JPH079342A - Washing device for surface plate of double polishing machine - Google Patents

Washing device for surface plate of double polishing machine

Info

Publication number
JPH079342A
JPH079342A JP18718893A JP18718893A JPH079342A JP H079342 A JPH079342 A JP H079342A JP 18718893 A JP18718893 A JP 18718893A JP 18718893 A JP18718893 A JP 18718893A JP H079342 A JPH079342 A JP H079342A
Authority
JP
Japan
Prior art keywords
surface plate
nozzle
polishing
nozzle device
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18718893A
Other languages
Japanese (ja)
Other versions
JP3366061B2 (en
Inventor
Sumio Tanaka
澄夫 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP18718893A priority Critical patent/JP3366061B2/en
Publication of JPH079342A publication Critical patent/JPH079342A/en
Application granted granted Critical
Publication of JP3366061B2 publication Critical patent/JP3366061B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To remove polishing wastes, a polishing material, and the like from the grooves of surface plates, and to carry out the washing work automatically, by inserting a nozzle device between the upper and the lower surface plates without removing the surface plates of a double polishing machine, and injecting a high pressure water from a nozzle to a polishing surface. CONSTITUTION:A double polishing machine 1 is composed as a device to polishing process the upper and the lower surfaces of a work by setting the work between the upper and the lower surface plates 10 and 11. A nozzle device 40 is inserted between the upper and the lower and surface plates and a high pressure water is injected while the nozzle device is reciprocated in the radial direction of the surface plates, so as to carry out the removing work of polishing wastes and a polishing material entered in the surfaces and the grooves of the surface plates. And around the nozzle of the nozzle device 40, brush members 58 are provided, so as to prevent the scattering of the water to the surroundings. To a washing device 20 to hold the nozzle device 40, a driving means to reciprocate a pipe 41, a pump 26 to feed the high pressure water, and the like are provided, and the washing work is carried out automatically.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラスや金属板、水
晶、シリコンウエハー等の被加工物に対して、定盤を用
いて平行に研削する両面研磨機において、定盤の清浄作
業を行う洗浄装置に関し、特に、両面研磨機の上下に配
置する定盤の研磨面に対して高圧水を噴出させることに
より、定盤の溝に残留する研削屑や研磨材を除去する作
業を自動的に行い得るようにする装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention performs a surface plate cleaning operation in a double-sided polishing machine that grinds a workpiece such as glass, metal plate, crystal, or silicon wafer in parallel using a surface plate. With regard to the cleaning device, in particular, by spraying high-pressure water onto the polishing surfaces of the surface plates placed above and below the double-sided polishing machine, the work of removing grinding dust and abrasives remaining in the surface plate grooves is automatically performed. To a device capable of performing.

【0002】[0002]

【従来の技術】ガラス板やシリコンウエハー、金属板等
の上下の面を平行に仕上げるために、従来より両面研磨
機を用いて加工することが行われている。前記両面研磨
機においては、例えば、実公昭60−12691号公報
等に示されるように、被加工物を上下から挟むようにし
て2つの定盤を配置し、前記定盤を支持する垂直軸を介
して反対方向に駆動しながら、被加工物の上下の面が平
行になるような加工を行うようにしている。前記両面研
磨機では、例えば、図7に示されるように、研磨面15
に多数の縦横の溝16、17を設けて定盤10を構成
し、前記定盤10を一方向に回転させ、前記定盤の研磨
面に対応させて、被加工物8を支持するキャリヤ7を配
置している。
2. Description of the Related Art In order to finish the upper and lower surfaces of a glass plate, a silicon wafer, a metal plate or the like in parallel, processing has been conventionally performed using a double-side polishing machine. In the double-sided polishing machine, for example, as disclosed in Japanese Utility Model Publication No. 60-12691, two surface plates are arranged so as to sandwich a work piece from above and below, and a vertical shaft for supporting the surface plate is used. While driving in the opposite direction, processing is performed such that the upper and lower surfaces of the workpiece are parallel. In the double-sided polishing machine, for example, as shown in FIG.
A plurality of vertical and horizontal grooves 16 and 17 are provided on the surface to form a surface plate 10, the surface plate 10 is rotated in one direction, and a carrier 7 for supporting a workpiece 8 corresponding to the polishing surface of the surface plate is provided. Are arranged.

【0003】また、前記定盤の研磨面15は、図8に示
されるように、深い溝を設けているもので、前記溝16
の幅Hを1mm程度に形成し、溝の深さDを10〜15mm
程度に設定し、前記溝を介して研磨屑や水等が排除され
得るようにする。そして、前記キャリヤ7の周囲に設け
たギヤを、中ギヤ5と外ギヤ6のギヤに噛み合わせて被
加工物を定盤に対して回転させながら、被加工物の表面
を研磨することができるようにする。前記研磨面15を
設けた定盤を被加工物の上下に配置して、2つの定盤が
被加工物に対して軽く接する状態に配置し、研磨用の水
や研磨材等を供給しながら、被加工物の上下の面を定盤
により平行になるように研磨する作業を行うようにして
いる。
Further, as shown in FIG. 8, the polishing surface 15 of the surface plate is provided with a deep groove, and the groove 16 is provided.
Width H of 1mm and groove depth D of 10-15mm
The degree is set so that polishing debris, water and the like can be removed through the groove. Then, the gear provided around the carrier 7 is meshed with the gears of the middle gear 5 and the outer gear 6 to rotate the workpiece, and the surface of the workpiece can be polished. To do so. The surface plates provided with the polishing surface 15 are arranged above and below the work piece, and the two surface plates are arranged so as to be in light contact with the work piece, while supplying water for polishing, an abrasive, etc. The polishing work is performed so that the upper and lower surfaces of the workpiece are parallel to each other by a surface plate.

