CN114786871A - Cleaning device of grinding device - Google Patents
Cleaning device of grinding device Download PDFInfo
- Publication number
- CN114786871A CN114786871A CN202080086058.6A CN202080086058A CN114786871A CN 114786871 A CN114786871 A CN 114786871A CN 202080086058 A CN202080086058 A CN 202080086058A CN 114786871 A CN114786871 A CN 114786871A
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- China
- Prior art keywords
- cleaning
- nozzle
- washing
- waste liquid
- liquid passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 113
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000002699 waste material Substances 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000005498 polishing Methods 0.000 claims abstract description 18
- 239000002002 slurry Substances 0.000 claims abstract description 17
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 238000005406 washing Methods 0.000 claims description 67
- 239000007921 spray Substances 0.000 claims description 9
- 239000010802 sludge Substances 0.000 abstract description 24
- 230000002093 peripheral effect Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The present invention relates to a cleaning device for a polishing device, which has a rotatable upper and lower platen and a slurry supply nozzle, and rotates the upper and lower platen while supplying slurry to polish a workpiece to be processed, wherein the cleaning device is characterized in that a waste liquid passage is cleaned, the waste liquid passage is formed on a platen receiving table which supports the lower platen and can rotate together with the lower platen, and is used for discharging waste slurry, the cleaning device for the polishing device comprises: the waste liquid passage is composed of an annular part positioned at the inner peripheral side of the platform bearing platform and a radial part extending radially from the annular part, relative to the waste liquid passage, the first cleaning nozzle faces the annular part, and the second cleaning nozzle faces the outer peripheral direction from the inner peripheral side of the platform bearing platform, and the whole area of the waste liquid passage can be automatically cleaned by spraying cleaning water and rotating the platform bearing platform. Thus, a cleaning device for a polishing apparatus is provided, which can effectively remove sludge accumulated in a waste liquid passage of a stage receiving table and can complete automatic cleaning in a short time.
Description
Technical Field
The invention relates to a cleaning device of a grinding device.
Background
Conventionally, for example, in the production of a silicon wafer, the wafer is polished by a polishing apparatus in order to obtain the required shape accuracy such as flatness and parallelism while conforming the wafer to a predetermined thickness (for example, see patent document 1). The polishing is performed by sandwiching a workpiece such as a wafer between upper and lower platens and rotating the upper and lower platens while supplying slurry.
Fig. 5A shows an example of the shape of the waste liquid passage of the platen receiving table supporting the lower platen of the polishing apparatus. A waste liquid passage extending obliquely from the center portion toward the outer circumferential direction for discharging waste slurry (hereinafter, also referred to as sludge) flowing down from the lower deck is formed on a deck receiving table that supports the lower deck and is rotatable together with the lower deck.
If the grinding is repeated, sludge accumulates in the waste liquid passage to hinder the discharge. Therefore, the operator periodically performs the cleaning work for removing the sludge in a manual work manner. Fig. 5B is a schematic diagram showing the cleaning operation.
As shown in fig. 5B, the operator manually inserts the cleaning hose into the waste liquid passage from the gap between the center portion and the outer peripheral portion of the lower surface plate, and sprays the cleaning water at a high pressure to remove the accumulated sludge.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2016-55381
Disclosure of Invention
Technical problem to be solved
However, as shown in fig. 5C, in a state where the lower surface plate is placed on the surface plate receiving base, the operator cannot see most of the waste liquid passage. Further, the space that can reach the waste liquid passage is only a narrow space having a width of about 70mm in total between the center portion and the outer peripheral portion of the lower surface plate, and the cleaning operation is difficult. Further, since the cleaning hose is manually operated, the front end of the cleaning hose cannot be fixed and the cleaning position cannot be fixed, and thus the sludge removing effect is not high. Further, when there are a plurality of waste liquid passages extending from the center portion toward the outer circumferential direction, the working time is also increased. For example, in the case where the waste liquid passage exists in 8 directions as shown in fig. 5A, it takes about 3 hours for the completion of the cleaning.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a cleaning apparatus for a polishing apparatus, which can effectively remove sludge accumulated in a waste liquid passage of a platen receiving table and can complete cleaning in a short time.
