CN210073908U

CN210073908U - LED packaging body and LED lamp

Info

Publication number: CN210073908U
Application number: CN201921000848.9U
Authority: CN
Inventors: 高春瑞; 郑剑飞; 官小飞; 郑文财
Original assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Current assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-02-14
Anticipated expiration: 2029-06-28

Abstract

The utility model provides a LED packaging body and have LED lamps and lanterns of this LED packaging body, the LED packaging body includes: the LED chip comprises a packaging support, an LED chip, a silica-silica gel composite layer, a first fluorescent glue layer, a transparent silica gel layer and a second fluorescent glue layer, wherein the silica-silica gel composite layer is pasted on the packaging support and covers the light emitting surface and the side face of the LED chip, and the first fluorescent glue layer, the transparent silica gel layer and the second fluorescent glue layer are sequentially arranged on the surface of the silica-silica gel composite layer in a stacking mode. Through the LED packaging body that this scheme provided, holistic light-emitting effect and light output volume homoenergetic can obtain better promotion.

Description

LED packaging body and LED lamp

Technical Field

The utility model relates to the field of lighting, concretely relates to LED packaging body and have LED lamps and lanterns of this LED packaging body.

Background

The light emitting diode, abbreviated As LED, refers to a semiconductor diode made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. and capable of converting electric energy into light energy. In the field of illumination, the LED chip needs to be packaged into an LED package, and then the LED package is applied to different lamp finished products. The great heat productivity of the LED is a great problem which is not overcome in the prior art.

In the LED packaging body, generally including the packaging support, seal the LED chip on the packaging support and cover the fluorescent glue of LED chip admittedly, because of the LED chip is kept apart and is sealed admittedly, so the mode of the outside heat transfer of LED chip is mainly heat-conduction and heat radiation, what conventional LED packaging body adopted is the form of even coating, encapsulate the lamp pearl after phosphor powder and glue homogeneous mixing promptly, phosphor powder at this moment is evenly distributed in the inside of lamp pearl, under the heat radiation effect of heat source (chip), the heat conduction effect of colloid, the phosphor powder temperature is high, some is up to 150 ℃. The excitation efficiency of the fluorescent powder is reduced along with the rise of the temperature of the lamp beads, so that the brightness of the whole lamp is reduced when the lamp is thermally stable.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model provides a LED packaging body and have LED lamps and lanterns of this LED packaging body can effectively improve above-mentioned problem.

In order to achieve the above purpose, the utility model provides a technical scheme as follows:

an LED package, comprising: the LED chip comprises a packaging support, an LED chip, a silica-silica gel composite layer, a first fluorescent glue layer, a transparent silica gel layer and a second fluorescent glue layer, wherein the silica-silica gel composite layer is pasted on the packaging support and covers the light emitting surface and the side face of the LED chip, and the first fluorescent glue layer, the transparent silica gel layer and the second fluorescent glue layer are sequentially arranged on the surface of the silica-silica gel composite layer in a stacking mode.

Furthermore, the surface of the silicon dioxide-silica gel composite layer is 0.05-0.1mm higher than the light emergent surface of the LED chip.

Further, the packaging support is provided with a bowl cup or a dam, and the LED chip, the silica-silica gel composite layer, the first fluorescent adhesive layer, the transparent silica gel layer and the second fluorescent adhesive layer are all arranged in the bowl cup or the dam.

An LED lamp at least comprises the LED packaging body.

Through the utility model provides a technical scheme has following beneficial effect:

