JP2010228058A - Washing device and washing method for abrasive cloth - Google Patents

Washing device and washing method for abrasive cloth Download PDF

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Publication number
JP2010228058A
JP2010228058A JP2009079630A JP2009079630A JP2010228058A JP 2010228058 A JP2010228058 A JP 2010228058A JP 2009079630 A JP2009079630 A JP 2009079630A JP 2009079630 A JP2009079630 A JP 2009079630A JP 2010228058 A JP2010228058 A JP 2010228058A
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Prior art keywords
polishing
polishing cloth
nozzle
cleaning
cloth
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Japanese (ja)
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Kentaro Sakata
謙太郎 坂田
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Fujikoshi Machinery Corp
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Fujikoshi Machinery Corp
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Priority to JP2009079630A priority Critical patent/JP2010228058A/en
Priority to EP10250452.9A priority patent/EP2236245A3/en
Priority to TW099107177A priority patent/TW201103697A/en
Priority to CN201010141121A priority patent/CN101844328A/en
Priority to KR1020100026642A priority patent/KR20100108254A/en
Priority to US12/732,904 priority patent/US20100248597A1/en
Publication of JP2010228058A publication Critical patent/JP2010228058A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a washing device for an abrasive cloth capable of well removing abrasive waste by increasing the receiving pressure of the abrasive cloth to increase an abrasive efficiency for a workpiece. <P>SOLUTION: In this washing device 34 for abrasive cloth, an abrasive cloth 16 is washed by supplying a high-pressure washing water from the nozzle 50 of a nozzle device 48 to the abrasive cloth 12 on a surface plate 12 in an abrasive device 10 in which a workpiece 20 is pressed against the surface plate 12 on which the abrasive cloth 16 is stamped, and the surface plate 12 is moved relative to the workpiece 20 while supplying slurry onto the abrasive cloth 16 for abrasion. The nozzle 50 is a straight nozzle for jetting a straight washing water at right angle to the abrasive cloth 16. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、研磨布の洗浄装置および洗浄方法に関する。   The present invention relates to a polishing cloth cleaning apparatus and a cleaning method.

半導体ウェーハ等のワークの研磨は、研磨布が貼付された定盤の該研磨布にワークを押接し、研磨布上にスラリー（研磨液）を供給しつつワークに対して定盤を相対移動させて行う。
ところで、研磨を続けると、研磨屑、スラリー、反応生成物等が次第に研磨布中に堆積し、研磨効率が低下したり、ワークを傷つけたりする悪影響が発生するので、適宜間隔をおいて、研磨布に高圧の洗浄水を噴出して洗浄するようにしている。
従来この洗浄装置としては、特許文献１に記載されているように、ノズルより高圧（５０ｋｇ／ｃｍ２程度）の洗浄水を研磨布に向けて斜めに噴出し、堆積物を研磨布中から浮き上がらせ、流出させるようにする装置が知られている。またノズルの周りを、高圧水が飛散しないようにブラシ手段で囲んでいる。 For polishing a workpiece such as a semiconductor wafer, the workpiece is pressed against the polishing cloth of the surface plate to which the polishing cloth is attached, and the surface plate is moved relative to the work while supplying slurry (polishing liquid) onto the polishing cloth. Do it.
By the way, if polishing is continued, polishing scraps, slurries, reaction products, etc. will gradually accumulate in the polishing cloth, resulting in an adverse effect of reducing polishing efficiency or damaging the workpiece. The cloth is washed by jetting high-pressure washing water.
Conventionally, as described in Patent Document 1, as this cleaning apparatus, cleaning water having a high pressure (about 50 kg / cm 2 ) is jetted obliquely toward a polishing cloth from a nozzle, and deposits are lifted from the polishing cloth. Devices are known that allow the flow and discharge. The nozzle is surrounded by brush means so that high-pressure water does not scatter.