(II) technical scheme
In order to achieve the above object, the present invention provides a cleaning device for a polishing apparatus, which comprises rotatable upper and lower turn tables and a slurry supply nozzle for supplying slurry between the upper and lower turn tables, and which polishes a workpiece interposed between the upper and lower turn tables by rotating the upper and lower turn tables while supplying the slurry, wherein a waste liquid passage is formed in a turn table receiving table for supporting the lower turn table and being rotatable together with the lower turn table, and discharges waste slurry flowing down from the lower turn table, the cleaning device for a polishing apparatus comprising: a first washing nozzle and a second washing nozzle which spray the washing water; and an arm portion to which the first cleaning nozzle and the second cleaning nozzle are attached and which fixes the arrangement position and the arrangement orientation of the first cleaning nozzle and the second cleaning nozzle, the waste liquid passage is composed of an annular part located on the inner circumferential side around the rotation axis of the platform receiving table and more than one radial parts radially extending from the annular part to the outer circumferential direction, the first cleaning nozzle faces the annular part, and the second cleaning nozzle faces the outer circumferential direction from the inner circumferential side of the platform receiving table, the washing water is sprayed from the first washing nozzle and the second washing nozzle which are fixedly arranged, and the platform bearing platform and the lower platform are rotated, and the whole area of the annular part can be automatically cleaned by the cleaning water from the first cleaning nozzle, and automatically washing the entire area of the radial portion using washing water from the second washing nozzle.
In this way, if the washing water is ejected from the first washing nozzle and the second washing nozzle which are fixedly arranged in the two directions and the platform receiving table and the lower platform are rotated to wash the waste liquid passage, the washing water is stably contacted with all the regions of the annular portion and the radial portion, so that the effect of removing sludge accumulated in these regions is high, and uniform washing can be completed in a short time. Moreover, the automatic cleaning can be carried out, which is very convenient.
The first and second washing nozzles may spray the washing water in a fan shape.
If the washing nozzle is a fan-shaped washing nozzle, washing can be performed uniformly in a wide range, and thus a higher sludge removal effect can be obtained.
(III) advantageous effects
As described above, according to the present invention, sludge accumulated in the waste liquid passage of the stage receiving table can be efficiently and stably removed, and uniform automatic cleaning can be performed in a short time, which is very simple.
Drawings
Fig. 1A is a plan view showing an example of the cleaning apparatus of the present invention.
Fig. 1B is a side view showing an example of the cleaning apparatus of the present invention.
Fig. 1C is a plan view schematically showing the vicinity of the cleaning apparatus of the present invention.
Fig. 1D is a side view schematically showing the vicinity of the cleaning apparatus of the present invention.
FIG. 1E is a schematic view showing an example of a platen receiving table of a polishing apparatus to which the cleaning apparatus of the present invention can be applied.
FIG. 1F is a schematic view showing an example of a polishing apparatus to which the cleaning apparatus of the present invention can be applied.
Fig. 2 is a schematic diagram showing a cleaning range of the cleaning apparatus according to the present invention.
Fig. 3A is a front view showing an ejection port of a fan nozzle that ejects washing water in a fan shape.
Fig. 3B is an explanatory diagram showing a jetting structure of a fan-shaped nozzle capable of jetting washing water in a fan shape.
Fig. 3C is a front view showing an ejection port of a linear nozzle that can linearly eject wash water.
Fig. 3D is an explanatory diagram showing a jetting structure of a linear nozzle capable of jetting washing water linearly.
Fig. 3E is a schematic diagram showing an example of a cleaning range using the fan nozzle.
FIG. 4 is a graph showing the annual cleaning time and the sludge removal amount in examples and comparative examples.