compared with the common silica gel packaging adhesive, the silica-silica gel composite layer has strong heat conduction capability, can more timely and quickly conduct heat emitted by the LED chip to the packaging support, and reduces the heat conducted to the first fluorescent adhesive layer or the second fluorescent adhesive layer; the first fluorescent glue layer forms a barrier for reducing the heat radiation of the LED chip (namely, the barrier can absorb the light emitted by the LED chip and convert the light), and can effectively prevent the heat radiation of the LED chip from acting on the second fluorescent glue layer; transparent silica gel layer heat conductivity between first fluorescence glue film and second fluorescence glue film is relatively poor, provide a low thermal conductivity's transparent glue passageway, reduce the heat conduction effect, slowed down the heat that conducts to second fluorescence glue film through heat-conducting mode, and then can effectively reduce the temperature of second fluorescence glue film, the light that the LED chip sent can be guaranteed on the one hand to the second fluorescence glue film obtains fully arousing, guarantee the excitation efficiency and the light yield of phosphor powder, on the other hand, can be under the light efficiency prerequisite of first fluorescence glue film, the whole light efficiency is adjusted or is improved to the phosphor glue of rethread adjustment second fluorescence glue film.

The silica-silica gel composite layer can realize uniform diffusion of light under the action of silica particles, so that the light distribution of the whole light is better.

All the fluorescent powder (the first fluorescent glue layer and the second fluorescent glue layer) is arranged above the LED chip, so that the utilization rate of the fluorescent powder is improved.

Through the LED packaging body that this scheme provided, holistic light-emitting effect and light output volume homoenergetic can obtain better promotion.

Drawings

FIG. 1 is a schematic diagram of an embodiment of an LED package;

FIG. 2 is a first schematic view illustrating an embodiment of an LED package;

FIG. 3 is a second schematic view illustrating the packaging of an LED package according to an embodiment;

fig. 4 is a third schematic view illustrating an LED package according to an embodiment.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

Referring to fig. 1 to 4, the present embodiment provides an LED package, including: the LED packaging structure comprises a packaging support 10, an LED chip 20, a silica-silica gel composite layer 30, a first fluorescent glue layer 40, a transparent silica gel layer 50 and a second fluorescent glue layer 60, wherein the silica-silica gel composite layer 30 is pasted on the packaging support 10 and covers the light emitting surface and the side face of the LED chip 20, and the first fluorescent glue layer 40, the transparent silica gel layer 50 and the second fluorescent glue layer 60 are sequentially arranged on the surface of the silica-silica gel composite layer 30 in a stacking mode.

Compared with the common silica gel packaging adhesive, the silica-silica gel composite layer 30 has strong heat conductivity, can more timely and quickly conduct the heat emitted by the LED chip 20 to the packaging support 10, and reduces the heat conducted to the first fluorescent adhesive layer 40 or the second fluorescent adhesive layer 60; the first phosphor layer 40 forms a barrier that reduces the thermal radiation of the LED chip (i.e., absorbs and converts the light emitted by the LED chip 20), and effectively prevents the thermal radiation of the LED chip 20 from being applied to the second phosphor layer 50; the heat conductivity of the transparent silica gel layer 50 between the first fluorescent adhesive layer 40 and the second fluorescent adhesive layer 60 is poor, a transparent glue channel with low heat conductivity is provided, the heat conduction effect is reduced, the heat conducted to the second fluorescent adhesive layer 60 through a heat conduction mode is slowed down, the temperature of the second fluorescent adhesive layer 60 can be effectively reduced, the second fluorescent adhesive layer 60 can ensure that light emitted by the LED chip 20 is fully excited on the one hand, the excitation efficiency and the light output quantity of fluorescent powder are ensured, on the other hand, the whole light efficiency can be adjusted or improved through adjusting the fluorescent glue of the second fluorescent adhesive layer 60 on the premise of the light efficiency of the first fluorescent adhesive layer 40.

The first fluorescent adhesive layer 40 and the second fluorescent adhesive layer 60 can both play a role in excitation conversion, meanwhile, the first fluorescent adhesive layer 40 also mainly plays a role in shielding heat radiation, and the second fluorescent adhesive layer 60 also mainly plays a role in adjustment optimization.

Meanwhile, the silica-silica gel composite layer 30 can also realize uniform diffusion of light under the action of silica particles, so that the overall light distribution is better.

All the fluorescent powder (the first fluorescent glue layer 40 and the second fluorescent glue layer 60) is arranged above the LED chip 20, so that the utilization rate of the fluorescent powder is improved.

