitting crystal is greater than 250mW, and the PO value of the purple light-emitting crystal is 1/10-1/5 of the PO value of the blue light-emitting crystal.
The fluorescent layer can be arranged according to the growth needs of the plant (especially the illumination needs for photosynthesis) to control the light emission characteristics (spectrum).
Preferably, the fluorescent layer is made of fluorescent colloid, and the fluorescent colloid is prepared by uniformly mixing multiple fluorescent powder, silica gel and fumed silica.
The multi-element fluorescent powder comprises a plurality of kinds of fluorescent powder so as to meet the requirement of luminescence.
The proportion of the fluorescent powder, the silica gel and the fumed silica and the thickness of the fluorescent layer can be set as required, so that the light-transmitting property and the bonding property are ensured while the light-emitting requirement is met.
Preferably, in the fluorescent colloid, the mass ratio of the fluorescent powder to the silica gel is (0.05-0.7): (1.2-1.8), and the mass ratio of the fumed silica in the fluorescent colloid is 0.5-2%.
Preferably, the multi-component phosphor includes red phosphor (red phosphor), green phosphor (green phosphor), and cyan phosphor (cyan phosphor).
The mass ratio of the red powder, the green powder and the green powder is preferably 1:5: 0.2.
The manufacturing method of the light source for plant illumination sequentially comprises the following steps:
1) arranging a circuit layer on a substrate;
2) arranging a silica gel dam on the substrate;
3) arranging a light-emitting crystal on a substrate;
4) making wiring connections to the luminescent crystals (including wiring connections between the luminescent crystals and wiring layer wiring, and between the luminescent crystals, if any);
5) coating a fluorescent colloid on the substrate and curing to form a fluorescent layer;
6) and arranging transparent colloid on the fluorescent layer and curing to form a transparent colloid layer.
Preferably, the fluorescent colloid is prepared in the following manner: and putting the fluorescent powder, the silica gel and the fumed silica into stirring equipment in proportion, and mixing and stirring until a uniform mixed colloid is formed.
Preferably, the transparent colloid is arranged in the following manner: coating a transparent colloid with the viscosity of more than 8000 (including) on the set fluorescent layer according to the height calculated by H ═ NxA/2 sin alpha, and curing to be a solid segment shape, wherein H is the height of the segment, N is the refractive index of the transparent colloid, A is the diameter of the segment, and alpha is the luminous emergence angle.
The invention has the beneficial effects that:
1. the light source for plant illumination provided by the invention adopts the combination of two luminescent crystals (the blue luminescent crystal and the purple luminescent crystal) and the fluorescent colloid mixed with fluorescent powder with multiple colors, so that the light source can excite a continuous spectrum, the luminous efficiency and the luminous intensity are improved, when the light source is used for plant illumination, the rapid growth of plants can be promoted, the purple light can inhibit the growth of the root systems of the plants, the over-development of the root systems is avoided, the energy is mainly concentrated on fruits or stems and leaves of the plants, and the purposes of growth promotion and rapid ripening are achieved.
2. The fluorescent colloid can effectively prevent the particle precipitation of the fluorescent powder in the packaging process due to the action of the fumed silica (the fluorescent powder crystal has heavier specific gravity, can quickly sink along with the rise of temperature in the baking process, the fumed silica has light specific gravity and small particles, and the particles tend to rise in silica gel in high-temperature baking, so that the fluorescent powder crystal can be prevented from sinking). The fluorescent colloid is cured at high temperature in a fast curing mode before being baked and cured, so that the sinking of the fluorescent powder in a high-temperature state can be further inhibited, and the fluorescent powder is far away from the luminescent crystal. Because the fluorescent powder is far away from the luminescent crystal and the substrate (the fluorescent crystal and the substrate are main heating bodies in the use process of the light source), the influence of high temperature on the fluorescent powder after long-time use can be effectively reduced in the use process of the light source, the quality variable of the fluorescent powder is reduced, and the color coordinate drift, the luminous flux reduction, the color temperature rise and the precipitation amount of blue light photons are inhibited, so that the luminous efficiency and the luminous stability of the LED light source are effectively improved, the light attenuation is reduced, the service power of the light source is reduced under the condition of the same illumination/brightness, the service life of the light source is prolonged, the energy is saved, and the pollution to the environment is reduced.
