CN115151611A - 固化性组合物、固化物及固化性组合物的使用方法 - Google Patents

固化性组合物、固化物及固化性组合物的使用方法 Download PDF

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Publication number
CN115151611A
CN115151611A CN202180018220.5A CN202180018220A CN115151611A CN 115151611 A CN115151611 A CN 115151611A CN 202180018220 A CN202180018220 A CN 202180018220A CN 115151611 A CN115151611 A CN 115151611A
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CN
China
Prior art keywords
curable composition
group
component
carbon atoms
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180018220.5A
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English (en)
Chinese (zh)
Inventor
三浦迪
宫胁学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN115151611A publication Critical patent/CN115151611A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
CN202180018220.5A 2020-03-23 2021-03-19 固化性组合物、固化物及固化性组合物的使用方法 Pending CN115151611A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020051071 2020-03-23
JP2020-051071 2020-03-23
PCT/JP2021/011453 WO2021193452A1 (ja) 2020-03-23 2021-03-19 硬化性組成物、硬化物、及び、硬化性組成物の使用方法

Publications (1)

Publication Number Publication Date
CN115151611A true CN115151611A (zh) 2022-10-04

Family

ID=77892585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180018220.5A Pending CN115151611A (zh) 2020-03-23 2021-03-19 固化性组合物、固化物及固化性组合物的使用方法

Country Status (4)

Country Link
JP (2) JPWO2021193452A1 (https=)
CN (1) CN115151611A (https=)
TW (1) TW202142605A (https=)
WO (1) WO2021193452A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089601A (ja) * 2003-09-17 2005-04-07 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
JP2011006610A (ja) * 2009-06-26 2011-01-13 Nagase Chemtex Corp 透明複合体
JP2014208615A (ja) * 2013-03-26 2014-11-06 Jnc株式会社 アルコキシシリル基含有シルセスキオキサンおよびその組成物
JP2017008145A (ja) * 2015-06-17 2017-01-12 株式会社ダイセル 硬化性組成物、接着シート、積層物及び装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4781280B2 (ja) * 2006-01-25 2011-09-28 信越化学工業株式会社 反射防止膜材料、基板、及びパターン形成方法
JP5369553B2 (ja) * 2007-09-07 2013-12-18 東レ株式会社 シロキサン樹脂組成物、硬化物およびこれを用いた光半導体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089601A (ja) * 2003-09-17 2005-04-07 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
JP2011006610A (ja) * 2009-06-26 2011-01-13 Nagase Chemtex Corp 透明複合体
JP2014208615A (ja) * 2013-03-26 2014-11-06 Jnc株式会社 アルコキシシリル基含有シルセスキオキサンおよびその組成物
JP2017008145A (ja) * 2015-06-17 2017-01-12 株式会社ダイセル 硬化性組成物、接着シート、積層物及び装置

Also Published As

Publication number Publication date
JP2025148455A (ja) 2025-10-07
WO2021193452A1 (ja) 2021-09-30
TW202142605A (zh) 2021-11-16
JPWO2021193452A1 (https=) 2021-09-30

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