CN114788420B - 高频电路 - Google Patents

高频电路 Download PDF

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Publication number
CN114788420B
CN114788420B CN202180007106.2A CN202180007106A CN114788420B CN 114788420 B CN114788420 B CN 114788420B CN 202180007106 A CN202180007106 A CN 202180007106A CN 114788420 B CN114788420 B CN 114788420B
Authority
CN
China
Prior art keywords
layer
transmission path
conductor
dielectric layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180007106.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN114788420A (zh
Inventor
新田耕司
上宫崇文
山岸杰
岛田茂树
上田宏
木谷聪志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN114788420A publication Critical patent/CN114788420A/zh
Application granted granted Critical
Publication of CN114788420B publication Critical patent/CN114788420B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN202180007106.2A 2020-05-13 2021-05-10 高频电路 Active CN114788420B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020084545 2020-05-13
JP2020-084545 2020-05-13
PCT/JP2021/017769 WO2021230215A1 (ja) 2020-05-13 2021-05-10 高周波回路

Publications (2)

Publication Number Publication Date
CN114788420A CN114788420A (zh) 2022-07-22
CN114788420B true CN114788420B (zh) 2025-03-18

Family

ID=78524434

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180007106.2A Active CN114788420B (zh) 2020-05-13 2021-05-10 高频电路

Country Status (4)

Country Link
US (1) US12389532B2 (https=)
JP (1) JP7597800B2 (https=)
CN (1) CN114788420B (https=)
WO (1) WO2021230215A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102908325B1 (ko) * 2020-12-10 2026-01-05 삼성전기주식회사 인쇄회로기판
US11758644B2 (en) * 2021-05-13 2023-09-12 Dell Products L.P. Slotted vias for circuit boards
DE112022005583T5 (de) * 2021-11-24 2024-10-02 Sumitomo Electric Industries, Ltd. Gedruckte Leiterplatte
JPWO2023095798A1 (https=) * 2021-11-24 2023-06-01

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5828555A (en) * 1996-07-25 1998-10-27 Fujitsu Limited Multilayer printed circuit board and high-frequency circuit device using the same
JP2003152292A (ja) * 2001-11-19 2003-05-23 Kyocera Corp 配線基板
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605654B2 (ja) 1995-03-31 1997-04-30 日本電気株式会社 複合マイクロ波回路モジュール及びその製造方法
JP3687041B2 (ja) * 1997-04-16 2005-08-24 大日本印刷株式会社 配線基板、配線基板の製造方法、および半導体パッケージ
FI106585B (fi) * 1997-10-22 2001-02-28 Nokia Mobile Phones Ltd Koaksiaalijohto, menetelmä koaksiaalijohdon valmistamiseksi ja langaton viestin
US6738598B2 (en) * 2001-08-17 2004-05-18 The Boeing Company Multilayer radio frequency interconnect system
US20030188889A1 (en) * 2002-04-09 2003-10-09 Ppc Electronic Ag Printed circuit board and method for producing it
JP3937433B2 (ja) * 2002-09-17 2007-06-27 日本電気株式会社 平面回路−導波管接続構造
JP2006067403A (ja) * 2004-08-30 2006-03-09 Kyocera Corp 積層型開口面アンテナ
TWI248330B (en) * 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
WO2007069789A1 (ja) * 2005-12-16 2007-06-21 Ibiden Co., Ltd. 多層プリント配線板およびその製造方法
JP4930590B2 (ja) * 2006-10-13 2012-05-16 日本電気株式会社 多層基板
JP4199796B2 (ja) * 2006-10-30 2008-12-17 京セラ株式会社 高周波線路−導波管変換器
JP2008244289A (ja) * 2007-03-28 2008-10-09 Mitsubishi Electric Corp 電磁シールド構造
CN101971327B (zh) * 2008-03-17 2012-07-18 三菱电机株式会社 多层介质基板及半导体封装
JP6011065B2 (ja) * 2012-06-28 2016-10-19 株式会社村田製作所 伝送線路
JP6537172B2 (ja) 2015-06-01 2019-07-03 住友電工プリントサーキット株式会社 プリント配線板
US9992859B2 (en) * 2015-09-25 2018-06-05 Intel Corporation Low loss and low cross talk transmission lines using shaped vias
KR102455653B1 (ko) * 2015-12-08 2022-10-18 주식회사 기가레인 고주파 전송선로
US11101533B2 (en) * 2016-10-13 2021-08-24 Win Semiconductors Corp. Radio frequency device
JP2019029609A (ja) * 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
US10849219B2 (en) * 2018-02-28 2020-11-24 Raytheon Company SNAP-RF interconnections
JP2019197785A (ja) 2018-05-08 2019-11-14 三菱電機株式会社 プリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5828555A (en) * 1996-07-25 1998-10-27 Fujitsu Limited Multilayer printed circuit board and high-frequency circuit device using the same
JP2003152292A (ja) * 2001-11-19 2003-05-23 Kyocera Corp 配線基板
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器

Also Published As

Publication number Publication date
CN114788420A (zh) 2022-07-22
US12389532B2 (en) 2025-08-12
US20230019563A1 (en) 2023-01-19
JP7597800B2 (ja) 2024-12-10
WO2021230215A1 (ja) 2021-11-18
JPWO2021230215A1 (https=) 2021-11-18

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