CN115066746A - 封装结构及其制备方法和电子设备 - Google Patents

封装结构及其制备方法和电子设备 Download PDF

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Publication number
CN115066746A
CN115066746A CN202080096220.2A CN202080096220A CN115066746A CN 115066746 A CN115066746 A CN 115066746A CN 202080096220 A CN202080096220 A CN 202080096220A CN 115066746 A CN115066746 A CN 115066746A
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CN
China
Prior art keywords
chip
redistribution layer
package
layer
heat
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Pending
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CN202080096220.2A
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English (en)
Inventor
李珩
张晓东
王思敏
戚晓芸
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN115066746A publication Critical patent/CN115066746A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

提供一种封装结构(20)及其制备方法和电子设备(100)。所述封装结构(20)包括第一重布线层(21)和第一芯片(22)，所述第一重布线层(21)包括第一金属线路(212)和与所述第一金属线路(212)连接的第一导热件(213)，所述第一导热件(213)至少部分露出所述第一重布线层(21)的顶面(214)，所述第一芯片(22)的背面一侧设于所述顶面(214)，并与所述第一导热件(213)连接。提供的所述封装结构(20)具有很好的散热效果。

Description

PCT国内申请，说明书已公开。

Claims (44)

  1. PCT国内申请，权利要求书已公开。
CN202080096220.2A 2020-02-12 2020-02-12 封装结构及其制备方法和电子设备 Pending CN115066746A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/074879 WO2021159306A1 (zh) 2020-02-12 2020-02-12 封装结构及其制备方法和电子设备

Publications (1)

Publication Number Publication Date
CN115066746A true CN115066746A (zh) 2022-09-16

Family

ID=77291971

Family Applications (1)

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CN202080096220.2A Pending CN115066746A (zh) 2020-02-12 2020-02-12 封装结构及其制备方法和电子设备

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CN (1) CN115066746A (zh)
WO (1) WO2021159306A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114334945B (zh) * 2021-12-01 2024-03-08 长电科技管理有限公司 一种封装结构及制作方法
CN116130451B (zh) * 2023-04-17 2023-07-11 深圳宏芯宇电子股份有限公司 芯片封装结构及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100449740C (zh) * 2006-06-19 2009-01-07 上海集成电路研发中心有限公司 降低半导体器件发热的散热方法、相应器件及其制造方法
CN201307606Y (zh) * 2008-12-10 2009-09-09 潮州三环（集团）股份有限公司 一种新型陶瓷封装基座
US20120299173A1 (en) * 2011-05-26 2012-11-29 Futurewei Technologies, Inc. Thermally Enhanced Stacked Package and Method
CN110299329A (zh) * 2018-03-21 2019-10-01 华为技术有限公司 一种封装结构及其制作方法、电子设备
CN208819865U (zh) * 2018-08-17 2019-05-03 深南电路股份有限公司 开关管及其芯片组件
CN110767614A (zh) * 2019-10-10 2020-02-07 华为技术有限公司 封装结构和电子装置

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WO2021159306A1 (zh) 2021-08-19

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