TW202142605A - 硬化性組合物、硬化物及硬化性組合物的使用方法 - Google Patents

硬化性組合物、硬化物及硬化性組合物的使用方法 Download PDF

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Publication number
TW202142605A
TW202142605A TW110109302A TW110109302A TW202142605A TW 202142605 A TW202142605 A TW 202142605A TW 110109302 A TW110109302 A TW 110109302A TW 110109302 A TW110109302 A TW 110109302A TW 202142605 A TW202142605 A TW 202142605A
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TW
Taiwan
Prior art keywords
curable composition
component
mass
group
carbons
Prior art date
Application number
TW110109302A
Other languages
English (en)
Chinese (zh)
Inventor
三浦迪
宮脇学
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202142605A publication Critical patent/TW202142605A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
TW110109302A 2020-03-23 2021-03-16 硬化性組合物、硬化物及硬化性組合物的使用方法 TW202142605A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020051071 2020-03-23
JP2020-051071 2020-03-23

Publications (1)

Publication Number Publication Date
TW202142605A true TW202142605A (zh) 2021-11-16

Family

ID=77892585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110109302A TW202142605A (zh) 2020-03-23 2021-03-16 硬化性組合物、硬化物及硬化性組合物的使用方法

Country Status (4)

Country Link
JP (2) JPWO2021193452A1 (https=)
CN (1) CN115151611A (https=)
TW (1) TW202142605A (https=)
WO (1) WO2021193452A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4301905B2 (ja) * 2003-09-17 2009-07-22 スタンレー電気株式会社 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
JP4781280B2 (ja) * 2006-01-25 2011-09-28 信越化学工業株式会社 反射防止膜材料、基板、及びパターン形成方法
JP5369553B2 (ja) * 2007-09-07 2013-12-18 東レ株式会社 シロキサン樹脂組成物、硬化物およびこれを用いた光半導体
JP2011006610A (ja) * 2009-06-26 2011-01-13 Nagase Chemtex Corp 透明複合体
JP6337336B2 (ja) * 2013-03-26 2018-06-06 Jnc株式会社 アルコキシシリル基含有シルセスキオキサンおよびその組成物
JP6652791B2 (ja) * 2015-06-17 2020-02-26 株式会社ダイセル 硬化性組成物、接着シート、積層物及び装置

Also Published As

Publication number Publication date
JP2025148455A (ja) 2025-10-07
WO2021193452A1 (ja) 2021-09-30
CN115151611A (zh) 2022-10-04
JPWO2021193452A1 (https=) 2021-09-30

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