JP2019091648A - Toning led lighting device and lighting fixture - Google Patents

Abstract

To provide a toning LED lighting device and a lighting fixture suitable for automobile painting and theater stage lighting.SOLUTION: A toning LED lighting device comprises a board 3, a dam 8 formed on the board, a light emitting surface 2 arranged in the dam 8 and comprising a plurality of LED chips 11 and 12 mounted on the same plane, a translucent resin part 9 packed in the dam 8, wiring layers 15 and 16, and a toning controller 40. The translucent resin part 9 includes a red phosphor and a green phosphor dispersedly arranged. The plurality of LED chips 11 and 12 comprise the LED chip 11 for emitting light in blue, and the LED chip 12 for emitting light in umber or white.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a toning LED lighting device and a lighting apparatus for emitting white light, for example, having a 3000 K to 5000 K toning range, a large amount of light (for example, 1 to 50,000 lumens (lm)), and a high luminance toning The present invention relates to an LED lighting device and a lighting device.

  In recent years, many lighting fixtures have been proposed in which the light emitting unit is replaced with an LED (Light Emitting Diode). As a mounting method of LED, COB mounting and package mounting are known. The COB mounting is performed, for example, by mounting a semiconductor element on a flat substrate having a pattern of lead electrodes formed of a metal film on the surface, electrically connecting the lead elements to the lead electrodes, and sealing with a resin.

  In the LED lighting device of the COB structure, the LED element mounted on the mounting substrate and the wiring on the mounting substrate are electrically connected by wire bonding or flip chip mounting, and the LED element mounting region is sealed with a translucent resin Manufactured. There is also known a manufacturing method in which an annular frame is provided around a mounting area on a substrate before resin sealing, and the inside of the frame is filled with a translucent resin and sealed (for example, a patent). Literature 1).

Recently, there is a demand for increasing the amount of light of the LED lighting device. However, when COB mounting a large number of LED chips on a substrate, if a substrate made of a material having a low thermal conductivity such as glass epoxy resin is used, the donut phenomenon that the light quantity of the light emission central part becomes worse especially. There is a problem that occurs. Therefore, in Patent Document 2, applicants apply a liquid material containing SiO ₂ particles having a mean particle diameter of several nm to several hundreds nm and a white inorganic pigment on the surface of a substrate at least the surface of which is metal, and baking it. We have proposed a semiconductor device capable of solving the doughnut phenomenon by forming a laminated structure of a white insulating layer and a metal layer.

  In addition, a heat pipe (heat spreader) has also been proposed which cools a heating element by vaporization and condensation of a sealed refrigerant so that mounting can be performed even in a small space. In patent document 3, it has the arrangement | positioning part for providing a to-be-cooled apparatus in any one of an upper plate and a lower plate, and the cooling which provided one or several middle plates between the said upper plate and the said lower plate. The cooling unit main body is provided inside the cooling unit main body, a vapor diffusion flow path for transferring heat generated by the cooled device as refrigerant to the peripheral portion of the cooling unit main body, and the middle plate And a capillary channel configured to return the refrigerant condensed in the peripheral portion to the side of the placement portion, wherein the placement portion is formed thinner than the other regions, and A heat pipe having a recess for mounting a cooling device has been proposed.

JP, 2009-164157, A Patent No. 5456209 gazette Patent No. 4119944

In order to inspect with the same color temperature as sunlight, such as morning, noon, evening, sunny and cloudy in the paint color inspection process of the automobile factory, the color temperature can be adjusted, and a large amount of LED light can be irradiated on the whole vehicle body However, the use of multiple light sources causes uneven color and lower brightness.
Also, in theatrical theater lighting, halogen lamps and incandescent lamps are used as lights to adjust color temperature to produce various scenes, and there is a need for alternative LED lighting to save energy, but multiple light sources And in the light source which divided the light emission surface, the subject that the color nonuniformity and the color tone of an outline were inferior compared with an incandescent lamp etc. occurred.

  Then, an object of the present invention is to provide a toning LED lighting device and a lighting fixture in which the above-mentioned subject is solved.