Fig. 5A is a schematic view showing an example of a platen receiving table of the polishing apparatus.
Fig. 5B is a schematic diagram showing an example of a conventional cleaning operation performed by an operator.
FIG. 5C is a schematic view of the space of the waste passage that can reach the platform receiving station.
Detailed Description
The present inventors have made extensive studies on the manner by which the cleaning water can be stably brought into contact with the entire region of the waste liquid passage, based on the sectional shape of the platform receiving table and the structure of the arrival point.
As a result, the present inventors have found that washing water is injected from nozzles fixedly arranged in two directions (i.e., an annular portion at the center and a radial portion from the center to the outer circumferential direction) to cause sludge to flow out, thereby achieving a high sludge removal effect and enabling washing to be completed in a short time, and have completed the present invention.
The present invention will be described in detail below with reference to the accompanying drawings as an example of an embodiment, but the present invention is not limited thereto.
FIG. 1F is a schematic view showing an example of a polishing apparatus to which the cleaning apparatus of the present invention can be applied. The upper side is a longitudinal sectional view and the lower side is a plan view. In addition, a platen receiving table and the like located on a lower side than the lower platen in the longitudinal sectional view are omitted, and the upper platen and the slurry supply nozzle are omitted in the plan view.
The polishing apparatus 11 includes an upper platen 12 and a lower platen 13 which are rotatable. The lower platen 13 includes a sun gear 14 at the upper surface of the center portion thereof, and an annular internal gear 15 at the peripheral portion thereof. The upper platform 12 can be raised and lowered. Further, a toothed portion that meshes with the sun gear 14 and the ring gear 15 is formed on the outer peripheral surface of a carrier 16 that holds a wafer W (workpiece), and a gear structure is formed as a whole.
The carrier 16 is provided with 1 or more holding holes 17. The wafer W to be polished is inserted into the holding hole 17 and held. One or more carriers 16 holding the wafers W are arranged, sandwiched between the upper surface plate 12 and the lower surface plate 13 which are lowered from above and positioned, and can rotate and revolve by the rotation of the lower surface plate 13 and the like.
A slurry supply nozzle 18 is disposed above the upper surface plate 12, and slurry can be supplied from the slurry supply nozzle 18 to between the wafer W and the upper and lower surface plates 12 and 13 through a through hole 19 provided in the upper surface plate 12.
Fig. 1E is a schematic view showing an example of a platen receiving table for supporting and rotating the lower platen in the polishing apparatus.
In the platform receiving base 20, a waste liquid passage 23 is formed which is composed of an annular portion 21 and 1 or more (here, 8) radial portions 22, the annular portion 21 is located on the inner circumferential side around the rotation axis of the platform receiving base, and the radial portions 22 extend radially from the annular portion in the outer circumferential direction. The radial portion 22 is inclined downward in the outer circumferential direction, and is configured to receive and discharge sludge from the lower deck 13. The number of the radial portions 22 is appropriately determined according to the amount of sludge to be discharged, and the upper limit number thereof is not particularly limited, and may be set to 60 or less, for example.
Next, a cleaning apparatus of the present invention applied to the polishing apparatus shown in fig. 1E and 1F will be described.
Fig. 1A shows a plan view of the cleaning apparatus, and fig. 1B shows a side view of the cleaning apparatus. All of which are configured in the polishing apparatus.
The cleaning device 1 includes a first cleaning nozzle 2, a second cleaning nozzle 3, and an arm 4; the first cleaning nozzle 2 faces the annular portion 21 of the stage receiving base 20, and the second cleaning nozzle 3 faces the outer circumferential direction from the inner circumferential side of the stage receiving base 20. The number of each may be 1 or more. The arrangement position and the arrangement direction of the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixed by an arm 4, and the arm 4 is further fixed to an outer peripheral plate 6 by a back plate 5. The outer peripheral plate 6 is a cylindrical member fixedly disposed so as to surround the stage receiving base 20, and the holding back plate 5, the arm portion 4, the first cleaning nozzle 2, and the second cleaning nozzle 3 are sequentially attached as described above, whereby the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixedly disposed.
