JP7218731B2 - Cleaning equipment for lapping equipment - Google Patents

Cleaning equipment for lapping equipment Download PDF

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JP7218731B2
JP7218731B2 JP2020002108A JP2020002108A JP7218731B2 JP 7218731 B2 JP7218731 B2 JP 7218731B2 JP 2020002108 A JP2020002108 A JP 2020002108A JP 2020002108 A JP2020002108 A JP 2020002108A JP 7218731 B2 JP7218731 B2 JP 7218731B2
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cleaning
nozzle
surface plate
washing
water
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JP2021109271A (en
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道夫 鈴木
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Priority to JP2020002108A priority Critical patent/JP7218731B2/en
Priority to PCT/JP2020/041761 priority patent/WO2021140737A1/en
Priority to KR1020227021626A priority patent/KR20220119387A/en
Priority to CN202080086058.6A priority patent/CN114786871B/en
Priority to TW109141034A priority patent/TW202130461A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Nozzles (AREA)

Description

本発明は、ラッピング装置の洗浄装置に関する。 TECHNICAL FIELD The present invention relates to a cleaning device for a lapping machine.

従来、例えばシリコンウェーハを製造する際には、ウェーハを所定の厚みに揃えると同時にその平坦度、平行度などの必要な形状精度を得るためにラッピング装置によるラッピングを行っている（例えば特許文献１参照）。ラッピングは上下定盤の間にウェーハ等の被加工物を挟み込み、スラリーを供給しつつ、上下定盤を回転させることにより行う。 Conventionally, when manufacturing silicon wafers, for example, lapping is performed by a lapping apparatus in order to obtain the necessary shape accuracy such as flatness and parallelism while aligning the wafers to a predetermined thickness (for example, Patent Document 1). reference). Lapping is performed by sandwiching a workpiece such as a wafer between upper and lower surface plates and rotating the upper and lower surface plates while supplying slurry.

このようなラッピング装置の下定盤を支持する定盤受け台の廃液路の形状の一例を図５Ａに示す。下定盤を支持して該下定盤と共に回転可能な定盤受け台には、下定盤から流れ落ちた廃スラリー（以下、スラッジとも言う）を排出するための、中心部から外周方向に向かって傾斜して延びる廃液路が形成されている。 FIG. 5A shows an example of the shape of the waste liquid path of the surface plate cradle that supports the lower surface plate of such a lapping apparatus. The surface plate receiving base, which supports the lower surface plate and is rotatable together with the lower surface plate, is inclined from the center toward the outer periphery for discharging waste slurry (hereinafter also referred to as sludge) that has flowed down from the lower surface plate. A waste channel is formed that extends through the

ラッピングを繰り返し行うと、廃液路にスラッジが堆積し排出が阻害されてしまう。そのため、定期的に作業者が手作業でスラッジを除去する洗浄作業を行っていた。図５Ｂに洗浄作業の模式図を示す。
図５Ｂに示すように、下定盤の中心部と外周部の隙間から洗管ホースを作業者の手により廃液路内部に挿入し、洗浄水を高圧噴射し堆積したスラッジを除去していた。 Repeated lapping results in accumulation of sludge in the waste liquid path, hindering discharge. For this reason, workers regularly perform cleaning work to remove the sludge manually. FIG. 5B shows a schematic diagram of the cleaning operation.
As shown in FIG. 5B, an operator manually inserts a pipe cleaning hose into the waste liquid channel through the gap between the center and outer periphery of the lower surface plate, and sprays cleaning water at high pressure to remove accumulated sludge.

特開２０１６－５５３８１JP 2016-55381

しかし、図５Ｃに示すように定盤受け台に下定盤が載った状態では、廃液路の大半が作業者に見えない状態となる。また、廃液路にアクセス可能なスペースは下定盤の中心部と外周部の共に約７０ｍｍ幅の狭いスペースしかなく、洗浄作業が困難なものとなっていた。また、手作業であることから洗管ホースの先端が固定できず洗浄位置が定まらないため、スラッジの除去効果が高いとは言えなかった。さらに、中心部から外周方向に向かって延びる廃液路が複数存在する場合には作業時間も増加する。例えば、図５Ａに示すような８方向に廃液路が存在する場合、洗浄完了に約３時間を要していた。 However, when the lower surface plate is placed on the surface plate cradle as shown in FIG. 5C, most of the waste liquid path is invisible to the operator. In addition, the space accessible to the waste liquid channel is only a narrow space of about 70 mm in both the central portion and the outer peripheral portion of the lower surface plate, which makes cleaning work difficult. In addition, since it is a manual operation, the tip of the tube cleaning hose cannot be fixed and the cleaning position cannot be fixed, so the sludge removal effect cannot be said to be high. Furthermore, if there are a plurality of waste liquid channels extending from the central portion toward the outer periphery, the working time is also increased. For example, when there are waste liquid channels in eight directions as shown in FIG. 5A, it takes about 3 hours to complete cleaning.

