TWI261317B - Multiport polishing fluid delivery system - Google Patents

Multiport polishing fluid delivery system Download PDF

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Publication number
TWI261317B
TWI261317B TW091117512A TW91117512A TWI261317B TW I261317 B TWI261317 B TW I261317B TW 091117512 A TW091117512 A TW 091117512A TW 91117512 A TW91117512 A TW 91117512A TW I261317 B TWI261317 B TW I261317B
Authority
TW
Taiwan
Prior art keywords
abrasive
fluid
grinding
arm
flow
Prior art date
Application number
TW091117512A
Other languages
Chinese (zh)
Inventor
Bradley S Withers
Brenda R Meng
Lidia Vereen
Peter N Skarpelos
Brian J Downum
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/921,588 external-priority patent/US20030027505A1/en
Priority claimed from US10/131,638 external-priority patent/US7086933B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TWI261317B publication Critical patent/TWI261317B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A method and system for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, the system includes an arm having a delivery portion disposed at least partially over the polishing surface. A first nozzle and a second nozzle are disposed on the delivery portion of the arm. The first nozzle is adapted to flow the polishing fluid at a first rate while the second nozzle is adapted to flow the polishing fluid at a second rate that is different than the first rate. A method for delivering a polishing fluid to a chemical mechanical polishing surface generally includes the steps of supplying the polishing fluid to a semiconductor polishing surface in one location at a first rate and providing the polishing fluid to the polishing surface at a second location at a second rate which is different than the first rate.

Description

1261317 A7 B7 五、發明説明() 發明領域: 本發明的實施例大體上係關於一種在一化學機械研 磨系統中研磨一基材的方法及設備。 發明背景: 在半導體晶圓處理中,使用化學機械平坦化,或 CMP ’已應因為具有可提高在一半導體工件,或基材(如 一晶圓)’上的元件密度而獲得睛睞。化學機械平坦化系 統大體上係利用一研磨頭來固持一基材並將基材壓頂一 研磨物質的研磨表面同時提供它們之間的相對運動。某 些平坦化系統利用一可相,對於一固定不動之支撐著該研 磨物質的平台移動之研磨頭。其它的系統則利用不同的 架構來提供研磨物質與該基材之間的相對運動,例如, 提供一可旋轉的平台。一研磨流體典型地於研磨期間被 提供於該基材與該研磨物質之間用以提供化學作用來寶 助從基材上去除掉物質。某些研磨流體亦可包含研磨物。 在發展強健的研磨系統及處理中的諸多挑戰之一為 才疋供均勻的物質移除於整個基材的被研磨表面上。例如, 當基材移動通過該研磨表面時,基材邊緣通常會被以較 高的速率加以研磨。這部分是因為基材在移動通過該研 磨表面時之摩擦力造成之基材的’’(nose drive),,的傾向的關 係。 影響基材表面的研磨均勻性的另一個問題為某些物 質會比其周圍的其它物質被更快地移除。例如,銅在研 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 1261317 A7 __ _B7五、發明説明() 經濟部智慧財產局員工消費合作社印製 移的 被銅 快在 更, }g) n 物Shi 化di /|\ 氧陷 為凹 地為 型充 。 典被 顯 常 質通明 物k的 銅除U 咳 4 、? 移寺 包快微 比較五 會之過 間銅超 期。度 磨除寬 成完 造是 所明 磨證 研被 為道 因之 輕決 減解 來種 用一 被何 案任 方有 決沒, 解但 的, 多 勻 許均 有不 然的 雖材 基 之 更的 及化 寸坦 尺平 線度 的高 小 、 更的 向句 朝均 業於 產對 於此 由 因 此展 因發 。 的 的度 意密 滿件 人元 令的 全高 勻 均 磨 研 之 中 統 系 磨 。 研 量械 考機 6V學 白 要化 t 在 最善 是改。 