CN115036287A - 包括同轴互连的集成器件 - Google Patents

包括同轴互连的集成器件 Download PDF

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Publication number
CN115036287A
CN115036287A CN202210862033.1A CN202210862033A CN115036287A CN 115036287 A CN115036287 A CN 115036287A CN 202210862033 A CN202210862033 A CN 202210862033A CN 115036287 A CN115036287 A CN 115036287A
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CN
China
Prior art keywords
interconnect
substrate
integrated device
electrical
die
Prior art date
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Pending
Application number
CN202210862033.1A
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English (en)
Chinese (zh)
Inventor
D·W·金
Y·K·宋
K-P·黄
H·B·蔚
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Qualcomm Inc
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Qualcomm Inc
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Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN115036287A publication Critical patent/CN115036287A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/267—Patterned shielding planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
CN202210862033.1A 2014-07-11 2015-07-09 包括同轴互连的集成器件 Pending CN115036287A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/329,646 US9385077B2 (en) 2014-07-11 2014-07-11 Integrated device comprising coaxial interconnect
US14/329,646 2014-07-11
PCT/US2015/039678 WO2016007706A1 (en) 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect
CN201580036954.0A CN106489191A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580036954.0A Division CN106489191A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Publications (1)

Publication Number Publication Date
CN115036287A true CN115036287A (zh) 2022-09-09

Family

ID=53719982

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210862033.1A Pending CN115036287A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件
CN201580036954.0A Pending CN106489191A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580036954.0A Pending CN106489191A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Country Status (8)

Country Link
US (1) US9385077B2 (https=)
EP (1) EP3167483A1 (https=)
JP (1) JP6802146B2 (https=)
KR (1) KR102411667B1 (https=)
CN (2) CN115036287A (https=)
AU (1) AU2015287804B2 (https=)
BR (1) BR112017000154B1 (https=)
WO (1) WO2016007706A1 (https=)

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US10381303B2 (en) * 2016-07-01 2019-08-13 Vanguard International Semiconductor Corporation Semiconductor device structures
TWI594338B (zh) * 2016-08-09 2017-08-01 矽品精密工業股份有限公司 電子堆疊結構及其製法
US10070525B2 (en) 2016-12-28 2018-09-04 Intel Corporation Internal to internal coaxial via transition structures in package substrates
WO2018182652A1 (en) * 2017-03-30 2018-10-04 Intel Corporation Semiconductor package having a coaxial first layer interconnect
US10734334B2 (en) * 2018-01-29 2020-08-04 Marvell Asia Pte, Ltd. Coaxial-interconnect structure for a semiconductor component
KR102740257B1 (ko) * 2019-12-17 2024-12-10 삼성전자주식회사 반도체 패키지
KR102903835B1 (ko) * 2020-08-25 2025-12-31 삼성전자주식회사 반도체 패키지
KR102934454B1 (ko) * 2020-11-03 2026-03-06 삼성전자주식회사 Bs-pdn 구조를 가진 집적회로 칩
KR20220124583A (ko) * 2021-03-03 2022-09-14 삼성전자주식회사 인터포저를 포함하는 전자 장치
US20230036650A1 (en) * 2021-07-27 2023-02-02 Qualcomm Incorporated Sense lines for high-speed application packages
CN115023038A (zh) * 2022-04-29 2022-09-06 清华大学 微系统集成电路的叠装结构和叠装方法
US20240047319A1 (en) * 2022-08-04 2024-02-08 Samsung Electronics Co., Ltd. Semiconductor package and method of fabricating the same
US12520417B2 (en) * 2022-12-12 2026-01-06 Rolls-Royce North American Technologies Inc. Circuit board assembly having a security shield and method of the same
US20250273612A1 (en) * 2024-02-28 2025-08-28 Qualcomm Incorporated Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnect

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US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US20070126091A1 (en) * 2005-12-07 2007-06-07 Wood Alan G Semiconductor components having through wire interconnects (TWI)
US20080158842A1 (en) * 2006-12-29 2008-07-03 Texas Instruments Incorporated Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure

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US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US20070126091A1 (en) * 2005-12-07 2007-06-07 Wood Alan G Semiconductor components having through wire interconnects (TWI)
US20080158842A1 (en) * 2006-12-29 2008-07-03 Texas Instruments Incorporated Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure

Also Published As

Publication number Publication date
BR112017000154A2 (pt) 2017-11-07
US9385077B2 (en) 2016-07-05
KR102411667B1 (ko) 2022-06-20
JP6802146B2 (ja) 2020-12-16
US20160013125A1 (en) 2016-01-14
KR20170028901A (ko) 2017-03-14
AU2015287804B2 (en) 2020-02-27
AU2015287804A1 (en) 2017-01-05
EP3167483A1 (en) 2017-05-17
WO2016007706A1 (en) 2016-01-14
JP2017520929A (ja) 2017-07-27
BR112017000154B1 (pt) 2022-05-17
CN106489191A (zh) 2017-03-08

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