特開平７−９３４０JP-A-7-9340

ところで、従来の上記洗浄装置では、研磨布内部に蓄積した研磨屑等が十分には排出されず、所望の研磨効率が得られないという課題がある。
研磨屑等が十分に排出されない原因としては、ノズルから斜めに噴出される高圧水がラッパ状に拡散し、研磨布の単位面積当たりの受圧力が弱いためと考えられる。
特に昨今では、研磨布に発泡性のポリウレタンを主材料とする研磨布が用いられ、不織布等の研磨布に比して研磨屑等の洗浄水による排出、除去が困難となっているという事情もある。 By the way, in the conventional cleaning device, there is a problem that polishing scraps accumulated in the polishing cloth are not sufficiently discharged, and a desired polishing efficiency cannot be obtained.
The reason why polishing scraps and the like are not sufficiently discharged is considered to be that high-pressure water ejected obliquely from the nozzle diffuses in a trumpet shape and the pressure received per unit area of the polishing cloth is weak.
In particular, recently, a polishing cloth mainly composed of foamable polyurethane is used for the polishing cloth, and it is difficult to discharge and remove polishing waste and the like with cleaning water as compared with a polishing cloth such as a nonwoven fabric. is there.

本発明は、上記課題を解決すべくなされ、その目的とするところは、研磨布の受圧力を高め、研磨屑等を良好に除去することができ、ひいてはワークの研磨効率を高めることができる研磨布の洗浄装置および洗浄方法を提供することにある。   The present invention is made to solve the above-mentioned problems, and the object of the present invention is to increase the pressure applied to the polishing cloth, to remove polishing debris and the like, and to improve the polishing efficiency of the workpiece. An object of the present invention is to provide a cloth cleaning apparatus and a cleaning method.

上記の目的を達成するため、本発明は次の構成を備える。
すなわち、本発明に係る研磨布の洗浄装置は、研磨布が貼付された定盤の該研磨布にワークを押接し、研磨布上にスラリーを供給しつつワークに対して定盤を相対移動させてワークを研磨する研磨装置における、前記定盤の研磨布にノズル装置のノズルから高圧の洗浄水を供給して研磨布を洗浄する研磨布の洗浄装置において、前記ノズルが、研磨布に対して、ストレートな洗浄水を直角に噴出するストレートノズルであることを特徴とする。 In order to achieve the above object, the present invention comprises the following arrangement.
That is, the cleaning device for a polishing cloth according to the present invention presses the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and moves the surface plate relative to the work while supplying slurry onto the polishing cloth. In a polishing apparatus for polishing a workpiece, in the polishing cloth cleaning apparatus for cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth of the surface plate, the nozzle is disposed on the polishing cloth. A straight nozzle that ejects straight wash water at right angles.

前記ストレートノズルを複数個有することを特徴とする。
また、前記ノズル装置を前記定盤上で移動させる移動装置を具備することを特徴とする。 A plurality of straight nozzles are provided.
The nozzle device may further include a moving device that moves the nozzle device on the surface plate.

また本発明に係る研磨布の洗浄方法は、研磨布が貼付された定盤の該研磨布にワークを押接し、研磨布上にスラリーを供給しつつワークに対して定盤を相対移動させてワークを研磨する研磨装置における、前記定盤の研磨布にノズル装置のノズルから高圧の洗浄水を供給して研磨布を洗浄する研磨布の洗浄方法において、前記ノズルにストレートノズルを用い、該ストレートノズルからストレートな高圧の洗浄水を研磨布に対して直角に噴出して研磨布を洗浄することを特徴とする。   The polishing cloth cleaning method according to the present invention includes pressing a workpiece against the polishing cloth of a surface plate to which the polishing cloth is adhered, and moving the surface plate relative to the work while supplying slurry onto the polishing cloth. In a polishing apparatus for polishing a workpiece, in a polishing cloth cleaning method for cleaning a polishing cloth by supplying high-pressure cleaning water from a nozzle of a nozzle device to the polishing cloth of the surface plate, the straight nozzle is used as the nozzle, and the straight The polishing cloth is cleaned by ejecting straight high-pressure cleaning water from the nozzle at right angles to the polishing cloth.