The toning LED lighting device according to the present invention comprises a substrate, a dam formed on the substrate, a light emitting surface constituted by a large number of LED chips disposed in the dam and mounted on the same plane, and in the dam A color-adjusting LED lighting apparatus comprising: a light-transmissive resin portion filled in: a wiring layer; and a color-matching controller, wherein the light-transmissive resin portion includes a red phosphor and a green phosphor dispersed and disposed. In addition, a large number of LED chips are configured of an LED chip emitting blue light and an LED chip emitting amber color or white.
In the above-mentioned color-matched LED lighting device, the LED chip emitting amber color or white is constituted of an LED chip emitting blue light and a chip upper surface phosphor layer covering the upper surface of the LED chip, the chip upper surface phosphor layer Can be configured to include dispersed red and yellow phosphors.
In the toned LED lighting device, a majority of the LED chips disposed along the outer edge of the light emitting surface may be configured by an LED chip that emits amber color or white color.
In the toned LED lighting device described above, the light emitting surface is an even number of polygons having an even number of angles, which constitutes the outer edge of the light emitting surface, and all of the LED chips disposed along the two opposing sides are amber. It can be configured to be configured by an LED chip that emits color or white.
In the color-matched LED lighting device, the plurality of LED chips may be arranged to be line symmetrical with respect to the vertical center line and / or the horizontal center line of the light emitting surface.
In the toned LED lighting device, the range of the amber or white color temperature may be 1700K to 5500K.
In the color-matching LED lighting device, the input power can be 100 W or more, and the color-matching range can be 1400 K to 7500 K.
In the color-matched LED lighting device, the ratio of the number of LED chips emitting blue light to the number of LED chips emitting amber color or white may be 1:10 to 10: 1.

  According to the present invention, it is possible to provide a toning LED lighting device and a lighting fixture with a large amount of light, which solve the problems of color unevenness and outline tint.

It is a top view of the LED lighting apparatus which concerns on the example of a 1st embodiment. It is side surface sectional drawing of the LED lighting apparatus which concerns on the example of a 1st embodiment. (A) It is side surface sectional drawing which shows an example of the module which mounted the surface electrode LED element, (b) It is side sectional drawing which shows an example of the module which mounted the vertical electrode LED element. It is a top view for demonstrating the LED chip arrange | positioned along the outline of a light emission surface. It is a block diagram which shows the LED lighting apparatus which concerns on the example of a 1st embodiment. It is a graph which shows the relationship between the power supply of a power supply device, and color temperature. It is a graph which shows the relationship between the power supply of a power supply device, and a color coordinate. It is a reference graph which shows the relationship between the LED chip to be used and a color coordinate. It is a top view of the LED lighting apparatus which concerns on the example of 2nd embodiment. It is side surface sectional drawing of the LED lighting apparatus which concerns on the example of 2nd embodiment.

Hereinafter, the present invention will be described based on examples.
[First Embodiment]
FIG. 1 is a plan view of an LED lighting device 1 according to a first embodiment of the present invention. The LED lighting device 1 mainly comprises a light emitting surface 2, a mounting substrate 3, a cathode electrode 5, an anode electrode 6, and a toning controller (not shown), and emits white light. It is a lighting device.

The light emitting surface 2 is a planar light source in which 145 LED chips are arranged in an array, and eight sets of blue lines extending in the vertical direction (hereinafter referred to as “longitudinal direction”) in FIG. It has nine sets of extending amber color lines. The respective color lines are arranged in parallel in the order of white, blue, white, blue ... white from the left in the left-right direction (hereinafter referred to as "horizontal direction") in FIG.
The blue lines are arranged along the same straight line, and consist of eight blue LED chips 11 connected in series, and the amber lines are arranged along the same straight line and nine amber color LED chips connected in series It consists of twelve. The respective color lines are connected in parallel to constitute a color module, and each color module is connected to two power supplies of the same specification one by one (blue 8 series × 8 parallel + amber color 9 series × 9 parallel).

