CN114786871B - Cleaning device for grinding device - Google Patents
Cleaning device for grinding device Download PDFInfo
- Publication number
- CN114786871B CN114786871B CN202080086058.6A CN202080086058A CN114786871B CN 114786871 B CN114786871 B CN 114786871B CN 202080086058 A CN202080086058 A CN 202080086058A CN 114786871 B CN114786871 B CN 114786871B
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- Prior art keywords
- cleaning
- nozzle
- waste liquid
- liquid passage
- cleaning nozzle
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 140
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000002699 waste material Substances 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 230000002093 peripheral effect Effects 0.000 claims abstract description 24
- 238000005498 polishing Methods 0.000 claims abstract description 21
- 239000002002 slurry Substances 0.000 claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims description 40
- 239000007921 spray Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 239000010802 sludge Substances 0.000 abstract description 24
- 230000000694 effects Effects 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The present invention relates to a cleaning device for a polishing apparatus, which has rotatable upper and lower stages and a slurry supply nozzle, and which rotates the upper and lower stages while supplying slurry, and which polishes a workpiece held therebetween, and is characterized in that a cleaning waste liquid passage is formed in a stage receiving table that supports the lower stage so as to be rotatable together with the lower stage, and is configured to discharge waste slurry, the cleaning device for a polishing apparatus comprising: the waste liquid passage is composed of an annular part positioned on the inner peripheral side of the platform pedestal and a radial part extending radially from the annular part, and the first cleaning nozzle faces the annular part and the second cleaning nozzle faces the outer peripheral direction from the inner peripheral side of the platform pedestal relative to the waste liquid passage, so that the platform pedestal can be rotated by jetting the cleaning water, thereby automatically cleaning the whole area of the waste liquid passage. Thus, a cleaning device for a polishing device is provided which can effectively remove sludge deposited on a waste liquid passage of a platen table and can complete automatic cleaning in a short time.
Description
Technical Field
The present invention relates to a cleaning device for a polishing apparatus.
Background
Conventionally, for example, in the production of silicon wafers, polishing is performed by a polishing apparatus in order to obtain a desired shape accuracy such as flatness and parallelism while keeping the wafer uniform to a predetermined thickness (for example, refer to patent document 1). Polishing is performed by sandwiching a workpiece such as a wafer between upper and lower stages and rotating the upper and lower stages while supplying slurry.
Fig. 5A shows an example of the shape of the waste liquid passage of the platen receiving base supporting the lower platen of the polishing apparatus. A waste liquid passage extending obliquely from the center toward the outer peripheral direction for discharging waste slurry (hereinafter also referred to as sludge) flowing down from the lower platform is formed in a platform pedestal that supports the lower platform and is rotatable together with the lower platform.
If the grinding is repeated, sludge accumulates in the waste liquid passage to hinder the discharge. Therefore, the operator regularly performs a cleaning operation for removing the sludge by a manual operation. Fig. 5B shows a schematic view of a cleaning operation.
As shown in fig. 5B, the operator inserts the cleaning hose into the waste liquid passage from the gap between the center portion and the outer peripheral portion of the lower stage by hand, and sprays the cleaning water under high pressure to remove the deposited sludge.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication 2016-55381
Disclosure of Invention
First, the technical problem to be solved
However, as shown in fig. 5C, the lower stage is placed on the stage receiving stage, and most of the waste liquid passage is not visible to the operator. In addition, the space in which the waste liquid passage is provided is only a narrow space having a total width of about 70mm between the center portion and the outer peripheral portion of the lower stage, and the cleaning operation is difficult. In addition, since the manual operation mode is adopted, the front end of the cleaning hose cannot be fixed, and the cleaning position cannot be fixed, so that the sludge removal effect is not high. Further, when there are a plurality of waste liquid passages extending from the center toward the outer circumferential direction, the working time also increases. For example, in the case where there are waste liquid passages in 8 directions as shown in fig. 5A, it takes about 3 hours for the washing to be completed.
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a cleaning device for a polishing apparatus, which can effectively remove sludge deposited in a waste liquid passage of a platen table and can complete cleaning in a short time.
