JP2010228058A - Washing device and washing method for abrasive cloth - Google Patents

Washing device and washing method for abrasive cloth Download PDF

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Publication number
JP2010228058A
JP2010228058A JP2009079630A JP2009079630A JP2010228058A JP 2010228058 A JP2010228058 A JP 2010228058A JP 2009079630 A JP2009079630 A JP 2009079630A JP 2009079630 A JP2009079630 A JP 2009079630A JP 2010228058 A JP2010228058 A JP 2010228058A
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JP
Japan
Prior art keywords
polishing
polishing cloth
nozzle
cleaning
cloth
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009079630A
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Japanese (ja)
Inventor
Kentaro Sakata
謙太郎 坂田
Original Assignee
Fujikoshi Mach Corp
不二越機械工業株式会社
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Application filed by Fujikoshi Mach Corp, 不二越機械工業株式会社 filed Critical Fujikoshi Mach Corp
Priority to JP2009079630A priority Critical patent/JP2010228058A/en
Publication of JP2010228058A publication Critical patent/JP2010228058A/en
Application status is Pending legal-status Critical

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

<P>PROBLEM TO BE SOLVED: To provide a washing device for an abrasive cloth capable of well removing abrasive waste by increasing the receiving pressure of the abrasive cloth to increase an abrasive efficiency for a workpiece. <P>SOLUTION: In this washing device 34 for abrasive cloth, an abrasive cloth 16 is washed by supplying a high-pressure washing water from the nozzle 50 of a nozzle device 48 to the abrasive cloth 12 on a surface plate 12 in an abrasive device 10 in which a workpiece 20 is pressed against the surface plate 12 on which the abrasive cloth 16 is stamped, and the surface plate 12 is moved relative to the workpiece 20 while supplying slurry onto the abrasive cloth 16 for abrasion. The nozzle 50 is a straight nozzle for jetting a straight washing water at right angle to the abrasive cloth 16. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a polishing cloth cleaning apparatus and a cleaning method.

For polishing a workpiece such as a semiconductor wafer, the workpiece is pressed against the polishing cloth of the surface plate to which the polishing cloth is attached, and the surface plate is moved relative to the work while supplying slurry (polishing liquid) onto the polishing cloth. Do it.
By the way, if polishing is continued, polishing scraps, slurries, reaction products, etc. will gradually accumulate in the polishing cloth, resulting in an adverse effect of reducing polishing efficiency or damaging the workpiece. The cloth is washed by jetting high-pressure washing water.
Conventionally, as described in Patent Document 1, as this cleaning apparatus, cleaning water having a high pressure (about 50 kg / cm 2 ) is jetted obliquely toward a polishing cloth from a nozzle, and deposits are lifted from the polishing cloth. Devices are known that allow the flow and discharge. The nozzle is surrounded by brush means so that high-pressure water does not scatter.

JP-A-7-9340

By the way, in the conventional cleaning device, there is a problem that polishing scraps accumulated in the polishing cloth are not sufficiently discharged, and a desired polishing efficiency cannot be obtained.
The reason why polishing scraps and the like are not sufficiently discharged is considered to be that high-pressure water ejected obliquely from the nozzle diffuses in a trumpet shape and the pressure received per unit area of the polishing cloth is weak.
In particular, recently, a polishing cloth mainly composed of foamable polyurethane is used for the polishing cloth, and it is difficult to discharge and remove polishing waste and the like with cleaning water as compared with a polishing cloth such as a nonwoven fabric. is there.

  The present invention is made to solve the above-mentioned problems, and the object of the present invention is to increase the pressure applied to the polishing cloth, to remove polishing debris and the like, and to improve the polishing efficiency of the workpiece. An object of the present invention is to provide a cloth cleaning apparatus and a cleaning method.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, the cleaning device for a polishing cloth according to the present invention presses the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and moves the surface plate relative to the work while supplying slurry onto the polishing cloth. In a polishing apparatus for polishing a workpiece, in the polishing cloth cleaning apparatus for cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth of the surface plate, the nozzle is disposed on the polishing cloth. A straight nozzle that ejects straight wash water at right angles.

A plurality of straight nozzles are provided.
The nozzle device may further include a moving device that moves the nozzle device on the surface plate.

  The polishing cloth cleaning method according to the present invention includes pressing a workpiece against the polishing cloth of a surface plate to which the polishing cloth is adhered, and moving the surface plate relative to the work while supplying slurry onto the polishing cloth. In a polishing apparatus for polishing a workpiece, in a polishing cloth cleaning method for cleaning a polishing cloth by supplying high-pressure cleaning water from a nozzle of a nozzle device to the polishing cloth of the surface plate, the straight nozzle is used as the nozzle, and the straight The polishing cloth is cleaned by ejecting straight high-pressure cleaning water from the nozzle at right angles to the polishing cloth.