  In the rows of the LED chips arranged in the lateral direction, the LED chips in the vertically adjacent rows are arranged in a staggered manner. In the row (color line) of the LED chips arranged in the vertical direction, the LED chips in the rows adjacent in the left-right direction are arranged in a zigzag shape. The light emitting surface 2 is not partitioned, and 145 LED chips are arranged at substantially equal intervals. Further, in the light emitting surface 2, the 145 LED chips 11 to 12 are arranged symmetrically in the vertical and horizontal directions, so that the problem of color unevenness does not occur.

FIG. 2 is a side cross-sectional view of the LED lighting device 1 according to the first embodiment.
The mounting substrate 3 is a substrate made of a material excellent in thermal conductivity in which the donut phenomenon does not occur, and is made of, for example, a copper plate or an aluminum plate. The mounting substrate 3 is sufficient as long as at least the surface is made of a metal material, for example, a heat spreader of a water cooling structure whose surface is made of copper (a laminated structure made of three types of copper plates: upper plate, middle plate and lower plate). Reference) may be used.
The back surface of the mounting substrate 3 according to the first embodiment is bonded to a heat sink (not shown) via an adhesive layer. As the adhesive layer, a high thermal conductive adhesive or a bonding sheet having an insulating property can be used.

On the surface of the mounting substrate 3, a reflective layer 7 that reflects the light emitted from the LED chips 11 to 12 is formed. The reflective layer 7 is, for example, a silver plating layer or an ink comprising white inorganic powder (white inorganic pigment) and silicon dioxide (SiO ₂ ) as main components and mixed with a solvent of diethylene glycol monobutyl ether containing organic phosphoric acid. Are coated by screen printing or the like and then fired to form an inorganic white insulating layer. In addition, the recessed part in which the reflection layer 7 is not formed may be provided in the mounting place of LED chip 11-12, and LED chip 11-12 may be directly die-bonded on the upper surface of the mounting substrate 3. FIG.

  Cathode electrodes 5a and 5b, anode electrodes 6a and 6b, dam members 8, cathode wires 15a and 15b, and anode wires 16a and 16b are disposed on the top surface of the mounting substrate 3. The mounting substrate 3 may be provided with a temperature sensor for monitoring the substrate temperature.

The blue LED chip 11 is, for example, an LED bare chip using a gallium nitride based semiconductor, and has a peak emission wavelength at 445 nm to 470 nm including a near blue region. The amber LED chip 12 is, for example, an LED bare chip using an AlInGaP-based semiconductor, and has a peak emission wavelength at 570 nm to 610 nm. From another point of view, the amber LED chip 12 can use a white chip that emits white light (for example, a correlated color temperature (CCT) of 2600 K to 5500 K). The LED chips of the same color have the same specifications.
The LED chip 11 is a surface electrode LED element connected by wire bonding of a gold wire (see FIG. 3A), the upper electrode of the LED chip 12 is connected by wire bonding of a gold wire, and the bottom electrode is die bonded Vertical electrode LED elements connected by (Refer FIG.3 (b)). The LED chip 11 is adhered by applying a die attach agent (silicon based) to the bottom, and the LED chip 12 is adhered by applying silver paste or solder paste to the bottom.

The wiring method of the LED chips 11 to 12 is not limited to the combination of the examples, and for example, all the LED chips may be configured by surface electrode LED elements, or all the LED chips may be configured by vertical electrode LED elements. it can. In the present embodiment, since the types of LED chips commercially available are limited, the combination of the illustrated LED chips is adopted.
The LED chips 11 to 12 are mounted at high density in the LED mounting area of the mounting substrate 3. More specifically, LED chips 11 to 12 each measuring 1.15 mm or less in height and width are mounted in a 33 mm × 33 mm LED mounting area in the dam. The maximum rated current of the LED chip 11 is 350 mA, and the total luminous output is 108.80 W. The maximum rated current of the LED chip 12 is 350 mA, and the total luminous output is 129.60 W.