(II) technical scheme
In order to achieve the above object, the present invention provides a cleaning apparatus for a polishing apparatus, which comprises rotatable upper and lower stages, and a slurry supply nozzle for supplying slurry between the upper and lower stages, and which rotates the upper and lower stages while supplying the slurry, and which polishes a workpiece interposed between the upper and lower stages, the cleaning apparatus comprising: a first washing nozzle and a second washing nozzle spraying the washing water; and an arm portion to which the first cleaning nozzle and the second cleaning nozzle are attached, wherein the arrangement position and the arrangement orientation of the first cleaning nozzle and the second cleaning nozzle are fixed, wherein the waste liquid passage is configured by an annular portion located on an inner peripheral side around the rotation axis of the stage support, and one or more radial portions extending radially from the annular portion in an outer peripheral direction, and wherein the first cleaning nozzle faces the annular portion and the second cleaning nozzle faces the outer peripheral direction from the inner peripheral side of the stage support with respect to the waste liquid passage, and wherein the cleaning water is ejected from the first cleaning nozzle and the second cleaning nozzle arranged in the fixed manner, and the stage support and the lower stage are rotated, whereby the entire region of the annular portion can be automatically cleaned by the cleaning water from the first cleaning nozzle, and the entire region of the radial portion can be automatically cleaned by the cleaning water from the second cleaning nozzle.
In this way, if the apparatus is configured to spray the washing water from the first washing nozzle and the second washing nozzle, which are fixedly disposed in the two directions, and rotate the stage support and the lower stage to wash the waste liquid passage, the washing water stably contacts all areas of the annular portion and the radial portion, and thus the effect of removing the sludge deposited in these areas is high, and uniform washing can be completed in a short time. Moreover, the automatic cleaning can be carried out, and the method is quite convenient.
The first washing nozzle and the second washing nozzle may spray the washing water in a fan shape.
In the case of the washing nozzle capable of spraying washing water in a fan shape, washing can be uniformly performed over a wide range, and thus a higher sludge removal effect can be obtained.
(III) beneficial effects
As described above, according to the present invention, the sludge deposited on the waste liquid passage of the stage receiving table can be effectively and stably removed, and the uniform automatic cleaning can be completed in a short time, which is quite simple.
Drawings
Fig. 1A is a plan view showing an example of the cleaning device of the present invention.
Fig. 1B is a side view showing an example of the cleaning device of the present invention.
Fig. 1C is a plan view schematically showing the vicinity of the cleaning device of the present invention.
Fig. 1D is a side view schematically showing the vicinity of the cleaning device of the present invention.
Fig. 1E is a schematic view showing an example of a platen table of a polishing apparatus to which the cleaning apparatus of the present invention is applicable.
Fig. 1F is a schematic view showing an example of a polishing apparatus to which the cleaning apparatus of the present invention is applicable.
Fig. 2 is a schematic view showing a cleaning range of the cleaning device according to the present invention.
Fig. 3A is a front view showing the injection port of the fan-shaped nozzle that can inject the washing water in a fan shape.
Fig. 3B is an explanatory view showing a spray structure of a fan nozzle capable of spraying washing water in a fan shape.
Fig. 3C is a front view showing the ejection port of the straight nozzle that can eject the cleaning water in a straight line.
Fig. 3D is an explanatory view showing an ejection structure of a linear nozzle capable of ejecting cleaning water in a linear manner.
Fig. 3E is a schematic view showing an example of a cleaning range using a fan nozzle.
FIG. 4 is a graph showing the annual cleaning time and the sludge removal amount of the examples and the comparative examples.
Fig. 5A is a schematic view showing an example of a platen of the polishing apparatus.
Fig. 5B is a schematic diagram showing an example of a conventional cleaning operation performed by an operator.
Fig. 5C is a schematic view of the space of the waste liquid channel that can reach the platform pedestal.
Detailed Description
The present inventors have studied how to stably contact the washing water with the entire region of the waste liquid passage, based on the cross-sectional shape of the stage support and the structure of the arrival point.
As a result, it has been found that the present invention can achieve a high sludge removal effect and complete cleaning in a short time by spraying cleaning water from nozzles fixedly arranged in two directions (that is, spraying the water divided into a ring portion at the center and a radial portion in the outer circumferential direction from the center) to flow out the sludge.
The present invention will be described in detail below as an example of an embodiment, with reference to the drawings, but the present invention is not limited thereto.
Fig. 1F is a schematic view showing an example of a polishing apparatus to which the cleaning apparatus of the present invention is applicable. The upper side is a vertical section and the lower side is a plan view. In addition, a stage receiving table or the like located below the lower stage in a vertical sectional view is omitted, and the upper stage and the slurry supply nozzle are omitted in a plan view.
The polishing apparatus 11 includes a rotatable upper platen 12 and a rotatable lower platen 13. The lower platform 13 has a sun gear 14 on the upper surface of the central portion thereof, and an annular ring gear 15 is provided at the peripheral portion thereof. The upper platform 12 can be lifted up and down. Further, a tooth-shaped portion that meshes with the sun gear 14 and the internal gear 15 is formed on the outer peripheral surface of the carrier 16 that holds the wafer W (workpiece), and a gear structure is formed as a whole.