そこで本発明はこのような問題点に鑑みなされたもので、本発明の目的は、定盤受け台の廃液路に堆積したスラッジを効果的に除去でき、かつ短時間で洗浄可能なラッピング装置の洗浄装置を提供することにある。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a lapping apparatus which can effectively remove the sludge accumulated in the waste liquid path of the surface plate cradle and can be cleaned in a short period of time. To provide a cleaning device.

上記課題を達成するために、本発明では、回転可能な上下定盤と、該上下定盤の間にスラリーを供給するスラリー供給ノズルとを有し、前記スラリーを供給しつつ、前記上下定盤を回転させて、該上下定盤間に挟み込んだ被加工物をラッピングするラッピング装置の洗浄装置であって、前記下定盤を支持して該下定盤と共に回転可能な定盤受け台に形成されており、前記下定盤から流れ落ちた廃スラリーを排出するための廃液路を洗浄水により洗浄するものであり、前記洗浄水を噴射する第一洗浄ノズル及び第二洗浄ノズルと、該第一洗浄ノズル及び第二洗浄ノズルが取り付けられており、該第一洗浄ノズル及び第二洗浄ノズルの配置位置及び配置向きを固定するアームとを有しており、前記定盤受け台の回転軸周りの内周側に位置するリング状部と、該リング状部から外周方向に放射状に延びる１つ以上の放射状部とからなる前記廃液路に対して、前記第一洗浄ノズルは前記リング状部に向いており、かつ、前記第二洗浄ノズルは前記定盤受け台の内周側から外周方向に向いており、該固定配置された第一洗浄ノズル及び第二洗浄ノズルから前記洗浄水が噴射され、かつ、前記定盤受け台及び前記下定盤が回転されることで、前記リング状部の全域が前記第一洗浄ノズルからの洗浄水により、かつ、前記放射状部の全域が前記第二洗浄ノズルからの洗浄水により、自動洗浄可能なものであることを特徴とするラッピング装置の洗浄装置を提供する。 In order to achieve the above object, the present invention has rotatable upper and lower surface plates and a slurry supply nozzle for supplying slurry between the upper and lower surface plates, and supplies the slurry while supplying the upper and lower surface plates. is rotated to lapping the workpiece sandwiched between the upper and lower surface plates, the lapping device is formed on a surface plate receiving table that supports the lower surface plate and is rotatable together with the lower surface plate. A waste liquid passage for discharging waste slurry that has flowed down from the lower surface plate is washed with washing water, and includes a first washing nozzle and a second washing nozzle for injecting the washing water, the first washing nozzle and A second washing nozzle is attached, and an arm for fixing the arrangement position and arrangement direction of the first washing nozzle and the second washing nozzle is provided, and the inner peripheral side around the rotation axis of the surface plate cradle and one or more radial portions radially extending from the ring-shaped portion in the outer peripheral direction, the first washing nozzle facing the ring-shaped portion, The second cleaning nozzle is directed from the inner peripheral side to the outer peripheral direction of the surface plate cradle, the cleaning water is jetted from the fixedly arranged first cleaning nozzle and the second cleaning nozzle, and By rotating the surface plate cradle and the lower surface plate, the entire area of the ring-shaped portion is filled with the washing water from the first washing nozzle, and the entire area of the radial portion is filled with the washing water from the second washing nozzle. To provide a cleaning device for a lapping device, which is characterized by being capable of automatic cleaning.

このように、上記の２方向に向けて固定配置された第一洗浄ノズル及び第二洗浄ノズルから洗浄水が噴射され、定盤受け台及び下定盤が回転されることで廃液路を洗浄するものであれば、リング状部及び放射状部の全域に洗浄水を安定して当てられるため、これらの領域に堆積したスラッジの除去効果が高く、短時間で均一に洗浄することができる。しかも、自動洗浄が可能であり、簡便である。 In this way, washing water is sprayed from the first washing nozzle and the second washing nozzle fixedly arranged in the above two directions, and the surface plate cradle and the lower surface plate are rotated to wash the waste liquid path. In this case, since the cleaning water can be stably applied to the entire area of the ring-shaped portion and the radial portion, the effect of removing sludge deposited on these areas is high, and uniform cleaning can be performed in a short time. Moreover, automatic cleaning is possible, which is convenient.