The polishing cloth is cleaned by setting the pressure received from the cleaning water of the polishing cloth to be equal to or larger than the polishing load applied to the workpiece during polishing of the workpiece.
The pressure received from the washing water of the polishing cloth is 150 to 350 gf / cm 2 .
It is characterized by cleaning an abrasive cloth mainly composed of foamed polyurethane.
Further, the cleaning is performed by ejecting cleaning water from the straight nozzle while moving the nozzle device on the surface plate.

  According to the present invention, by using the straight nozzle, it is possible to increase the receiving pressure of the polishing cloth, and it is possible to suitably clean and remove polishing debris accumulated in the polishing cloth. As a result, the rate of occurrence of scratches on the workpiece polishing surface can be lowered, and the polishing accuracy can be improved. In addition, the polishing efficiency (polishing time) can be improved, and the life of the polishing cloth can be extended.

It is explanatory drawing of a grinding | polishing apparatus. It is explanatory drawing which shows the other example of a grinding | polishing head. It is explanatory drawing of a washing | cleaning apparatus. It is explanatory drawing of a nozzle apparatus.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment when the invention is applied to a wafer polishing apparatus will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory view showing an outline of the polishing apparatus 10.
Reference numeral 12 denotes a surface plate, which is rotated in a horizontal plane around the rotation shaft 14 by a known drive mechanism (not shown). On the upper surface of the surface plate 12, a polishing cloth 16 mainly made of foamed polyurethane is affixed.

Reference numeral 18 denotes a polishing head, and a work (semiconductor wafer or the like) 20 to be polished is held on the lower surface side thereof. The polishing head 18 is rotated about the rotation shaft 22. The polishing head 18 can be moved up and down by a vertical movement mechanism (not shown) such as a cylinder.
A slurry supply nozzle 24 supplies slurry (polishing liquid) onto the polishing pad 16.

The workpiece 20 is held on the lower surface side of the polishing head 18 by the surface tension of water or by a suction force, and then the polishing head 18 is lowered and placed on the polishing cloth 16 of the surface plate 12 rotating in a horizontal plane. The lower surface side of the workpiece 20 is polished by being pressed with a pressing force of 150 gf / cm 2 (for example, 150 gf / cm 2 ), and the polishing head 18 is rotated about the rotation shaft 22. During polishing, slurry is supplied from the slurry supply nozzle 24 onto the polishing cloth 16.

  The polishing head 18 has various known structures, and the type of the polishing head is not particularly limited. For example, as shown in FIG. 2, the center roller 26 disposed at the center of the surface plate 12 is provided so as to be movable between the outer position of the surface plate 12 and the position on the outer periphery of the surface plate 12. A structure in which the polishing head 18 is rotatably supported between the support roller 28 and the support roller 28 may be used. The support roller 28 is supported by a rotating arm 32 that rotates about a shaft 30.

Next, FIG. 3 is an explanatory view showing an example of the cleaning device 34 for the polishing pad 16.
The cleaning device 34 is provided on the side of the surface plate 12 of the polishing device 10.
Reference numeral 36 denotes an elevating table, which can be moved up and down by a cylinder device 38 or the like. A moving body 40 that moves forward and backward in the direction of the surface plate 12 is provided on the lifting platform 36. The moving body 40 is moved forward and backward by an appropriate forward / backward moving mechanism (moving device). The advance / retreat mechanism is not particularly limited. For example, the advance / retreat mechanism is advanced / retreated in cooperation with a ball screw 42 provided on the lifting platform 36. The ball screw 42 is rotated by a drive motor 44. Alternatively, the advance / retreat mechanism may be a cylinder device.

A pipe-like arm 46 is attached to the moving body 40, and a nozzle device 48 is attached to the tip of the arm 46. As the moving body 40 moves back and forth, the nozzle device 48 moves back and forth on the surface plate 12 in the radial direction.
As shown in FIG. 4, a straight nozzle 50 is attached to the nozzle device 48. The straight nozzle 50 is fixed vertically to the casing 54 of the nozzle device 48 by the stay 52, and the high-pressure washing water is ejected substantially straight and at right angles to the polishing cloth 16 without spreading the fountain. ing.

  The high-pressure cleaning water is supplied to the straight nozzle 50 through the flexible pipe 56 and the pipe 58 provided in the moving body 40 and the arm 46. A brush 60 is disposed on the lower surface side of the casing 54 so as to surround the periphery of the nozzle opening of the straight nozzle 50 so that high-pressure washing water ejected from the straight nozzle 50 to the polishing pad 16 does not scatter.