3. The fluorescent colloid disclosed by the invention is high-temperature resistant, can effectively reduce yellowing caused by radiant heat of the luminescent crystal and reduce the precipitation rate of blue light when used for a long time, so that the excitation efficiency is high, the thermal stability is good, the luminous efficiency and the luminous stability of a light source are greatly improved, and the light decay is reduced.
4. In addition, the substrate has high light reflection degree, photons generated by the luminescent crystal can be reflected out in a diffuse reflection mode, and the outgoing amount of the photons can be increased by 3% -5%, so that the photon conversion efficiency of the LED light source is improved to the maximum extent, and the luminous efficiency is improved.
5. The transparent colloid is in a spherical segment shape with a special size after being solidified, and is beneficial to improving the light intensity of a light source, thereby providing enough energy for the photosynthesis of plants and being beneficial to the rapid growth of the plants.
Drawings
FIG. 1 is a schematic longitudinal sectional view of one embodiment of the light source (in a front-mount package) of the present invention;
FIG. 2 is a schematic longitudinal sectional view of another embodiment (flip-chip) of the light source of the present invention;
FIG. 3 is a top view of one embodiment of the light source of the present invention;
FIG. 4 is a flow chart of a method of making the light source of the present invention;
fig. 5 is a graph showing the relationship between the temperature and the time of the reflow apparatus when the light emitting crystal is fixed on the circuit layer in the flip chip packaging method according to the present invention.
Detailed Description
Referring to fig. 1, 2 and 3, the invention discloses a light source for plant illumination, which comprises a substrate (or a support) 1, a circuit layer 2 fixed on the substrate, a plurality of light emitting crystals and a silica gel dam, wherein the plurality of light emitting crystals are located in an annular region surrounded by the silica gel dam, the light emitting crystals comprise blue light emitting crystals 4 and violet light emitting crystals 6, the violet light emitting crystals are located in the middle of a light emitting crystal distribution region, namely are uniformly distributed in the middle of the annular region surrounded by the silica gel dam, preferably are distributed in an annular shape, and the blue light emitting crystals are distributed on the periphery of the violet light emitting crystals.
The number ratio of the violet light emitting crystal to the blue light emitting crystal depends on power, and is preferably less than 1/12.
The light-emitting wavelength of the blue light-emitting crystal is preferably 440-465nm, the light-emitting wavelength of the purple light-emitting crystal is preferably 380-420nm, the PO value of the blue light-emitting crystal is usually more than 250mW, the PO value of the purple light-emitting crystal is preferably 1/10-1/5 of the PO value of the blue light-emitting crystal, the voltage values of the blue light-emitting crystal and the purple light-emitting crystal are basically kept consistent, and the voltage drop range is within 0.1V.
The plurality of luminescent crystals are preferably arranged in a plurality of rows in an annular area formed by the silica gel dam, the luminescent crystals in the same row are connected in series, the luminescent crystals in different rows are connected in parallel, the luminescent crystals in the same row are preferably arranged at equal intervals, the interval is preferably 0.3-2.5mm, such as 0.3mm, 1mm, 1.5mm or 2.5mm, and a substrate (the part on which the luminescent crystals are not fixed) in the annular area formed by the silica gel dam forms a light reflecting area 9.
The substrate is preferably a nano-scale multi-layer coated (silver film) aluminum/copper substrate to increase the reflectivity (the reflectivity can reach more than 98%), and silver ion transfer is not generated at high temperature, and the substrate outside the annular area surrounded by the silica gel dam can be provided with a fixing hole 10 for mounting or fixing a light source.
The circuit layer is preferably a copper foil and has a height of 20-30um, such as 20um, 25um or 30 um.
The silica gel box dam is followed the surface of base plate is protruding, whole or part of silica gel box dam can be fixed on the circuit layer, and with the circuit layer is closely laminated, the height of silica gel box dam preferably is 0.5-1mm, such as 0.5mm, 0.8mm or 1 mm.
The light source for plant illumination can adopt a forward packaging mode or a flip packaging mode.