また、前記第一洗浄ノズル及び前記第二洗浄ノズルは、前記洗浄水が扇形状に噴射可能なものとすることができる。
洗浄水を扇形状に噴射可能な洗浄ノズルであれば、広範囲を均一に洗浄可能なため、より高いスラッジ除去効果を得ることができる。 Further, the first washing nozzle and the second washing nozzle can jet the washing water in a fan shape.
A cleaning nozzle capable of jetting cleaning water in a fan shape can uniformly clean a wide area, so that a higher sludge removal effect can be obtained.

以上のように、本発明によれば、定盤受け台の廃液路中のスラッジを効果的に安定して除去でき、かつ短時間で均一に自動洗浄可能であり簡便である。 As described above, according to the present invention, it is possible to effectively and stably remove the sludge in the waste liquid path of the surface plate cradle, and it is possible to perform uniform automatic cleaning in a short period of time, which is convenient.

本発明の洗浄装置の一例を示す上面図である。It is a top view which shows an example of the washing|cleaning apparatus of this invention. 本発明の洗浄装置の一例を示す側面図である。It is a side view which shows an example of the washing|cleaning apparatus of this invention. 本発明の洗浄装置付近の概略を示す上面図である。It is a top view which shows the outline of the washing|cleaning apparatus vicinity of this invention. 本発明の洗浄装置付近の概略を示す側面図である。It is a side view which shows the outline of the washing|cleaning apparatus vicinity of this invention. 本発明の洗浄装置を適用可能なラッピング装置の定盤受け台の一例を示す概略図である。1 is a schematic view showing an example of a surface plate cradle of a lapping device to which the cleaning device of the present invention can be applied; FIG. 本発明の洗浄装置を適用可能なラッピング装置の一例を示す概略図である。It is a schematic diagram showing an example of a lapping device to which the cleaning device of the present invention can be applied. 本発明の洗浄装置による洗浄範囲を示す模式図である。FIG. 3 is a schematic diagram showing a cleaning range of the cleaning device of the present invention; 洗浄水が扇形状に噴射可能な扇形ノズルの噴射口を示す正面図である。FIG. 4 is a front view showing an ejection port of a fan-shaped nozzle capable of ejecting cleansing water in a fan shape; 洗浄水が扇形状に噴射可能な扇形ノズルの噴射構造を示す説明図である。FIG. 4 is an explanatory view showing a jetting structure of a fan-shaped nozzle capable of jetting cleansing water in a fan-like shape; 洗浄水が直線状に噴射可能な直進ノズルの噴射口を示す正面図である。FIG. 4 is a front view showing an injection port of a straight nozzle capable of linearly injecting cleansing water. 洗浄水が直線状に噴射可能な直進ノズルの噴射構造を示す説明図である。FIG. 10 is an explanatory view showing an injection structure of a straight nozzle capable of linearly injecting cleansing water. 扇形ノズルを用いた洗浄範囲の一例を示す模式図である。FIG. 4 is a schematic diagram showing an example of a cleaning range using a fan-shaped nozzle; 実施例と比較例の年間洗浄時間及びスラッジ除去量を示すグラフである。4 is a graph showing the annual cleaning time and the amount of sludge removed in Examples and Comparative Examples. ラッピング装置の定盤受け台の一例を示す概略図である。It is a schematic diagram showing an example of a surface plate cradle of a lapping apparatus. 従来の作業者による洗浄作業の一例を示す模式図である。It is a schematic diagram which shows an example of the cleaning work by the conventional worker. 定盤受け台の廃液路にアクセス可能なスペースを示す概略図である。FIG. 4 is a schematic diagram showing the space accessible to the waste channel of the platen cradle;

本発明者は、定盤受け台の断面形状及びアクセスポイントの構造から、どのような方式にすれば洗浄水を安定して廃液路全域に当てられるか鋭意検討を行った。
その結果、２方向に向けて固定配置されたノズルから洗浄水を噴射（すなわち、中心のリング状部と、中心部から外周方向への放射状部に分けて噴射）してスラッジを流し落とすことで、高いスラッジ除去効果を有し、かつ短時間で洗浄可能なことを見出し、本発明を完成させた。 The inventor of the present invention has diligently studied how to stably apply washing water to the entire area of the waste liquid channel, based on the cross-sectional shape of the surface plate cradle and the structure of the access point.
As a result, washing water is sprayed from nozzles fixedly arranged in two directions (i.e., a ring-shaped part in the center and a radial part from the center to the outer circumference) to wash off the sludge. The present inventors have completed the present invention by finding that , has a high sludge removal effect and can be cleaned in a short time.

