JP2010052090A - Polishing device and polishing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device facilitating cleaning and suppressing the remaining of polishing slurry smudges, and a polishing method using the same. <P>SOLUTION: A double-side polishing device 50 comprises a sun gear 21, an internal gear 22, a lower surface plate 20, an upper surface plate 30, and a slurry nozzle 151 provided on the upper surface plate 30. Below the lower surface plate 20, a bucket-shaped first slurry receiver 105 is provided so as to surround the outside of the internal gear 22. A plurality of spray nozzles 90a, 90b discharging flushing water toward an inner wall part of the internal gear 22 and the first slurry receiver 105 is provided near a bottom surface side of a side wall inner edge part of the first slurry receiver 105. Between an inner wall of the internal gear 22 and a lower surface plate receiving portion 20B of the lower surface plate 20, a plurality of spray nozzles 91a, 91b disposed so as to discharge flushing water toward the inner wall of the internal gear 22 and the lower surface plate receiving portion 20B of the lower surface plate 20 is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a polishing apparatus and a polishing method for polishing a substrate to a predetermined thickness and surface state.

Conventionally, piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators have been used as reference frequency sources for electronic equipment such as communication equipment, information equipment, and consumer equipment. Moreover, as a piezoelectric material of the piezoelectric vibrating piece used in this piezoelectric device, single crystal quartz is adopted because stable frequency characteristics can be obtained. A quartz crystal vibrating piece made of quartz is formed by using a quartz crystal wafer as a base material cut out from a quartz lumbard in which a part of an artificial quartz crystal is formed into a block shape with a clear crystal axis (optical axis). That is, the cut crystal wafer is polished so as to have a desired thickness and surface state, and then necessary electrodes such as an excitation electrode are formed, and further formed into a desired shape, so that the crystal wafer is separated from the crystal wafer. The above crystal vibrating piece is obtained. Here, since the thickness of the crystal wafer adjusted by the polishing process is a factor that determines the frequency of the crystal vibrating piece obtained from the crystal wafer, the polishing process is a very important process.
In addition to a quartz wafer, a semiconductor wafer (IC wafer) used when forming a semiconductor integrated circuit is also polished to a desired thickness. When polishing these crystal wafers and semiconductor wafers, each wafer is very susceptible to contamination because it does not impair the characteristics of its surface. The cleaning work is performed by flowing cleaning water such as water. At the time of cleaning, the cleaning liquid is discharged from the water discharging means such as a spray nozzle toward the wafer and the surface plate, and the polishing slurry adhering to the wafer and the surface plate is washed away.
For example, Patent Document 1 discloses a double-side polishing apparatus as a polishing apparatus that polishes a wafer using a polishing slurry and includes a water discharge means for cleaning.

  The double-side polishing apparatus described in Patent Document 1 is a so-called planetary gear having a carrier plate as a planetary gear having a wafer holding hole for holding one or a plurality of crystal wafers, a sun gear (sun gear), and an internal gear (internal gear). It is a gear type double-sided lapping device. When a quartz wafer is polished using this double-side polishing machine, a plurality of carrier plates holding the quartz wafer in the wafer holding holes are held between the sun gear at the center of the double-side polishing machine and the internal gear at the outer periphery. Then, the quartz wafer is sandwiched so as to be pressed against both main surfaces of the quartz wafer by a lower surface plate and an upper surface plate arranged in the vertical direction of the carrier plate holding the quartz wafer. Then, while supplying the polishing slurry from the slurry nozzle of the slurry supply device as the slurry supply means disposed above the quartz wafer, the lower surface plate and the upper surface plate are rotated in the relative direction, and at the same time, the carrier by the sun gear and the internal gear. Both main surfaces of the quartz wafer are polished simultaneously by rotating and revolving the plate.

JP 2005-230978 A

  By the way, a slurry receiver that receives polishing slurry is usually disposed below a surface plate of a polishing apparatus such as the double-side polishing apparatus described in Patent Document 1, and the polishing slurry used for polishing flows down to the slurry receiver. Accumulated and collected. In addition, a polishing apparatus that performs polishing by circulating the polishing slurry by returning the polishing slurry recovered in the slurry receiver to the slurry supply apparatus via a separately provided slurry recovery apparatus is also widely used. At this time, the polishing slurry becomes contaminated in a portion that becomes a path through which the polishing slurry used in the polishing process of the polishing apparatus flows down, that is, a portion between the polishing surface of the surface plate and the polishing slurry receiver. Easy to remain. As described above, the polishing slurry remaining on the polishing apparatus dries and adheres to the agglomerates as time passes to contaminate the apparatus, and the adhered agglomerates may drop off, resulting in a defect in the quality of the polishing process. is there. For example, when polishing processing is performed by circulating the polishing slurry as described above, aggregates of the dropped polishing slurry are mixed into the polishing slurry recovery liquid, which is processed from the slurry supply means to the workpiece such as a quartz wafer. When supplied to the surface, there is a risk of generating scratches on the processed surface. In addition, in order to suppress such adverse effects on the polishing process quality, when cleaning and cleaning the polishing apparatus after the polishing process, the surface between the surface side different from the processed surface of the surface plate and the slurry receiver is placed. Has a problem that workability is very poor. For example, it is necessary to clean and clean after removing the surface plate.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A polishing apparatus according to this application example includes a surface plate having a polishing surface for polishing at least one of the parallel surfaces of the substrate, and the substrate facing the polishing surface. Slurry supply means for supplying polishing slurry to a processed surface to be polished, a slurry receiver disposed below the surface plate and receiving the polishing slurry used in the polishing, and the polishing surface of the surface plate And a water discharge means for discharging the wash water toward at least a part between the slurry receivers from different surface sides.

  According to this configuration, by discharging the cleaning water from the water discharging means, it is possible to efficiently clean the portion from the lower side of the surface different from the polishing surface of the surface plate that is difficult to access to the slurry receiver. It is possible to prevent the polishing slurry containing polishing scraps from being fixed to the polishing apparatus. Therefore, it is possible to improve the efficiency of cleaning of the polishing apparatus, and it is possible to prevent quality defects such as scratches generated on the processed surface of the base material by dropping the fixed polishing slurry and dropping on the polished surface of the base material. .

  Application Example 2 In the polishing apparatus according to the application example described above, the slurry receiver and the slurry supply unit are connected by a slurry pipe, and have a slurry circulation structure capable of performing polishing while circulating the polishing slurry. It is characterized by that.

  According to this configuration, the polishing slurry can be prevented from sticking to and dropping off from the polishing apparatus, so that the solidified product of the polishing slurry is less likely to be mixed into the circulating polishing slurry. Polishing can be efficiently performed while automatically supplying the slurry.

  Application Example 3 In the polishing apparatus according to the application example, the water discharge means has a water discharge port for spraying the cleaning water in a mist form.