A chip arrangement for improving the color of the outline of the light emitting surface 2 will be described.
In FIG. 4, 36 LED chips 11 to 12 arranged along the outline (outer edge) of the octagonal light emitting surface 2 are shown surrounded by dotted lines. In the present embodiment, 28 pieces of the 36 LED chips arranged along the outline (outer edge) of the light emitting surface 2 are configured by the amber LED chip 12. As described above, in the present embodiment, by configuring 70% or more of the plurality of LED chips disposed along the contour (outer edge) of the light emitting surface 2 with the amber LED chip 12, the contour of the light emitting surface is obtained. By lowering the color temperature, it is possible to realize a light emitting surface of the same color as incandescent and halogen lamps.
The badness of the tint of the contour of the light emitting surface 2 is particularly noticeable in the illumination used by attaching a lens like a spotlight, but according to the LED lighting device 1 of the present embodiment, the color of the contour of the light emitting surface 2 The taste is good.
The light emitting surface 2 is formed in an octagonal shape so as to realize a light emitting surface close to a circle like a conventional spotlight.

The area where the LED chips 11 to 12 are mounted is surrounded by a dam material 8 at least the surface of which is provided with light reflectivity. The dam material 8 prevents the flow of the sealing resin at the time of manufacture, and is made of a resin, a metal material or the like. Inside the dam material 8 is provided a translucent resin portion 9 formed by filling and curing a translucent resin (for example, an epoxy resin, a silicone resin, an acrylic resin).
In the translucent resin portion 9, green phosphors and red phosphors are dispersed. A nitride-based, oxynitride-based, oxide-based, and sulfide-based phosphor can be used as the phosphor of the present embodiment. For example, a LuAG-based phosphor which is a green phosphor represented by the chemical formula Lu ₃ Al ₅ O ₁₂ : Ce, a SCASN-based phosphor which is a red phosphor represented by a chemical formula (Sr, Ca) AlSiN ₃ : Eu, a chemical formula CASN-based phosphor which is a red phosphor represented by CaAlSiN ₃ : Eu, scandium oxide phosphor which is a green phosphor represented by a chemical formula CaSc ₂ O ₄ : Ce, green phosphor represented by a chemical formula SiAlON: Eu Also included are sialon-based phosphors. From another point of view, for example, the LED chip is a gallium nitride-based compound semiconductor and comprises at least one element selected from the group consisting of Y, Lu, Sc, La, Gd and Sm, and Al, Ga and In. A first resin layer containing at least one element selected from the group and containing a garnet-based phosphor bound by cerium, and a first resin layer formed on the first resin layer and containing no phosphor An LED light emitting device comprising two resin layers is also included in the present invention. Here, as the gallium nitride-based compound semiconductor (general formula In _i Ga _j Al _k N, where 0 ≦ i, 0 ≦ j, 0 ≦ k, i + j + k = 1), GaN doped with InGaN or various impurities is used. Initially, various ones can be used. In this embodiment, a red phosphor having a peak emission of 620 to 645 nm and a green phosphor (or a yellow-green phosphor) represented by a chemical formula Lu ₃ Al ₅ O ₁₂ : Ce ²⁺ having a peak emission of 515 to 560 nm It was used.

  The translucent resin part 9 of a preferable aspect consists of resin (For example, resin containing a dispersing agent substantially equivalent to fluorescent substance and a resin which prevents sedimentation of fluorescent substance), The fluorescent substance is a substance in the said resin. A state of being uniformly dispersed is maintained for a long time (for example, 4 hours or more). In the light-transmissive resin portion 9 made of such resin, the amount of phosphor on the chip can be stabilized without performing fine control such as a leaving time after resin filling and a heat curing time, and the resin Even if there is a slight inclination during curing, the viscosity of the resin does not cause any bias in the distribution of the phosphors.

  The color-adjusting controller achieves a desired correlated color temperature by controlling the value of current supplied to the blue module consisting of 64 blue LED chips 11 and the amber color module consisting of 81 amber color LED chips 12 Is possible. The ratio of the LED chip constituting the blue module to the LED chip constituting the amber color module is not limited to the exemplified one, and it is disclosed that, for example, 1:10 to 10: 1.