研磨布の洗浄水からの受圧力を、ワーク研磨時のワークへの研磨荷重と同等、もしくは該研磨荷重よりも大きくして研磨布の洗浄を行うことを特徴とする。
研磨布の洗浄水からの受圧力を１５０〜３５０ｇｆ／ｃｍ２とすることを特徴とする。
発泡ポリウレタンを主材料とする研磨布の洗浄を行うことを特徴とする。
また、前記ノズル装置を前記定盤上で移動させつつ洗浄水をストレートノズルから噴出して洗浄を行うことを特徴とする。 The polishing cloth is cleaned by setting the pressure received from the cleaning water of the polishing cloth to be equal to or larger than the polishing load applied to the workpiece during polishing of the workpiece.
The pressure received from the washing water of the polishing cloth is 150 to 350 gf / cm 2 .
It is characterized by cleaning an abrasive cloth mainly composed of foamed polyurethane.
Further, the cleaning is performed by ejecting cleaning water from the straight nozzle while moving the nozzle device on the surface plate.

本発明によれば、ストレートノズルを用いることによって、研磨布の受圧力を大きくでき、研磨布中に堆積している研磨屑等を好適に洗浄、除去できる。これによりワーク研磨面における傷発生率は低くすることができ、研磨精度を向上できる。また、研磨効率（研磨時間）も向上でき、さらには、研磨布の寿命も長くすることが可能となった。   According to the present invention, by using the straight nozzle, it is possible to increase the receiving pressure of the polishing cloth, and it is possible to suitably clean and remove polishing debris accumulated in the polishing cloth. As a result, the rate of occurrence of scratches on the workpiece polishing surface can be lowered, and the polishing accuracy can be improved. In addition, the polishing efficiency (polishing time) can be improved, and the life of the polishing cloth can be extended.

研磨装置の説明図である。It is explanatory drawing of a grinding | polishing apparatus. 研磨ヘッドの他の例を示す説明図である。It is explanatory drawing which shows the other example of a grinding | polishing head. 洗浄装置の説明図である。It is explanatory drawing of a washing | cleaning apparatus. ノズル装置の説明図である。It is explanatory drawing of a nozzle apparatus.

以下、本発明を、ウェーハの研磨装置に適用した場合の好適な実施の形態について、添付図面に基づいて詳細に説明する。
図１は研磨装置１０の概略を示す説明図である。
１２は定盤であり、公知の駆動機構（図示せず）により回転軸１４を中心に水平面内で回転する。定盤１２の上面には、例えば発泡ポリウレタンを主材とする研磨布１６が貼付されている。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment when the invention is applied to a wafer polishing apparatus will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory view showing an outline of the polishing apparatus 10.
Reference numeral 12 denotes a surface plate, which is rotated in a horizontal plane around the rotation shaft 14 by a known drive mechanism (not shown). On the upper surface of the surface plate 12, a polishing cloth 16 mainly made of foamed polyurethane is affixed.

１８は研磨ヘッドであり、その下面側に研磨すべきワーク（半導体ウェーハ等）２０が保持される。研磨ヘッド１８は回転軸２２を中心に回転される。また研磨ヘッド１８は、シリンダ等の上下動機構（図示せず）により上下動可能となっている。
２４はスラリー供給ノズルであり、スラリー（研磨液）を研磨布１６上に供給するものである。 Reference numeral 18 denotes a polishing head, and a work (semiconductor wafer or the like) 20 to be polished is held on the lower surface side thereof. The polishing head 18 is rotated about the rotation shaft 22. The polishing head 18 can be moved up and down by a vertical movement mechanism (not shown) such as a cylinder.
A slurry supply nozzle 24 supplies slurry (polishing liquid) onto the polishing pad 16.