Through the LED packaging body of this scheme, holistic light-emitting effect and light output volume homoenergetic can obtain better promotion.

Specifically, in this embodiment, the LED chip 20 is a blue LED chip, and forms white light by the action of the fluorescent glue (the first fluorescent glue layer 40 and the second fluorescent glue layer 60). Of course, in other embodiments, other LED chips and fluorescent glue may be used.

Specifically, in this embodiment, the package support 10 is a package support that is conventionally used for packaging the LED chip 20, and in order to ensure thermal conductivity, in this embodiment, a metal package support with a good thermal conductivity is preferred; of course, in other embodiments, the present invention is not limited to this, and a package holder made of a ceramic material or a glass material may be used. The LED chip 20 is fixed and sealed on the package support 10 in a manner that the LED chip 20 is fixed and crystallized on the package support 10 by silver paste or solder paste, and then electrically connected with an electrode of the package support 10 by a bonding wire; or the electrodes of the LED chip 20 are directly and electrically connected with the electrodes of the packaging support 10 in a flip-chip mode; the above are conventional technologies, and are not described in detail herein.

Specifically, the silica-silica gel composite layer 30 is formed by mixing silica particles and silica gel according to a certain ratio, and the silica-silica gel composite layer obtained by the mixing preparation method is the prior art and will not be described in detail herein.

Further, in this embodiment, the surface of the silicon dioxide-silica gel composite layer 30 is 0.05-0.1mm higher than the light-emitting surface of the LED chip 20. At this time, a space close to half of the thickness of the LED chip 20 is left on the surface of the LED chip 20 away from the surface of the silica-silica gel composite layer 30, so as to extend the thermal conduction distance and reduce the upward thermal conduction heat.

Further, in this embodiment, the package support 10 is a package support having a bowl or a dam, and the LED chip 20, the silica-silica gel composite layer 30, the first fluorescent adhesive layer 40, the transparent silica gel layer 50 and the second fluorescent adhesive layer 60 are all disposed in the bowl or the dam. The molding is good and the collapse is not easy to happen. Preferably, the package support 10 is provided with a bowl 11, the bowl 11 is in contact connection with the substrate of the package support 10, the heat conductivity is good, and better heat conduction is realized.

Further, in this embodiment, the structure of the first fluorescent glue layer 40 and the transparent silica gel layer 50 is obtained by centrifuging the fluorescent glue layer to precipitate the fluorescent powder, that is, during the preparation, a fluorescent glue layer is coated on the surface of the silica-silica gel composite layer 30, and then the fluorescent powder of the fluorescent glue layer is precipitated to the lower layer by centrifuging (prior art) to form the first fluorescent glue layer 40, and the upper layer becomes the transparent silica gel layer 50.

Adopt centrifugal mode to make the phosphor powder deposit to the first phosphor glue layer 40 of bottom formation understructure for the phosphor powder of first phosphor glue layer 40 is inseparable, forms the barrier of a thermal radiation that reduces the blue light, and the phosphor powder of second phosphor glue layer 60 is used to the thermal radiation of more effective prevention blue light, reduces the temperature of the phosphor powder of second phosphor glue layer 60.

Meanwhile, when the fluorescent powder is centrifugally precipitated, the silica particles of the silica-silica gel composite layer 30 can also play a role in supporting and blocking, and the fluorescent powder is prevented from centrifugally permeating into the silica-silica gel composite layer 30, so that the silica-silica gel composite layer 30 does not need to be baked and cured in advance, the preparation steps are simplified, and the efficiency is improved.

Of course, in other embodiments, other manners may also be adopted, such as attaching the first fluorescent glue layer 40 of the lower layer structure and the transparent silicone glue layer 50 of the upper layer structure respectively.

The experimental data are illustrated below:

taking two equal parts of fluorescent powder with the same amount and the same proportion, and using one part of the fluorescent powder for packaging a conventional LED, namely directly packaging the fluorescent powder into an LED packaging body 1 by using fluorescent glue; the other part was used for the LED package 2 prepared in this scheme. In the LED package 1 and the LED package 2, other components such as a package support and an LED chip are the same except for different structural layers.