  Here, FIG. 5 is a block diagram showing a configuration of the LED lighting device 1 according to the first embodiment. As described above, the light emitting surface 2 includes a blue module (8 series × 8 parallel) consisting of 8 blue lines in which 8 blue LED chips 11 are connected in series, and 9 amber color LED chips 12 An amber color module (9 series × 9 parallel) consisting of 9 amber color lines connected in series is installed. As shown in FIG. 5, the power supply device 30 a is connected to the blue module made up of the blue LED chip 11 and supplies power to the blue LED chip 11. Further, the power supply device 30 b is connected to an amber color module including the amber color LED chip 12 and supplies power to the amber color LED chip 12.

  The color-adjusting controller 40 is electrically connected to the power supply 30a and the power supply 30b, and controls the outputs of the power supply 30a and the power supply 30b in order to adjust the color temperature of the light emitting surface 2. For example, when the color temperature of the illumination of the light emitting surface 2 is to be increased, the toning controller 40 controls the output of the power supply device 30a to increase the power supplied to the blue LED chip 11 having a high color temperature. The output of the power supply device 30b is controlled to lower the power supplied to the amber color LED chip 12 having a low color temperature. Conversely, when the color temperature of the illumination of the light emitting surface 2 is lowered, the toning controller 40 controls the output of the power supply device 30a to lower the power supplied to the blue LED chip 11 having a high color temperature, The output of the power supply device 30b is controlled to increase the power supplied to the amber color LED chip 12 having a low color temperature.

  Here, the inventor conducted the following experiment in order to grasp the relationship between the supplied power of the power supply device and the color temperature. Specifically, illumination with a blue LED chip covered with a fluorescent paint-containing resin and a color temperature of 6000 K was connected to one power supply device, and a white LED chip covered with a fluorescent paint-containing resin with a color temperature of 3000 K Connected to the power supply of And the color temperature of the whole LED lighting was measured, changing the power supply (power consumption) of each power supply device. In addition, in order to verify the change of the color temperature according to the substrate temperature, the color temperature was measured when the substrate temperature is 25 ° C. and when the substrate temperature is 60 ° C. In the present embodiment, the substrate temperature was adjusted by the water cooling jacket method.

  FIG. 6 is a graph showing the relationship between the supplied power and the color temperature of the power supply device, and FIG. 7 is a reference graph showing the relationship between the supplied power and the color coordinates of the power supply device. As shown in FIG. 6, in the items 1 to 4, only the power supply of the 3000K LED was changed while keeping the supply power of the 6000K LED zero. In this case, the color temperature of the entire LED lighting device only changes in a narrow range of 3132 to 3244 K when the substrate temperature is 25 ° C., for example. In items 12 to 14, only the supply power of the 6000K LED chip is changed while the supply power of the 3000K LED chip is zero, but also in this case, for example, when the substrate temperature is 25 ° C. The color temperature changed in a narrow range of 5880 to 5699K. On the other hand, as shown in items 5 to 11, when power is supplied to the 3000K and 6000K LED chips, for example, the substrate temperature is 25 ° C. by changing the power supplied to the 3000K and 6000K LED chips. It has been found that the color temperature can be controlled in a wide range of 3403 to 5520. That is, as in the LED lighting device 1 according to the present embodiment, the blue LED chip and the amber LED chip are provided, and power is controlled and supplied to the LED chips of the respective colors by different power systems. It has been found that the temperature can be controlled over a wide range. As shown in FIG. 6, when the substrate temperature is 60 ° C., items 1 to 14 have the same tendency as the case where the substrate temperature is 25 ° C., and almost no difference in color temperature depending on the substrate temperature is seen The

  In the example shown in FIGS. 6 and 7, since the experiment is performed using the LED illumination of 3000 K and the LED illumination of 6000 K, the color temperature can be adjusted in the range of approximately 3000-6000 K. The composition is not limited to the configuration, and the color temperature can be controlled in the range of approximately 1400 to 7500 K by the preparation of the used LED chip and the phosphor.