The fixing of the first cleaning nozzle 2, the second cleaning nozzle 3, and the arm 4 will be described in more detail using a simplified diagram showing the positional relationship for the sake of explanation.
Fig. 1C is a plan view of the vicinity of the cleaning device, and fig. 1D is a side view of the vicinity of the cleaning device.
The holding back plate 5 of the cleaning device is adjustable in length in accordance with the outer peripheral plate 6, and is held by the outer peripheral plate 6 by, for example, spring expansion and contraction, and then fixed to the outer peripheral plate 6 by screws or the like. The arm 4 of the cleaning apparatus 1 is slidable in the horizontal direction to adjust the nozzle position, and the tip of the arm 4 having the first cleaning nozzle 2 and the second cleaning nozzle 3 is slidable in the vertical direction to adjust the height. Further, the spray direction of the washing water can also be adjusted by rotating the first washing nozzle 2 and the second washing nozzle 3, respectively. By these adjustments, the tip end of the arm 4 can be inserted into the waste liquid passage from the gap at the center of the lower surface plate, and the injection position of the first cleaning nozzle 2 can be adjusted and fixed to face the annular portion 21 and the injection position of the second cleaning nozzle 3 can be adjusted and fixed to face the radial portion 22.
The holding back plate 5 may be reinforced with a reinforcing material. This is effective in preventing positional displacement of the arm 4, such as lifting of the cleaning water jet.
Of course, the method of fixing the first cleaning nozzle 2 and the second cleaning nozzle 3 via the arm 4 is not limited to this, and may be determined as appropriate. For example, the arm portion 4 may be fixed to a floor, a wall surface, another fixing member, or the like.
Fig. 2 shows the range of spraying of the washing water by the washing apparatus 1.
As shown in fig. 2, the annular portion 21 is sprayed with the cleaning water from the first cleaning nozzle 2, and the radial portion 22 is sprayed with the cleaning water from the second cleaning nozzle 3.
In this way, the cleaning water is sprayed while the arrangement position and the arrangement direction of the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixed, and the platform receiving base 20 and the lower platform 13 are rotated, thereby automatically performing the cleaning operation.
Further, since the washing water from the first washing nozzle 2 is sprayed to the entire area of the annular portion 21 and the washing water from the second washing nozzle 3 is sprayed to the entire area of the radial portion 22, sludge in the entire area of the waste liquid passage can be effectively removed. Further, since the sludge removing effect is high, the working time is shortened, and since it is an automatic operation, an operator is not required in the washing.
Further, the first cleaning nozzle 2 and the second cleaning nozzle 3 (particularly, the second cleaning nozzle 3) may be fan-shaped nozzles capable of jetting cleaning water in a fan shape. In the case of the fan-type nozzle, the washing water is widely spread to be sprayed, and thus a higher sludge removing effect can be obtained.
The structure of the fan-shaped nozzle and the linear nozzle capable of linearly spraying the washing water will be described.
Fig. 3A shows a front view of the ejection opening of the fan-shaped nozzle, fig. 3B shows an ejection explanatory view of a cross section a-a of the fan-shaped nozzle, fig. 3C shows a front view of the ejection opening of the straight-line nozzle, and fig. 3D shows an ejection explanatory view of a cross section B-B of the straight-line nozzle.
As shown in fig. 3A and 3B, the fan-shaped nozzle has a groove extending in a fan shape from a central discharge port, and the discharged washing water spreads along the groove, so that the discharge shape is in a fan shape.
On the other hand, in the linear nozzle, as shown in fig. 3C and 3D, since the washing water is directly sprayed from the center of the spray port, the spray shape becomes a straight line.
Fig. 3E shows an example of the arrangement of the fan-shaped nozzles facing the radial portion.