【0004】[0004]

【発明が解決しようとする課題】前記定盤により被加工
物の研磨の作業を行った後で、定盤の溝の中に研磨屑や
研磨材等が残留するので、作業の終了後に、両面研磨機
から定盤を取り外し、定盤の溝から研磨屑等を除去する
ことが必要とされる。ところが、定盤の研磨面に設けら
れる溝は、幅が非常に狭く深く形成されているものであ
り、その溝に入り込んだ研磨屑や研磨材等が固化しかけ
た状態にあるために、溝から容易に除去できないという
問題がある。そこで、従来より幅の狭い金属板部材を溝
の中に挿入して、研磨屑等を掻き出すような手段が用い
られているが、定盤の研磨面に設ける縦横の溝の数が非
常に多いために、清浄作業に多くの時間を必要とし、能
率の良くない作業を強いられるという欠点がある。さら
に、定盤の溝の中から研磨材や研磨屑等を完全に除去し
ない状態で、次の研磨作業を行った場合には、研磨に要
する時間が長くなることの他に、研磨屑の固まりが研磨
中の被加工物の研磨面に接して、研磨面を傷付けたり、
破損することがあり、研磨中と、作業後の清浄作業を十
分に行うことが求められることが多い。
SUMMARY OF THE INVENTION After the work of polishing a work piece by the surface plate is performed, polishing debris and abrasives remain in the grooves of the surface plate. It is necessary to remove the surface plate from the polishing machine and remove polishing debris and the like from the groove of the surface plate. However, the groove provided on the polishing surface of the surface plate has a very narrow width and is deeply formed, and since the polishing dust and the polishing material that have entered the groove are about to solidify, There is a problem that it cannot be easily removed. Therefore, a metal plate member having a width narrower than that of the conventional one is used to scrape out polishing dust or the like, but the number of vertical and horizontal grooves provided on the polishing surface of the surface plate is very large. Therefore, there is a drawback in that cleaning work requires a lot of time and inefficient work is required. Further, when the next polishing operation is performed without completely removing the abrasives and polishing debris from the groove of the surface plate, the polishing time becomes long and Touches the polishing surface of the workpiece being polished, scratching the polishing surface,
It may be damaged, and it is often required to perform sufficient cleaning work during polishing and after the work.

【0005】[0005]

【発明の目的】本発明は、前述したような定盤の清浄作
業の問題を解消するもので、上下に対向して配置した定
盤の研磨面に対して、ノズル装置から高圧水を噴射し
て、溝に入り込んだ研磨屑等を自動的に除去できるよう
にするとともに、水が周囲に飛散することを防止できる
ようにする両面研磨機定盤の洗浄装置を提供することを
目的としている。
SUMMARY OF THE INVENTION The present invention solves the above-described problem of the surface plate cleaning work, in which high-pressure water is sprayed from a nozzle device onto the polishing surfaces of the surface plates which are vertically opposed to each other. It is therefore an object of the present invention to provide a cleaning device for a surface plate of a double-sided polishing machine that can automatically remove polishing dust and the like that have entered the groove and prevent water from splashing around.

【0006】[0006]

【課題を解決するための手段】本発明は、上部定盤と下
部定盤とを対向させて配置し、前記2つの定盤の対向す
る研磨面の間に、被加工物を支持するキャリヤを配置
し、前記2つの定盤を垂直軸を介して反対方向に回転さ
せるとともに、被加工物を保持するキャリヤを公転させ
ながら、被加工物の上下の面を平行に研磨する両面研磨
機に対する洗浄装置に関する。本発明においては、前記
両面研磨機の上下の定盤の間にノズル装置を移動可能に
配置し、前記ノズル装置の上下に配置するノズルから高
圧の水を噴出させる機構を構成し、前記両面研磨機の定
盤を回転させるとともに、ノズル装置を定盤に対してラ
ジアル方向に往復移動させ、前記ノズルから噴出される
高圧水により、定盤の溝に残留する研磨屑等を除去する
機構を構成している。
SUMMARY OF THE INVENTION According to the present invention, an upper surface plate and a lower surface plate are arranged so as to face each other, and a carrier for supporting a workpiece is provided between opposing polishing surfaces of the two surface plates. Cleaning for a double-sided polishing machine that arranges and rotates the two surface plates in opposite directions via a vertical axis and revolves the carrier holding the work piece while polishing the upper and lower surfaces of the work piece in parallel. Regarding the device. In the present invention, a nozzle device is movably arranged between the upper and lower surface plates of the double-sided polishing machine, and a mechanism for ejecting high-pressure water from nozzles arranged on the upper and lower sides of the nozzle device is constituted. While rotating the surface plate of the machine, the nozzle device is reciprocally moved in the radial direction with respect to the surface plate, and the high-pressure water ejected from the nozzle removes polishing debris remaining in the grooves of the surface plate. is doing.