  FIG. 8 is a reference graph showing the relationship between the LED chip used and the color coordinates. When the light emitting surface on which the blue LED chip and the amber LED chip are mounted is covered with a translucent resin containing a green phosphor and a red phosphor, and the phosphor is compounded so that the emission color of the blue LED chip is 7500K. The light emission color of the amber LED chip is 1400 K, and the toning range is 1400 K to 7500 K (the toning range of (A) in FIG. 8). When the light emitting surface on which the blue LED chip and the white LED chip (bulb color) are mounted is covered with the same light transmitting resin containing the same phosphor as described above, the light emitting color of the white LED is 2800 K and the toning range is 2800 K to 7500 K (The toning range of (B) in FIG. 8). In addition, when the light emitting surface on which the blue LED chip and the amber LED chip are mounted is covered with a translucent resin prepared by preparing a phosphor so that the emission color of the blue LED chip is 3000K, the toning range is 1400K to 3000K. (The toning range of (C) in FIG. 8). As described above, the color matching range can be arbitrarily controlled by the combination of the LED chip and the phosphor used. Note that although color coordinates are displayed in grayscale in FIG. 7 and FIG. 8 for convenience, in the case of actual color display, it is from the reddish color such as sunset or sunrise to sunlight in the daytime It can be seen that the colors up to the color can be toned.

The LED lighting device 1 according to the first embodiment described above can provide a toning light source which is a single light source and does not cause color unevenness such as a multi light source. Moreover, the problem of color unevenness is solved by arranging the LED chip groups of two colors consisting of approximately the same number of LED chips in high density in a staggered arrangement, and the amber color LED chips are arranged along the outer edge of the light emitting surface It was confirmed that the outline of the color similar to that of the halogen spotlight can be reproduced, and the quality is sufficiently satisfactory as stage lighting.
In addition, since a desired correlated color temperature can be realized with a large amount of light and high luminance, it can be applied to various applications. For example, when used as a light source for inspection of a car body or car interior, it is close to sunlight Since a spectrum can also be realized, simulation and inspection in an outdoor light environment can also be performed.
Although the octagonal light emitting surface 2 is illustrated in the present embodiment, the light emitting surface 2 is also along the outer edge of the light emitting surface 2 even when the light emitting surface 2 is a polygon such as a quadrangle or a hexagon, or circular or elliptical. Placing an amber-colored LED chip or a white LED chip is effective in reproducing an outline of the same color as an incandescent lamp or the like. In the case where the light emitting surface 2 is a polygon having an even number of angles, the blue LED chip 11 and the amber LED chip 12 are arranged in line symmetry with the vertical center line and the horizontal center line in the light emitting surface 2 In this embodiment, the majority of the plurality of LED chips (preferably 60% or more, more preferably 70% or more) disposed along the outer edge of the light emitting surface 2 is the amber LED chip 12. The same effect as that of the example is achieved.

Second Embodiment
Next, the LED lighting device 1a according to the second embodiment will be described. FIG. 9 is a plan view of the LED lighting device 1a according to the second embodiment, and FIG. 10 is a side cross-sectional view of the LED lighting device 1a according to the second embodiment. The LED illumination device 1a according to the second embodiment is different from the LED illumination device 1 according to the first embodiment in that the LED illumination device 1a according to the second embodiment has the light emitting surface 2a, except for the LED illumination device 1 according to the first embodiment. And operate in the same manner.

  As shown in FIG. 9, the light emitting surface 2a is rectangular in plan view, and the LED chips 11 and 13 are arranged at high density in a staggered arrangement. Since the LED chip 11 is the same chip as the blue LED chip 11 of the first embodiment, the description is omitted. On the other hand, as shown in FIG. 10, the LED chip 13 is a white LED chip configured by forming the phosphor layer 14 on the blue LED chip 11. The blue LED chip 15 constituting the LED chip 13 may be the same chip as the blue LED chip 11 of the first embodiment or may be a different chip.