以下、本発明について、実施態様の一例として、図を参照しながら詳細に説明するが、本発明はこれに限定されるものではない。
図１Ｆは本発明の洗浄装置を適用可能なラッピング装置の一例を示す概略図である。上側が縦断面図であり、下側が平面図である。なお、縦断面図における下定盤より下側に位置する定盤受け台等は省略しており、平面図においては上定盤やスラリー供給ノズルは除いている。
ラッピング装置１１は回転可能な上下定盤１２、１３を有している。下定盤１３はその中心部上面にサンギア１４を有し、その周縁部には環状のインターナルギア１５が設けられている。上定盤１２は上下に昇降可能になっている。また、ウェーハＷ（被加工物）を保持するキャリア１６の外周面には上記サンギア１４及びインターナルギア１５と噛合するギア部が形成され、全体として歯車構造をなしている。
キャリア１６には１つあるいは複数の保持孔１７が設けられている。ラッピングされるウェーハＷはこの保持孔１７内に挿入されて保持される。該ウェーハＷを保持したキャリア１６は１つあるいは複数配置され、上方より下降して着盤した上定盤１２と下定盤１３との間に挟み込まれ、下定盤１３等の回転により自転や公転が可能になっている。
また、上定盤１２の上方にはスラリー供給ノズル１８が配置されており、該スラリー供給ノズル１８から上定盤１２に設けられた貫通孔１９を介してウェーハＷと上下定盤１２、１３の間にスラリーを供給可能である。 Hereinafter, the present invention will be described in detail as an example of embodiments with reference to the drawings, but the present invention is not limited thereto.
FIG. 1F is a schematic diagram showing an example of a lapping apparatus to which the cleaning apparatus of the present invention can be applied. The upper side is a longitudinal sectional view, and the lower side is a plan view. Note that the surface plate cradle and the like located below the lower surface plate in the longitudinal sectional view are omitted, and the upper surface plate and the slurry supply nozzle are omitted in the plan view.
The lapping device 11 has rotatable upper and lower platens 12 and 13 . The lower platen 13 has a sun gear 14 on its central upper surface, and an annular internal gear 15 on its peripheral edge. The upper platen 12 can be moved up and down. Further, a gear portion that meshes with the sun gear 14 and the internal gear 15 is formed on the outer peripheral surface of the carrier 16 that holds the wafer W (work piece), thereby forming a gear structure as a whole.
Carrier 16 is provided with one or more retaining holes 17 . A wafer W to be lapped is inserted and held in the holding hole 17 . One or a plurality of carriers 16 holding the wafers W are arranged, and are sandwiched between the upper surface plate 12 and the lower surface plate 13 which descend from above and land thereon. It is possible.
A slurry supply nozzle 18 is arranged above the upper surface plate 12 , and the wafer W and the upper and lower surface plates 12 and 13 are fed from the slurry supply nozzle 18 through a through hole 19 provided in the upper surface plate 12 . A slurry can be supplied in between.

図１Ｅは上記ラッピング装置において、下定盤を支持し、回転させる定盤受け台の一例を示す概略図である。
定盤受け台２０には、該定盤受け台の回転軸周りの内周側に位置するリング状部２１と、該リング状部から外周方向に放射状に延びる１つ以上（ここでは８つ）の放射状部２２とからなる廃液路２３が形成されている。下定盤１３からのスラッジを受け、排出する構造となっており、放射状部２２は外周方向に向かって下方に傾斜している。 FIG. 1E is a schematic view showing an example of a surface plate support for supporting and rotating the lower surface plate in the lapping apparatus.
The surface plate cradle 20 has a ring-shaped portion 21 located on the inner peripheral side of the rotation axis of the surface plate cradle, and one or more (here, eight) radially extending from the ring-shaped portion in the outer peripheral direction. A waste liquid passage 23 is formed with a radial portion 22 of . It has a structure for receiving and discharging sludge from the lower surface plate 13, and the radial portion 22 is inclined downward toward the outer peripheral direction.