【0007】また、本発明においては、前記ノズル装置
を配置する洗浄装置には、ノズル装置の支持部材の高さ
を設定する手段と、ノズル装置を往復移動させる手段、
および、高圧水をノズル装置に向けて供給する手段を設
け、往復移動手段に接続されるパイプの端部に、前記ノ
ズル装置を支持させることができる。さらに、本発明に
おいては、前記ノズル装置の上下に設けるノズルを中心
にしてカバー部材を配置し、定盤の研磨面を洗浄した水
の飛散防止手段を、前記カバー部材に一体に設けること
ができる。前記構成に加えて、前記カバー部材に設ける
水の飛散防止手段をブラシ状の部材により構成し、前記
ブラシ状の部材の突出高さを、ノズルと研磨面の間隔に
対応させて構成することができる。さらに、本発明にお
いては、前記洗浄装置には、ノズル装置に高圧水を供給
する手段に加えて、別体に接続するノズル部材等に対し
て、高圧の水を供給する手段を構成することもでき、例
えば、水飛散防止手段としてのナイロンブラシ状の部材
を設けたハンドシャワーガンを用いることにより、定盤
の研磨面を洗浄するノズル部材では洗浄できない部材に
対しても、洗浄作業を容易に行う手段を構成することが
できる。
Further, according to the present invention, in the cleaning device in which the nozzle device is arranged, means for setting the height of the supporting member of the nozzle device, means for reciprocating the nozzle device,
Further, means for supplying high-pressure water toward the nozzle device can be provided, and the nozzle device can be supported at the end of the pipe connected to the reciprocating means. Further, in the present invention, the cover member is arranged around the nozzles provided above and below the nozzle device, and the water splash preventing means for cleaning the polishing surface of the surface plate can be provided integrally with the cover member. . In addition to the above configuration, the water scattering prevention means provided on the cover member may be configured by a brush-shaped member, and the protruding height of the brush-shaped member may be configured to correspond to the distance between the nozzle and the polishing surface. it can. Further, in the present invention, in addition to the means for supplying high-pressure water to the nozzle device, the cleaning device may be provided with means for supplying high-pressure water to a nozzle member or the like that is separately connected. Therefore, for example, by using a hand shower gun provided with a nylon brush-like member as a water splash prevention means, it is possible to easily perform a cleaning operation even for a member that cannot be cleaned by a nozzle member that cleans the polishing surface of the surface plate. Means for doing so can be configured.

【0008】[0008]

【作用】本発明の両面研磨機定盤の洗浄装置において
は、被加工物に対する研磨作業が終了した後で、上下の
定盤の間に所定の間隔を開け、ノズル装置を挿入すると
ともに、洗浄装置から高圧水をノズル装置に向けて送り
出すようにする。そして、定盤を低速で回転させるとと
もに、ノズル装置を洗浄装置から出没させる方向に往復
駆動し、研磨ノズルから50〜100気圧程度の高圧水
を噴射して、定盤の溝に入り込んでいる研磨屑等を除去
する作業を行うようにする。その研磨屑等の除去作業に
際しては、ノズルの周囲をカバー部材で覆うことによ
り、高圧水が周囲に飛散することを防止でき、両面研磨
機の周囲を汚したりすることがなく、洗浄装置の制御装
置に必要な制御情報を設定しておくことにより、作業を
自動的に行うことができる。
In the double-side polishing machine surface plate cleaning apparatus of the present invention, after the polishing work for the workpiece is completed, a predetermined gap is provided between the upper and lower surface plates, the nozzle device is inserted, and the cleaning is performed. The high pressure water is sent out from the device toward the nozzle device. Then, while rotating the platen at a low speed, the nozzle device is reciprocally driven in a direction of retracting from the cleaning device, high-pressure water of about 50 to 100 atm is jetted from the polishing nozzle, and the polishing is entering the groove of the platen. Work to remove scraps. When removing the polishing debris, etc., by covering the periphery of the nozzle with a cover member, it is possible to prevent high-pressure water from splashing to the surroundings, and to prevent contamination of the periphery of the double-sided polishing machine and control of the cleaning device. The work can be automatically performed by setting necessary control information in the device.

【0009】[0009]

【実施例】図示される例にしたがって、本発明の両面研
磨機定盤の洗浄装置を説明する。図1に示される例は、
両面研磨機1に対して洗浄装置20を組み合わせて、定
盤の研磨面に対する洗浄作業を行う場合を示している。
前記両面研磨機1は、一般に用いられている装置と同様
な機構のものを使用しており、前記図7に示されるよう
な定盤を用い、上部定盤11と下部定盤10の間で、被
加工物に対する研磨の作業を行う機構を構成している。
前記下部定盤10は支持盤4により支持され、モータ2
から駆動装置3を介して所定の速度で水平方向に回転さ
れる。また、下部定盤10は定盤支持部材12により装
置の上側から支持され、上下用装置13により下部定盤
10に対する間隔を設定できるように設けられ、前記下
部定盤10の中心部に配置する中ギヤ5に対して連動用
ギヤ14を接続し、上下の定盤を互いに反対方向に回転
させるようにする。さらに、前記下部定盤10の中心部
に配置する中ギヤ5と、外周部に配置する外ギヤ6に対
して、図7に示されたようなキャリヤ7の外周部に配置
するギヤを噛み合わせ、被加工物をキャリヤに支持させ
た状態で研磨加工を行う。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cleaning device for a double side polishing machine platen according to the present invention will be described with reference to the illustrated example. The example shown in FIG.
The case where the cleaning device 20 is combined with the double-sided polishing machine 1 to perform cleaning work on the polishing surface of the surface plate is shown.
The double-sided polishing machine 1 has a mechanism similar to that of a generally used apparatus. A surface plate as shown in FIG. 7 is used, and an upper surface plate 11 and a lower surface plate 10 are connected to each other. , Which constitutes a mechanism for performing a polishing operation on the workpiece.
The lower surface plate 10 is supported by a support plate 4, and the motor 2
Is rotated in the horizontal direction at a predetermined speed via the drive device 3. Further, the lower surface plate 10 is supported by the surface plate support member 12 from the upper side of the apparatus, and is provided so that an interval between the lower surface plate 10 and the lower surface plate 10 can be set by the device 13 for vertical movement, and is arranged at the center of the lower surface plate 10. The interlocking gear 14 is connected to the middle gear 5 so that the upper and lower surface plates rotate in mutually opposite directions. Further, a gear arranged on the outer peripheral portion of the carrier 7 as shown in FIG. 7 is meshed with a middle gear 5 arranged on the central portion of the lower surface plate 10 and an outer gear 6 arranged on the outer peripheral portion. The polishing process is performed with the workpiece supported by the carrier.