The nozzle moving device does not move the nozzle straight as described above, but as shown in FIG. 2, the arm 46 having the nozzle device 48 attached to the tip is reciprocally rotated around the shaft 47. May be.
A plurality of straight nozzles 50 attached to the nozzle device 48 may be provided along the arm 46 (not shown).
Further, the brush 60 does not necessarily have to be provided, or may be other scattering prevention means instead of the brush.

The polishing cloth 16 is cleaned as follows.
During the polishing of the workpiece 20, the moving body 40 is retracted, and the nozzle device 48 is retracted to a position that does not interfere with the polishing of the workpiece 20.
When the polishing of the workpiece 20 is completed and the polishing cloth 16 needs to be cleaned, the moving body 40 is moved toward the surface plate 12 and high-pressure cleaning water is ejected from the straight nozzle 50 toward the polishing cloth 16. However, the nozzle device 48 is reciprocated on the polishing pad 16 in the radial direction over the radius of the surface plate 12, and the surface plate 12 is also rotated about the axis. As a result, the polishing cloth 16 is cleaned.

In the embodiment, the cleaning water from the straight nozzle 50 was jetted to the polishing pad 16 at a right angle, and the jetting angle was zero degrees, that is, jetted to the polishing pad 16 almost straight without spreading the fountain. . The ejection pressure of the washing water from the straight nozzle 50 was 13 MPa, and the amount of water was 1 l / min. The diameter of the nozzle outlet was approximately 4 mm, and the pressure received by the polishing pad 16 from the cleaning water was 270 gf / cm 2 . Incidentally, the load from the workpiece | work at the time of grinding | polishing the workpiece | work 20 to the polishing pad 16 was about 150 gf / cm < 2 >.
The distance between the straight nozzle 50 and the polishing pad 16 was about 100 mm. However, since almost straight cleaning water is ejected from the straight nozzle 50, the pressure received by the polishing cloth 16 from the cleaning water is not significantly affected by the distance between the straight nozzle 50 and the polishing cloth 16, and is about ± 20 mm. It can be considered that the distance fluctuation is constant. Therefore, the management of the distance of the straight nozzle 50 from the polishing pad 16 may not be performed so strictly.

As a comparative example, the polishing cloth was cleaned by ejecting cleaning water at a jet angle of 25 degrees from a normal nozzle toward the polishing cloth at a right angle. Also in this case, the ejection pressure of the washing water from the nozzle was 13 MPa, and the amount of water was 1 l / min. The diameter of the nozzle outlet was about 4 mm, and the pressure received by the polishing cloth from the cleaning water was about 80 gf / cm 2 . In addition, the load from the workpiece to the polishing cloth during workpiece polishing is about 150 gf / cm 2 , which is the same as in the embodiment. The distance between the nozzle and the polishing pad was about 100 mm, which was the same as in the example.

  By using the straight nozzle 50 as in the embodiment, the pressure received by the polishing pad 16 can be increased. As a result, polishing debris and the like accumulated in the polishing cloth 16 mainly composed of polyurethane foam could be washed and removed suitably. This can be confirmed from the fact that the scratches generated on the polished surface of the workpiece are remarkably reduced as compared with the comparative example. The scratch occurrence rate on the workpiece polishing surface was about ½ compared to the comparative example, and the polishing accuracy was improved. Also, the polishing efficiency (polishing time) was improved by about 10%. Furthermore, the dressing frequency can be extended from once in 3 batches to once in 10 batches, and the life of the polishing cloth has been extended.

Further, by using the straight nozzle 50, the pressure receiving pressure hardly changes even if the distance between the nozzle 50 and the polishing pad 16 is changed, and fine adjustment of the distance of the nozzle 50 with respect to the polishing pad 16 becomes unnecessary.
In addition, by using the straight nozzle 50, the area to which the cleaning water hits is reduced, and it takes time to clean the entire polishing cloth 16, but it has been found that there is no problem in the quality of the workpiece if the unwashed area is 20% or less. .

In addition, it can be said that the larger the receiving pressure of the polishing cloth from the cleaning water is, the better from the viewpoint of the cleaning power, but there is a problem that the polishing cloth is broken when it is too large. The pressing force of the polishing cloth from the workpiece during polishing of the workpiece is 150 to 300 gf / cm 2 . The pressure received from the cleaning water is preferably 150 to 350 gf / cm 2 , which is equal to or slightly larger than the pressing force from the workpiece.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, the present invention can be applied not only to the above-described single-side polishing apparatus but also to the cleaning of the polishing cloth on the upper and lower surface plates in a double-side polishing apparatus that sandwiches and polishes a workpiece between the upper and lower surface plates.