The carrier 16 is provided with 1 or more holding holes 17. The wafer W to be polished is inserted into the holding hole 17 to be held. 1 or more carriers 16 for holding the wafer W are disposed between the upper table 12 and the lower table 13 positioned to be lowered from above, and can rotate and revolve by rotation of the lower table 13 or the like.
A slurry supply nozzle 18 is disposed above the upper stage 12, and a slurry can be supplied from the slurry supply nozzle 18 between the wafer W and the upper and lower stages 12 and 13 via a through hole 19 provided in the upper stage 12.
Fig. 1E is a schematic view showing an example of a platen table for supporting and rotating a lower platen in the polishing apparatus.
In the stage 20, a waste liquid passage 23 is formed which is composed of an annular portion 21 and 1 or more (8 in this case) radial portions 22, the annular portion 21 being located on the inner peripheral side around the rotation axis of the stage, and the radial portions 22 extending radially from the annular portion in the outer peripheral direction. In this structure, the radial portion 22 is inclined downward in the outer circumferential direction, and the sludge from the lower deck 13 is received and discharged. The number of the radial portions 22 is not particularly limited, and may be set to 60 or less, for example, since the number is appropriately determined according to the amount of discharged sludge or the like.
Next, a cleaning device according to the present invention applied to the polishing device shown in fig. 1E and 1F will be described.
Fig. 1A shows a top view of the cleaning device, and fig. 1B shows a side view of the cleaning device. All are arranged in the polishing apparatus.
The cleaning device 1 includes a first cleaning nozzle 2, a second cleaning nozzle 3, and an arm 4; the first cleaning nozzle 2 faces the annular portion 21 of the stage 20, and the second cleaning nozzle 3 faces the outer circumferential direction from the inner circumferential side of the stage 20. The number of each may be 1 or plural. The arrangement position and arrangement direction of the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixed by the arm portion 4, and the arm portion 4 is further fixed to the outer peripheral plate 6 by the sandwiching back plate 5. The outer peripheral plate 6 is a cylindrical member fixedly disposed so as to surround the stage 20, and the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixedly disposed by sequentially attaching the clamp back plate 5, the arm 4, and the first cleaning nozzle 2 and the second cleaning nozzle 3 as described above.
The fixing of the first cleaning nozzle 2, the second cleaning nozzle 3, and the arm 4 will be described in more detail with reference to the drawings that simplify the description of the positional relationship.
Fig. 1C shows a top view near the cleaning device, and fig. 1D shows a side view near the cleaning device.
The clamping back plate 5 of the cleaning device can be adjusted in length in cooperation with the outer peripheral plate 6, and is fixed to the outer peripheral plate 6 by screws or the like after being clamped to the outer peripheral plate 6 by, for example, spring expansion and contraction. The arm 4 of the cleaning device 1 is capable of adjusting the nozzle position by sliding in the horizontal direction, and the tip end of the arm 4 having the first cleaning nozzle 2 and the second cleaning nozzle 3 is capable of adjusting the height by sliding in the vertical direction. Further, the direction of the washing water can be adjusted by rotating the first washing nozzle 2 and the second washing nozzle 3, respectively. By these adjustments, the tip portion of the arm portion 4 can be inserted into the waste liquid passage from the gap in the center of the lower stage, and the injection position of the first cleaning nozzle 2 can be adjusted and fixed to the annular portion 21, and the injection position of the second cleaning nozzle 3 can be adjusted to the radial portion 22.
The clip back plate 5 may be reinforced with a reinforcing material. This is effective in preventing the arm 4 from being displaced in the rising position accompanying the ejection of the washing water.
Of course, the method of fixing the first cleaning nozzle 2 and the second cleaning nozzle 3 via the arm portion 4 is not limited thereto, and may be appropriately determined. For example, the arm 4 may be fixed to a floor, a wall surface, other fixing members, or the like.
Fig. 2 shows the spray range of the washing water by the washing apparatus 1.
As shown in fig. 2, the annular portion 21 is sprayed with the washing water from the first washing nozzle 2, and the radial portion 22 is sprayed with the washing water from the second washing nozzle 3.
In this way, the cleaning operation is automatically performed by jetting the cleaning water in a state where the arrangement positions and the arrangement directions of the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixed, and rotating the stage receiving table 20 and the lower stage 13.
In addition, since the washing water from the first washing nozzle 2 is sprayed to the entire area of the annular portion 21 and the washing water from the second washing nozzle 3 is sprayed to the entire area of the radial portion 22, the sludge in the entire area of the waste liquid passage can be effectively removed. Further, since the sludge removal effect is high, the working time is shortened, and since it is an automatic operation, an operator is not required in the cleaning.