【0010】前記両面研磨機1により被加工物の研磨加
工を行った後で、定盤の溝に入り込んだ研磨屑や研磨材
を除去するために、前記図1に示されるように、上下の
定盤10、11の間隔を開き、両定盤の間にノズル装置
40を挿入して、高圧水による洗浄作業を行うようにす
る。本発明の洗浄装置20は、装置本体21の側部から
パイプ41を介してノズル装置40を設けており、前記
ノズル装置40に対して高圧の水を供給するために、装
置本体の内部にモータ25と高圧ポンプ26、および、
レシーバタンク27等を設けている。前記高圧ポンプに
よりレシーバタンクに蓄積される水は、例えば、50〜
100気圧の任意の圧力でノズルから噴出させ得るよう
にするもので、定盤に対して噴射する水圧を任意に設定
できるようにされる。また、前記ノズル装置40の作業
高さを設定するために、上下動作用のハンドル29を設
け、手動で上部装置30の高さを変化させ、ノズル装置
の高さを任意に設定する。さらに、装置の所定の位置に
は、操作パネル22を配置し、装置本体に設けた制御装
置23に対する制御情報を入力することができるように
する。
After the workpiece is polished by the double-sided polishing machine 1, as shown in FIG. 1, in order to remove the polishing chips and the polishing material that have entered the grooves of the surface plate, The interval between the surface plates 10 and 11 is opened, and the nozzle device 40 is inserted between both surface plates to perform the cleaning work with high-pressure water. The cleaning device 20 of the present invention is provided with a nozzle device 40 from a side portion of the device body 21 via a pipe 41. In order to supply high-pressure water to the nozzle device 40, a motor is provided inside the device body. 25 and the high-pressure pump 26, and
A receiver tank 27 and the like are provided. The water accumulated in the receiver tank by the high-pressure pump is, for example, 50 to
It is designed so that it can be ejected from the nozzle at an arbitrary pressure of 100 atm, and the water pressure to be ejected onto the surface plate can be arbitrarily set. Further, in order to set the working height of the nozzle device 40, a handle 29 for vertical movement is provided, and the height of the upper device 30 is manually changed to arbitrarily set the height of the nozzle device. Further, an operation panel 22 is arranged at a predetermined position of the device so that control information for the control device 23 provided in the device body can be input.

【0011】前記洗浄装置20の構成は、図2、3に示
されるように構成しているもので、装置本体21の基部
には、前記高圧水の供給機構を配置し、ノズル装置40
を支持する上部装置30を、上下動装置28を介して支
持し、図示される例では、パンタグラフ状の上下動機構
をハンドル29の回転により作動させるようにしてい
る。洗浄装置の上部装置30には、図3に示されるよう
なノズル駆動装置31を設けており、ノズル装置40を
支持するパイプ41に対して、操作パネル22を介して
入力した制御情報にしたがって、往復移動させるための
駆動を行うようにする。前記ノズル駆動装置31は、モ
ータ32により駆動されるロッド33を、連動部材35
を介してパイプ41の端部に接続し、ガイドシャフト3
4に沿わせて前記連動部材35を案内する機構を構成し
ている。そして、前記モータ32によりロッド33を設
定された範囲で往復移動させることにより、ノズル装置
40を用いて定盤に対する洗浄作業を行うことができ
る。前記ノズル装置40を支持するとともに、高圧の水
を供給するためのパイプ41は、上部装置30の先端部
に配置する先端案内部37に設けたガイドローラ装置3
8と、パッキング部材39、および、図示を省略した支
持手段により案内され、ノズル装置40の往復移動に際
して、ブレ等が生じないように構成される。
The cleaning device 20 is constructed as shown in FIGS. 2 and 3, and the high-pressure water supply mechanism is arranged at the base of the device main body 21, and the nozzle device 40 is provided.
The upper device 30 that supports the vertical movement device 28 is supported via the vertical movement device 28, and in the illustrated example, the pantograph-shaped vertical movement mechanism is operated by the rotation of the handle 29. A nozzle drive device 31 as shown in FIG. 3 is provided in the upper device 30 of the cleaning device, and in accordance with the control information input via the operation panel 22 to the pipe 41 supporting the nozzle device 40, Drive for reciprocating movement is performed. The nozzle driving device 31 includes a rod 33 driven by a motor 32,
Is connected to the end of the pipe 41 via the guide shaft 3
4, a mechanism for guiding the interlocking member 35 is configured. By moving the rod 33 back and forth within the set range by the motor 32, it is possible to perform the cleaning work on the surface plate using the nozzle device 40. A pipe 41 for supporting the nozzle device 40 and for supplying high-pressure water is provided with a guide roller device 3 provided at a tip guide portion 37 arranged at a tip portion of the upper device 30.
8 and the packing member 39, and the supporting means (not shown) guides the nozzle device 40 so that it does not shake when the nozzle device 40 reciprocates.

【0012】前記パイプ41の先端部に保持されるノズ
ル装置40は、図4に示されるような構成のものを用い
ることができる。前記図4に示されるノズル装置40に
おいて、ノズル本体42に対して上下にノズル51、6
1を配置し、各ノズル51、61から噴射される高圧水
が、上下の定盤の研磨面に対する洗浄作業を行うことが
できるようにする。前記上下のノズルに対応させて、上
洗浄部50と下洗浄部60とをそれぞれ配置しており、
前記上下の洗浄部50、60は、ほぼ同一の構成のもの
とされる。そこで、前記上下の洗浄部の構成を、上部定
盤11に対応して配置する上洗浄部50を例にして説明
すると、前記ノズル51は、高圧水噴出口52から噴出
する水の噴射範囲を角度θに設定し、その角度θを任意
に調整できるように構成する。
The nozzle device 40 held at the tip of the pipe 41 may have the structure shown in FIG. In the nozzle device 40 shown in FIG. 4, the nozzles 51, 6 are arranged above and below the nozzle body 42.
1 is arranged so that the high-pressure water sprayed from the nozzles 51 and 61 can perform the cleaning work on the polishing surfaces of the upper and lower surface plates. An upper cleaning unit 50 and a lower cleaning unit 60 are arranged respectively corresponding to the upper and lower nozzles,
The upper and lower cleaning units 50 and 60 have substantially the same structure. Therefore, the configuration of the upper and lower cleaning units will be described by taking the upper cleaning unit 50 arranged corresponding to the upper surface plate 11 as an example, and the nozzle 51 controls the jetting range of water jetted from the high-pressure water jet port 52. The angle θ is set, and the angle θ can be arbitrarily adjusted.