When the normal-mounted packaging mode is adopted, the luminescent crystal is preferably fixed on the substrate by adopting insulating silica gel 3 as primer, the height of the insulating silica gel is less than 1/3 of the height of the luminescent crystal, preferably less than 8 μm, and the rotation angle of the luminescent crystal is preferably less than 5 °. The insulating silica gel preferably has a thermal conductivity of 1.0 or more and a viscosity of 50 or more. The position of the substrate for fixing the luminescent crystal can be provided with a square hole groove or a round hole groove, and the aperture size can be determined according to the power of a light source and is generally more than 10 mm. The circuit layer, the luminescent crystals adjacent to the circuit layer and any two adjacent luminescent crystals in the same row are connected through gold wires 5, and the height of the gold wires (the distance between the highest point of the gold wires and the substrate) is preferably 160 +/-10 μm.
When the flip-chip packaging mode is adopted, high-reflection ink is coated on the substrate and the circuit layer, the luminescent crystal is fixed on the circuit layer by adopting silver glue or tin paste 11 as primer, and the rotation angle of the luminescent crystal is preferably less than 5 degrees.
The fluorescent layer 8 is arranged on the substrate, the fluorescent layer covers the luminescent crystal and is fixedly connected with the luminescent crystal, the fluorescent layer is formed by curing a fluorescent colloid, the luminescent crystal can be uniformly coated and cured with the fluorescent colloid, the fluorescent colloid fills an annular area surrounded by the silica gel dam (the silica gel dam surrounds the fluorescent layer), the top surface of the fluorescent layer is preferably flush with the top surface of the silica gel dam, and the fluorescent colloid is preferably prepared by uniformly mixing multiple fluorescent powder, silica gel and gas-phase silica.
According to different color ratios of the fluorescent powder, the mass ratio of the fluorescent powder to the silica gel is (0.05-0.7): (1.2-1.8), and the proportion of the fluorescent powder is correspondingly increased or the proportion of the silica gel is correspondingly reduced along with the increase of the CIE coordinate value along with the lower color temperature. The mass percentage of the fumed silica in the fluorescent colloid is 0.5-2%. The mass proportion of the fumed silica in the fluorescent colloid can be adjusted flexibly according to the proportion of the fluorescent powder in the fluorescent colloid or the viscosity of the silica gel, the proportion of the fluorescent powder in the fluorescent colloid is smaller or the viscosity of the silica gel is larger, then the adding proportion of the fumed silica is smaller, the proportion of the fluorescent powder in the fluorescent colloid is larger or the viscosity of the silica gel is lower, and then the adding proportion of the fumed silica is increased.
The phosphor, the silica gel and the fumed silica can be mixed by stirring with any stirring equipment suitable for stirring and mixing the phosphor colloid in the prior art, the stirring equipment is firstly stirred for 50S at the rotating speed of 800 revolutions per M, then stirred for 80S at the rotating speed of 1300 revolutions per M and finally stirred for 50S at the rotating speed of 500 revolutions per M.
The multi-element fluorescent powder comprises multiple kinds of fluorescent powder to meet the requirement of luminescence, for example, the multi-element fluorescent powder is prepared by uniformly mixing red powder (red fluorescent powder), green powder (green fluorescent powder) and green powder (cyan fluorescent powder), and the mass ratio of the red powder, the green powder and the green powder is preferably 1:5: 0.2; for another example, in order to promote photosynthesis of plants, green powder with the wavelength of 525, yellow powder with the wavelength of 558 and red powder with the wavelength of 650 are included or added in the multi-element fluorescent powder, and the mass ratio of the green powder with the wavelength of 525 to the yellow powder with the wavelength of 558 to the red powder with the wavelength of 650 is preferably 5: 5: (1.2-2.0).
The particle size of the fumed silica is preferably in the range of 5 to 50nm, such as 5nm, 10nm, 30nm or 50 nm.
The fumed silica is preferably monomethyltrichlorosilane, dimethyldichlorosilane or hexamethyldisilazane.
The fluorescent colloid with the even coating in top of silica gel box dam and solidification have transparent colloid layer 7, transparent colloid layer preferred is the outside bellied segment form in middle part, the bottom surface area of segment with the outer fringe cross sectional area size of silica gel box dam is the same, and the height of segment is H, reaches according to the diameter of segment the refractive index of transparent colloid is calculated through following formula:
H＝N×A/2sinα,
wherein N is the refractive index of the transparent colloid, A is the diameter of the segment, and alpha is the light-emitting emergence angle.
