CN209977759U

CN209977759U - COB light bar for backlight and backlight plate

Info

Publication number: CN209977759U
Application number: CN201920709957.1U
Authority: CN
Inventors: 李伟伟; 周波
Original assignee: Shenzhen Chi Chi Energy Saving Lighting Ltd By Share Ltd
Current assignee: Jiangxi zhaochi Guangyuan Technology Co.,Ltd.
Priority date: 2019-05-17
Filing date: 2019-05-17
Publication date: 2020-01-21
Anticipated expiration: 2029-05-17

Abstract

The utility model relates to a COB lamp strip for backlight, which comprises a lamp strip base body prefabricated with a long-strip COB substrate, wherein the length direction of the COB substrate is parallel to that of the lamp strip base body; an etching circuit is formed on the COB substrate and a plurality of LED lamp beads are packaged; the LED lamp bead comprises an LED wafer and a packaging structure for packaging the LED wafer on the COB substrate, wherein the packaging structure comprises a dam and a fluorescent glue layer, the dam is glued on the COB substrate and surrounds the LED wafer, and the fluorescent glue layer is glued in the dam. In addition still relate to a board in a poor light, including the board body in a poor light, still include a plurality of foretell COB lamp strips that are used for being shaded, each lamp strip base member is arranged in parallel and equidistant ground on one of them face of board body in a poor light. The utility model discloses a prefabricated COB base plate on the lamp strip base member, can directly encapsulate the LED wafer on this lamp strip base member, therefore can simplify the preparation technology of this COB lamp strip effectively, can not only show and improve production efficiency, supporting tool reduces correspondingly moreover to reduction in production cost such as equipment investment.

Description

COB light bar for backlight and backlight plate

Technical Field

The utility model belongs to the technical field of the illumination, concretely relates to a board in a poor light that is used for COB lamp strip in a poor light and adopts this COB lamp strip.

Background

Fig. 1 and fig. 2 show the structure of a conventional backlight COB lamp strip, and such backlight lamp strips (e.g. PCT2835/EMC3030, etc.) are all provided with lamp beads 2 mounted on a lamp strip substrate 1. The defects are as follows:

in the manufacturing process, a lamp bead packaging process and a lamp strip packaging process are included, specifically, each lamp bead 2 is packaged firstly, and then the lamp beads 2 are mounted on the lamp strip base body 1 in a pasting mode, wherein the lamp bead packaging comprises operations of die bonding, welding wire, dispensing and the like, the lamp strip packaging comprises operations of printing solder paste, mounting, reflow soldering and the like, multiple times of packaging are needed in a partition and time-sharing mode, and the process is complex; the required equipment comprises a die bonder, a wire bonder, a printer, a steel mesh, a chip mounter, a reflow oven and the like, and the required equipment investment is high.

Therefore, the COB lamp strip that is shaded currently is low in production efficiency and manufacturing cost is higher.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a be used for COB lamp strip that is shaded and adopt the board in a poor light of this COB lamp strip can solve prior art's partial defect at least.

The embodiment of the utility model relates to a COB lamp strip for backlight, which comprises a lamp strip base body prefabricated with a long-strip COB substrate, wherein the length direction of the COB substrate is parallel to that of the lamp strip base body; an etching circuit is formed on the COB substrate and a plurality of LED lamp beads are packaged;

LED lamp pearl includes the LED wafer and will the LED wafer encapsulate in packaging structure on the COB base plate, packaging structure including the point glue in just surround on the COB base plate the box dam of LED wafer and point glue in the fluorescence glue layer in the box dam.

As one of the embodiment, at least part the LED lamp pearl is flip-chip lamp pearl, the COB base plate correspondence has at least one flip-chip pad section, the LED wafer of flip-chip lamp pearl is flip-chip wafer and by the fluorescence glue film surrounds flip-chip wafer's top surface and side wall, flip-chip wafer solid brilliant on the flip-chip pad section that corresponds.

As an embodiment, the flip chip is soldered on the corresponding flip pad segment.

As one of the embodiments, at least part of the LED lamp beads are installed on the front surface of the substrate, the COB substrate is provided with at least one installed section, the LED chip of the installed lamp beads is installed on the front surface of the substrate, the fluorescent glue layer surrounds the top surface and the side wall of the installed chip, and the installed chip is fixed on the corresponding installed section.

As one embodiment, the front-mounted wafer is fixed on the corresponding front-mounted segment by a conductive adhesive or a non-conductive adhesive.

As one embodiment, the glue used for the box dam is transparent glue.

