CN114786871B - 研磨装置的清洗装置 - Google Patents

研磨装置的清洗装置 Download PDF

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Publication number
CN114786871B
CN114786871B CN202080086058.6A CN202080086058A CN114786871B CN 114786871 B CN114786871 B CN 114786871B CN 202080086058 A CN202080086058 A CN 202080086058A CN 114786871 B CN114786871 B CN 114786871B
Authority
CN
China
Prior art keywords
cleaning
nozzle
waste liquid
liquid passage
cleaning nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080086058.6A
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English (en)
Chinese (zh)
Other versions
CN114786871A (zh
Inventor
铃木道夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of CN114786871A publication Critical patent/CN114786871A/zh
Application granted granted Critical
Publication of CN114786871B publication Critical patent/CN114786871B/zh
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Nozzles (AREA)
CN202080086058.6A 2020-01-09 2020-11-09 研磨装置的清洗装置 Active CN114786871B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-002108 2020-01-09
JP2020002108A JP7218731B2 (ja) 2020-01-09 2020-01-09 ラッピング装置の洗浄装置
PCT/JP2020/041761 WO2021140737A1 (ja) 2020-01-09 2020-11-09 ラッピング装置の洗浄装置

Publications (2)

Publication Number Publication Date
CN114786871A CN114786871A (zh) 2022-07-22
CN114786871B true CN114786871B (zh) 2024-03-08

Family

ID=76787846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080086058.6A Active CN114786871B (zh) 2020-01-09 2020-11-09 研磨装置的清洗装置

Country Status (5)

Country Link
JP (1) JP7218731B2 (ja)
KR (1) KR20220119387A (ja)
CN (1) CN114786871B (ja)
TW (1) TW202130461A (ja)
WO (1) WO2021140737A1 (ja)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079342A (ja) * 1993-06-30 1995-01-13 Sumio Tanaka 両面研磨機定盤の洗浄装置
TW421619B (en) * 1998-06-08 2001-02-11 Ebara Corp Discharging mechanism of product from polishing and polishing device
JP2004281641A (ja) * 2003-03-14 2004-10-07 Tokyo Electron Ltd 塗布装置
CN201049437Y (zh) * 2004-10-12 2008-04-23 应用材料公司 一种抛光垫调节器及具有抛光垫调节器的化学机械装置
JP2010052090A (ja) * 2008-08-28 2010-03-11 Epson Toyocom Corp 研磨装置および研磨方法
CN101844328A (zh) * 2009-03-27 2010-09-29 不二越机械工业株式会社 用于清洗研磨布的装置和方法
CN104217979A (zh) * 2013-05-28 2014-12-17 东京毅力科创株式会社 基板清洗装置和基板清洗方法
CN104701218A (zh) * 2013-12-04 2015-06-10 株式会社迪思科 清洗装置
CN105382677A (zh) * 2014-08-26 2016-03-09 株式会社荏原制作所 抛光处理组件、基板处理装置及抛光垫清洗方法
JP2016055381A (ja) * 2014-09-09 2016-04-21 信越半導体株式会社 ラッピング方法
CN209831364U (zh) * 2019-04-30 2019-12-24 青岛嘉星晶电科技股份有限公司 组合式晶片研磨盘

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3030608B2 (ja) * 1995-08-21 2000-04-10 株式会社荏原製作所 ラップ機の定盤洗浄装置
JP6369263B2 (ja) * 2014-09-25 2018-08-08 株式会社Sumco ワークの研磨装置およびワークの製造方法
KR101596598B1 (ko) 2014-11-10 2016-02-22 주식회사 엘지실트론 웨이퍼 연마장치

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079342A (ja) * 1993-06-30 1995-01-13 Sumio Tanaka 両面研磨機定盤の洗浄装置
TW421619B (en) * 1998-06-08 2001-02-11 Ebara Corp Discharging mechanism of product from polishing and polishing device
JP2004281641A (ja) * 2003-03-14 2004-10-07 Tokyo Electron Ltd 塗布装置
CN201049437Y (zh) * 2004-10-12 2008-04-23 应用材料公司 一种抛光垫调节器及具有抛光垫调节器的化学机械装置
JP2010052090A (ja) * 2008-08-28 2010-03-11 Epson Toyocom Corp 研磨装置および研磨方法
CN101844328A (zh) * 2009-03-27 2010-09-29 不二越机械工业株式会社 用于清洗研磨布的装置和方法
CN104217979A (zh) * 2013-05-28 2014-12-17 东京毅力科创株式会社 基板清洗装置和基板清洗方法
CN104701218A (zh) * 2013-12-04 2015-06-10 株式会社迪思科 清洗装置
CN105382677A (zh) * 2014-08-26 2016-03-09 株式会社荏原制作所 抛光处理组件、基板处理装置及抛光垫清洗方法
JP2016055381A (ja) * 2014-09-09 2016-04-21 信越半導体株式会社 ラッピング方法
CN209831364U (zh) * 2019-04-30 2019-12-24 青岛嘉星晶电科技股份有限公司 组合式晶片研磨盘

Also Published As

Publication number Publication date
JP2021109271A (ja) 2021-08-02
JP7218731B2 (ja) 2023-02-07
CN114786871A (zh) 2022-07-22
WO2021140737A1 (ja) 2021-07-15
TW202130461A (zh) 2021-08-16
KR20220119387A (ko) 2022-08-29

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