The transparent colloid layer adopts the spherical segment shape with the special size, which is beneficial to improving the light intensity of the light source, thereby providing enough energy for the photosynthesis of plants and being beneficial to the rapid growth of the plants. The light intensity of the light source irradiating the surface of the stem leaf of the plant is calculated according to the following formula:
I＝E×d2/cosα3
wherein, I is the light intensity value of the light emitting energy, E is the maximum illumination value on the straight line distance, d is the straight line distance, and alpha is the included angle between the vertical normal line and the inclined distance.
The transparent colloid layer is prepared by mixing two kinds of silica gel with the viscosity of more than 8000 according to the mass ratio of 1:1, the two kinds of silica gel can be mixed by any stirring equipment suitable for stirring and mixing the colloid in the prior art, the stirring equipment firstly stirs 100S at the rotating speed of 1000 r/M, then stirs 160S at the rotating speed of 1800 r/M, and finally stirs 80S at the rotating speed of 800 r/M.
Referring to fig. 4, the invention also discloses a manufacturing method of the light source for plant illumination, which sequentially comprises the following steps:
1) arranging a circuit layer on a substrate;
2) arranging a silica gel dam on the substrate;
3) arranging a light-emitting crystal on a substrate;
4) making wiring connections to the luminescent crystals (including wiring connections between the luminescent crystals and wiring layer wiring, and between the luminescent crystals, if any);
5) coating a fluorescent colloid on the substrate and curing to form a fluorescent layer;
6) and arranging transparent colloid on the fluorescent layer and curing to form a transparent colloid layer.
In the step 1), the circuit layer is laid according to the specific requirements of the light source, when a face-up packaging mode is adopted, a square hole or a round hole can be formed in the position, fixed with the luminescent crystal, on the substrate, the aperture size can be determined according to the power of the light source and is generally more than 10mm, and when a face-down packaging mode is adopted, the substrate and the circuit layer are coated with high-light-reflection ink.
In step 2), the silica gel box dam can adopt the box dam machine to fix on the base plate, enclose silica gel designated area on the base plate, whole or partial silica gel is located on the circuit layer, make silica gel with the accurate laminating of circuit layer, then adopt oven/oven to toast 30 minutes under 150 ℃ of temperature environment, make silica gel turn into the solid by the liquid, form the silica gel box dam.
In the step 3), when a normal packaging mode is adopted, the luminescent crystal can be fixed on the substrate by adopting a die bonder through the insulating silica gel (primer), and when a flip packaging mode is adopted, the luminescent crystal can be fixed on the circuit layer by adopting silver adhesive or tin paste as the primer.
In the step 4), when the normal packaging mode is adopted, any suitable welding equipment can be adopted to use the gold wire to connect the circuit layer and the adjacent luminescent crystal and any adjacent two luminescent crystals in the same row, and when the flip packaging mode is adopted, reflow equipment can be used for baking to enable the luminescent crystal to be combined with the circuit layer, and the control relation between the temperature and the time of the reflow equipment is shown in fig. 5.
In the step 5), the fluorescent colloid can be uniformly coated on the luminescent crystal, the circuit layer and the substrate (on the substrate in the annular region surrounded by the silica gel dam) by a dispenser, so that the annular region surrounded by the silica gel dam is filled with the fluorescent colloid, the fluorescent colloid is tightly attached to the luminescent crystal, the circuit layer and the substrate, and then the light source color coordinate is detected by using an integrating device, wherein the deviation range of the color coordinate is less than +/-0.001 according to the corresponding standard.
The fluorescent colloid is preferably cured at high temperature and quickly at the bottom of the substrate by using heating equipment, and then the high-light-efficiency light source is baked and cured by using an oven, wherein the curing condition of quick curing can be flexibly adjusted according to the viscosity and the fluidity of the fluorescent colloid, the preferred heating temperature is 80-120 ℃, and the heating time is less than 20 minutes; the baking and curing mode is that baking is carried out for 60 minutes at 100 ℃ and then for 180 minutes at 160 ℃. The rapid curing is carried out before the baking and curing, so that the sinking of the fluorescent powder in a high-temperature state can be effectively inhibited, and the fluorescent powder is far away from the luminescent crystal.