ワーク２０は、水の表面張力により、あるいは吸引力等により研磨ヘッド１８の下面側に保持され、次いで研磨ヘッド１８が下降され、水平面内で回転している定盤１２の研磨布１６上に所定の押圧力（例えば１５０ｇｆ／ｃｍ２）で押圧され、また研磨ヘッド１８が回転軸２２を中心に回転されることによって、ワーク２０の下面側が研磨される。研磨中、スラリー供給ノズル２４から研磨布１６上にスラリーが供給される。 The workpiece 20 is held on the lower surface side of the polishing head 18 by the surface tension of water or by a suction force, and then the polishing head 18 is lowered and placed on the polishing cloth 16 of the surface plate 12 rotating in a horizontal plane. The lower surface side of the workpiece 20 is polished by being pressed with a pressing force of 150 gf / cm 2 (for example, 150 gf / cm 2 ), and the polishing head 18 is rotated about the rotation shaft 22. During polishing, slurry is supplied from the slurry supply nozzle 24 onto the polishing cloth 16.

なお、研磨ヘッド１８には種々の公知の構造のものがあり、研磨ヘッドの種類としては特に限定されない。例えば、図２に示すように、定盤１２の中央部に配置したセンターローラ２６と、定盤１２の外側位置と定盤１２の外周部上の位置との間に亙って移動可能に設けられた支持ローラ２８との間で、研磨ヘッド１８を回転自在に支持する構造のものでもよい。支持ローラ２８は、軸３０を中心に回動する回動アーム３２に支持されている。   The polishing head 18 has various known structures, and the type of the polishing head is not particularly limited. For example, as shown in FIG. 2, the center roller 26 disposed at the center of the surface plate 12 is provided so as to be movable between the outer position of the surface plate 12 and the position on the outer periphery of the surface plate 12. A structure in which the polishing head 18 is rotatably supported between the support roller 28 and the support roller 28 may be used. The support roller 28 is supported by a rotating arm 32 that rotates about a shaft 30.

次に、図３は、研磨布１６の洗浄装置３４の一例を示す説明図である。
洗浄装置３４は研磨装置１０の定盤１２の側方に位置して設けられている。
３６は昇降台であり、シリンダ装置３８等によって昇降可能に設けられている。昇降台３６上には、定盤１２の方向に向かって進退動する移動体４０が設けられている。移動体４０は適宜な進退動機構（移動装置）によって進退動される。進退動機構は特に限定されるものではないが、例えば、昇降台３６に設けたボールネジ４２に連携されて進退動される。ボールネジ４２は駆動モータ４４によって回転される。あるいは進退動機構はシリンダ装置であってもよい。 Next, FIG. 3 is an explanatory view showing an example of the cleaning device 34 for the polishing pad 16.
The cleaning device 34 is provided on the side of the surface plate 12 of the polishing device 10.
Reference numeral 36 denotes an elevating table, which can be moved up and down by a cylinder device 38 or the like. A moving body 40 that moves forward and backward in the direction of the surface plate 12 is provided on the lifting platform 36. The moving body 40 is moved forward and backward by an appropriate forward / backward moving mechanism (moving device). The advance / retreat mechanism is not particularly limited. For example, the advance / retreat mechanism is advanced / retreated in cooperation with a ball screw 42 provided on the lifting platform 36. The ball screw 42 is rotated by a drive motor 44. Alternatively, the advance / retreat mechanism may be a cylinder device.