The LED packaging body 1 and the LED packaging body 2 are used for testing cold state data and hot state data of a region, the cold state data refer to testing photoelectric parameters when the temperature of the lamp beads is not increased to be thermally stable, the hot state data refer to testing data after the temperature of the lamp beads reaches thermal stability, and specifically, the hot state temperature is 105 ℃.

Wherein, table 1 is the cold data of the LED package 1; table 2 is thermal state data of the LED package 1; table 3 shows cold data of the LED package 2; table 4 shows thermal state data of LED package 2.

Table 1 cold data for LED package 1

Serial number	Luminous flux lm	Color rendering index Ra	Color temperature CCT
				1	120.1	83.3	2901
2	119.4	83.1	2911
				3	121.2	83.5	2920
5	122.2	82.9	2911
				6	120.4	83.2	2914
7	118.3	83	2890
				8	119.5	83.2	2897
Mean value of	120.16	83.17	2906

Table 2 thermal state data of LED package 1

Serial number	Luminous flux lm	Color rendering index Ra	Color temperature CCT
				1	94.99	84	3133
2	94.92	84.2	3143
				3	96.48	84.3	3153
5	96.92	84.1	3143
				6	95.41	83.9	3147
7	93.59	84.3	3121
				8	94.88	84.1	3128
Mean value of	95.31	84.13	3138

For the LED package 1 luminous flux: the ratio of the hot state data to the cold state data is: 95.31/120.16 is 79.32%.

Table 3 cold data for LED package 2

Serial number	Luminous flux lm	Color rendering index Ra	Color temperature CCT
				1	123.1	83	2896
2	120.4	8.1	2884
				3	125.2	83.0	2924
5	124.2	82.7	2912
				6	120.4	83.0	2904
7	122.3	83.1	2889
				8	122.5	83.0	2900
Mean value of	122.59	82.99	2901

Table 4 thermal state data for LED package 2

Serial number	Luminous flux lm	Color rendering index Ra	Color temperature CCT
				1	98.60	84.1	3127
2	96.48	84	3114
				3	100.35	84.2	3157
5	99.61	83.8	3144
				6	96.68	83.7	3136
7	98.09	84.2	3120
				8	98.17	83.8	3132
Mean value of	98.28	83.97	3133

For the LED package 2 luminous flux: the ratio of the hot state data to the cold state data is: 98.28/122.59-80.17%.

Under the same conditions of the same fluorescent powder type, chip specification and the like, the brightness of the lamp bead (LED packaging body 2) of the utility model is higher than that of the conventional (LED packaging body 1) (122.59-120.16)/120.16 ═ 2.02%.

The thermal state maintenance rate, the utility model discloses lamp pearl (LED packaging body 2) luminance is than conventional (LED packaging body 1) high (80.17-79.32)/79.32 ═ 1.02%.

The embodiment also provides an LED lamp, which at least includes the LED package.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An LED package, comprising: the LED chip comprises a packaging support, an LED chip, a silica-silica gel composite layer, a first fluorescent glue layer, a transparent silica gel layer and a second fluorescent glue layer, wherein the silica-silica gel composite layer is pasted on the packaging support and covers the light emitting surface and the side face of the LED chip, and the first fluorescent glue layer, the transparent silica gel layer and the second fluorescent glue layer are sequentially arranged on the surface of the silica-silica gel composite layer in a stacking mode.

2. The LED package of claim 1, wherein: the surface of the silicon dioxide-silica gel composite layer is 0.05-0.1mm higher than the light emergent surface of the LED chip.

3. The LED package of claim 1, wherein: the LED packaging structure comprises a packaging support, wherein the packaging support is provided with a bowl cup or a dam, and the LED chip, a silicon dioxide-silica gel composite layer, a first fluorescent adhesive layer, a transparent silica gel layer and a second fluorescent adhesive layer are all arranged in the bowl cup or the dam.

4. An LED lamp, characterized in that: comprising at least an LED package according to any of the preceding claims 1 to 3.