【0013】また、前記ノズル51の周囲にカバー部材
54を配置して、水が周囲に飛散することを防止する手
段を構成している。前記カバー部材54は、ノズル51
の基部に係止部56を介して固定される筒状部55と、
その上部に配置する円板部材57により構成し、前記円
板部材57の外周部にブラシ部材58を設けている。前
記ブラシ部材58は太さが1mm程度で長さが10cm程度
のナイロンを所定の密度で配置したものを用い、図5に
示されるように、ノズル51を中心にして、円板部材の
外周部に所定の幅でリング状に配置される。なお、前記
ブラシ部材58は、ノズルから噴出される高圧水が、定
盤の溝や研磨面にはねかえって、周囲に飛散することを
防止するものであるから、ノズルから噴射される水圧等
の条件に応じて、ブラシの密度や長さ幅等の条件を適宜
変更することができる。さらに、前記上洗浄部50に設
けるカバー部材においては、円板部材57に対して排水
用の孔59……を設けておき、清掃に使用した水を下部
に向けて排水できるようにされる。
Further, a cover member 54 is arranged around the nozzle 51 to constitute means for preventing water from splashing around. The cover member 54 includes the nozzle 51.
A tubular portion 55 fixed to the base portion of the through a locking portion 56,
The disc member 57 is arranged on the upper portion of the disc member 57, and the brush member 58 is provided on the outer peripheral portion of the disc member 57. As the brush member 58, a nylon member having a thickness of about 1 mm and a length of about 10 cm is arranged at a predetermined density. As shown in FIG. Are arranged in a ring shape with a predetermined width. Since the brush member 58 prevents the high-pressure water ejected from the nozzle from splashing to the surroundings by returning to the groove or polishing surface of the surface plate, the pressure of water ejected from the nozzle or the like can be prevented. Depending on the conditions, conditions such as the density and length of the brush can be changed as appropriate. Further, in the cover member provided in the upper cleaning section 50, holes 59 for draining are provided in the disc member 57 so that the water used for cleaning can be drained downward.

【0014】前記上洗浄部50に対向させて、ノズル本
体42の下部に配置する下洗浄部60では、前記上洗浄
部の場合と同様な構成のノズル61と、カバー部材64
とを配置しており、前記ノズル61から噴出する高圧水
により、下部定盤10に対する清掃作用を行うようにす
る。また、前記カバー部材64を構成する円板部材67
には、開口を配置する必要がなく、ノズルから噴射する
水を下部定盤10の表面に流して、その周囲から排除さ
せることができる。さらに、前記下洗浄部60において
も、ノズル61の噴出口62から噴出させる水の噴射角
度θを適宜設定することができ、カバー部材の円板部材
67に設けるブラシ部材68の構成も、水圧等に対応さ
せて任意に設定することができる。
In the lower cleaning section 60, which is disposed below the nozzle body 42 so as to face the upper cleaning section 50, the nozzle 61 having the same structure as that of the upper cleaning section and the cover member 64 are provided.
Are arranged so that the lower surface plate 10 is cleaned by the high pressure water ejected from the nozzle 61. Further, a disk member 67 that constitutes the cover member 64.
In this case, it is not necessary to arrange an opening, and the water jetted from the nozzle can be made to flow to the surface of the lower surface plate 10 and be removed from the surrounding area. Further, also in the lower cleaning section 60, the jet angle θ of the water jetted from the jet port 62 of the nozzle 61 can be set as appropriate, and the configuration of the brush member 68 provided on the disc member 67 of the cover member can be such as water pressure. Can be arbitrarily set according to.

【0015】前述したように構成したノズル装置40を
用いて、両面研磨機1の定盤に対する洗浄作業を行う場
合には、両面研磨機1により被加工物の研磨を行った後
で、定盤を取り外さずに清掃を行うことができる。つま
り、被加工物に対する研磨作業が終了した時点で、定盤
の清掃を行う必要がある場合に、図1に示されるよう
に、固定位置に配置する下部定盤10に対して、上部定
盤11を上下用装置13を用いて上昇させ、駆動装置3
の中ギヤ5と上部定盤11の連動用ギヤ14を接続する
手段を配置する。さらに、前記上下の定盤10、11の
間にノズル装置40を位置決めできるように、洗浄装置
20の上部装置の高さを設定し、ノズル装置の移動範囲
を操作パネル22を介して入力する。そして、前記洗浄
装置20の高圧水供給手段を作動させて、ノズルから高
圧水を噴射しながら、上下の定盤を低速で回転させると
ともに、ノズル装置40を定盤の中心と外周部との間に
直線状にラジアル方向に往復移動させながら、洗浄作業
を行うようにする。したがって、前記洗浄装置による定
盤の洗浄作業を行う際に、非常に高圧の水をノズルから
噴射させることにより、定盤の深い溝に入り込んで固化
しかけている研磨屑や研磨材等を水圧により排除するこ
とができる。
When the platen of the double-sided polishing machine 1 is cleaned by using the nozzle device 40 having the above-described structure, the double-sided polishing machine 1 polishes the workpiece, and then the platen. Cleaning can be done without removing. That is, when it is necessary to clean the surface plate at the time when the polishing work for the workpiece is finished, as shown in FIG. 11 is moved up and down using the up-and-down device 13 to drive the drive device 3
A means for connecting the middle gear 5 and the interlocking gear 14 of the upper surface plate 11 is arranged. Further, the height of the upper device of the cleaning device 20 is set so that the nozzle device 40 can be positioned between the upper and lower surface plates 10 and 11, and the moving range of the nozzle device is input via the operation panel 22. Then, the high pressure water supply means of the cleaning device 20 is operated to rotate the upper and lower surface plates at a low speed while injecting the high pressure water from the nozzle, and the nozzle device 40 is placed between the center of the surface plate and the outer peripheral portion. Perform the cleaning work while linearly reciprocating in the radial direction. Therefore, when cleaning the surface plate by the cleaning device, by spraying very high-pressure water from the nozzle, the polishing debris and abrasives entering the deep groove of the surface plate and solidifying are hydraulically pressured. Can be eliminated.