次に、図１Ｅ、１Ｆに示したラッピング装置に適用する本発明の洗浄装置について説明する。
図１Ａに洗浄装置の上面図、図１Ｂに洗浄装置の側面図を示す。いずれもラッピング装置に対して配置した時の態様である。
洗浄装置１は第一洗浄ノズル２及び第二洗浄ノズル３、アーム４を有しており、前記第一洗浄ノズル２は定盤受け台２０のリング状部２１に向いており、前記第二洗浄ノズル３は定盤受け台２０の内周側から外周方向に向いている。各々、数は１つでも良いし複数でも良い。前記第一洗浄ノズル２及び前記第二洗浄ノズル３の配置位置及び配置向きはアーム４によって固定され、さらにアーム４はクランプ背板５によって外周板６に固定されている。この外周板６は定盤受け台２０を囲むように固定配置された円筒状のものであり、これに上記のようにクランプ背板５、アーム４、第一洗浄ノズル２及び第二洗浄ノズル３が順に取り付けられているので、第一洗浄ノズル２及び第二洗浄ノズル３が固定配置される。 Next, the cleaning apparatus of the present invention applied to the lapping apparatus shown in FIGS. 1E and 1F will be described.
FIG. 1A shows a top view of the cleaning device, and FIG. 1B shows a side view of the cleaning device. All of them are modes when arranged with respect to the lapping device.
The cleaning device 1 has a first cleaning nozzle 2, a second cleaning nozzle 3, and an arm 4. The first cleaning nozzle 2 faces the ring-shaped portion 21 of the platen cradle 20, and the second cleaning The nozzles 3 are directed from the inner peripheral side of the surface plate cradle 20 to the outer peripheral direction. The number of each may be one or plural. Arrangement positions and orientations of the first washing nozzle 2 and the second washing nozzle 3 are fixed by an arm 4 , and the arm 4 is fixed to a peripheral plate 6 by a clamp back plate 5 . The outer peripheral plate 6 is cylindrical and fixed so as to surround the surface plate cradle 20. The clamp back plate 5, the arm 4, the first cleaning nozzle 2 and the second cleaning nozzle 3 are mounted on the outer peripheral plate 6 as described above. are attached in order, the first cleaning nozzle 2 and the second cleaning nozzle 3 are fixedly arranged.

この第一洗浄ノズル２、第二洗浄ノズル３及びアーム４の固定について、説明のため互いの位置関係を簡略化して示した図を用いてより詳細に説明する。
図１Ｃに洗浄装置付近の上面図、図１Ｄに洗浄装置付近の側面図を示す。
洗浄装置のクランプ背板５は、外周板６に合わせて長さが調整可能となっており、例えばバネ伸縮によって外周板６にクランプした後、ネジ等で外周板６に固定される。洗浄装置１のアーム４は水平方向にスライドすることでノズルの位置を調整可能であり、第一洗浄ノズル２及び第二洗浄ノズル３を有するアーム４の先端部は鉛直方向にスライドすることで高さが調整可能である。また、第一洗浄ノズル２及び第二洗浄ノズル３をそれぞれ回転させることで洗浄水の噴射方向も調整可能である。これらの調整によって下定盤の中心の隙間から廃液路内部へアーム４の先端部を挿入し、第一洗浄ノズル２の噴射位置がリング状部２１へ、第二洗浄ノズル３の噴射位置が放射状部２２へ向かうように調整し固定することができる。
なお、クランプ背板５については補強材を用いて補強してもよい。洗浄水の噴射に伴うアーム４の上昇等の位置ずれを防ぐのに効果的である。
当然、アーム４を介しての第一洗浄ノズル２及び第二洗浄ノズル３の固定の仕方はこれに限定されず、適宜決定できる。例えばアーム４が床や壁、他の固定部材等に固定されていても良い。 Fixing of the first cleaning nozzle 2, the second cleaning nozzle 3, and the arm 4 will be described in more detail with reference to a simplified diagram showing the mutual positional relationship for the sake of explanation.
FIG. 1C shows a top view of the vicinity of the cleaning device, and FIG. 1D shows a side view of the vicinity of the cleaning device.
The length of the clamp back plate 5 of the cleaning device can be adjusted according to the outer peripheral plate 6. For example, the clamp back plate 5 is clamped to the outer peripheral plate 6 by spring expansion and contraction, and then fixed to the outer peripheral plate 6 with screws or the like. The arm 4 of the cleaning device 1 slides horizontally to adjust the position of the nozzles, and the tip of the arm 4 having the first cleaning nozzle 2 and the second cleaning nozzle 3 slides vertically to adjust the height. is adjustable. Further, by rotating the first cleaning nozzle 2 and the second cleaning nozzle 3, the direction of spraying the cleaning water can be adjusted. With these adjustments, the tip of the arm 4 is inserted into the waste liquid passage through the gap in the center of the lower surface plate, the injection position of the first washing nozzle 2 is the ring-shaped portion 21, and the injection position of the second washing nozzle 3 is the radial portion. 22 can be adjusted and fixed.
Note that the clamp back plate 5 may be reinforced using a reinforcing material. This is effective in preventing displacement such as lifting of the arm 4 due to jetting of washing water.
Of course, the method of fixing the first cleaning nozzle 2 and the second cleaning nozzle 3 via the arm 4 is not limited to this, and can be determined as appropriate. For example, the arm 4 may be fixed to the floor, wall, other fixed member, or the like.