  According to this configuration, by polishing while spraying mist-like cleaning water, the polishing slurry is less likely to adhere to the portion of the polishing apparatus to which the cleaning water has been applied. It is possible to reduce or omit the load of the cleaning work. In addition, the amount of water discharged from the water discharge means is suppressed, and when polishing processing is performed by circulating the polishing slurry, the polishing slurry is not easily diluted by the cleaning water, so that the quality of the polishing processing can be stabilized. .

  Application Example 4 In the polishing apparatus according to the application example, the water discharge port of the water discharge unit is provided to be swingable.

  According to this configuration, the change in the water pressure of the cleaning water with respect to the portion to be cleaned of the polishing apparatus can improve the removal efficiency of dirt such as the polishing slurry.

  Application Example 5 In the polishing apparatus according to the application example described above, the surface of the surface plate is in contact with at least a part of a portion to which the cleaning water from the water discharge means is applied between the slurry receiver from a surface different from the polishing surface. A wiper for rubbing is provided.

  According to this configuration, the dirt removal efficiency can be further improved.

  Application Example 6 In the polishing apparatus according to the application example described above, vibration is applied to at least a part of a portion to which the cleaning water from the water discharge unit is applied between the slurry receiver from a surface different from the polishing surface of the surface plate. It is characterized by comprising an exciting means for applying.

  According to this configuration, the portion of the polishing apparatus that is exposed to the cleaning water vibrates, so that foreign matters such as polishing slurry can be efficiently removed.

  Application Example 7 A polishing method according to this application example includes a surface plate having a polishing surface for polishing at least one of the parallel surfaces of the substrate, and the substrate facing the polishing surface. Slurry supply means for supplying polishing slurry to a processed surface to be polished, a slurry receiver disposed below the surface plate and receiving the polishing slurry used in polishing, and the polishing surface of the surface plate A polishing method for polishing the base material using a polishing apparatus having a water discharge means for discharging cleaning water toward at least a part between the slurry receivers from different surfaces, and polishing the base material And a step of applying the cleaning water to a portion between the slurry receivers from a surface different from the processing surface of the surface plate by the water discharging means.

  According to this configuration, by discharging the cleaning water from the water discharging means, it is possible to efficiently clean the portion from the lower side of the surface different from the polishing surface of the surface plate that is difficult to access to the slurry receiver. It is possible to prevent the polishing slurry containing polishing scraps from being fixed to the polishing apparatus. Therefore, it is possible to improve the efficiency of cleaning of the polishing apparatus, and to prevent the defective polishing such as scratches generated on the processing surface of the base material from falling off on the polishing surface of the base material by dropping the fixed polishing slurry and polishing processing. It can be performed.

  Application Example 8 A polishing method according to this application example includes a base plate having a polishing surface for polishing at least one of parallel surfaces of a base material, and the base material facing the polishing surface. Slurry supply means for supplying polishing slurry to a processed surface to be polished, a slurry receiver disposed below the surface plate and receiving the polishing slurry used in the polishing, and the polishing surface of the surface plate A polishing method for polishing the substrate using a polishing apparatus having a water discharge means for discharging cleaning water toward at least a part between the slurry receivers from different surface sides, the water discharge means, Polishing is performed while applying the cleaning water to a portion between the slurry receiver from a surface different from the processing surface of the surface plate.

  According to this configuration, since the polishing slurry used for the polishing process is less likely to adhere to the portion wetted by the cleaning water discharged from the water discharge means, the polishing slurry is less likely to adhere, and the load of the cleaning operation is reduced. Or it can be omitted.

  Hereinafter, an embodiment of a polishing apparatus will be described with reference to the drawings.

(Double-side polishing machine)
First, a double-side polishing apparatus as a polishing apparatus used in the polishing method of the present embodiment will be described with reference to the drawings.
FIG. 1 is a cross-sectional view schematically illustrating a double-side polishing apparatus. FIG. 2 is a plan view schematically showing a carrier plate for holding a workpiece as a substrate in the double-side polishing apparatus. FIG. 3A is a plan view schematically illustrating the movement of each part including the carrier plate in the lower surface plate portion of the double-side polishing apparatus, and FIG. 3B is a cross-sectional view taken along the line AA in FIG. It is a fragmentary sectional view typically explaining including the upper surface plate arranged in the upper part of (a).

In FIG. 1, a double-side polishing device 50 is a planetary gear type double-sided lapping device, which includes a sun gear (sun gear) 21, an internal gear (internal gear) 22, a lower surface plate 20 as a first surface plate, An upper surface plate 30 as a surface plate 2 is provided as a main rotating member, and these rotating members can be driven independently. Further, the upper surface plate 30 of the double-side polishing apparatus 50 includes a slurry nozzle 151 as a part of the slurry supply means. Below the lower surface plate 20, a first slurry receiver 105 and a second slurry receiver 106 are provided. Is provided.
Hereinafter, the cross-sectional structure of the double-side polishing apparatus 50 will be described in detail with reference to FIG. 1, but the double-side polishing apparatus 50 includes, as shown in FIG. And other members are combined.

  As shown in FIG. 1, the sun gear 21 is rotatably attached to the center of the double-side polishing apparatus 50, and a gear portion 40 is provided at the lower end portion thereof. The gear unit 40 is connected to a sun gear driving device 46 that can drive and rotate the sun gear 21 via the gear unit 40. Specifically, the sun gear driving device 46 includes a motor (not shown) and a transmission for shifting the rotation of the motor, and a chain 48 is wound around the gear 47 directly connected to the sun gear driving device 46 and the gear portion 40. ing. As a result, the rotation of the motor shifted by the transmission of the sun gear driving device 46 is transmitted to the gear unit 40 via the gear 47 and the chain 48, and the sun gear 21 rotates at a speed corresponding to the driving force of the sun gear driving device 46. It is designed to rotate at.

  The lower surface plate 20 is rotatably attached to the outside of the sun gear 21 and has a disk-shaped surface plate portion 20A having a polishing surface 20c for polishing a workpiece on the upper surface, and a surface different from the polishing surface 20c of the surface plate portion 20A. The lower surface plate receiving portion 20B is supported from below, and a gear portion 60 is provided at the lower end of the lower surface plate receiving portion 20B. The gear portion 60 is connected to a lower surface plate / upper surface plate driving device 66 that drives and rotates the lower surface plate 20 via the gear portion 60. The lower surface plate / upper surface plate driving device 66 is provided with a motor (not shown) and a transmission for shifting the rotation of the motor, and is directly connected to the lower surface plate / upper surface plate driving device 66, similarly to the sun gear driving device 46. The lower platen / upper platen driving device 66 further includes a gear 69 around which the other of the chain 68 is wound, and the gear 69. And a gear 69a fixed to the rotary shaft 69b and meshed with the gear portion 60 of the lower surface plate 20. As a result, the rotation of the motor shifted by the transmission of the lower surface plate / upper surface plate driving device 66 is transmitted to the gear 69 via the gear 67 and the chain 68. As a result, the gear 69a rotates integrally with the gear 69, and the lower surface plate 20 rotates at a rotation speed corresponding to the driving force of the lower surface plate / upper surface plate driving device 66.