The first cleaning nozzle 2 and the second cleaning nozzle 3 (particularly, the second cleaning nozzle 3) may be fan-shaped nozzles capable of spraying cleaning water in a fan shape. In the case of the fan-shaped nozzle, the cleaning water is sprayed widely, and thus a higher sludge removal effect can be obtained.
The structure of such a fan-shaped nozzle and a linear nozzle capable of jetting the cleaning water in a linear manner will be described.
Fig. 3A shows a front view of the ejection port of the fan-shaped nozzle, fig. 3B shows an ejection explanatory view of the section A-A of the fan-shaped nozzle, fig. 3C shows a front view of the ejection port of the straight-line nozzle, and fig. 3D shows an ejection explanatory view of the section B-B of the straight-line nozzle.
As shown in fig. 3A and 3B, the fan-shaped nozzle has a groove extending in a fan shape from the central discharge port, and the discharged cleaning water spreads along the groove, so that the discharge shape becomes a fan shape.
In contrast, in the straight nozzle, as shown in fig. 3C and 3D, the cleaning water is directly ejected from the center of the ejection port, and thus the ejection shape becomes a straight line.
Fig. 3E shows an example of the arrangement of the fan-shaped nozzles facing the radial portion.
The direction of the cleaning water spread in the fan nozzle may be changed by the throttle of the cleaning nozzle, but it is more preferable that the cleaning water be arranged so as to spread in the longitudinal direction. In this case, as shown in fig. 3E, the washing water is sprayed to the entire waste liquid passage in accordance with the rotation of the stage receiving table, and therefore a higher sludge removal effect can be obtained than in the case of arranging in a laterally expanded manner.
A cleaning method using the cleaning apparatus 1 of the present invention described above will be described.
First, the arm 4 is attached to the clamp back plate 5, and the first cleaning nozzle 2 and the second cleaning nozzle 3 are attached to the tip end portion of the arm 4. Further, the chucking back plate 5 is mounted to the fixedly arranged outer peripheral plate 6.
In a state where the length of the arm in the horizontal direction is adjusted, the height in the vertical direction of the tip portion to which the nozzle is attached is adjusted, and the tip portion is inserted into the waste liquid passage from the center portion gap of the lower stage. Then fixing the position and direction of the cleaning nozzle.
In this state, the cleaning water is sprayed while rotating the stage support and the lower stage.
This causes washing water to be sprayed in both the annular portion and the radial portion (in the outer circumferential direction), and the entire area of the waste liquid passage is automatically washed.
In addition, as the cleaning water sprayed from the cleaning nozzle, for example, water can be used. A higher sludge removal effect can be obtained if high pressure water is used. The injection force itself is not particularly limited, and may be 20Mpa or more, for example.
Examples
The present invention is further illustrated below based on examples, which are merely illustrative and should not be construed as limiting.
Example (example)
The cleaning device of the present invention shown in fig. 1A to 1D, 3A, and 3B was prepared.
The first cleaning nozzle and the second cleaning nozzle of the cleaning device are provided so as to spray the cleaning water in a fan shape, and the second cleaning nozzle is provided so that the cleaning water is spread in the longitudinal direction. High-pressure water of 20Mpa was sprayed from the first cleaning nozzle and the second cleaning nozzle to rotate the stage support at 2rpm, and an automatic cleaning operation was performed to measure the annual cleaning time and the sludge removal amount.
Comparative example
The cleaning operation was performed under the same conditions as in the example, except that the cleaning apparatus of the present invention was not used, but was performed by a manual operation method shown in fig. 5B.
As a result, as shown in FIG. 4, in the example, the annual cleaning time was 112 hours and the annual sludge removal amount was 448kg. In the comparative example, the annual cleaning time was 336 hours and the annual sludge removal was 134kg. The annual cleaning time was 1/3 and the annual sludge removal was increased by about 234% with the cleaning apparatus of the present invention, compared to the conventional method (comparative example) in which the operator used the cleaning hose for cleaning.
The present invention is not limited to the above embodiments. The above-described embodiments are examples, and any embodiments having substantially the same configuration and effects as the technical ideas described in the claims of the present invention are included in the technical scope of the present invention.
