EP2236245A3 - Equipment and method for cleaning polishing cloth - Google Patents

Equipment and method for cleaning polishing cloth Download PDF

Info

Publication number
EP2236245A3
EP2236245A3 EP10250452.9A EP10250452A EP2236245A3 EP 2236245 A3 EP2236245 A3 EP 2236245A3 EP 10250452 A EP10250452 A EP 10250452A EP 2236245 A3 EP2236245 A3 EP 2236245A3
Authority
EP
European Patent Office
Prior art keywords
polishing cloth
polishing
equipment
washing water
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10250452.9A
Other languages
German (de)
French (fr)
Other versions
EP2236245A2 (en
Inventor
Kentaro Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of EP2236245A2 publication Critical patent/EP2236245A2/en
Publication of EP2236245A3 publication Critical patent/EP2236245A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

The equipment (34) for cleaning polishing cloth (16) is capable of increasing pressure of washing water received by the polishing cloth (16), securely removing deposits from the polishing cloth (16) and improving polishing efficiency. The equipment (34) is used in a polishing apparatus (10), in which a work piece (20) is pressed onto the polishing cloth (16) adhered on a polishing plate (12) and the work piece (20) is relatively moved with respect to the polishing plate (12) with supplying slurry to the polishing cloth (16) so as to polish the work piece (20). The equipment (34) comprises a nozzle unit (48) having a nozzle (50) capable of spraying high-pressure washing water toward the polishing cloth (16). The nozzle (50) is a straight nozzle capable of linearly spraying the washing water and perpendicularly spraying the washing water with respect to the polishing cloth (16).
EP10250452.9A 2009-03-27 2010-03-11 Equipment and method for cleaning polishing cloth Withdrawn EP2236245A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009079630A JP2010228058A (en) 2009-03-27 2009-03-27 Washing device and washing method for abrasive cloth

Publications (2)

Publication Number Publication Date
EP2236245A2 EP2236245A2 (en) 2010-10-06
EP2236245A3 true EP2236245A3 (en) 2013-09-11

Family

ID=42245563

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10250452.9A Withdrawn EP2236245A3 (en) 2009-03-27 2010-03-11 Equipment and method for cleaning polishing cloth

Country Status (6)

Country Link
US (1) US20100248597A1 (en)
EP (1) EP2236245A3 (en)
JP (1) JP2010228058A (en)
KR (1) KR20100108254A (en)
CN (1) CN101844328A (en)
TW (1) TW201103697A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615589B (en) * 2012-04-12 2014-09-24 浙江金瑞泓科技股份有限公司 Polishing system and polishing method using polishing disk guide disc
WO2013173559A1 (en) * 2012-05-18 2013-11-21 Venmill Industries Device, methods and systems for restoring optical discs
US9754622B2 (en) 2014-03-07 2017-09-05 Venmill Industries Incorporated Methods for optimizing friction between a pad and a disc in an optical disc restoration device
US9620166B2 (en) 2012-05-18 2017-04-11 Venmill Industries Methods for restoring optical discs
JP6146375B2 (en) * 2014-06-12 2017-06-14 信越半導体株式会社 Polishing pad cleaning method and wafer polishing method
JP2017121672A (en) 2016-01-05 2017-07-13 不二越機械工業株式会社 Method for polishing workpiece and method for dressing polishing pad
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
JP6304349B1 (en) * 2016-11-15 2018-04-04 株式会社Sumco Wafer edge polishing apparatus and method
JP7218731B2 (en) * 2020-01-09 2023-02-07 信越半導体株式会社 Cleaning equipment for lapping equipment
CN111482901B (en) * 2020-04-30 2022-08-26 青岛华芯晶电科技有限公司 Cleaning device of chemical mechanical polishing equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079340A (en) * 1993-06-30 1995-01-13 Mitsubishi Materials Corp Dressing device of polishing cloth
EP1103345A2 (en) * 1999-11-25 2001-05-30 Fujikoshi Machinery Corporation Cloth cleaning device and polishing machine
JP2001237204A (en) * 2000-02-22 2001-08-31 Hitachi Ltd Method of manufacturing device
JP2003127063A (en) * 2001-10-22 2003-05-08 Sony Corp Cmp device and polishing method by cmp device
US20040132388A1 (en) * 2002-12-31 2004-07-08 Matthias Kuhn System for chemical mechanical polishing comprising an improved pad conditioner