移動体４０にはパイプ状のアーム４６が取り付けられ、アーム４６の先端にはノズル装置４８が取り付けられている。移動体４０が進退動することによって、ノズル装置４８は、定盤１２上をラジアル方向に進退動するようになっている。
ノズル装置４８には、図４に示すように、ストレートノズル５０が取り付けられている。ストレートノズル５０は、ステー５２により、ノズル装置４８のケーシング５４に垂直に固定され、高圧の洗浄水を、噴水を広げることなくほぼストレートに、かつ研磨布１６に対して直角に噴出するようになっている。 A pipe-like arm 46 is attached to the moving body 40, and a nozzle device 48 is attached to the tip of the arm 46. As the moving body 40 moves back and forth, the nozzle device 48 moves back and forth on the surface plate 12 in the radial direction.
As shown in FIG. 4, a straight nozzle 50 is attached to the nozzle device 48. The straight nozzle 50 is fixed vertically to the casing 54 of the nozzle device 48 by the stay 52, and the high-pressure washing water is ejected substantially straight and at right angles to the polishing cloth 16 without spreading the fountain. ing.

高圧の洗浄水は、フレキシブル配管５６を介して、移動体４０およびアーム４６内に配設した配管５８を通じてストレートノズル５０に供給される。ケーシング５４の下面側には、ストレートノズル５０から研磨布１６に噴出される高圧の洗浄水が周囲に飛散しないように、ストレートノズル５０のノズル口周囲を囲んでブラシ６０が配設されている。   The high-pressure cleaning water is supplied to the straight nozzle 50 through the flexible pipe 56 and the pipe 58 provided in the moving body 40 and the arm 46. A brush 60 is disposed on the lower surface side of the casing 54 so as to surround the periphery of the nozzle opening of the straight nozzle 50 so that high-pressure washing water ejected from the straight nozzle 50 to the polishing pad 16 does not scatter.

なお、ノズルの移動装置は上記のようにノズルを直進動させるのでなく、図２に示すように、先端にノズル装置４８を取り付けたアーム４６を軸４７を中心に往復回動させるように構成してもよい。
また、ノズル装置４８に取り付けるストレートノズル５０は、アーム４６に沿って複数個設けてもよい（図示せず）。
また、ブラシ６０は必ずしも設けなくともよく、あるいはブラシに代わる他の飛散防止手段であってもよい。 The nozzle moving device does not move the nozzle straight as described above, but as shown in FIG. 2, the arm 46 having the nozzle device 48 attached to the tip is reciprocally rotated around the shaft 47. May be.
A plurality of straight nozzles 50 attached to the nozzle device 48 may be provided along the arm 46 (not shown).
Further, the brush 60 does not necessarily have to be provided, or may be other scattering prevention means instead of the brush.

研磨布１６の洗浄は次のようにして行われる。
ワーク２０の研磨中は、移動体４０が後退され、ノズル装置４８がワーク２０の研磨の邪魔にならない位置まで退避している。
ワーク２０の研磨が終了し、研磨布１６の洗浄が必要な際には、移動体４０が定盤１２上に向けて移動され、ストレートノズル５０から高圧の洗浄水を研磨布１６に向けて噴出しつつ、ノズル装置４８が研磨布１６上をラジアル方向に定盤１２の半径分に亙って往復動され、また定盤１２も軸線を中心として回転される。これにより研磨布１６の洗浄が行われる。 The polishing cloth 16 is cleaned as follows.
During the polishing of the workpiece 20, the moving body 40 is retracted, and the nozzle device 48 is retracted to a position that does not interfere with the polishing of the workpiece 20.
When the polishing of the workpiece 20 is completed and the polishing cloth 16 needs to be cleaned, the moving body 40 is moved toward the surface plate 12 and high-pressure cleaning water is ejected from the straight nozzle 50 toward the polishing cloth 16. However, the nozzle device 48 is reciprocated on the polishing pad 16 in the radial direction over the radius of the surface plate 12, and the surface plate 12 is also rotated about the axis. As a result, the polishing cloth 16 is cleaned.