  The internal gear 22 is rotatably attached to the outside of the lower surface plate 20, and a gear portion 70 is provided at the lower end portion thereof. The gear unit 70 is connected to an internal gear driving device 76 that can drive and rotate the internal gear 22 via the gear unit 70. Similarly to the sun gear drive device 46, the internal gear drive device 76 also includes a motor (not shown) and a transmission for shifting the rotation of the motor, and the gear 77 directly connected to the internal gear drive device 76 and the gear of the internal gear 22 are provided. A chain 78 is wound around the portion 70. As a result, the rotation of the motor shifted by the transmission of the internal gear driving device 76 is transmitted to the gear portion 70 via the gear 77 and the chain 78, and the internal gear 22 corresponds to the driving force of the internal gear driving device 76. It is designed to rotate at the rotation speed.

  On the other hand, the upper surface plate 30 is a disk-shaped surface plate having a polishing surface 30c for polishing a workpiece on the lower surface side, and is suspended from a cylinder rod 39 of a cylinder (not shown) disposed above, It can be moved up and down by operating the cylinder. In the double-side polishing apparatus 50 of FIG. 1, the upper surface plate 30 is lifted to stand at a standby position, for example. The upper surface plate 30 can be driven and rotated by the lower surface plate / upper surface plate driving device 66. Specifically, a shaft 80 is rotatably inserted into the center hole of the sun gear 21, and a driver 81 is attached to the upper end portion of the shaft 80. A vertical groove 81a is formed in the driver 81. When the upper surface plate 30 is lowered and polished, the vertical groove 81a is engaged with the hook 82 of the upper surface plate 30. Yes. Further, a gear portion 83 is provided at the lower end portion of the shaft 80, and the gear portion 83 is engaged with the gear 85 via the play gear 84. The gear 85 is fixed together with the gear 69 a to the rotation shaft 69 b of the lower surface plate / upper surface plate driving device 66. Accordingly, when the lower surface plate / upper surface plate driving device 66 is operated, the driving force of the lower surface plate / upper surface plate driving device 66 is transmitted to the gear portion 83 via the gear 85 and the idle gear 84, and is transmitted to the driver 81. The engaged upper surface plate 30 rotates in the direction opposite to the lower surface plate 20.

  Further, the upper platen 30 is provided with a slurry nozzle 151 for discharging or dropping the polishing slurry onto the polishing surface of the substrate by a slurry supply device 150 as a slurry supply means. The polishing slurry is an abrasive in which abrasive grains such as artificial diamond are dispersed in water or oil at a high concentration. The polishing slurry supplied to the polishing surface of the base material from the slurry nozzle 151 is controlled by the slurry supply device 150 so that a predetermined amount is constantly or intermittently supplied to the polishing surface during polishing.

The double-side polishing apparatus 50 includes a bowl-shaped first slurry receiver 105 provided so as to surround the outside of the internal gear 22. Further, in the vicinity of the bottom surface side of the inner edge portion of the side wall of the first slurry receiver 105, water discharge means for discharging cleaning water toward the inner wall portion including the outer peripheral surface of the internal gear 22 and the inner bottom surface of the first slurry receiver 105. A plurality of spray nozzles 90a and 90b are provided. The spray nozzles 90a and 90b are connected by a water distribution pipe to a cleaning device 155 that controls the pressure of the cleaning water supplied from the cleaning water source and the timing of water discharge.
The slurry receiver 105 is a container that collects the polishing slurry used for the polishing process and the cleaning water used when cleaning the double-side polishing apparatus 50 by the spray nozzles 90a and 90b, and to the periphery of the polishing slurry and the cleaning water. Functions as a cover to prevent splashing.
The drain ports 105a and 105b provided on the bottom surface of the slurry receiver 105 are connected to a slurry recovery device 152 having a pump and a recovery tank (not shown) by slurry piping. In the slurry pipe, recovery valves D105a and D105b and discharge valves D105c and D105d are arranged. When polishing is performed in a slurry circulation mode in which the polishing slurry recovered in the slurry receiver 105 is recovered in the slurry recovery device 152 and reused, the discharge valves D105c and D105d are closed and the recovery valves D105a and D105b are opened. When the used polishing slurry collected in the slurry receiver 105 or the cleaning water discharged from the spray nozzles 90a, 90b is discharged to the outside, the recovery valves D105a, D105b are closed and the discharge valves D105c, D105d are set. be opened.

Further, the inner wall of the internal gear 22 and the lower surface plate receiving portion 20B of the lower surface plate 20, that is, the polishing surface 20c of the lower surface plate 20, are different between the inner wall of the internal gear 22 and the lower surface plate receiving portion 20B of the lower surface plate 20. A plurality of spray nozzles 91a and 91b are provided as water discharge means arranged to discharge the cleaning water toward the surface. The spray nozzles 91a and 91b are connected to the cleaning device 155 by a water pipe, similarly to the spray nozzles 90a and 90b.
Below the portion where the cleaning water discharged from the spray nozzles 91a, 91b flows down, that is, below the portion where the gap between the inner wall of the internal gear 22 and the lower surface plate receiving portion 20B is formed in the vertical direction, A second slurry receiver 106 is provided. The slurry receiver 106 flows down from between the internal gear 22 and the lower surface plate 20 of the cleaning water used when the double-side polishing apparatus 50 is cleaned by the spray nozzles 91a and 91b and the polishing slurry used for the polishing process. Functions as a container for collecting the polishing slurry.

Drain ports 106a and 106b are provided on the bottom surface of the slurry receiver 106, and the drain ports 106a and 106b are connected to a slurry recovery device 152 having a recovery tank by a slurry pipe. In the slurry pipe, recovery valves D106a and D106b and discharge valves D106c and D106d are arranged. When polishing is performed in a slurry circulation mode in which the polishing slurry recovered in the slurry receiver 106 is recovered in the slurry recovery device 152 and reused, the discharge valves D106c and D106d are closed and the recovery valves D106a and D106b are opened. Further, when the used polishing slurry collected in the slurry receiver 106 or the cleaning water discharged from the spray nozzles 91a, 91b is discharged to the outside, the recovery valves D106a, D106b are closed and the discharge valves D106c, D106d are set. be opened.
The slurry collection device 152 connected to the slurry receivers 105 and 106 by slurry piping is provided with a collection pump, a filtration device, or a slurry replenishment device (not shown) so that the collected polishing slurry can be reused. In addition, they are connected by slurry piping so as to be sent out to the slurry supply device 150.

In the double-side polishing apparatus 50 configured as described above, a carrier plate 10 as a planetary gear that holds a base material that is one or a plurality of objects to be polished is placed on the lower surface plate 20. In the present embodiment, a base material that is a workpiece subjected to double-side polishing by the double-side polishing apparatus 50 is hereinafter referred to as a workpiece.
As shown in FIG. 2, the carrier plate 10 is a disk-shaped plate having a plurality of work holding holes 15 for holding a work 1a as a base material, and is a polished wafer obtained by polishing the work 1a. The thickness is smaller than the target thickness value. The carrier plate 10 of this embodiment is provided with five workpiece holding holes 15.

