JP7591720B2 - サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法 - Google Patents

サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法 Download PDF

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JP7591720B2
JP7591720B2 JP2021575758A JP2021575758A JP7591720B2 JP 7591720 B2 JP7591720 B2 JP 7591720B2 JP 2021575758 A JP2021575758 A JP 2021575758A JP 2021575758 A JP2021575758 A JP 2021575758A JP 7591720 B2 JP7591720 B2 JP 7591720B2
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resin composition
substrate
fill
cured product
semiconductor device
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JPWO2021157472A1 (https=
Inventor
悠介 深本
泰史 山田
泰明 前田
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
JP2021575758A 2020-02-04 2021-01-29 サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法 Active JP7591720B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020017382 2020-02-04
JP2020017382 2020-02-04
JP2020077822 2020-04-24
JP2020077822 2020-04-24
PCT/JP2021/003158 WO2021157472A1 (ja) 2020-02-04 2021-01-29 サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法

Publications (2)

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JPWO2021157472A1 JPWO2021157472A1 (https=) 2021-08-12
JP7591720B2 true JP7591720B2 (ja) 2024-11-29

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JP2021575758A Active JP7591720B2 (ja) 2020-02-04 2021-01-29 サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法

Country Status (4)

Country Link
US (1) US20230054960A1 (https=)
JP (1) JP7591720B2 (https=)
CN (1) CN115039218A (https=)
WO (1) WO2021157472A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117099198A (zh) * 2021-04-05 2023-11-21 松下知识产权经营株式会社 侧填充用树脂组合物、半导体装置、侧填充构件的除去方法和半导体装置的制造方法
US12394767B2 (en) * 2022-09-30 2025-08-19 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices and methods of manufacturing electronic devices

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273554A (ja) 2003-03-05 2004-09-30 Mitsubishi Electric Corp 中空構造を有する半導体装置
JP2005105243A (ja) 2003-07-18 2005-04-21 Shin Etsu Chem Co Ltd フリップチップ実装用サイドフィル材及び半導体装置
JP2009007467A (ja) 2007-06-28 2009-01-15 Shin Etsu Chem Co Ltd 実装用難燃性サイドフィル材及び半導体装置
JP2013178378A (ja) 2012-02-28 2013-09-09 Olympus Corp 光電変換モジュールおよび光伝送ユニット
WO2018110550A1 (ja) 2016-12-15 2018-06-21 ナガセケムテックス株式会社 熱硬化性樹脂組成物、光硬化性樹脂組成物、硬化物及び耐熱性向上剤
US20180259729A1 (en) 2017-03-07 2018-09-13 International Business Machines Corporation Fluid control structure
JP2019041097A (ja) 2017-08-28 2019-03-14 日立化成株式会社 電子部品装置を製造する方法、熱プレス用シート及び熱プレス用熱硬化性樹脂組成物
WO2019098053A1 (ja) 2017-11-14 2019-05-23 株式会社弘輝 補強用樹脂組成物及び電子部品装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213428A (ja) * 1995-11-20 1996-08-20 Rohm Co Ltd 半導体装置の実装方法
JP5161924B2 (ja) * 2010-06-25 2013-03-13 パナソニック株式会社 半導体装置
JP6187894B2 (ja) * 2012-09-13 2017-08-30 パナソニックＩｐマネジメント株式会社 回路装置の製造方法、半導体部品の実装構造および回路装置
JP5608211B2 (ja) * 2012-12-10 2014-10-15 パナソニック株式会社 半導体装置
TWI675080B (zh) * 2016-09-23 2019-10-21 南韓商Ｌｇ化學股份有限公司 黏著劑組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273554A (ja) 2003-03-05 2004-09-30 Mitsubishi Electric Corp 中空構造を有する半導体装置
JP2005105243A (ja) 2003-07-18 2005-04-21 Shin Etsu Chem Co Ltd フリップチップ実装用サイドフィル材及び半導体装置
JP2009007467A (ja) 2007-06-28 2009-01-15 Shin Etsu Chem Co Ltd 実装用難燃性サイドフィル材及び半導体装置
JP2013178378A (ja) 2012-02-28 2013-09-09 Olympus Corp 光電変換モジュールおよび光伝送ユニット
WO2018110550A1 (ja) 2016-12-15 2018-06-21 ナガセケムテックス株式会社 熱硬化性樹脂組成物、光硬化性樹脂組成物、硬化物及び耐熱性向上剤
US20180259729A1 (en) 2017-03-07 2018-09-13 International Business Machines Corporation Fluid control structure
JP2019041097A (ja) 2017-08-28 2019-03-14 日立化成株式会社 電子部品装置を製造する方法、熱プレス用シート及び熱プレス用熱硬化性樹脂組成物
WO2019098053A1 (ja) 2017-11-14 2019-05-23 株式会社弘輝 補強用樹脂組成物及び電子部品装置

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WO2021157472A1 (ja) 2021-08-12
CN115039218A (zh) 2022-09-09
JPWO2021157472A1 (https=) 2021-08-12
US20230054960A1 (en) 2023-02-23

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