CN115039218A - 侧填充树脂组合物、半导体装置和用于除去侧填充构件的方法 - Google Patents

侧填充树脂组合物、半导体装置和用于除去侧填充构件的方法 Download PDF

Info

Publication number
CN115039218A
CN115039218A CN202180012199.8A CN202180012199A CN115039218A CN 115039218 A CN115039218 A CN 115039218A CN 202180012199 A CN202180012199 A CN 202180012199A CN 115039218 A CN115039218 A CN 115039218A
Authority
CN
China
Prior art keywords
resin composition
filling
semiconductor device
cured product
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202180012199.8A
Other languages
English (en)
Chinese (zh)
Inventor
深本悠介
山田泰史
前田泰明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN115039218A publication Critical patent/CN115039218A/zh
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
CN202180012199.8A 2020-02-04 2021-01-29 侧填充树脂组合物、半导体装置和用于除去侧填充构件的方法 Withdrawn CN115039218A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020017382 2020-02-04
JP2020-017382 2020-02-04
JP2020077822 2020-04-24
JP2020-077822 2020-04-24
PCT/JP2021/003158 WO2021157472A1 (ja) 2020-02-04 2021-01-29 サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法

Publications (1)

Publication Number Publication Date
CN115039218A true CN115039218A (zh) 2022-09-09

Family

ID=77199536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180012199.8A Withdrawn CN115039218A (zh) 2020-02-04 2021-01-29 侧填充树脂组合物、半导体装置和用于除去侧填充构件的方法

Country Status (4)

Country Link
US (1) US20230054960A1 (https=)
JP (1) JP7591720B2 (https=)
CN (1) CN115039218A (https=)
WO (1) WO2021157472A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117099198A (zh) * 2021-04-05 2023-11-21 松下知识产权经营株式会社 侧填充用树脂组合物、半导体装置、侧填充构件的除去方法和半导体装置的制造方法
US12394767B2 (en) * 2022-09-30 2025-08-19 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices and methods of manufacturing electronic devices

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213428A (ja) * 1995-11-20 1996-08-20 Rohm Co Ltd 半導体装置の実装方法
JP2004273554A (ja) * 2003-03-05 2004-09-30 Mitsubishi Electric Corp 中空構造を有する半導体装置
JP4176619B2 (ja) * 2003-07-18 2008-11-05 信越化学工業株式会社 フリップチップ実装用サイドフィル材及び半導体装置
JP2009007467A (ja) * 2007-06-28 2009-01-15 Shin Etsu Chem Co Ltd 実装用難燃性サイドフィル材及び半導体装置
JP5161924B2 (ja) * 2010-06-25 2013-03-13 パナソニック株式会社 半導体装置
JP5996215B2 (ja) * 2012-02-28 2016-09-21 オリンパス株式会社 光電変換モジュールおよび光伝送ユニット
JP6187894B2 (ja) * 2012-09-13 2017-08-30 パナソニックＩｐマネジメント株式会社 回路装置の製造方法、半導体部品の実装構造および回路装置
JP5608211B2 (ja) * 2012-12-10 2014-10-15 パナソニック株式会社 半導体装置
TWI675080B (zh) * 2016-09-23 2019-10-21 南韓商Ｌｇ化學股份有限公司 黏著劑組成物
WO2018110550A1 (ja) * 2016-12-15 2018-06-21 ナガセケムテックス株式会社 熱硬化性樹脂組成物、光硬化性樹脂組成物、硬化物及び耐熱性向上剤
US9989713B1 (en) * 2017-03-07 2018-06-05 International Business Machines Corporation Fluid control structure
JP2019041097A (ja) * 2017-08-28 2019-03-14 日立化成株式会社 電子部品装置を製造する方法、熱プレス用シート及び熱プレス用熱硬化性樹脂組成物
KR102641596B1 (ko) * 2017-11-14 2024-02-27 가부시키가이샤 코키 보강용 수지 조성물 및 전자 부품 장치

Also Published As

Publication number Publication date
JP7591720B2 (ja) 2024-11-29
WO2021157472A1 (ja) 2021-08-12
JPWO2021157472A1 (https=) 2021-08-12
US20230054960A1 (en) 2023-02-23

Similar Documents

Publication Publication Date Title
KR100554323B1 (ko) 열경화성 수지 조성물
KR100556981B1 (ko) 전자부품
JP2005350647A (ja) 液状エポキシ樹脂組成物
JP6657104B2 (ja) 熱硬化性樹脂組成物及びその製造方法
WO2004059721A1 (ja) 電子部品装置
CN102959006B (zh) 环氧树脂组合物及半导体装置
CN115039218A (zh) 侧填充树脂组合物、半导体装置和用于除去侧填充构件的方法
JP2014094981A (ja) 半導体封止用液状エポキシ樹脂組成物とそれを用いた半導体装置
JP2009256466A (ja) 電子部品用接着剤
JP3644340B2 (ja) エポキシ樹脂組成物
JP4786964B2 (ja) 熱硬化型エポキシ樹脂組成物及びそれを用いた半導体装置
JP2010174077A (ja) 電子部品用接着剤
KR20110069393A (ko) 에폭시 수지 조성물과 이를 포함하는 밀봉제
KR20000070227A (ko) 반도체 장치의 장착 구조 및 장착방법
KR101308307B1 (ko) 언더필 밀봉제로서 유용하고 재작업성을 가지는 저발열성의열경화성 수지 조성물
TWI425020B (zh) 免清洗性經活化的樹脂組成物及使用彼進行表面貼裝的方法
JP2004204047A (ja) 液状エポキシ樹脂組成物
CN1314752C (zh) 环氧树脂组合物
CN104080829B (zh) 耐冲击性优秀的热固性环氧树脂组合物
US20240186203A1 (en) Side-filling resin composition, semiconductor device, method for removing side-filling member, and method for fabricating the semiconductor device
WO2005108483A1 (ja) 電子部品装置
KR101117757B1 (ko) 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름
JP2008085264A (ja) 半導体装置
JP2022076436A (ja) サイドフィル用樹脂組成物、半導体装置、サイドフィル材の除去方法、及び半導体装置の製造方法
JP4239645B2 (ja) 一液型エポキシ樹脂組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20220909