When the workpiece 1 a is polished by the double-side polishing apparatus 50, as shown in FIG. 3, the plurality of carrier plates 10 in which the workpiece 1 a is inserted and held in the workpiece holding holes 15 are connected to the sun gear 21 at the center of the double-side polishing apparatus 50. And held between the internal gears 22 on the outer periphery. Further, both main surfaces of the workpiece 1a are pressed by the lower surface plate 20 and the upper surface plate 30 which are arranged in the vertical direction of the carrier plate 10 and simultaneously grind both main surfaces of the workpiece 1a with the work surfaces 1a facing each other. So that the carrier plate 10 is sandwiched. The carrier plate 10 is rotated by the sun gear 21 and the internal gear 22 at the same time as the lower surface plate 20 and the upper surface plate 30 are rotated relative to the work 1a while supplying the polishing slurry from the slurry nozzle 151 above the work 1a. Are rotated and revolved to simultaneously polish both main surfaces of the work 1a. In FIG. 3A, the rotation directions of the sun gear 21, the internal gear 22, the lower surface plate 20, and the carrier plate 10 are indicated by arrows 25 to 28, but not limited thereto, the rotation of the carrier plate 10 is not limited thereto. The direction (arrow 28) may vary depending on the revolution ratio. As described above, the workpiece 1a can also be polished by rotating the lower surface plate 20 and the carrier plate 10 while the upper surface plate 30 is fixed without rotating.
Further, when the upper surface plate 30 is lowered and polished, the hook 82 engaged with the vertical groove 81a of the driver 81 shown in FIG. 1 is retracted so as not to be engaged with the vertical groove 81a. It has become. When the hook 82 is retracted, the upper surface plate 30 is fixed without rotating during polishing, and the three members of the sun gear 21, the internal gear 22, and the lower surface plate 20 rotate to perform polishing. A so-called three-way polishing process is performed.

(Polishing method)
Next, a method for polishing the workpiece 1a using the double-side polishing apparatus 50 will be described in detail.
FIG. 4 is a flowchart showing a polishing method for polishing the workpiece 1 a using the double-side polishing apparatus 50. In the following description of the polishing method for the workpiece 1a, refer to FIGS. 1 to 3 for the double-side polishing apparatus 50 including the carrier plate 10 holding the workpiece 1a.

In polishing the workpiece 1a, first, a predetermined number of workpieces 1a are inserted and held in the workpiece holding holes 15 of the carrier plate 10. A plurality of carrier plates 10 on which the workpiece 1a is set in this way are prepared. Then, the plurality of carrier plates 10 on which the work 1a is set are set on the lower surface plate 20 in a state where they are engaged with the sun gear 21 and the internal gear 22 of the double-side polishing apparatus 50 (step S1).
Next, the cylinder is operated to lower the upper surface plate 30 suspended from the cylinder rod 39, and the workpiece 1a held by the carrier plate 10 is moved between the lower surface plate 20 and the upper surface plate 30 with a predetermined pressure (polishing load). ) Is added.

  Next, as shown in step S2, the recovery valves D105a, D105b, D106a, D106b and the discharge valves D105c, D105d, D106c of the slurry pipes connecting the slurry receivers 105, 106 of the double-side polishing apparatus 50 and the slurry recovery apparatus 152, respectively. , D106d is operated to enter the slurry circulation mode. That is, the recovery valves D105a, D105b, D106a, and D106b are opened, and the discharge valves D105c, D105d, D106c, and D106d are closed. As a result, the polishing slurry recovered in the slurry receivers 105 and 106 is recovered in the slurry recovery device 152 via the slurry piping, filtered and replenished as necessary, and then supplied to the slurry supply device via the slurry piping. 150 is used for polishing.

Next, as shown in step S3, the slurry supply device 150 is driven to supply a predetermined amount of polishing slurry from the slurry nozzle 151 to the processed surface of the workpiece 1a, while the sun gear 21, the lower surface plate 20, and the internal gear 22 are connected. Driving and rotating to start polishing.
The polishing process is continued, and when the thickness of the workpiece 1a reaches the target thickness value, the polishing process is terminated (step S4).

  After the polishing process is completed, next, as shown in step S5, the slurry pipe recovery valves D105a, D105b, D106a, D106b and the discharge valves D105c, D105d, D106c, D106d are operated to enter the slurry discharge mode. That is, the recovery valves D105a, D105b, D106a, and D106b are closed, and the discharge valves D105c, D105d, D106c, and D106d are opened. As a result, the waste liquid containing the washing water discharged from the drain outlets 105a, 105b, 106a, 106b of the slurry receivers 105, 106 to the slurry pipe is not sent to the slurry recovery device 152, and the discharge valves D105c, D105d, D106c, D106d is discharged to the outside.

  Next, as shown in step S6, the cleaning device 155 is driven to start the discharge of cleaning water from the spray nozzles 90a, 90b, 91a, 91b, and is different from the polishing surface 20c of the lower surface plate 20 of the double-side polishing device 50. The abrasive slurry remaining below the surface is cleaned.

During the cleaning of the polishing slurry dirt of the double-side polishing apparatus 50, first, as shown in step S7, the carrier plate 10 is removed from the double-side polishing apparatus 50, and the polished work 1a held on the carrier plate 10 is removed.
If there is still a workpiece 1a to be polished next (Yes in step S8), the carrier plate 10 in which a predetermined number of workpieces 1a are inserted and held in the workpiece holding holes 15 is used as the sun gear 21 of the double-side polishing apparatus 50. Are set on the lower surface plate 20 in a state of being engaged with the internal gear 22 (step S9).
Then, when the washing for a predetermined time from the washing water discharge in step S6 is finished, the washing water is stopped to be discharged as shown in step S10, and the process returns to step S2 to return the slurry pipe recovery valves D105a, D105b, D106a, By operating D106b and discharge valves D105c, D105d, D106c, and D106d, the slurry piping is set to the slurry circulation mode, and then the polishing process for a new workpiece 1a is repeated.

  If there is no more workpiece 1a to be polished next after the workpiece 1a is removed during the cleaning of the polishing slurry dirt of the double-side polishing apparatus 50 (No in step S8), the cleaning water is discharged for a predetermined time from step S6. When the cleaning is completed, the water discharge of the cleaning water is stopped as shown in step S11, and the series of polishing processing steps is completed.