図２に上記洗浄装置１による洗浄水の噴射範囲を示す。
図２に示すように、第一洗浄ノズル２からの洗浄水はリング状部２１に、第二洗浄ノズル３からの洗浄水は放射状部２２に噴射される。
このように、第一洗浄ノズル２及び第二洗浄ノズル３の配置位置及び配置向きが固定された状態で洗浄水が噴射され、かつ、定盤受け台２０及び下定盤１３が回転されることで、自動で洗浄作業が行われるものとなっている。
そして、第一洗浄ノズル２からの洗浄水がリング状部２１の全域に、かつ、第二洗浄ノズル３からの洗浄水が放射状部２２の全域に噴射されるため、廃液路全域のスラッジを効果的に除去することができる。また、スラッジ除去効果が高いため作業時間が短縮され、さらに自動運転のため洗浄中は作業者を必要としない。 FIG. 2 shows the spraying range of washing water from the washing device 1. As shown in FIG.
As shown in FIG. 2, the washing water from the first washing nozzle 2 is sprayed to the ring-shaped portion 21 and the washing water from the second washing nozzle 3 is sprayed to the radial portion 22 .
In this manner, the washing water is sprayed in a state where the arrangement position and arrangement direction of the first washing nozzle 2 and the second washing nozzle 3 are fixed, and the surface plate cradle 20 and the lower surface plate 13 are rotated. , the cleaning operation is performed automatically.
Since the washing water from the first washing nozzle 2 is sprayed over the entire ring-shaped portion 21 and the washing water from the second washing nozzle 3 is sprayed over the entire radial portion 22, the sludge in the entire waste liquid path is effectively removed. can be effectively removed. In addition, since the sludge removal effect is high, the work time is shortened, and since it operates automatically, there is no need for an operator during cleaning.

また、第一洗浄ノズル２及び第二洗浄ノズル３（特には第二洗浄ノズル３）は、洗浄水が扇形状に噴射可能な扇型ノズルとすることができる。扇型ノズルであれば、洗浄水が広範囲に拡がって噴射されるため、より高いスラッジ除去効果を得ることができる。
このような扇型ノズルと、洗浄水が直線状に噴射可能な直進ノズルの構造を説明する。
図３Ａに扇型ノズルの噴射口の正面図、図３Ｂに扇型ノズルのＡ－Ａ断面における噴射説明図、図３Ｃに直進ノズルの噴射口の正面図、図３Ｄに直進ノズルのＢ－Ｂ断面における噴射説明図を示す。
図３Ａ、図３Ｂに示すように、扇形ノズルでは中心の噴出口から扇形に拡がる溝があり、噴射された洗浄水がこの溝に沿って拡散するため、噴射形状が扇形となる。
それに対し直進ノズルでは、図３Ｃ、図３Ｄに示すように噴出口中心から洗浄水がそのまま噴射されるため、噴射形状が直線となる。 Further, the first cleaning nozzle 2 and the second cleaning nozzle 3 (especially the second cleaning nozzle 3) can be fan-shaped nozzles capable of jetting cleaning water in a fan shape. With the fan-shaped nozzle, the cleaning water is sprayed over a wide range, so a higher sludge removal effect can be obtained.
Structures of such a fan-shaped nozzle and a linear nozzle capable of linearly injecting cleansing water will be described.
FIG. 3A is a front view of the jet nozzle of the fan-shaped nozzle, FIG. 3B is an illustration of jetting in the AA section of the fan-shaped nozzle, FIG. 3C is a front view of the jet nozzle of the straight nozzle, and FIG. 3D is the BB of the straight nozzle. FIG. 4 shows an illustration of jetting in a cross section;
As shown in FIGS. 3A and 3B, the fan-shaped nozzle has a fan-shaped groove extending from the central ejection port, and the jetted cleansing water diffuses along this groove, resulting in a fan-shaped jet.
On the other hand, in the straight nozzle, as shown in FIGS. 3C and 3D, the cleansing water is directly ejected from the center of the ejection port, so the ejection shape is straight.

図３Ｅは放射状部に向けた扇型ノズルの配置の一例である。
なお、扇形ノズルの洗浄水の拡散方向は洗浄ノズルの締め込みで変更可能であるが、洗浄水が縦方向に拡がるように配置するのがより好ましい。この場合、図３Ｅに示すように、定盤受け台の回転と合わせて廃液路の全体に洗浄水が噴射されるため、横方向に拡がるように配置するよりも、より高いスラッジ除去効果を得ることができる。 FIG. 3E is an example of an arrangement of fan-shaped nozzles directed toward the radial portion.
Although the direction in which the cleaning water spreads from the fan-shaped nozzle can be changed by tightening the cleaning nozzle, it is more preferable to dispose the cleaning water so that the cleaning water spreads in the vertical direction. In this case, as shown in FIG. 3E, washing water is sprayed all over the waste liquid path along with the rotation of the surface plate cradle. be able to.