The diffusion direction of the washing water in the fan-shaped nozzle can be changed by throttling the washing nozzle, but it is more preferable to arrange the washing water so as to spread in the vertical direction. In this case, as shown in fig. 3E, since the washing water is sprayed to the entire waste liquid passage in accordance with the rotation of the platform receiving table, a higher sludge removing effect can be obtained as compared with the case where the washing water is arranged to spread laterally.
A cleaning method using the cleaning apparatus 1 of the present invention will be described.
First, the arm 4 is attached to the holding back plate 5, and the first cleaning nozzle 2 and the second cleaning nozzle 3 are attached to the tip end portion of the arm 4. Further, the clamping back plate 5 is mounted to the fixedly arranged peripheral plate 6.
The height of the tip portion to which the nozzle is attached in the vertical direction is adjusted in a state where the length of the arm portion in the horizontal direction is adjusted, and the tip portion is inserted into the waste liquid passage from the central portion gap of the lower surface plate. And then fixing the position and the direction of the cleaning nozzle.
In this state, the surface plate receiving base and the lower surface plate are rotated while the washing water is sprayed.
Thereby, washing water is jetted in both directions of the annular portion and the radial portion (outer circumferential direction), and automatic washing of the entire area of the waste liquid passage is performed.
As the washing water sprayed from the washing nozzle, for example, water can be used. A higher sludge removal effect can be obtained if high-pressure water is used. The injection force itself is not particularly limited, and may be, for example, 20MPa or more.
Examples
The present invention will be further described with reference to the following examples, which are merely illustrative and should not be construed as limiting.
(examples)
A cleaning apparatus of the present invention shown in fig. 1A to 1D, 3A, and 3B was prepared.
The first washing nozzle and the second washing nozzle of the washing device are designed to spray washing water in a fan shape, and the second washing nozzle is installed in a manner that the washing water is expanded in the vertical direction. High-pressure water of 20Mpa was injected from the first and second cleaning nozzles to rotate the stage at 2rpm, thereby performing an automatic cleaning operation, and measuring an annual cleaning time and a sludge removal amount.
Comparative example
Cleaning was performed under the same conditions as in the examples, except that the cleaning apparatus of the present invention was not used, but was performed by a manual operation shown in fig. 5B.
As a result, as shown in FIG. 4, in the example, the annual washing time was 112 hours and the annual sludge removal amount was 448 kg. In the comparative example, the annual washing time was 336h and the annual sludge removal amount was 134 kg. Compared with the prior mode (comparative example) that the operator uses the cleaning hose for cleaning, the annual cleaning time is 1/3 by adopting the cleaning device of the invention, and the annual sludge removal amount is improved by about 234 percent.
The present invention is not limited to the above embodiment. The above embodiments are illustrative, and any configuration having substantially the same configuration as the technical idea described in the claims of the present invention and having the same operation and effect is included in the technical scope of the present invention.
Claims (2)
1. A cleaning device for a polishing apparatus, which comprises rotatable upper and lower platens and a slurry supply nozzle for supplying a slurry between the upper and lower platens, and which polishes a workpiece interposed between the upper and lower platens by rotating the upper and lower platens while supplying the slurry,
washing a waste liquid passage formed on a table receiving table supporting the lower table to be rotatable together with the lower table, by washing water, for discharging waste slurry flowing down from the lower table,
the cleaning device of the grinding device comprises: a first cleaning nozzle and a second cleaning nozzle which spray the cleaning water; and an arm portion to which the first cleaning nozzle and the second cleaning nozzle are attached and which fixes the arrangement position and the arrangement orientation of the first cleaning nozzle and the second cleaning nozzle,
the waste liquid passage is composed of an annular part located on the inner circumferential side around the rotation axis of the platform receiving table and more than one radial parts radially extending from the annular part to the outer circumferential direction,
the first cleaning nozzle faces the annular part, and the second cleaning nozzle faces the outer circumferential direction from the inner circumferential side of the platform receiving table,
by spraying the washing water from the first washing nozzle and the second washing nozzle which are fixedly arranged and rotating the platform receiving table and the lower platform, the whole area of the annular part can be automatically washed by the washing water from the first washing nozzle, and the whole area of the radial part can be automatically washed by the washing water from the second washing nozzle.