【0016】なお、本発明の装置においては、図2に示
されるように、装置本体に対して高圧水供給用のバルブ
19を配置しているので、前記バルブ19に対してゴム
ホースを接続し、そのゴムホースに高圧水噴射ノズル部
材等の別の清掃手段を接続することができる。前述した
ように、別体に設ける高圧水噴射ノズル部材としては、
例えば、図6に示されるようなハンドガン装置70を構
成することができ、装置本体71に対して前記バルブ1
9に接続するホース74を配置し、弁作動部材72を用
いて、パイプ部材73の先端に配置するノズル装置75
のノズル76から、高圧水を噴射させるようにする。
In the apparatus of the present invention, as shown in FIG. 2, a valve 19 for supplying high pressure water is arranged on the apparatus main body. Therefore, a rubber hose is connected to the valve 19, It is possible to connect another cleaning means such as a high pressure water jet nozzle member to the rubber hose. As described above, as the high-pressure water jet nozzle member provided separately,
For example, a hand gun device 70 as shown in FIG. 6 can be configured, and the valve 1 is attached to the device body 71.
Nozzle device 75 which arranges the hose 74 connected to 9 and arranges at the tip of the pipe member 73 using the valve operating member 72.
The high pressure water is jetted from the nozzle 76.

【0017】また、前記ノズル装置75では、ノズルの
周囲をカバーするように、水飛散防止部材としてのブラ
シ部材78を配置しており、前記ブラシ部材78とし
て、ナイロンの太さが1〜3mmの繊維を、ノズル76を
中心にして円形状に支持板77に植毛したものを用いて
いる。さらに、前記ハンドガン装置70のパイプ部材7
3の先端部を角度θだけ曲げて、その先端部にノズル部
材75を配置し、洗浄作業を容易に行い得るようにして
いる。前記パイプの曲げ角度θは、130〜150°に
設定して、その曲げ部の周囲に補強部材79を配置し、
ノズル76から高圧の水を噴射して洗浄作業を行う際の
操作性を向上させるとともに、ノズル部材の支持を良好
に行い得るようにしている。そして、前記ハンドガン装
置70を用いて、定盤の洗浄を行うことの他に、前記本
体のノズル装置40により洗浄できない他の部材、例え
ば、中ギヤや外ギヤの歯の表面、その他の汚れた部分に
対して、高圧水による洗浄作業を行うことができる。ま
た、前記バルブ19を介して供給する高圧水の水圧は、
バルブの開きを調整することにより、任意に調整できる
もので、本体のノズル装置を用いる場合よりも、低い水
圧で水を噴射させることができる。したがって、前記別
体に取り付けるノズルを用いることにより、研磨機の定
盤以外の部材や定盤の周囲の部分の他に、作業場の床や
壁等も清掃することができ、それ等の洗浄作業を容易に
行うことができる。
Further, in the nozzle device 75, a brush member 78 as a water splash preventing member is arranged so as to cover the periphery of the nozzle, and the brush member 78 has a nylon thickness of 1 to 3 mm. The fibers are circularly planted on the support plate 77 around the nozzle 76 and used. Further, the pipe member 7 of the hand gun device 70.
The tip portion of 3 is bent by an angle θ, and the nozzle member 75 is arranged at the tip portion so that the cleaning operation can be easily performed. The bending angle θ of the pipe is set to 130 to 150 °, and the reinforcing member 79 is arranged around the bent portion,
The operability is improved when the high-pressure water is jetted from the nozzle 76 to perform the cleaning work, and the nozzle member can be favorably supported. In addition to cleaning the surface plate using the hand gun device 70, other members that cannot be cleaned by the nozzle device 40 of the main body, for example, the surface of the teeth of the middle gear and the outer gear, and other stains The part can be washed with high-pressure water. Further, the water pressure of the high pressure water supplied via the valve 19 is
It can be arbitrarily adjusted by adjusting the opening of the valve, and water can be jetted at a lower water pressure than in the case of using the nozzle device of the main body. Therefore, by using the nozzle attached to the separate body, it is possible to clean the members other than the surface plate of the polishing machine and the peripheral portion of the surface plate, as well as the floor and walls of the work place, and to perform the cleaning work. It can be done easily.