The phosphor layer 14 is made of a translucent resin in which phosphors having a white (580 to 630 nm) peak emission of a light bulb color are dispersed and disposed. In the present embodiment, the phosphor layer 14 is configured by dispersing and arranging a red phosphor and a yellow phosphor. As the red phosphor, the same phosphor as in the first embodiment can be used. Also, as a yellow phosphor, for example, a YAG-based phosphor (chemical formula Y ₃ Al ₅ O ₁₂ : Ce) in which crystals of garnet structure composed of a composite oxide of yttrium and aluminum are mixed (chemical formula Y ₃ Al ₅ O ₁₂ : Ce), chemical formula La ₃ An LSN-based phosphor represented by Si ₆ N ₁₁ : Ce can be used.

  In the present embodiment, after the phosphor layer 14 is formed on the blue LED chip 15 to constitute the LED chip 13 and the phosphor layer 14 is cured, the green phosphor is used as in the first embodiment. A translucent resin in which the red phosphors are dispersed is filled in the dam material 8 to form a translucent resin portion 9.

  As described above, in the light emitting surface 2 a according to the second embodiment, the blue LED chip 11 and the LED chip 13 in which the phosphor layer 14 is formed on the blue LED chip 15 are disposed. In the present embodiment, the blue LED chip 11 can emit light with a color temperature of 6500 K to the outside, and the LED chip 13 can emit light with a color temperature of 2700 K to the outside. It is not limited to the configuration.

  Thus, in the LED lighting device 1a according to the second embodiment, only one type of blue LED chip 11 is used, but like the amber LED chip 12 of the first embodiment, the contour of the light emitting surface 2a is used. By constituting 70% or more of the LED chips arranged along with the LED chip 13 with the color temperature reduced by forming the phosphor layer 14 on the blue LED chip 11, as in the first embodiment, It is possible to realize a light emitting surface of the same color as incandescent and halogen lamps. In particular, in the LED lighting device 1a according to the second embodiment, the color of the outline is further improved by configuring all the LED chips arranged along the outline of the light emitting surface 2a with the LED chip 13. it can.

  As mentioned above, although the preferable embodiment of this invention was described, the technical scope of this invention is not limited to the description of the said embodiment. Various modifications and improvements can be added to the embodiment described above, and modifications in which such modifications or improvements are added are also included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 2 Light emission surface 3 Mounting substrate 4 Printed wiring board 5 Cathode electrode 6 Anode electrode 7 Reflective layer 8 Dam material 9 Translucent resin part 11 Blue LED chip 12 Amber color LED chip 15 Cathode wiring 16 Anode wiring

Claims (8)

A substrate, a dam formed on the substrate, a light emitting surface composed of a large number of LED chips disposed in the dam and mounted on the same plane, and a translucent resin portion filled in the dam; A color matching LED lighting apparatus comprising a wiring layer and a color matching controller,
The light-transmissive resin portion includes a red phosphor and a green phosphor dispersed and disposed,
What is claimed is: 1. A color-matched LED lighting apparatus comprising: a plurality of LED chips, the LED chip emitting blue light, and the LED chip emitting amber color or white light. An LED chip that emits amber color or white light is configured of an LED chip that emits blue light and a chip top phosphor layer that covers the top surface of the LED chip,
The toning LED lighting device according to claim 1, wherein the chip top phosphor layer includes dispersed red phosphors and yellow phosphors.   The toning LED lighting device according to claim 1 or 2, wherein a majority of the LED chips disposed along the outer edge of the light emitting surface are configured by LED chips emitting amber color or white. The light emitting surface is a polygon with an even number of angles,
The LED chip according to claim 3, wherein all of the LED chips which constitute the outer edge of the light emitting surface and are arranged along the two opposing sides are LED chips emitting amber color or white color. Toning LED lighting device.   5. The toning LED light according to claim 3, wherein the plurality of LED chips are arranged in line symmetry with respect to a vertical center line and / or a horizontal center line of the light emitting surface. apparatus.   The toning LED lighting device according to any one of claims 1 to 5, wherein the range of the amber or white color temperature is 1700K to 5500K.   The toning LED lighting device according to any one of claims 1 to 6, wherein input power is 100 W or more, and a toning range is 1400K to 7500K.   The ratio of the number of LED chips emitting blue light and the number of LED chips emitting amber color or white is 1:10 to 10: 1, according to any one of claims 1 to 7, Toning LED lighting device.