In the step 6), the transparent colloid is preferably set in the following manner: coating a transparent colloid with the viscosity of more than 8000 (including) on the set fluorescent layer according to the height calculated by H ═ NxA/2 sin alpha, and curing to be a solid segment shape, wherein H is the height of the segment, N is the refractive index of the transparent colloid, A is the diameter of the segment, and alpha is the luminous emergence angle.
The transparent colloid is cured by baking the light source in an oven at 100 deg.C for 60 min and 160 deg.C for 180 min.
Preferably, before the fluorescent colloid and the transparent colloid are cured, the light source is respectively vacuumized to prevent bubbles generated in the packaging process of the light source, the vacuumization can be performed in a vacuum box, the temperature of the vacuumization is 45 +/-5 ℃, the vacuum degree is-1 atmospheric pressure, the time of the vacuumization before the fluorescent colloid is cured is preferably 10 minutes, and the time of the vacuumization before the transparent colloid is cured is preferably 25 minutes.
It is right fluorescent colloid with the solidification of toasting of transparent colloid can be gone on in segments, is right promptly fluorescent colloid carries out the fast curing back, coats transparent colloid, it is right again transparent colloid toasts the solidification, also can be right fluorescent colloid carries out the fast curing back, directly coats transparent colloid, then right again fluorescent colloid with transparent colloid toasts the solidification simultaneously.
Claims (10)
1. The light source for plant illumination comprises a substrate and a plurality of light-emitting crystals arranged on the substrate, and is characterized in that a fluorescent layer and a transparent colloid are further arranged on the substrate, the fluorescent layer covers the light-emitting crystals and fixedly bonds the light-emitting crystals in the fluorescent layer, the transparent colloid is fixedly bonded on the fluorescent layer and is in a spherical segment shape with the middle part protruding outwards, and the light-emitting crystals comprise purple light crystals and blue light crystals.
2. The light source of claim 1, wherein said substrate is provided with a dam structure, said dam structure protruding from the surface of the substrate and surrounding said phosphor layer, said phosphor layer being located in said dam structure with its edge portion bonded to said dam.
3. The light source of claim 1, wherein the violet crystal is located in a middle portion of the distribution area of the luminescent crystals.
4. The light source of claim 3, wherein the purple light crystals have a PO value of 1/10-1/5 of the PO value of the blue light crystals.
5. The light source according to any of claims 1-4, wherein said phosphor layer is made of a phosphor gel, said phosphor gel being made by uniformly mixing a plurality of phosphors, silica gel and fumed silica.
6. The light source according to claim 5, wherein the phosphor is present in the phosphor colloid in a mass ratio of (0.05-0.7) to (1.2-1.8), and the fumed silica is present in the phosphor colloid in a mass ratio of 0.5-2%.
7. The light source of claim 6, wherein the plurality of phosphors comprises red, green and cyan powders.
8. Method for making a light source for lighting plants according to claims 1 to 7, characterized in that it comprises the following steps in sequence:
1) arranging a circuit layer on a substrate;
2) arranging a silica gel dam on the substrate;
3) arranging a light-emitting crystal on a substrate;
4) carrying out circuit connection of the luminescent crystal;
5) coating a fluorescent colloid on the substrate and curing to form a fluorescent layer;
6) and arranging transparent colloid on the fluorescent layer and curing to form a transparent colloid layer.
9. The method of claim 8, wherein the fluorescent colloid is prepared by: and putting the fluorescent powder, the silica gel and the fumed silica into stirring equipment in proportion, and mixing and stirring until a uniform mixed colloid is formed.
10. The method according to claim 8, characterized in that the transparent colloid is arranged in the following manner: coating a transparent colloid with the viscosity of more than 8000 (including) on the set fluorescent layer according to the height calculated by H ═ NxA/2 sin alpha, and curing to be a solid segment shape, wherein H is the height of the segment, N is the refractive index of the transparent colloid, A is the diameter of the segment, and alpha is the luminous emergence angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011189772.6A CN112310265A (en) | 2020-10-30 | 2020-10-30 | Light source for plant illumination and manufacturing method thereof |
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Cited By (1)
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