以上のような本発明の洗浄装置１を用いた洗浄方法について説明する。
まず、クランプ背板５にアーム４を取り付け、該アーム４の先端部に第一洗浄ノズル２及び第二洗浄ノズル３を取り付ける。さらに、クランプ背板５を固定配置されている外周板６に取り付ける。
アームの水平方向の長さを調整した状態で、ノズルが取り付けられている先端部の鉛直方向の高さを調整し、先端部を下定盤の中心部隙間から廃液路内部に挿入する。そして洗浄ノズルの位置、向きを固定する。
この状態で定盤受け台及び下定盤を回転させつつ、洗浄水を噴射する。
これによりリング状部と放射状部（外周方向）の２方向に洗浄水が噴射され、廃液路全域の自動洗浄が行われる。
なお、洗浄ノズルから噴射する洗浄水としては、例えば水を用いることができる。高圧水を用いるとより高いスラッジ除去効果が得られる。噴射力自体は特に限定されず、例えば２０Ｍｐａ以上とすることができる。 A cleaning method using the cleaning apparatus 1 of the present invention as described above will be described.
First, the arm 4 is attached to the clamp back plate 5 , and the first washing nozzle 2 and the second washing nozzle 3 are attached to the tip of the arm 4 . Furthermore, the clamp back plate 5 is attached to the fixedly arranged peripheral plate 6 .
While adjusting the horizontal length of the arm, adjust the vertical height of the tip to which the nozzle is attached, and insert the tip into the waste liquid channel through the gap in the center of the lower surface plate. Then, the position and direction of the cleaning nozzle are fixed.
In this state, washing water is sprayed while rotating the surface plate cradle and the lower surface plate.
As a result, washing water is sprayed in two directions, the ring-shaped portion and the radial portion (peripheral direction), so that the entire area of the waste liquid passage is automatically washed.
Water, for example, can be used as the washing water jetted from the washing nozzle. A higher sludge removal effect can be obtained by using high-pressure water. The injection force itself is not particularly limited, and can be, for example, 20 Mpa or more.

以下、本発明を実施例に基づきさらに説明するが、これらの実施例は例示的に示されるもので限定的に解釈されるべきではない。 The present invention will be further described below based on examples, but these examples are shown by way of illustration and should not be construed as limiting.

（実施例）
図１Ａ～図１Ｄ、図３Ａ、図３Ｂに示す本発明の洗浄装置を用意した。
該洗浄装置の第一洗浄ノズル及び第二洗浄ノズルを、洗浄水が扇形状に噴射可能なものとし、第二洗浄ノズルについては洗浄水が縦方向に拡がるように装着した。第一洗浄ノズル及び第二洗浄ノズルから２０Ｍｐａの高圧水を噴射し、定盤受け台を２ｒｐｍで回転させ自動洗浄作業を行い、年間の洗浄時間及びスラッジ除去量を測定した。 (Example)
A cleaning apparatus of the present invention as shown in FIGS. 1A-1D, 3A and 3B was prepared.
The first washing nozzle and the second washing nozzle of the washing device were capable of jetting washing water in a fan shape, and the second washing nozzle was mounted so that the washing water spreads in the vertical direction. High-pressure water of 20 Mpa was injected from the first cleaning nozzle and the second cleaning nozzle, and the surface plate cradle was rotated at 2 rpm to perform automatic cleaning work, and the annual cleaning time and the amount of sludge removed were measured.

（比較例）
本発明の洗浄装置を用いず、図５Ｂに示すような手作業で行った以外、実施例と同様の条件で洗浄作業を行った。 (Comparative example)
The cleaning work was performed under the same conditions as in the example, except that the cleaning apparatus of the present invention was not used and the cleaning work was performed manually as shown in FIG. 5B.

その結果、図４に示すように、実施例では年間洗浄時間が１１２ｈ、年間スラッジ除去量が４４８ｋｇとなった。比較例では年間洗浄時間が３３６ｈ、年間スラッジ除去量が１３４ｋｇであった。作業者が洗管ホースを用いて洗浄を行う従来方式（比較例）と比較すると、本発明の洗浄装置により年間洗浄時間は１／３に、年間スラッジ除去量は約２３４％向上した。 As a result, as shown in FIG. 4, in Example, the annual washing time was 112 hours, and the annual amount of sludge removed was 448 kg. In the comparative example, the annual washing time was 336 hours and the annual sludge removal amount was 134 kg. Compared with the conventional method (comparative example) in which an operator uses a tube washing hose, the washing device of the present invention reduces the annual washing time to 1/3 and improves the annual sludge removal amount by about 234%.

なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は、例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 It should be noted that the present invention is not limited to the above embodiments. The above embodiment is an example, and any device that has substantially the same configuration as the technical idea described in the claims of the present invention and produces similar effects is the present invention. It is included in the technical scope of the invention.