実施例では、ストレートノズル５０からの洗浄水は、研磨布１６に向けて直角に噴出され、また噴射角度は零度、すなわち、噴水が広がることなくほぼストレートに、研磨布１６に対して噴出された。ストレートノズル５０からの洗浄水の噴出圧力は１３ＭＰａ、水量は１ｌ／minとした。ノズルの噴出口の口径はほぼ４ｍｍ、洗浄水からの研磨布１６の受圧力は２７０ｇｆ／ｃｍ２であった。因みに、ワーク２０研磨時のワークから研磨布１６への荷重は約１５０ｇｆ／ｃｍ２であった。
なお、ストレートノズル５０と研磨布１６との距離は約１００ｍｍとした。しかし、ストレートノズル５０から、ほぼストレートな洗浄水が噴出されるので、洗浄水からの研磨布１６の受圧力は、ストレートノズル５０と研磨布１６との距離にはそれほど影響されず、±２０ｍｍ程度の距離の変動程度では一定と考えてよい。したがって、ストレートノズル５０の研磨布１６からの距離の管理はそれほど厳密に行わなくともよい。 In the embodiment, the cleaning water from the straight nozzle 50 was jetted to the polishing pad 16 at a right angle, and the jetting angle was zero degrees, that is, jetted to the polishing pad 16 almost straight without spreading the fountain. . The ejection pressure of the washing water from the straight nozzle 50 was 13 MPa, and the amount of water was 1 l / min. The diameter of the nozzle outlet was approximately 4 mm, and the pressure received by the polishing pad 16 from the cleaning water was 270 gf / cm 2 . Incidentally, the load from the workpiece | work at the time of grinding | polishing the workpiece | work 20 to the polishing pad 16 was about 150 gf / cm < 2 >.
The distance between the straight nozzle 50 and the polishing pad 16 was about 100 mm. However, since almost straight cleaning water is ejected from the straight nozzle 50, the pressure received by the polishing cloth 16 from the cleaning water is not significantly affected by the distance between the straight nozzle 50 and the polishing cloth 16, and is about ± 20 mm. It can be considered that the distance fluctuation is constant. Therefore, the management of the distance of the straight nozzle 50 from the polishing pad 16 may not be performed so strictly.

比較例として、通常のノズルから直角に研磨布に向けて洗浄水を噴出角２５度で噴出して研磨布の洗浄を行った。なお、この場合も、ノズルからの洗浄水の噴出圧力は１３ＭＰａ、水量は１ｌ／minとした。ノズルの噴出口の口径はほぼ４ｍｍ、洗浄水からの研磨布の受圧力は約８０ｇｆ／ｃｍ２となった。また、ワーク研磨時のワークから研磨布への荷重は約１５０ｇｆ／ｃｍ２で実施例の場合と同じである。また、ノズルと研磨布との距離も約１００ｍｍと、実施例と同じとした。 As a comparative example, the polishing cloth was cleaned by ejecting cleaning water at a jet angle of 25 degrees from a normal nozzle toward the polishing cloth at a right angle. Also in this case, the ejection pressure of the washing water from the nozzle was 13 MPa, and the amount of water was 1 l / min. The diameter of the nozzle outlet was about 4 mm, and the pressure received by the polishing cloth from the cleaning water was about 80 gf / cm 2 . In addition, the load from the workpiece to the polishing cloth during workpiece polishing is about 150 gf / cm 2 , which is the same as in the embodiment. The distance between the nozzle and the polishing pad was about 100 mm, which was the same as in the example.