As one embodiment, the package structure further includes a transparent protective adhesive layer, and the transparent protective adhesive layer at least covers the top surface of the fluorescent adhesive layer.

In one embodiment, the transparent protective adhesive layer is a silica gel layer.

As one embodiment, along the length direction of the COB substrate, the LED lamp beads are arranged on the COB substrate at equal intervals.

The embodiment of the utility model provides a still relate to a backlight, including the backlight body, still include a plurality of as above be used for the COB lamp strip in a poor light, each the lamp strip base member parallel and equidistant ground arrange in on one of them face of backlight body.

The embodiment of the utility model provides a following beneficial effect has at least:

the utility model discloses a prefabricated COB base plate on the lamp strip base member, can directly encapsulate the LED wafer on this lamp strip base member, therefore can simplify the preparation technology of this COB lamp strip effectively, can not only show and improve production efficiency, supporting tool reduces correspondingly moreover to reduction in production cost such as equipment investment.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a conventional COB light bar provided in the background art;

FIG. 2 is a schematic structural diagram of the patch lamp bead in FIG. 1;

fig. 3 is the embodiment of the utility model provides a structural schematic of COB lamp strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Example one

As shown in fig. 3, an embodiment of the present invention provides a COB lamp strip for backlight, including a lamp strip base 100 prefabricated with a long bar-shaped COB substrate 101, wherein a length direction of the COB substrate 101 is parallel to a length direction of the lamp strip base 100; an etching circuit is formed on the COB substrate 101 and a plurality of LED lamp beads 200 are packaged; LED lamp pearl 200 includes LED wafer 201 and will LED wafer 201 encapsulate in packaging structure on the COB base plate 101, packaging structure including the point glue in just surround on the COB base plate 101 LED wafer 201's box dam 202 and point glue in the fluorescence glue layer in the box dam 202.

The COB substrate 101 is pre-fixed on the light bar substrate 100, that is, the COB substrate and the light bar substrate are connected into an integrated structure before the LED lamp bead 200 is packaged; the connection mode between the COB substrate 101 and the light bar base body 100 can be bonding, welding, or integrated into one piece. The forming method of the etching circuit and the connection relationship between the etching circuit and each LED bead 200/LED wafer 201 are conventional techniques in the art, and are not described herein again.

It is understood that, based on the above-mentioned packaging structure, the LED chip 201 is packaged by using the dam 202+ dispensing method. The LED chip 201, the fluorescent glue, etc. are all conventional materials in the art, and will not be described in detail here. The glue used for the dam 202 is preferably transparent glue.

The COB lamp strip for being shaded that this embodiment provided, through prefabricated COB base plate 101 on lamp strip base member 100, can directly encapsulate LED wafer 201 on this lamp strip base member 100, therefore can simplify the preparation technology of this COB lamp strip effectively, can not only show improvement production efficiency, supporting tool reduces correspondingly moreover to reduction in production costs such as equipment investment.

In the LED lamp bead 200, the forward-mounted LED chip 201 may be adopted, or the flip-chip LED chip 201 may be adopted.

In one of the embodiments, at least part of the LED lamp bead 200 is a flip-chip lamp bead, the COB substrate 101 correspondingly has at least one flip-chip bonding pad segment, the flip-chip lamp bead includes a flip-chip 201 and surrounds the fluorescent adhesive layer on the top surface and the side walls of the flip-chip 201, and the flip-chip 201 is die-bonded on the corresponding flip-chip bonding pad segment. The flip chip 201 is preferably soldered to the corresponding lead pad segment, but the flip chip 201 may also be die-bonded to the COB substrate 101 through a conductive adhesive or a non-conductive adhesive.

In another embodiment, at least a portion of the LED lamp beads 200 are installed on the front surface of the COB substrate 101, and the COB substrate 101 has at least one installed section, and the installed lamp beads include an installed wafer 201 and a fluorescent adhesive layer surrounding the top surface and the side walls of the installed wafer 201, and the installed wafer 201 is die-bonded to the corresponding installed section. The front-mounted wafer 201 is fixed on the corresponding front-mounted section by a conductive adhesive or a non-conductive adhesive.

It is understood that the above-mentioned flip chip 201 has the same structure as the flip chip 201, and only differs from the connection surface of the COB substrate 101, which is conventional in the art and will not be described in detail herein.

Generally, in a COB light bar, it is preferable that each LED light bead 200 employs a front-mounted LED chip 201 or a flip-chip LED chip 201, so as to facilitate production.