Next, the effect of the said embodiment is described.
The double-side polishing apparatus 50 of the above embodiment includes spray nozzles 90a, 90b, 91a, 91b that discharge cleaning water toward a portion that becomes a path where polishing slurry below the polishing surface 20c of the lower surface plate 20 is different from the polishing surface 20c. Provided.
This makes it possible to efficiently clean the polishing slurry adhering to the portion from the lower surface of the lower surface plate 20 different from the polishing surface 20c of the lower surface plate 20 that is difficult to reach to the slurry receiver 105, so that the polishing slurry containing polishing debris of the work 1a Can be prevented from sticking to the double-side polishing apparatus 50. Therefore, it is possible to efficiently clean the polishing slurry dirt of the double-side polishing apparatus 50, and to prevent quality defects such as scratches generated on the processed surface of the workpiece 1a due to the fixed polishing slurry dropping off and dropping on the processed surface of the workpiece 1a. can do.

In the double-side polishing apparatus 50 of the above embodiment, the slurry receivers 105 and 106 and the slurry supply apparatus 150 as the slurry supply means are connected by a slurry pipe via a slurry recovery apparatus 152, and polishing is performed while circulating the polishing slurry. It was set as the structure which can be performed. Then, the slurry piping recovery valves D105a, D105b, D106a, D106b and the discharge valves D105c, D105d, D106c, D106d are operated to set the slurry piping to the slurry circulation mode during the polishing process. A polishing method was performed in which the polishing slurry was cleaned by the spray nozzles 90a, 90b, 91a, 91b in the discharge mode.
As a result, the polishing slurry can be circulated in a state in which the polishing slurry is cleaned by the spray nozzles 90a, 90b, 91a, 91b, and the sticking and dropping of the polishing slurry are suppressed. Therefore, it is possible to efficiently perform polishing while automatically supplying the polishing slurry while suppressing quality defects such as scratches due to the effect that the solidified product of the polishing slurry is less likely to be mixed into the polishing slurry to be circulated.
Further, when the dirt of the polishing slurry is washed, the slurry pipe is in the slurry discharge mode, so that the waste liquid containing the washing water accumulated in the slurry receivers 105 and 106 is not collected by the slurry collecting device 152 and is discharged. It is discharged from D105c, D105d, D106c, and D106d. As a result, it is possible to avoid a problem that the polishing slurry to be circulated is thinned or an unnecessary material is mixed in, so that stable polishing quality can be ensured.

  The polishing apparatus described in the above embodiment and the polishing method using the same can be implemented as the following modifications.

(Modification 1)
In the polishing method of the above embodiment, the slurry piping recovery valves D105a, D105b, D106a, and D106b and the discharge valves D105c, D105d, D106c, and D106d of the double-side polishing apparatus 50 are operated to circulate the slurry piping during the polishing process. The polishing method is such that after the polishing process is completed, the slurry piping is set to the slurry discharge mode to clean the polishing slurry dirt by the spray nozzles 90a, 90b, 91a, 91b.
However, the present invention is not limited to this, and by using a spray nozzle with a reduced water discharge amount and a wide water discharge range, that is, a spray nozzle that sprays the cleaning water in a mist form, polishing can be performed while discharging the cleaning water.
FIG. 5 is a flowchart for explaining a modification of the polishing method in the case of using a spray nozzle that sprays cleaning water in a mist form. The polishing method of the present modification is the same as that of the above embodiment except that the slurry pipe is set to the slurry circulation mode during the polishing process, and thus the description of the same configuration is omitted. Moreover, since the example of using the double-side polishing apparatus 50 of the said embodiment is demonstrated in the grinding | polishing method of this modification, please refer FIGS. 1-3 about the structure of the double-side polishing apparatus 50. FIG. Note that the polishing apparatus used in the polishing method of this modification is not limited to the double-side polishing apparatus 50 of the above-described embodiment, but can be applied to modifications of the polishing apparatus described later.

  The polishing apparatus used in the polishing method of the present modification uses a type that sprays cleaning water in a mist form as the spray nozzles 90a, 90b, 91a, 91b in the double-side polishing apparatus 50 of the above embodiment. The spray nozzles 90a, 90b are sprayed so that the cleaning water sprayed from each of the spray nozzles 90a, 90b, 91a, 91b spreads as wide as possible in a portion that becomes a path through which the polishing slurry flows during the polishing process of the double-side polishing apparatus 50. , 91a, 91b, and the cleaning water 155 adjusts the water pressure of the cleaning water.

Also in the polishing method of this modification using the double-side polishing apparatus 50 provided with such spray nozzles 90a, 90b, 91a, 91b, first, a plurality of carriers in which the workpiece 1a is inserted and held in the workpiece holding hole 15 are used. The plate 10 is set on the lower surface plate 20 in a state where it is engaged with the sun gear 21 and the internal gear 22 of the double-side polishing apparatus 50 (step S21).
Then, the upper surface plate 30 is lowered, and the work 1 a held on the carrier plate 10 is sandwiched between the lower surface plate 20 and the upper surface plate 30 with a predetermined polishing load applied.

  Next, as shown in step S22, the slurry piping recovery valves D105a, D105b, D106a, D106b and the discharge valves D105c, D105d, D106c, D106d of the double-side polishing apparatus 50 are operated to enter the slurry circulation mode.

Next, as shown in step S23, the cleaning device 155 is driven to start water discharge (spraying) of mist-like cleaning water from the spray nozzles 90a, 90b, 91a, 91b. To start polishing while supplying a predetermined amount of polishing slurry from the slurry nozzle 151 to the processing surface of the workpiece 1a (step S24). That is, the polishing slurry is circulated and the polishing water is discharged while the cleaning water is discharged. In this modification, the amount of water discharged is reduced by using the spray nozzles 90a, 90b, 91a, 91b for spraying the cleaning water in a mist form. Drain the wash water while holding it down. For this reason, the polishing slurry that is sent to the slurry supply device 150 via the slurry recovery device 152 and reused is not thinned to the left, and when the concentration is adjusted by the slurry recovery device 152, the concentration slurry is adjusted. It is easy to manage because less polishing slurry is required.
The polishing process is continued as it is, and the polishing process is terminated when the thickness of the workpiece 1a reaches the target thickness value (step S25).

After the polishing process is completed, next, as shown in step S26, the carrier plate 10 is removed from the double-side polishing apparatus 50, and the workpiece 1a after the polishing process held on the carrier plate 10 is removed.
If there is still a workpiece 1a to be polished next (Yes in step S27), the carrier plate 10 in which a predetermined number of workpieces 1a are inserted and held in the workpiece holding holes 15 is used as the sun gear 21 of the double-side polishing apparatus 50. Are set on the lower surface plate 20 in a state of meshing with the internal gear 22 (step S28), and the process returns to step S24 to repeat the polishing of the new workpiece 1a.

  If there is no more work 1a that is the next polishing object after the work 1a is taken out in step S26 (No in step S27), the water discharge of the cleaning water is stopped as shown in step S29, and a series of polishing processes are performed. finish.