１…洗浄装置、 ２…第一洗浄ノズル、 ３…第二洗浄ノズル、 ４…アーム、
５…クランプ背板、 ６…外周板、
１１…ラッピング装置、 １２…上定盤、 １３…下定盤、 １４…サンギア、
１５…インターナルギア、 １６…キャリア、 １７…保持孔、
１８…スラリー供給ノズル、 １９…貫通孔、
２０…定盤受け台、 ２１…リング状部、 ２２…放射状部、 ２３…廃液路、
Ｗ…ウェーハ。 DESCRIPTION OF SYMBOLS 1... Cleaning apparatus, 2... First cleaning nozzle, 3... Second cleaning nozzle, 4... Arm,
5... Clamp back plate, 6... Peripheral plate,
11... Lapping device, 12... Upper surface plate, 13... Lower surface plate, 14... Sun gear,
15... Internal gear, 16... Carrier, 17... Holding hole,
18... Slurry supply nozzle, 19... Through hole,
20... Surface plate cradle, 21... Ring-shaped part, 22... Radial part, 23... Waste liquid path,
W... Wafer.

Claims (2)

回転可能な上下定盤と、該上下定盤の間にスラリーを供給するスラリー供給ノズルとを有し、前記スラリーを供給しつつ、前記上下定盤を回転させて、該上下定盤間に挟み込んだ被加工物をラッピングするラッピング装置の洗浄装置であって、
前記下定盤を支持して該下定盤と共に回転可能な定盤受け台に形成されており、前記下定盤から流れ落ちた廃スラリーを排出するための廃液路を洗浄水により洗浄するものであり、
前記洗浄水を噴射する第一洗浄ノズル及び第二洗浄ノズルと、該第一洗浄ノズル及び第二洗浄ノズルが取り付けられており、該第一洗浄ノズル及び第二洗浄ノズルの配置位置及び配置向きを固定するアームとを有しており、
前記定盤受け台の回転軸周りの内周側に位置するリング状部と、該リング状部から外周方向に放射状に延びる１つ以上の放射状部とからなる前記廃液路に対して、
前記第一洗浄ノズルは前記リング状部に向いており、かつ、前記第二洗浄ノズルは前記定盤受け台の内周側から外周方向に向いており、
該固定配置された第一洗浄ノズル及び第二洗浄ノズルから前記洗浄水が噴射され、かつ、前記定盤受け台及び前記下定盤が回転されることで、前記リング状部の全域が前記第一洗浄ノズルからの洗浄水により、かつ、前記放射状部の全域が前記第二洗浄ノズルからの洗浄水により、自動洗浄可能なものであることを特徴とするラッピング装置の洗浄装置。 It has rotatable upper and lower surface plates and a slurry supply nozzle for supplying slurry between the upper and lower surface plates, and while supplying the slurry, the upper and lower surface plates are rotated to sandwich between the upper and lower surface plates. A cleaning device for a lapping device that lapping a workpiece,
A waste liquid path formed on a surface plate receiving table that supports the lower surface plate and is rotatable together with the lower surface plate, for discharging waste slurry that has flowed down from the lower surface plate, is washed with washing water,
A first washing nozzle and a second washing nozzle for injecting the washing water, and the first washing nozzle and the second washing nozzle are attached, and the arrangement position and arrangement direction of the first washing nozzle and the second washing nozzle are and an arm for fixing,
With respect to the waste liquid path, which is composed of a ring-shaped portion located on the inner peripheral side of the rotating shaft of the surface plate cradle and one or more radial portions radially extending from the ring-shaped portion in the outer peripheral direction,
The first cleaning nozzle faces the ring-shaped portion, and the second cleaning nozzle faces from the inner peripheral side to the outer peripheral direction of the surface plate cradle,
The cleaning water is sprayed from the fixedly arranged first cleaning nozzle and second cleaning nozzle, and the surface plate receiving base and the lower surface plate are rotated, so that the entire area of the ring-shaped portion is covered with the first A cleaning device for a lapping device, wherein the cleaning water from the cleaning nozzle and the entire area of the radial portion can be automatically cleaned by the cleaning water from the second cleaning nozzle. 前記第一洗浄ノズル及び前記第二洗浄ノズルは、前記洗浄水が扇形状に噴射可能なものであることを特徴とする請求項１に記載のラッピング装置の洗浄装置。 2. The cleaning device for a lapping apparatus according to claim 1, wherein said first cleaning nozzle and said second cleaning nozzle are capable of jetting said cleaning water in a fan shape.
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KR101596598B1 (en) 2014-11-10 2016-02-22 주식회사 엘지실트론 Wafer polishing apparatus

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TW202130461A (en) 2021-08-16
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