実施例のように、ストレートノズル５０を用いることによって、研磨布１６の受圧力を大きくできる。これにより、発泡ポリウレタンを主材とする研磨布１６中に堆積している研磨屑等を好適に洗浄、除去できた。このことは、ワークの研磨面に発生する傷が比較例と比して格段に少なくなったことから確認できる。ワーク研磨面における傷発生率は比較例に比べて１／２程となり、研磨精度が向上した。また、研磨効率（研磨時間）も１０％ほど向上した。さらに、ドレス投入頻度も、３バッチに１回が１０バッチに１回に延長でき、研磨布の寿命も長くなった。   By using the straight nozzle 50 as in the embodiment, the pressure received by the polishing pad 16 can be increased. As a result, polishing debris and the like accumulated in the polishing cloth 16 mainly composed of polyurethane foam could be washed and removed suitably. This can be confirmed from the fact that the scratches generated on the polished surface of the workpiece are remarkably reduced as compared with the comparative example. The scratch occurrence rate on the workpiece polishing surface was about ½ compared to the comparative example, and the polishing accuracy was improved. Also, the polishing efficiency (polishing time) was improved by about 10%. Furthermore, the dressing frequency can be extended from once in 3 batches to once in 10 batches, and the life of the polishing cloth has been extended.

また、ストレートノズル５０を用いることによって、ノズル５０と研磨布１６間の距離が変わっても受圧力はほとんど変わらないため、研磨布１６に対するノズル５０の距離の微調整が不要となる。
なお、ストレートノズル５０を用いることにより、洗浄水の当たる面積が小さくなり、研磨布１６全体の洗浄に時間がかかるが、未洗浄面積が２０％以下ならばワークの品質に問題ないことがわかった。 Further, by using the straight nozzle 50, the pressure receiving pressure hardly changes even if the distance between the nozzle 50 and the polishing pad 16 is changed, and fine adjustment of the distance of the nozzle 50 with respect to the polishing pad 16 becomes unnecessary.
In addition, by using the straight nozzle 50, the area to which the cleaning water hits is reduced, and it takes time to clean the entire polishing cloth 16, but it has been found that there is no problem in the quality of the workpiece if the unwashed area is 20% or less. .

なおまた、洗浄水からの研磨布の受圧力は、洗浄力の観点からは大きければ大きいほどよいといえるが、あまり大きいと研磨布が破断するという問題がある。ワークの研磨時におけるワークからの研磨布の押圧力は１５０〜３００ｇｆ／ｃｍ２である。洗浄水からの受圧力は、ワークからの押圧力と同等かこれよりも若干大きめの、１５０〜３５０ｇｆ／ｃｍ２を目安とするとよい。 In addition, it can be said that the larger the receiving pressure of the polishing cloth from the cleaning water is, the better from the viewpoint of the cleaning power, but there is a problem that the polishing cloth is broken when it is too large. The pressing force of the polishing cloth from the workpiece during polishing of the workpiece is 150 to 300 gf / cm 2 . The pressure received from the cleaning water is preferably 150 to 350 gf / cm 2 , which is equal to or slightly larger than the pressing force from the workpiece.

以上、本発明の好適な実施の形態について説明したが、本発明は上記実施の形態に限定されるものではない。例えば、上記のような片面研磨装置でなく、上下定盤にワークを挟み込んで研磨する両面研磨装置における上下定盤の研磨布の洗浄にも適応できるものである。   The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, the present invention can be applied not only to the above-described single-side polishing apparatus but also to the cleaning of the polishing cloth on the upper and lower surface plates in a double-side polishing apparatus that sandwiches and polishes a workpiece between the upper and lower surface plates.

１０ 研磨装置
１２ 定盤
１４ 回転軸
１６ 研磨布
１８ 研磨ヘッド
２０ ワーク
２２ 回転軸
２４ スラリー供給ノズル
３４ 洗浄装置
３６ 昇降台
３８ シリンダ装置
４０ 移動体
４２ ボールネジ
４４ 駆動モータ
４６ アーム
４８ ノズル装置
５０ ストレートノズル
５４ ケーシング
５６ フレキシブル配管
５８ 配管 DESCRIPTION OF SYMBOLS 10 Polishing apparatus 12 Surface plate 14 Rotating shaft 16 Polishing cloth 18 Polishing head 20 Work 22 Rotating shaft 24 Slurry supply nozzle 34 Cleaning device 36 Lifting table 38 Cylinder device 40 Moving body 42 Ball screw 44 Drive motor 46 Arm 48 Nozzle device 50 Straight nozzle 54 Casing 56 Flexible piping 58 Piping