DESCRIPTION OF SYMBOLS 10 Polishing apparatus 12 Surface plate 14 Rotating shaft 16 Polishing cloth 18 Polishing head 20 Work 22 Rotating shaft 24 Slurry supply nozzle 34 Cleaning device 36 Lifting table 38 Cylinder device 40 Moving body 42 Ball screw 44 Drive motor 46 Arm 48 Nozzle device 50 Straight nozzle 54 Casing 56 Flexible piping 58 Piping

Claims (8)

  1. In the polishing apparatus for polishing a work by pressing the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and polishing the work by moving the surface plate relative to the work while supplying the slurry onto the polishing cloth. In the polishing cloth cleaning apparatus for cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth,
    An apparatus for cleaning a polishing cloth, wherein the nozzle is a straight nozzle that ejects straight cleaning water at right angles to the polishing cloth.
  2.   The polishing cloth cleaning apparatus according to claim 1, comprising a plurality of the straight nozzles.
  3.   3. The polishing cloth cleaning apparatus according to claim 1, further comprising a moving device that moves the nozzle device on the surface plate.
  4. In the polishing apparatus for polishing a work by pressing the work against the polishing cloth of the surface plate to which the polishing cloth is attached, and polishing the work by moving the surface plate relative to the work while supplying the slurry onto the polishing cloth. In the polishing cloth cleaning method of cleaning the polishing cloth by supplying high-pressure cleaning water from the nozzle of the nozzle device to the polishing cloth,
    A method for cleaning a polishing cloth, wherein a straight nozzle is used as the nozzle, and straight high-pressure cleaning water is jetted from the straight nozzle at right angles to the polishing cloth to clean the polishing cloth.
  5.   5. The polishing cloth according to claim 4, wherein the polishing cloth is cleaned with a pressure received from the cleaning water of the polishing cloth equal to or greater than a polishing load applied to the workpiece during polishing of the workpiece. Cleaning method.
  6. Claim 4 or 5 method for cleaning polishing cloth according to, characterized in that the pressure force from the wash water of the polishing pad and 150~350gf / cm 2.
  7.   The method for cleaning an abrasive cloth according to claim 6, wherein the polishing cloth mainly comprising foamed polyurethane is cleaned.
  8.   The method for cleaning an abrasive cloth according to any one of claims 4 to 7, wherein cleaning is performed by ejecting cleaning water from a straight nozzle while moving the nozzle device on the surface plate.
JP2009079630A 2009-03-27 2009-03-27 Washing device and washing method for abrasive cloth Pending JP2010228058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009079630A JP2010228058A (en) 2009-03-27 2009-03-27 Washing device and washing method for abrasive cloth

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2009079630A JP2010228058A (en) 2009-03-27 2009-03-27 Washing device and washing method for abrasive cloth
EP10250452.9A EP2236245A3 (en) 2009-03-27 2010-03-11 Equipment and method for cleaning polishing cloth
TW99107177A TW201103697A (en) 2009-03-27 2010-03-12 Equipment and method for cleaning polishing cloth
KR1020100026642A KR20100108254A (en) 2009-03-27 2010-03-25 Equipment and method for cleaning polishing cloth
CN201010141121A CN101844328A (en) 2009-03-27 2010-03-25 The apparatus and method that are used for cleaning polishing cloth
US12/732,904 US20100248597A1 (en) 2009-03-27 2010-03-26 Equipment and method for cleaning polishing cloth

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JP2010228058A true JP2010228058A (en) 2010-10-14

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JP2009079630A Pending JP2010228058A (en) 2009-03-27 2009-03-27 Washing device and washing method for abrasive cloth

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US (1) US20100248597A1 (en)
EP (1) EP2236245A3 (en)
JP (1) JP2010228058A (en)
KR (1) KR20100108254A (en)
CN (1) CN101844328A (en)
TW (1) TW201103697A (en)

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CN102615589A (en) * 2012-04-12 2012-08-01 浙江金瑞泓科技股份有限公司 Polishing system and polishing method using polishing disk guide disc
JP2016000444A (en) * 2014-06-12 2016-01-07 信越半導体株式会社 Method of washing polishing pad, and method of polishing wafer
DE102017200023A1 (en) 2016-01-05 2017-07-06 Fujikoshi Machinery Corporation Method for polishing a workpiece and method for dressing a polishing pad

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US9754622B2 (en) 2014-03-07 2017-09-05 Venmill Industries Incorporated Methods for optimizing friction between a pad and a disc in an optical disc restoration device
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase

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Publication number Publication date
KR20100108254A (en) 2010-10-06
EP2236245A3 (en) 2013-09-11
EP2236245A2 (en) 2010-10-06
US20100248597A1 (en) 2010-09-30
TW201103697A (en) 2011-02-01
CN101844328A (en) 2010-09-29

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