Wherein, to the COB lamp strip that adopts just adorning LED wafer 201, its manufacture process can include: carrying out die bonding operation on a light bar matrix 100 prefabricated with a COB substrate 101; etching a circuit on the light bar base body 100 or the COB substrate 101 to achieve the purpose of circuit communication; the dam 202 and the dispensing operation are further performed on the COB substrate 101 to complete the packaging of each LED chip 201.

For a COB light bar using the flip-chip LED chip 201, the manufacturing process may include: printing solder paste on a light bar base body 100 prefabricated with a COB substrate 101, and carrying out die bonding operation; a reflow furnace; etching a circuit on the light bar base body 100 or the COB substrate 101 to achieve the purpose of circuit communication; the dam 202 and the dispensing operation are further performed on the COB substrate 101 to complete the packaging of each LED chip 201.

Further preferably, the package structure further includes a transparent protective adhesive layer, and the transparent protective adhesive layer at least covers the top surface of the fluorescent adhesive layer. Based on the packaging structure of the dam 202+ dispensing, the transparent protective adhesive layer may be dispensed in the dam 202 and may cover the top surface and the side wall of the fluorescent adhesive layer. The fluorescent adhesive layer is surrounded by the transparent protective adhesive layer, so that the fluorescent adhesive layer can be prevented from being polluted and damaged, the light emitting quality is ensured, and the uniformity and consistency of the light emitting can be ensured for a long time in the using process of the lamp bead; by adopting the double-layer packaging structure of the transparent protective adhesive layer and the fluorescent adhesive layer, the light source has later time when the light source cracks, better temperature resistance and longer service life.

In a specific application embodiment, as shown in fig. 3, the LED beads 200 are arranged on the COB substrate 101 at equal intervals along the length direction of the COB substrate 101.

Example two

The embodiment of the utility model provides a still relate to a board in a poor light, including the board body in a poor light, still include a plurality of above-mentioned embodiments a COB lamp strip that is used for being shaded that provide, this COB lamp strip's concrete structure here is not repeated. Each light bar base body 100 is arranged on one of the plate surfaces of the backlight plate body in parallel and at equal intervals.

Generally, the backlight body is a square plate, and the length direction of each light bar base 100 is parallel to the length direction or the width direction of the backlight body.

Generally, the backlight panel can be used as a backlight panel for a television set, and the specific structure thereof is conventional in the art and will not be described herein.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a COB lamp strip for being shaded which characterized in that: the LED lamp strip comprises a lamp strip base body prefabricated with a long-strip-shaped COB base plate, wherein the length direction of the COB base plate is parallel to the length direction of the lamp strip base body; an etching circuit is formed on the COB substrate and a plurality of LED lamp beads are packaged;

2. The COB light bar for backlights of claim 1, wherein: at least part LED lamp pearl is flip-chip lamp pearl, COB base plate correspondence has at least one flip-chip pad section, the LED wafer of flip-chip lamp pearl be flip-chip wafer and by fluorescent glue layer surrounds flip-chip wafer's top surface and side wall, flip-chip wafer is brilliant admittedly on the flip-chip pad section that corresponds.

3. The COB light bar for backlights of claim 2, wherein: the flip chip is welded on the corresponding flip pad section.

4. The COB light bar for backlights of claim 1, wherein: at least part LED lamp pearl is just adorning lamp pearl, COB base plate correspondence has at least one and just adorns the section, just adorn the LED wafer of lamp pearl for just adorning the wafer and by fluorescent glue layer surrounds just adorn the top surface and the side wall of wafer, just adorn the wafer solid brilliant in corresponding just adorning on the section.

5. The COB light bar for backlights of claim 4, wherein: the front-mounted wafer is fixed on the corresponding front-mounted section through conductive glue or non-conductive glue.

6. The COB light bar for backlights of claim 1, wherein: the glue used for the box dam is transparent glue.

7. The COB light bar for backlights of claim 1, wherein: the packaging structure further comprises a transparent protective adhesive layer, and the transparent protective adhesive layer at least covers the top surface of the fluorescent adhesive layer.

8. The COB light bar for backlights of claim 7, wherein: the transparent protective glue layer is a silica gel layer.

9. The COB light bar for backlights of claim 1, wherein: follow COB base plate length direction, each LED lamp pearl is in equidistant interval arrangement on the COB base plate.

10. A backlight board, includes the backlight board body, its characterized in that: the COB light bar for the backlight further comprises a plurality of COB light bars for the backlight according to any one of claims 1 to 9, wherein the light bar matrixes are arranged on one plate surface of the backlight plate body in parallel and at equal intervals.