According to the polishing method of the first modification, in the double-side polishing apparatus 50, the spray nozzles 90a, 90b, 91a, 91b are of the type that sprays cleaning water in a mist form. Then, with the amount of washing water sprayed from each spray nozzle being suppressed as much as possible, polishing is performed while circulating the polishing slurry in the slurry circulation mode while applying the slurry to the site where the polishing slurry flows down. The configuration is to be performed.
Accordingly, the polishing process is performed while constantly moistening the part that becomes a path for the polishing slurry to flow during the polishing process of the double-side polishing apparatus 50 by the spray nozzles 90a, 90b, 91a, 91b spraying the cleaning water in a mist form. It becomes difficult for the polishing slurry to adhere, and the cleaning work of the polishing slurry after the polishing process can be reduced or omitted. In addition, since the cleaning water is sprayed in a mist form while suppressing the amount of water discharged, the polishing slurry that is sent to the slurry supply device 150 via the slurry recovery device 152 and reused does not diminish to the left. When the concentration adjustment is performed by the recovery device 152, the amount of polishing slurry for adjusting the concentration is small, so that the management is easy.

(Modification 2)
In the above embodiment and Modification 1, the double-side polishing apparatus 50 that is a planetary gear type double-sided lapping apparatus is used as the polishing apparatus. Not only this but the grinding | polishing method of the said embodiment can also be implemented even if it uses a single-side polish apparatus.
FIG. 6 is a cross-sectional view schematically illustrating an example of a single-side polishing apparatus that can be used in the polishing method of the embodiment and the first modification. In this modification, the same components as those in the above embodiment and modification 1 are denoted by the same reference numerals and description thereof is omitted.

  A single-side polishing apparatus 250 as a polishing apparatus shown in FIG. 6 has a lower surface plate 220 that is rotatably provided, an upper surface plate 230 that is fixed during polishing, and an upper portion that is disposed below the lower surface plate 220 is open. A slurry nozzle 251 that is provided on the bowl-shaped slurry receiver 205, the slurry supply device 150 as the slurry supply means, and the upper surface plate 230, and discharges or drops the polishing slurry onto the processing surface 201c of the workpiece 201a by the slurry supply device 150. And have.

  The lower surface plate 220 includes a disk-shaped surface plate portion 220A having a polishing surface 220c similar to the lower surface plate 20 (see FIG. 3A) of the above embodiment, and a shaft that supports the surface plate portion 220A from the lower center. The gear part 260 is provided in the lower end part of the shaft part 220B. The gear portion 260 is connected to a lower surface plate driving device 266 that drives and rotates the lower surface plate 220 via the gear portion 260. The lower surface plate driving device 266 includes a motor (not shown) and a transmission for shifting the rotation of the motor. The lower surface plate driving device 266 includes a gear 267 directly connected to the lower surface plate driving device 266 and a chain 268 wound around the gear 267. Further, the lower surface plate driving device 266 has a gear 269 around which the other side of the chain 268 is wound, and a gear 269a fixed to the rotary shaft 269b together with the gear 269 and meshed with the gear portion 260 of the lower surface plate 220. is doing. As a result, the rotation of the motor changed by the transmission of the lower surface plate driving device 266 is transmitted to the gear 269 via the gear 267 and the chain 268. As a result, the gear 269a rotates integrally with the gear 269, and the lower surface plate 220 rotates at a rotation speed corresponding to the driving force of the lower surface plate driving device 266.

On the other hand, the upper surface plate 230 is suspended from a cylinder rod 239 of a cylinder (not shown), and can be moved up and down by driving the cylinder. The upper surface plate 230 includes a fixing means (not shown) that fixes the workpiece 201a to the workpiece fixing surface 230c on the side facing the workpiece 201a that is a polished workpiece. As the fixing means, for example, a method of forming a large number of holes from the work fixing surface 230c of the upper surface plate 230 and sucking air from the opposite side of the work fixing surface 230c through the holes to adsorb the work 201a. Can be used.
Further, the upper surface plate 230 is provided with a slurry nozzle 251 for discharging or dripping polishing slurry onto the processing surface 201c of the workpiece 201a. The polishing slurry supplied from the slurry nozzle 251 to the processed surface of the workpiece 201a during the polishing process is supplied for a predetermined time or intermittently by a slurry supply device 150 connected to the slurry nozzle 251 by a slurry pipe. Be controlled.

The single-side polishing apparatus 250 includes a bowl-shaped slurry receiver 205 provided so as to surround the outside of the lower surface plate 220. Further, in the vicinity of the bottom surface side of the inner edge portion of the side wall of the slurry receiver 205, as a water discharge means for discharging cleaning water toward the outer wall surface excluding the polishing surface 220c of the lower surface plate 220 and the inner wall portion including the inner bottom surface of the slurry receiver 205. A plurality of spray nozzles 290a and 290b are provided. The spray nozzles 290a and 290b are connected by a water distribution pipe to a cleaning device 155 that controls the pressure of the cleaning water supplied from the cleaning water source and the timing of water discharge.
A drain port 205b provided on the bottom surface of the slurry receiver 205 is connected to a slurry recovery device 152 having a pump and a recovery tank (not shown) via a slurry pipe. A recovery valve D205a and a discharge valve D205c are disposed in the slurry pipe. When polishing is performed in a slurry circulation mode in which the polishing slurry recovered in the slurry receiver 205 is recovered in the slurry recovery device 152 and reused, the discharge valve D205c is closed and the recovery valve D205a is opened. Further, when the used polishing slurry recovered in the slurry receiver 205 or the cleaning water discharged from the spray nozzles 290a and 290b is discharged to the outside, the recovery valve D205a is closed and the discharge valve D205c is opened.
The slurry collection device 152 connected to the slurry receiver 205 by the slurry pipe is provided with a collection pump, a filtration device, or a slurry replenishment device (not shown), and the collected polishing slurry is adjusted so that it can be reused. Are connected by a slurry pipe so as to be sent to the slurry supply device 150.

  When the workpiece 201a is polished by the single-side polishing apparatus 250, first, one or more workpieces 201a (two workpieces 201a are shown in FIG. 6) are fixed to the workpiece fixing surface 230c of the upper surface plate 230 by the fixing means. . Then, the lower surface plate driving device 266 is driven to rotate the lower surface plate 220 at a predetermined rotational speed, and while supplying the polishing slurry from the slurry nozzle 251, the upper surface plate 230 is lowered by operating the cylinder to move the work 201a. By pressing the processed surface 201c against the polished surface 220c of the lower surface plate 220 with a predetermined polishing load, the processed surface 201c of the workpiece 201a can be polished on one side.

  Also in the single-side polishing apparatus 250 of the modified example, a predetermined effect can be obtained using the same polishing method as in the above embodiment. That is, the polishing adhered to the part including the slurry receiver 205 by the spray nozzles 290a and 290b for discharging the cleaning water toward the part of the lower surface plate 220 that is different from the polishing surface 220c of the lower surface plate 220 toward the path where the polishing slurry flows down. The slurry can be washed efficiently. As a result, it is possible to prevent quality defects such as scratches that occur when the adhered polishing slurry falls off and falls onto the processed surface 201c of the workpiece 201a. In addition, when polishing is performed in the slurry circulation mode, the polishing slurry is circulated in a state where the polishing slurry is washed away by the spray nozzles 290a and 290b to prevent the polishing slurry from sticking and dropping off. Therefore, it is possible to perform polishing efficiently while automatically supplying the polishing slurry while suppressing quality defects such as scratches.