然於求 仍對需 求,著 需此在 的因存 面 仍 表 度1261317 A7 B7 V. INSTRUCTIONS () Field of the Invention: Embodiments of the present invention generally relate to a method and apparatus for grinding a substrate in a chemical mechanical polishing system. BACKGROUND OF THE INVENTION: In semiconductor wafer processing, the use of chemical mechanical planarization, or CMP' should have been favored because of the increased density of components on a semiconductor workpiece, or substrate (e.g., a wafer). The chemical mechanical planarization system generally utilizes a polishing head to hold a substrate and press the substrate against an abrasive surface of the abrasive material while providing relative motion therebetween. Some flattening systems utilize a phase-to-phase grinding head that moves against a stationary platform that supports the abrasive material. Other systems utilize different architectures to provide relative motion between the abrasive material and the substrate, for example, to provide a rotatable platform. A grinding fluid is typically provided between the substrate and the abrasive material during milling to provide chemistry to aid in the removal of material from the substrate. Some abrasive fluids may also contain abrasives. One of the many challenges in developing robust grinding systems and processes is the removal of uniform materials from the entire surface of the substrate being ground. For example, as the substrate moves through the abrasive surface, the edge of the substrate is typically ground at a higher rate. This is due in part to the tendency of the substrate to have a 'nose drive' of the substrate as it moves through the abrasive surface. Another problem that affects the uniformity of the surface of the substrate is that certain materials are removed more quickly than other materials around them. For example, copper on the 5th page of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm). (Please read the note on the back and fill out this page.) Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives 1261317 A7 __ _B7 V. Description of invention () The Intellectual Property Office of the Ministry of Economic Affairs, the staff of the Consumer Cooperatives, printed the copper of the copper, and it is more, }g) n Shi Shi di /|\ The oxygen trap is a concave fill. The code is often plagued by the material k of the copper in addition to U cough 4,? Move the temple package to compare the five times. The degree of grinding and smashing is the result of the slashing of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations. The more high-small, more succinct and flat-to-shoulders are all produced in this way. The degree of intimacy is full of human elements, and the whole high uniformity is ground in the grinding. Research and measurement equipment 6V learning white to be t in the best is to change. However, the demand is still in demand, and the cause of the need is still

述 概I 及 的一 目 明| 發I 送, 輸中 體例 流施 磨實 研 \ 一 在 將。 來供 用提 么gt —TV 種# 一 統 , 系 中的 樣面 態表 一 磨 的研 明械 發機 本學 在化 1 至 一 置 少設 至被 的嘴 面喷 表二 磨第 研一 該及 在嘴 置 噴 設 一 被第 1 1 有。 具分 其部 臂送 I 一il 括的 包上 統之 系分 該部 磨該 研讓 該可 讓成 可 .、tr 成設 計被 設嘴 被喷 嘴二 噴第 一 該 第而 該, Ο 4^^ 上流 分率 部流 送 一 運第 的一 臂以 該體 在流 第 之一 率, 流中一 _ 第態 於一 同另 不的 一 明 以發 體本 流在 磨 研 動 流 率 流 來 用 種 體 流 磨 研 - 送 , 研 中體 例導 施半 實 \ \ 至 在體 。 流 供磨 提研 被應 法供 方率 的,流 面 \ 表第 磨一 研以 械 了 機括 學包 化法 一 方 至該 以 該 於 同 不 的 面 表 磨 研 及該 ’ 至 處體 置流 位磨 一 研 的該 面供 表提 磨率 頁 6 第 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 第 第 率 流 等 置 位 流二。 第¾ #πν 步 1261317 A7 B7 五、發明説明() 發明詳細說明: 第一圖顯示一用來研磨一基材1 1 2之研磨系統1 ο 0 的一實施例,其具有一研磨流體傳送系統1 〇2其控制著 研磨流體1 14在整個研磨物質1 08上的分布。