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
US5674115A (en) * 1994-07-06 1997-10-07 Sony Corporation Apparatus for grinding a master disc
JPH09309063A (en) * 1996-05-24 1997-12-02 Nippon Steel Corp Method and device for washing polishing surface plate
US5868608A (en) * 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
JP3722591B2 (en) * 1997-05-30 2005-11-30 株式会社日立製作所 Polishing equipment
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5945346A (en) * 1997-11-03 1999-08-31 Motorola, Inc. Chemical mechanical planarization system and method therefor
US6338669B1 (en) * 1997-12-26 2002-01-15 Ebara Corporation Polishing device
JP3615931B2 (en) * 1998-03-26 2005-02-02 株式会社荏原製作所 Polishing apparatus and conditioning method in the polishing apparatus
JP3031345B2 (en) * 1998-08-18 2000-04-10 日本電気株式会社 Polishing apparatus and polishing method
US6319098B1 (en) * 1998-11-13 2001-11-20 Applied Materials, Inc. Method of post CMP defect stability improvement
US6220936B1 (en) * 1998-12-07 2001-04-24 Chartered Semiconductor Manufacturing Ltd. In-site roller dresser
US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
US6669538B2 (en) * 2000-02-24 2003-12-30 Applied Materials Inc Pad cleaning for a CMP system
JP2001237208A (en) * 2000-02-24 2001-08-31 Ebara Corp Cleaning method of cleaning surface of polishing device and cleaning device
JP2002144218A (en) * 2000-11-09 2002-05-21 Ebara Corp Polishing device
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US20020187731A1 (en) * 2001-06-07 2002-12-12 Taiwan Semiconductor Manufacturing Co., Ltd. In-situ pad and wafer cleaning during chemical mechanical polishing
TWI261317B (en) * 2001-08-02 2006-09-01 Applied Materials Inc Multiport polishing fluid delivery system
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US20050260936A1 (en) * 2004-05-21 2005-11-24 Rodriguez Jose O Dynamic atomizer on conditioner assemblies using high velocity water
CN101386149B (en) * 2007-09-12 2011-01-26 K.C.科技股份有限公司 Cleaning device for chemical mechanical polishing device
US7674156B2 (en) * 2007-10-08 2010-03-09 K.C. Tech Co., Ltd Cleaning device for chemical mechanical polishing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079340A (en) * 1993-06-30 1995-01-13 Mitsubishi Materials Corp Dressing device of polishing cloth
US5421768A (en) * 1993-06-30 1995-06-06 Mitsubishi Materials Corporation Abrasive cloth dresser
EP1103345A2 (en) * 1999-11-25 2001-05-30 Fujikoshi Machinery Corporation Cloth cleaning device and polishing machine
JP2001237204A (en) * 2000-02-22 2001-08-31 Hitachi Ltd Method of manufacturing device
JP2003127063A (en) * 2001-10-22 2003-05-08 Sony Corp Cmp device and polishing method by cmp device
US20040132388A1 (en) * 2002-12-31 2004-07-08 Matthias Kuhn System for chemical mechanical polishing comprising an improved pad conditioner

Also Published As

Publication number Publication date
TW201103697A (en) 2011-02-01
US20100248597A1 (en) 2010-09-30
EP2236245A2 (en) 2010-10-06
CN101844328A (en) 2010-09-29
KR20100108254A (en) 2010-10-06
JP2010228058A (en) 2010-10-14

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