【0018】また、本発明の装置では、ノズルから噴射
される高圧水の圧力が高い場合や、ブラシ部材のみによ
って水の飛散を防止できない場合には、別体のカバー部
材により定盤の周囲を覆うこともできる。前記定盤の周
囲をカバーする部材としては、任意の部材を用いること
ができるもので、例えば、比較的厚いナイロンのシート
状のものを、上部定盤と下部定盤の外周部に巻き付け
て、スカート状に配置することによって構成し、上下の
カバー部材の間にノズル装置40が通過できる程度の隙
間を形成することもできる。前記カバー手段の他に、本
発明においては、定盤の外周部にブラシ状の部材を巻き
つけて、高圧水が定盤の外部に噴出することを防止する
手段を構成することができる。さらに、本発明の装置に
おいては、両面研磨機に使用する定盤の溝の深さや研磨
材の性質等に対応させて、ノズルから噴射する水圧を設
定することができ、その水圧に対応させて、カバー部材
の構成等も任意に形成することができる。
Further, in the apparatus of the present invention, when the pressure of the high-pressure water jetted from the nozzle is high or when the splashing of water cannot be prevented only by the brush member, a separate cover member is provided around the surface plate. It can also be covered. As the member for covering the periphery of the surface plate, any member can be used, for example, a relatively thick nylon sheet-shaped material is wound around the outer peripheral parts of the upper surface plate and the lower surface plate, It may be configured by arranging in a skirt shape, and a gap may be formed between the upper and lower cover members so that the nozzle device 40 can pass therethrough. In addition to the cover means, according to the present invention, a brush-like member may be wound around the outer peripheral portion of the surface plate to form means for preventing high-pressure water from spouting outside the surface plate. Furthermore, in the device of the present invention, the water pressure sprayed from the nozzle can be set in accordance with the depth of the groove of the surface plate used for the double-sided polishing machine, the property of the polishing material, etc. The structure of the cover member and the like can be arbitrarily formed.

【0019】[0019]

【発明の効果】本発明の両面研磨機定盤の洗浄装置は、
前述したように構成した洗浄装置を用いるものであるか
ら、両面研磨機から定盤を取り外すことなしに、上下の
定盤の間隔を開いて、ノズル装置を用いて洗浄作業を容
易に行うことができる。また、本発明の洗浄装置では、
ノズル装置の移動範囲を設定することにより、定盤に対
する洗浄作業を自動的に行うことが可能であり、ノズル
から噴出される高圧水により、定盤の溝の内部を容易に
洗浄できるとともに、特別の手動工具等を用いて、溝の
内部を洗浄する場合に比較して、短時間で洗浄作業を行
うことができる。さらに、本発明のノズル装置では、定
盤に噴射した水が周囲に飛散することを防止する手段を
設けているので、洗浄作業中に、高圧水が周囲に飛散す
ることを防止でき、作業現場が汚れることがなく、作業
員が洗浄装置をセットした後で、自動的に作業を行うこ
とを可能にする。
EFFECTS OF THE INVENTION The double side polishing machine surface plate cleaning device of the present invention is
Since the cleaning device configured as described above is used, it is possible to easily perform the cleaning work using the nozzle device by opening the interval between the upper and lower surface plates without removing the surface plate from the double-side polishing machine. it can. Further, in the cleaning device of the present invention,
By setting the moving range of the nozzle device, it is possible to automatically perform the cleaning work on the surface plate, and the high pressure water jetted from the nozzle can easily clean the inside of the groove of the surface plate and As compared with the case of cleaning the inside of the groove by using the manual tool or the like, the cleaning work can be performed in a shorter time. Further, the nozzle device of the present invention is provided with a means for preventing the water sprayed on the surface plate from splashing to the surroundings, so that it is possible to prevent the high pressure water from splashing to the surroundings during the cleaning work, and the work site It does not get dirty and allows workers to work automatically after setting the cleaning device.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の洗浄装置を両面研磨機に組み合わせ
た状態を示す説明図である。
FIG. 1 is an explanatory view showing a state in which the cleaning apparatus of the present invention is combined with a double-side polishing machine.

【図2】 本発明の洗浄装置の構成を示す側面図であ
る。
FIG. 2 is a side view showing the configuration of the cleaning device of the present invention.

【図3】 洗浄装置の平面図である。FIG. 3 is a plan view of the cleaning device.

【図4】 本発明のノズル装置の構成を示す説明図であ
る。
FIG. 4 is an explanatory diagram showing a configuration of a nozzle device of the present invention.

【図5】 上洗浄部の説明図である。FIG. 5 is an explanatory diagram of an upper cleaning unit.

【図6】 本発明に用いるハンドガンの構成を示す説明
図である。
FIG. 6 is an explanatory diagram showing a configuration of a handgun used in the present invention.

【図7】 一般的な両面研磨機における定盤と被加工物
の構成を示す説明図である。
FIG. 7 is an explanatory view showing a configuration of a surface plate and a work piece in a general double-side polishing machine.

【図8】 定盤の断面図である。FIG. 8 is a cross-sectional view of a surface plate.

【符号の説明】[Explanation of symbols]