可被使用 在本發明的各態樣中之研磨系統的例子被揭示於1 999年 二月 4曰由 Birang等人提申之美國專利申請案第 〇9/1 44,456號及1 998年四月14日授予Tolies等人之美國 專利第5,73 8,574號中,這兩個案子的内容藉由此參照而 被併於本文中。雖然研磨流體傳送系統1 02係參照著舉 例性的研磨系統1 0 0來加以說明,但本發明亦可應用於 用來處理基材的其它研磨系統中。 大致上,該舉例性的研磨系統100包括一平台104 及一研磨頭106。平台104被設置在該研磨頭1〇6底下, 該研磨頭於研磨期間固持該基材1丨2。該平台丨04被設 置在該系統1〇〇的一基庫122上且耦合至一馬達(未示 出)。該馬達可旋轉該平台1 04用以提供至少一部分的相 對研磨運動於設置在該平台1 〇4的該研磨物質丨〇8與基 材1 1 2之間。應被瞭解的是,介於基材丨丨2與研磨物質 1 〇 8之間的相對運動可用其它的方式來提供。例如,介 該研磨物質1 〇 8與基材1 1 2之間的相對研磨運動的至少 4分可藉由將該研磨頭1 〇 6移動於一不動的平台1 〇 4 之上’直線地將該研磨物質移動於該基材11 2底下,同 時移動研磨物質1 08及研磨頭1 〇6兩者,等來達成。 研磨物質108是由該平台1〇4來支撐使得一研磨表 第7頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公管) (請先閲讀背面之注意事項再填寫本頁) -—裝· -訂· 經濟部智慧財產局員工消費合作社印製 Α261317A brief description of I and I | send I send, transfer the system of the flow of grinding and grinding research \ one will. To provide for the use of gt - TV species # unified system, the state of the surface of the table, a grinding of the research and development of the machine, the school in the 1 to a set of less to the face of the nozzle, the second mill, the first research and The nozzle is sprayed one by one. The part of the bag that is sent to the arm of the I-il is divided into the part of the system. The part of the machine is made to be able to be made into a design, and the design of the tr is set by the nozzle to be sprayed with the first nozzle, Ο 4^ ^ The upper flow fractional unit sends the first arm of the first movement to the first rate of the flow, and the flow is in the same state as the first one, and the original flow is used to grind the flow rate. Body flow grinding - send, research in the system to introduce semi-real \ \ to the body. The flow supply grinding research is applied to the party's rate of supply, and the flow surface \ table is the first to be studied, and the machine is covered by the method of the method, and the surface is ground and the body is placed. This surface of the flow grinding mill is used for the table grinding rate. Page 6 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). (Please read the back note and fill out this page.) Set the stream two. 3⁄4 #πν步1261317 A7 B7 V. INSTRUCTION DESCRIPTION () DETAILED DESCRIPTION OF THE INVENTION: The first figure shows an embodiment of a grinding system 1 ο 0 for grinding a substrate 1 1 2 having a grinding fluid delivery system 1 〇 2 which controls the distribution of the grinding fluid 1 14 over the entire abrasive mass 108. Examples of abrading systems that can be used in various aspects of the present invention are disclosed in U.S. Patent Application Serial No. 9/1,44,456, filed on Apr. U.S. Patent No. 5,73,574, the entire disclosure of which is incorporated herein by reference. Although the abrasive fluid transfer system 102 is described with reference to an exemplary polishing system 100, the present invention is also applicable to other polishing systems for processing substrates. In general, the exemplary polishing system 100 includes a platform 104 and a polishing head 106. The platform 104 is disposed under the polishing head 1〇6, which holds the substrate 1丨2 during grinding. The platform 丨04 is disposed on a base library 