Claims (8)

研磨布が貼付された定盤の該研磨布にワークを押接し、研磨布上にスラリーを供給しつつワークに対して定盤を相対移動させてワークを研磨する研磨装置における、前記定盤の研磨布にノズル装置のノズルから高圧の洗浄水を供給して研磨布を洗浄する研磨布の洗浄装置において、
前記ノズルが、研磨布に対して、ストレートな洗浄水を直角に噴出するストレートノズルであることを特徴とする研磨布の洗浄装置。 In the polishing apparatus for polishing a work by pressing the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and polishing the work by moving the surface plate relative to the work while supplying the slurry onto the polishing cloth. In the polishing cloth cleaning apparatus for cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth,
An apparatus for cleaning a polishing cloth, wherein the nozzle is a straight nozzle that ejects straight cleaning water at right angles to the polishing cloth. 前記ストレートノズルを複数個有することを特徴とする請求項１記載の研磨布の洗浄装置。   The polishing cloth cleaning apparatus according to claim 1, comprising a plurality of the straight nozzles. 前記ノズル装置を前記定盤上で移動させる移動装置を具備することを特徴とする請求項１または２記載の研磨布の洗浄装置。   3. The polishing cloth cleaning apparatus according to claim 1, further comprising a moving device that moves the nozzle device on the surface plate. 研磨布が貼付された定盤の該研磨布にワークを押接し、研磨布上にスラリーを供給しつつワークに対して定盤を相対移動させてワークを研磨する研磨装置における、前記定盤の研磨布にノズル装置のノズルから高圧の洗浄水を供給して研磨布を洗浄する研磨布の洗浄方法において、
前記ノズルにストレートノズルを用い、該ストレートノズルからストレートな高圧の洗浄水を研磨布に対して直角に噴出して研磨布を洗浄することを特徴とする研磨布の洗浄方法。 In the polishing apparatus for polishing a work by pressing the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and polishing the work by moving the surface plate relative to the work while supplying the slurry onto the polishing cloth. In the polishing cloth cleaning method of cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth,
A method for cleaning a polishing cloth, wherein a straight nozzle is used as the nozzle, and straight high-pressure cleaning water is jetted from the straight nozzle at right angles to the polishing cloth to clean the polishing cloth. 研磨布の洗浄水からの受圧力を、ワーク研磨時のワークへの研磨荷重と同等、もしくは該研磨荷重よりも大きくして研磨布の洗浄を行うことを特徴とする請求項４記載の研磨布の洗浄方法。   5. The polishing cloth according to claim 4, wherein the polishing cloth is cleaned with a pressure received from the cleaning water of the polishing cloth equal to or greater than a polishing load applied to the workpiece during polishing of the workpiece. Cleaning method. 研磨布の洗浄水からの受圧力を１５０〜３５０ｇｆ／ｃｍ２とすることを特徴とする請求項４または５記載の研磨布の洗浄方法。 Claim 4 or 5 method for cleaning polishing cloth according to, characterized in that the pressure force from the wash water of the polishing pad and 150~350gf / cm 2. 発泡ポリウレタンを主材料とする研磨布の洗浄を行うことを特徴とする請求項６記載の研磨布の洗浄方法。   The method for cleaning an abrasive cloth according to claim 6, wherein the polishing cloth mainly comprising foamed polyurethane is cleaned. 前記ノズル装置を前記定盤上で移動させつつ洗浄水をストレートノズルから噴出して洗浄を行うことを特徴とする請求項４〜７いずれか１項記載の研磨布の洗浄方法。   The method for cleaning an abrasive cloth according to any one of claims 4 to 7, wherein cleaning is performed by ejecting cleaning water from a straight nozzle while moving the nozzle device on the surface plate.
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