1 両面研磨機、 5 中ギヤ、 6 外ギヤ、
7 キャリヤ、10 下部定盤、 11 上部
定盤、 15 研磨面、16・17 溝、 20
洗浄装置、 26 高圧ポンプ、30 上部装
置、 31 ノズル駆動装置、 32 モータ、3
7 先端案内部、 40 ノズル装置、 41
パイプ、50 上洗浄部、 41 上ノズル、 5
4 上カバー装置、57 円板部材、 58 ブ
ラシ部材、 60 下洗浄部、61 下ノズル、
64 下カバー装置、 68 ブラシ部材、70
ハンドガン装置、 75 ノズル装置、 76
ノズル、78 ブラシ部材。
1 double side polishing machine, 5 middle gear, 6 outer gear,
7 Carrier, 10 Lower Surface Plate, 11 Upper Surface Plate, 15 Polishing Surface, 16/17 Groove, 20
Cleaning device, 26 high pressure pump, 30 upper device, 31 nozzle drive device, 32 motor, 3
7 Tip guide part, 40 Nozzle device, 41
Pipe, 50 upper cleaning part, 41 upper nozzle, 5
4 upper cover device, 57 disc member, 58 brush member, 60 lower cleaning unit, 61 lower nozzle,
64 lower cover device, 68 brush member, 70
Hand gun device, 75 nozzle device, 76
Nozzle, 78 brush member.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 上部定盤と下部定盤とを対向させて配置
し、前記2つの定盤の対向する研磨面の間に被加工物を
支持するキャリヤを配置し、前記2つの定盤を垂直軸を
介して反対方向に回転させるとともに、被加工物を保持
するキャリヤを公転させながら、被加工物の上下の面を
平行に研磨する両面研磨機において、 前記両面研磨機の上下の定盤の間にノズル装置を移動可
能に配置し、前記ノズル装置の上下に配置するノズルか
ら高圧の水を噴出させる機構を構成し、 前記両面研磨機の定盤を回転させるとともに、ノズル装
置を定盤に対してラジアル方向に往復移動させ、 前記ノズルから噴出される高圧水により、定盤の溝に残
留する研磨屑等を除去することを特徴とする両面研磨機
定盤の洗浄装置。
1. An upper surface plate and a lower surface plate are arranged so as to face each other, and a carrier for supporting a workpiece is arranged between opposing polishing surfaces of the two surface plates, and the two surface plates are arranged. A double-sided polishing machine that rotates in opposite directions via a vertical axis and revolves a carrier that holds a workpiece while polishing the upper and lower surfaces of the workpiece in parallel. A nozzle device is movably arranged between the nozzle device and a mechanism for ejecting high-pressure water from nozzles arranged above and below the nozzle device, and the surface plate of the double-side polishing machine is rotated, and the nozzle device is installed as a surface plate. A double-sided polishing machine surface plate cleaning device, characterized in that it is reciprocally moved in the radial direction and the high-pressure water jetted from the nozzle removes polishing dust and the like remaining in the grooves of the surface plate.
【請求項2】 前記ノズル装置を設ける洗浄装置には、
ノズル装置の支持部材の高さを設定する手段と、ノズル
装置を往復移動させる手段、および、高圧水をノズル装
置に向けて供給する手段を設け、 往復移動手段に接続されるパイプの端部に、前記ノズル
装置を支持させることを特徴とする請求項1に記載の両
面研磨機定盤の洗浄装置。
2. The cleaning device provided with the nozzle device,
Means for setting the height of the support member of the nozzle device, means for reciprocating the nozzle device, and means for supplying high-pressure water toward the nozzle device are provided, and at the end of the pipe connected to the reciprocating means. The cleaning device for a double side polishing machine surface plate according to claim 1, wherein the nozzle device is supported.
【請求項3】 前記ノズル装置の上下に設けるノズルを
中心にして、それぞれカバー部材を配置し、 定盤の研磨面を洗浄した水の飛散防止手段を、前記カバ
ー部材に一体に設けることを特徴とする請求項1または
2に記載の両面研磨機定盤の洗浄装置。
3. A cover member is arranged around each of the nozzles provided above and below the nozzle device, and means for preventing water splashing by cleaning the polishing surface of the surface plate is provided integrally with the cover member. The cleaning device for a double-sided polishing machine surface plate according to claim 1 or 2.
【請求項4】 前記カバー部材に設ける水の飛散防止手
段をブラシ状の部材により構成し、前記ブラシ状の部材
の突出高さをノズルと研磨面の間隔に対応させて構成す
ることを特徴とする請求項3に記載の両面研磨機定盤の
洗浄装置。
4. The water splash prevention means provided on the cover member is constituted by a brush-shaped member, and the protruding height of the brush-shaped member is made to correspond to the distance between the nozzle and the polishing surface. The cleaning device for a double-sided polishing machine surface plate according to claim 3.
【請求項5】 前記洗浄装置には、ノズル装置に高圧水
を供給する手段に加えて、別体に設けるノズル部材等に
対して高圧水を供給する手段を設けることを特徴とする
請求項1に記載の両面研磨機定盤の洗浄装置。
5. The cleaning device is provided with means for supplying high-pressure water to a nozzle device and the like, in addition to means for supplying high-pressure water to the nozzle device. Double-sided polishing machine surface plate cleaning device described in.
JP18718893A 1993-06-30 1993-06-30 Cleaning equipment for double-side polishing machine surface plate Expired - Fee Related JP3366061B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18718893A JP3366061B2 (en) 1993-06-30 1993-06-30 Cleaning equipment for double-side polishing machine surface plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18718893A JP3366061B2 (en) 1993-06-30 1993-06-30 Cleaning equipment for double-side polishing machine surface plate

Publications (2)

Publication Number Publication Date
JPH079342A true JPH079342A (en) 1995-01-13
JP3366061B2 JP3366061B2 (en) 2003-01-14

Family

ID=16201651

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3366061B2 (en)

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JP2001150345A (en) * 1999-08-03 2001-06-05 Applied Materials Inc Washing and slurry-scattering system assembly used in chemical mechanical-polishing device
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DE10232670A1 (en) * 2002-07-18 2004-02-05 Wacker Siltronic Ag Process and device for cleaning a lapping disc has two parallel plates with an integrated high pressure hose feeding a fluid and with suction removal
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US8579679B2 (en) 2009-09-15 2013-11-12 Sumco Corporation Conditioning method and conditioning apparatus for polishing pad for use in double side polishing device
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JP2001150345A (en) * 1999-08-03 2001-06-05 Applied Materials Inc Washing and slurry-scattering system assembly used in chemical mechanical-polishing device
JP4620919B2 (en) * 2000-11-09 2011-01-26 不二越機械工業株式会社 Method and apparatus for cleaning polishing surface plate
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US6807701B2 (en) 2000-11-09 2004-10-26 Fujikoshi Machinery Corp. Method of cleaning abrasive plates of abrasive machine and cleaning device
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DE10232670B4 (en) * 2002-07-18 2004-05-13 Wacker Siltronic Ag Method and device for cleaning lapping disks
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KR101363890B1 (en) * 2012-06-07 2014-02-19 에이엠테크놀로지 주식회사 Facing apparatus for surface plate of double side polishing device for wafer
JP2016168541A (en) * 2015-03-12 2016-09-23 株式会社荏原製作所 Substrate treatment apparatus
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