Claims (2)
1. A cleaning device for a polishing device, comprising rotatable upper and lower stages, and a slurry supply nozzle for supplying slurry between the upper and lower stages, wherein the upper and lower stages are rotated while supplying the slurry, and a workpiece interposed between the upper and lower stages is polished, characterized in that:
a waste liquid passage formed in a stage receiving table rotatably supporting the lower stage and configured to discharge waste slurry flowing down from the lower stage, the waste liquid passage being cleaned by cleaning water,
the cleaning device of the polishing device comprises: a first washing nozzle and a second washing nozzle spraying the washing water; and an arm portion on which the first cleaning nozzle and the second cleaning nozzle are mounted, and in which the arrangement position and the arrangement orientation of the first cleaning nozzle and the second cleaning nozzle are fixed,
the waste liquid passage is composed of an annular part positioned on the inner peripheral side around the rotation axis of the platform pedestal, and at least one radial part radially extending from the annular part to the outer peripheral direction, the first cleaning nozzle faces the annular part, and the second cleaning nozzle faces the outer peripheral direction from the inner peripheral side of the platform pedestal relative to the waste liquid passage,
by ejecting the cleaning water from the first cleaning nozzle and the second cleaning nozzle which are fixedly disposed, and rotating the stage support and the lower stage, it is possible to automatically clean the entire region of the annular portion with the cleaning water from the first cleaning nozzle, and to automatically clean the entire region of the radial portion with the cleaning water from the second cleaning nozzle.
2. The cleaning device for a polishing apparatus as recited in claim 1, wherein:
the first washing nozzle and the second washing nozzle may spray the washing water in a fan shape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-002108 | 2020-01-09 | ||
| JP2020002108A JP7218731B2 (en) | 2020-01-09 | 2020-01-09 | Cleaning equipment for lapping equipment |
| PCT/JP2020/041761 WO2021140737A1 (en) | 2020-01-09 | 2020-11-09 | Cleaning device for lapping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114786871A CN114786871A (en) | 2022-07-22 |
| CN114786871B true CN114786871B (en) | 2024-03-08 |
Family
ID=76787846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080086058.6A Active CN114786871B (en) | 2020-01-09 | 2020-11-09 | Cleaning device for grinding device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7218731B2 (en) |
| KR (1) | KR20220119387A (en) |
| CN (1) | CN114786871B (en) |
| TW (1) | TW202130461A (en) |
| WO (1) | WO2021140737A1 (en) |
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| JP3030608B2 (en) * | 1995-08-21 | 2000-04-10 | 株式会社荏原製作所 | Platen cleaning equipment for lapping machines |
| JP6369263B2 (en) * | 2014-09-25 | 2018-08-08 | 株式会社Sumco | Work polishing apparatus and work manufacturing method |
| KR101596598B1 (en) * | 2014-11-10 | 2016-02-22 | 주식회사 엘지실트론 | Wafer polishing apparatus |
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2020
- 2020-01-09 JP JP2020002108A patent/JP7218731B2/en active Active
- 2020-11-09 WO PCT/JP2020/041761 patent/WO2021140737A1/en active Application Filing
- 2020-11-09 KR KR1020227021626A patent/KR20220119387A/en unknown
- 2020-11-09 CN CN202080086058.6A patent/CN114786871B/en active Active
- 2020-11-24 TW TW109141034A patent/TW202130461A/en unknown
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| JPH079342A (en) * | 1993-06-30 | 1995-01-13 | Sumio Tanaka | Washing device for surface plate of double polishing machine |
| TW421619B (en) * | 1998-06-08 | 2001-02-11 | Ebara Corp | Discharging mechanism of product from polishing and polishing device |
| JP2004281641A (en) * | 2003-03-14 | 2004-10-07 | Tokyo Electron Ltd | Coating equipment |
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| CN104217979A (en) * | 2013-05-28 | 2014-12-17 | 东京毅力科创株式会社 | Substrate cleaning apparatus and substrate cleaning method |
| CN104701218A (en) * | 2013-12-04 | 2015-06-10 | 株式会社迪思科 | Cleaning apparatus |
| CN105382677A (en) * | 2014-08-26 | 2016-03-09 | 株式会社荏原制作所 | buff process module, SUBSTRATE PROCESSING APPARATUS and buff pad cleaning method |
| JP2016055381A (en) * | 2014-09-09 | 2016-04-21 | 信越半導体株式会社 | Lapping method |
| CN209831364U (en) * | 2019-04-30 | 2019-12-24 | 青岛嘉星晶电科技股份有限公司 | Combined wafer grinding disc |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202130461A (en) | 2021-08-16 |
| KR20220119387A (en) | 2022-08-29 |
| WO2021140737A1 (en) | 2021-07-15 |
| JP7218731B2 (en) | 2023-02-07 |
| CN114786871A (en) | 2022-07-22 |
| JP2021109271A (en) | 2021-08-02 |
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