2. The cleaning device for an abrasive device according to claim 1,
the first and second washing nozzles may spray the washing water in a fan shape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020002108A JP7218731B2 (en) | 2020-01-09 | 2020-01-09 | Cleaning equipment for lapping equipment |
| JP2020-002108 | 2020-01-09 | ||
| PCT/JP2020/041761 WO2021140737A1 (en) | 2020-01-09 | 2020-11-09 | Cleaning device for lapping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114786871A true CN114786871A (en) | 2022-07-22 |
| CN114786871B CN114786871B (en) | 2024-03-08 |
Family
ID=76787846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080086058.6A Active CN114786871B (en) | 2020-01-09 | 2020-11-09 | Cleaning device for grinding device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7218731B2 (en) |
| KR (1) | KR20220119387A (en) |
| CN (1) | CN114786871B (en) |
| TW (1) | TW202130461A (en) |
| WO (1) | WO2021140737A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3030608B2 (en) * | 1995-08-21 | 2000-04-10 | 株式会社荏原製作所 | Platen cleaning equipment for lapping machines |
| JP6369263B2 (en) * | 2014-09-25 | 2018-08-08 | 株式会社Sumco | Work polishing apparatus and work manufacturing method |
| KR101596598B1 (en) | 2014-11-10 | 2016-02-22 | 주식회사 엘지실트론 | Wafer polishing apparatus |
-
2020
- 2020-01-09 JP JP2020002108A patent/JP7218731B2/en active Active
- 2020-11-09 WO PCT/JP2020/041761 patent/WO2021140737A1/en active Application Filing
- 2020-11-09 KR KR1020227021626A patent/KR20220119387A/en unknown
- 2020-11-09 CN CN202080086058.6A patent/CN114786871B/en active Active
- 2020-11-24 TW TW109141034A patent/TW202130461A/en unknown
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| JPH079342A (en) * | 1993-06-30 | 1995-01-13 | Sumio Tanaka | Washing device for surface plate of double polishing machine |
| TW421619B (en) * | 1998-06-08 | 2001-02-11 | Ebara Corp | Discharging mechanism of product from polishing and polishing device |
| JP2004281641A (en) * | 2003-03-14 | 2004-10-07 | Tokyo Electron Ltd | Coating equipment |
| CN201049437Y (en) * | 2004-10-12 | 2008-04-23 | 应用材料公司 | Polishing pad adjuster and chemical machinery device with the same |
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| CN101844328A (en) * | 2009-03-27 | 2010-09-29 | 不二越机械工业株式会社 | The apparatus and method that are used for cleaning polishing cloth |
| CN104217979A (en) * | 2013-05-28 | 2014-12-17 | 东京毅力科创株式会社 | Substrate cleaning apparatus and substrate cleaning method |
| CN104701218A (en) * | 2013-12-04 | 2015-06-10 | 株式会社迪思科 | Cleaning apparatus |
| CN105382677A (en) * | 2014-08-26 | 2016-03-09 | 株式会社荏原制作所 | buff process module, SUBSTRATE PROCESSING APPARATUS and buff pad cleaning method |
| JP2016055381A (en) * | 2014-09-09 | 2016-04-21 | 信越半導体株式会社 | Lapping method |
| CN209831364U (en) * | 2019-04-30 | 2019-12-24 | 青岛嘉星晶电科技股份有限公司 | Combined wafer grinding disc |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7218731B2 (en) | 2023-02-07 |
| CN114786871B (en) | 2024-03-08 |
| TW202130461A (en) | 2021-08-16 |
| KR20220119387A (en) | 2022-08-29 |
| WO2021140737A1 (en) | 2021-07-15 |
| JP2021109271A (en) | 2021-08-02 |
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