(Modification 3)
In the double-side polishing apparatus 50 and the single-side polishing apparatus 250 described in the above embodiment, Modification 1 and Modification 2, the spray nozzles 90a, 90b, 91a, 91b and the spray nozzles 290a, 290b as the water discharge means for washing water are swung. By providing it so as to be movable, the polishing slurry can be more efficiently cleaned.
FIG. 7 is a cross-sectional view schematically illustrating a single-side polishing apparatus in which a spray nozzle is swingably provided. 7 illustrates an example in which the water discharge direction of the spray nozzle is variable in the single-side polishing apparatus having the same configuration as that of the single-side polishing apparatus 250 of the second modification, and is partially omitted. In addition, the same components as those of the second modification are given the same reference numerals and the description thereof is omitted.

A single-side polishing apparatus 250 ′ shown in FIG. 7 has a lower surface plate 220 that is rotatably provided, an upper surface plate 230 that is fixed at the time of polishing, and a bowl-like shape that is open below the lower surface plate 220 and has an upper opening. It has a slurry receiver 205 and a slurry nozzle 251 that is provided on the upper surface plate 230 and discharges or drops the polishing slurry onto the processing surface 201c of the workpiece 201a.
A plurality of spray nozzles 290a and 290b are provided in the vicinity of the bottom surface of the inner edge portion of the side wall of the slurry receiver 205. The spray nozzles 290a and 290b are provided so as to be swingable in the directions of arrows 295 and 296, respectively. Has been. The spray nozzles 290a and 290b are swung within a range in which the cleaning water discharged from the water discharge port corresponds to the inner wall portion including the outer peripheral surface of the lower surface plate 220 excluding the polishing surface 220c and the inner bottom surface of the slurry receiver 205. ing. Note that the swinging direction of the spray nozzles 290a and 290b is not limited to the direction of the arrows 295 and 296, and for example, the spray nozzles 290a and 290b may be swung in directions orthogonal to the arrows 295 and 296, or may be swung so as to rotate the water outlet. You may make it move.

  According to the single-side polishing apparatus 250 ′ of the above-described modification example 3, a change occurs in the water pressure of the cleaning water with respect to the portion to be cleaned of the single-side polishing apparatus 250 ′, thereby more effectively removing dirt such as polishing slurry. Can do.

(Modification 4)
In the double-side polishing apparatus 50 and the single-side polishing apparatus 250 described in the above embodiment, Modification 1 and Modification 2, by adding a cleaning auxiliary means for applying a mechanical force to each member to which the polishing slurry dirt adheres, Polishing slurry contamination by the spray nozzles 90a, 90b, 91a, 91b and the spray nozzles 290a, 290b can be more effectively removed.
8 and 9 schematically illustrate a single-side polishing apparatus as a polishing apparatus to which a cleaning auxiliary means is added. FIG. 8 illustrates a single-side polishing apparatus to which an ultrasonic oscillator as a cleaning auxiliary means is added. FIG. 9 is a cross-sectional view showing an example of a single-side polishing apparatus provided with a wiper as a cleaning auxiliary means.
The single-side polishing apparatus shown in FIGS. 8 and 9 is the same as the single-side polishing apparatus 250 of Modification 2 shown in FIG. 6 except that an ultrasonic oscillator and a wiper are provided as cleaning assisting means. In addition, a part of the illustration is omitted, and the same components as those of the second modification are denoted by the same reference numerals and the description thereof is omitted.

The single-side polishing apparatus 350 shown in FIG. 8 includes a lower surface plate 220 that is rotatably provided, an upper surface plate 230 that is fixed during polishing, and a bowl-shaped slurry that is disposed below the lower surface plate 220 and has an upper opening. And a slurry nozzle 251 that is provided on the upper surface plate 230 and discharges or drops the polishing slurry onto the processing surface 201c of the workpiece 201a by a slurry supply device (not shown). Further, in the vicinity of the bottom surface side of the inner edge portion of the side wall of the slurry receiver 205, as a water discharge means for discharging cleaning water toward the outer wall surface excluding the polishing surface 220c of the lower surface plate 220 and the inner wall portion including the inner bottom surface of the slurry receiver 205. A plurality of spray nozzles 290a and 290b are arranged.
In addition, an ultrasonic oscillator 360 connected to an ultrasonic oscillator (not shown) is partially moved on the inner wall side of the slurry receiver 205 in the direction of the arrow 365 so that the inner wall of the slurry receiver 205 can come into contact with or leave the inner wall of the slurry receiver 205 It is possible. Further, below the lower surface plate 220, an ultrasonic wave oscillation provided so as to be movable in the direction of an arrow 375 so as to be in contact with or away from a surface different from the polishing surface of the surface plate portion 220A and a part of the shaft portion 220B. A child 370 is provided.
When the ultrasonic oscillators 360 and 370 wash the single-side polishing apparatus 350 by discharging cleaning water from the spray nozzles 290a and 290b, the ultrasonic oscillators 360 and 370 are connected to the polishing surface 220c of the inner wall of the slurry receiver 205 or the surface plate portion 220A of the lower surface plate 220. Ultrasonic waves are oscillated by contacting different surfaces and a part of the shaft 220B. By this ultrasonic vibration, the polishing slurry dirt remaining on the inner wall of the slurry receiver 205 or the lower surface of the lower surface plate 220 is floated and easily removed, so that the polishing slurry dirt can be more effectively removed.

On the other hand, a single-side polishing apparatus 450 shown in FIG. 9 has a wiper 460 comprising a holder 462 and a wipe material 461 such as urethane rubber in the vicinity of the surface on the side different from the polishing surface 220c of the surface plate portion 220A of the lower surface plate 220. The wipe member 461 is provided so as to be movable in the direction of an arrow 465 so that the wiper member 461 can come into contact with or leave the surface plate portion 220A. Further, in the vicinity of the shaft portion 220B below the lower surface plate 220, a wiper 470 made up of a holder 472 and a wipe material 471 allows the wipe material 471 to contact or separate from a part of the shaft portion 220B. It is provided to be movable in the direction.
The wipers 460 and 470 have different surfaces from the polishing surface 220c of the surface plate portion 220A of the lower surface plate 220 and a part of the shaft portion 220B when the single-side polishing device 450 is cleaned by discharging cleaning water from the spray nozzles 290a and 290b. Contact. At this time, since the lower surface plate 220 is rotating, the wiper 461 of the wiper 460 and the wiper 460 and the wiper 470 are in contact with a surface different from the polishing surface 220c of the surface plate portion 220A and the polishing slurry dirt of the shaft portion 220B. The polishing slurry dirt is scraped off by the wipe material 71 of the wiper 470, and the cleaning effect by the cleaning water discharged from the spray nozzles 290a and 290b is further improved.

  The embodiment of the present invention, its modification, or the example made by the inventor has been specifically described above, but the present invention is limited to the above-described embodiment, its modification, or example. Instead, various changes can be made without departing from the scope of the invention.

For example, in the polishing apparatus described in the above embodiment and Modifications 2 to 4, each cleaning means and cleaning auxiliary means provided for cleaning polishing slurry dirt are effective even if used alone, It can also be used in combination.
This makes it possible to more effectively remove the polishing slurry.

  Moreover, in the said embodiment and the modification, the example which grind | polishes the workpiece | work 1a and 201a as a rectangular flat base material was demonstrated. However, the shape of the substrate to be polished in plan view may be a circle, a triangle, a pentagon or more polygon, or an indeterminate shape, and is not limited to a flat plate shape. For example, even if it is a block-shaped base material, the polishing method of the present invention can be applied.

  In the above-described embodiment, an example in which polishing is performed using the double-side polishing apparatus 50 that is a double-sided lapping apparatus has been described. Of course, the polishing may be performed using a double-side polishing apparatus. Also, the gist of the present invention can be applied to abrasive processing other than the lapping apparatus and the polishing apparatus.

  Moreover, in the said embodiment, the three-way grinding | polishing method or four which rotate three members among the four rotation members of the sun gear 21, the lower surface plate 20, the internal gear 22, and the upper surface plate 30 of the double-side polish apparatus 50. The example of the grinding | polishing method which performs grinding | polishing by the 4-way grinding | polishing processing method which rotates all was demonstrated. The gist of the present invention is not limited to this, but the lower surface plate 20 and the upper surface plate 30 are fixed and the sun gear 21 and the internal gear 22 are rotated to rotate the carrier plate 10 to polish the workpiece 1a. It is also possible to apply to a polishing method.

  In the above embodiment, the sun gear 21, the lower surface plate 20, and the internal gear 22 of the double-side polishing apparatus 50 are rotated in the same direction, and the upper surface plate 30 is not rotated or rotated in the opposite direction. For example, the polishing method may be executed by rotating the lower surface plate 20 and the upper surface plate 30 in the same direction.

1 is a cross-sectional view schematically illustrating a double-side polishing apparatus as an embodiment of a polishing apparatus. The top view which shows typically the carrier plate holding the workpiece | work as a base material in a double-side polish apparatus. (A) is a plan view for schematically explaining the movement of each part in the lower surface plate part of the double-side polishing apparatus, and (b) is a top view of (a) taken along the line AA in (a). The fragmentary sectional view explaining typically including a surface plate. The flowchart which shows one Embodiment of the grinding | polishing method. The flowchart explaining the modification of a grinding | polishing method. Sectional drawing which shows an example of the single-sided grinding | polishing apparatus as a grinding | polishing apparatus. Sectional drawing which shows the modification of the single-sided grinding | polishing apparatus as a grinding | polishing apparatus. Sectional drawing which shows the modification of the single-sided grinding | polishing apparatus as a grinding | polishing apparatus. Sectional drawing which shows the modification of the single-sided grinding | polishing apparatus as a grinding | polishing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1a, 201a ... Work as base material, 10 ... Carrier plate, 15 ... Work holding hole, 20, 220 ... Lower surface plate, 20A, 220A ... Surface plate portion, 20B ... Lower surface plate receiving portion, 20c, 220c ... Polishing surface, DESCRIPTION OF SYMBOLS 21 ... Sun gear, 22 ... Internal gear, 30,230 ... Upper surface plate, 30c ... Polishing surface, 50 ... Double-side polish apparatus as a polisher, 90a, 90b, 91a, 91b, 290a, 290b ... Spray nozzle as water discharge means 105 ... first slurry receiver, 106 ... second slurry receiver, 105a, 105b, 106a, 106b, 205b ... drain, D105a, D105b, D106a, D106b, D205a ... recovery valve, D105c, D105d, D106c, D106d ... Discharge valve, 150 ... Slurry as part of slurry supply means Slurry nozzle as part of the slurry supply means, 152 ... Slurry recovery device, 155 ... Cleaning device, 201c ... Processing surface, 205 ... Slurry receiver, 220B ... Shaft portion, 230c ... Work fixing surface, 250, 250 ′, 350, 450... Single-side polishing device as a polishing device, 360, 370... Ultrasonic oscillator, 460, 470.

Claims (8)

A surface plate having a polishing surface for polishing at least one of the parallel surfaces of the substrate;
Slurry supply means for supplying a polishing slurry to a processing surface to be polished of the substrate facing the polishing surface;
A slurry receiver that is disposed below the surface plate and receives the polishing slurry used in polishing,
A polishing apparatus comprising: a water discharging means for discharging cleaning water from at least a part between the slurry receivers from a surface side different from the polishing surface of the surface plate. The polishing apparatus according to claim 1, wherein
A polishing apparatus characterized in that the slurry receiver and the slurry supply means are connected by a slurry pipe and have a slurry circulation structure capable of performing polishing while circulating the polishing slurry. The polishing apparatus according to claim 1 or 2,
The polishing apparatus, wherein the water discharge means has a water discharge port for spraying the cleaning water in a mist form. In the polishing device according to any one of claims 1 to 3,
A polishing apparatus, wherein the water discharge port of the water discharge means is swingably provided. In the polishing apparatus according to any one of claims 1 to 4,
Polishing comprising a wiper that comes into contact with and rubs against at least a part of a portion to which the washing water from the water discharge means is applied between the slurry receiver from a surface different from the polishing surface of the surface plate apparatus. In the polishing apparatus according to any one of claims 1 to 5,
Polishing comprising vibration means for applying vibration to at least part of a portion of the surface plate to which the washing water from the water discharging means is applied between the slurry receiver and a surface different from the polishing surface. apparatus. A surface plate having a polishing surface for polishing at least one of the parallel surfaces of the substrate, and a slurry for supplying polishing slurry to the processed surface of the substrate opposite to the polishing surface. Supply means, a slurry receiver that is disposed below the surface plate and receives the polishing slurry used in the polishing process, and at least part of the surface of the surface plate between the polishing surface and a surface different from the polishing surface A polishing method for polishing the substrate using a polishing apparatus having a water discharge means for discharging cleaning water toward the water,
Polishing the substrate;
Washing by applying the washing water to a portion between the slurry receivers from a surface different from the processing surface of the surface plate by the water discharge means;
A polishing method comprising: A surface plate having a polishing surface for polishing at least one of the parallel surfaces of the substrate, and a slurry for supplying polishing slurry to the processed surface of the substrate opposite to the polishing surface. Supply means, a slurry receiver that is disposed below the surface plate and receives the polishing slurry used in the polishing process, and at least part of the surface of the surface plate between the polishing surface and a surface different from the polishing surface A polishing method for polishing the substrate using a polishing apparatus having a water discharge means for discharging cleaning water toward the water,
A polishing method characterized in that the water discharge means performs polishing while applying the cleaning water to a portion between the slurry receivers from a surface different from the processing surface of the surface plate.

Images