122 of the system 1 且 and coupled to a motor (not shown). The motor can rotate the platform 104 to provide at least a portion of the relative grinding motion between the abrasive mass 8 disposed on the platform 1 〇 4 and the substrate 1 12. It will be appreciated that the relative motion between substrate 丨丨2 and abrasive material 1 〇 8 can be provided in other ways. For example, at least 4 points of the relative grinding motion between the abrasive material 1 〇 8 and the substrate 1 12 can be moved linearly by moving the polishing head 1 〇 6 over a stationary platform 1 〇 4 The abrasive is moved under the substrate 11 2 while moving both the abrasive material 108 and the polishing head 1 〇 6 to achieve this. The abrasive substance 108 is supported by the platform 1〇4 so that the paper size of the 7th page of a grinding table is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 male pipe) (please read the back note first and then fill in the page) - Installed - Booked · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed Α 261317

、發明説明( (請先閲讀背面之注意事項再填寫本頁) :116面朝上對至該研磨頭106。典型地,該研磨物質1〇8 :由黏劑’真空,機械式夾持或類此者於研磨期間被固 疋於β平纟1G4上。非必要地,且特別是在研磨物質⑽ 被:乍成-網狀的應用中,研磨物質1G8係可釋放地固定 '邊平口 104上,典型地係藉由在該研磨物質1 〇8與該 平《 104又間的真空來達成,如之前所述之美國專利申 請案第09/144,456號中所述者。 研磨物質1〇8可以是一傳統的或是一固定式研磨物 質。傳統的研磨物質1〇8、大體上是由一發泡的聚合物所 構成且被設置於該平台104上成為一墊子。在一實施例 中,該傳統的研磨物質1〇8為一發泡的聚氨酯。此傳統 的研磨物質108可從設在美國德拉瓦州的R〇dd公司購得。 經濟部智慧財產局員工消費合作社印製 研磨顆粒固定式的研磨物質108大體上是由許多懸 浮在一樹脂結合劑中的研磨顆粒所構成,該樹脂結合劑 被設置在一背板上分散開的元件中。研磨顆粒固定式的 研磨物質1 08可以墊子或網的形式被使用。當研磨顆粒 被包含於研磨物質本身中時,使用該研磨顆粒固定式的 研磨物質的研磨系統就不會再用含有研磨物的研磨流體 了。研磨顆粒固定式的研磨物質的例子被揭示於1 997年 十二月2日授予Rutherford等人的美國專利第5,692,950號 及1995年九月26日授予Haas等人的美國專利第5,45 3,312 號中,這兩個專利的内容藉由此參照而被併於本文中。 此研磨顆粒固定式的研磨物質1 0 8可從設在美國明尼蘇 達州聖保羅市的3 Μ公司購得。 第煩 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1261317 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 研磨頭1 0 6是被支撐在該平台1 〇 4上。研磨頭1 〇 6 將基材112固持於一面向該研磨表面116的凹部.120中。 研磨頭1 06典型地朝向平台1 04移動並在處理期間將基 材壓頂該研磨物質1 0 8。研磨頭1 0 6可以是固定不動的 或可旋轉的’孤立的、沿軌道移動的、直線移動的或各 式運動的組合同時將基材1 2壓頂該研磨物質1 〇 8。研磨 頭10 6的一個例子為揭示於2 0 01年二月6日授予Zuniga 等人的美國專利第6,1 83,354B1號中,該案内容藉由此 參照而被併於本文中。研磨頭1 06的令一個例子為由設 在美國加州SantaClara市的Applied Materials公司所製造的ΉΤΑΝ HEADTM晶圓載具。 研磨流體傳送系統1 02大體上包含一傳送臂1 30, 多個設在該臂1 3 0上的噴嘴1 3 2及至少一研磨流體源 1 3 4。該傳送臂1 3 0被建構來控制研磨流體1 1 4在該研磨 物質108的研磨表面116上的分布。在一實施例中,該 傳送臂1 3 0成可計量在不同流率下沿著該臂1 3 0的研磨 流體1 1 4。因為研磨流體1 1 4是從一單一的來源被供應, 所以研磨流體 1 1 4是以一均勻的濃度被施用但數量則是 沿著該研磨物質108的寬度(或直徑)而不同。 傳送臂130大體上是耦合至該基座122接近該平台 1 04。該傳送臂1 3 0大體上具有至少一部分1 3 6是被懸吊 在該研磨物質1 08之上。該傳送臂1 3 0可被耦合至該系 統1 0 0的遺它部分上只要該部分1 3 6可被設置成能夠將 研磨流體1 1 4傳送至該研磨表面11 6即可。 第9頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 丨裝· 、可· 線:· 1261317 A7 B7 五、發明説明() 々等賣冑1 32沿著設置在該平纟1 04之上的該傳送 I 1 3 0的▲ #刀1 3 6被設置。在一實施例中,噴嘴} 3 2 I吕至V第賣鳴14〇及一第二喷嘴142。典型地, 第一喷嘴140被設置在該臂13〇上,相對於該研磨物質 1〇8的旋轉中心而言是在第二噴嘴M2徑向朝内的位置。 研磨流體114在整個研磨物質1〇8上的散布是藉由讓研 磨流體114以一不同於流經第二喷嘴142的流率從該第 一喷嘴140流過來加以控制的。 如第2圖中所示,第一噴嘴140是以一第一流率讓 研磨流體114流到研磨表面116的一第一部分2〇2處, 而第二噴嘴142是以一第二流率讓研磨流體114流到研 磨表面116的一第二部分2〇4處。以此方式,即可調整 橫跨研磨物質1 0 8的寬度之研磨流體丨丨4的分布。 回到第1圖,離開第一及第二噴嘴丨4 〇 ,丨4 2的流率 是彼此不同的。流率可以是相對於彼此是固定的或是可 控制的。在一實施例中,該流體傳送臂130包括一研磨 流體供應管路124其被分又至該第一及第二流體14〇, 142。一 T形套件126耦合至該供應管路124且具有一第 一輸送管路144及一輸送管路146分叉出來,它們分別 耦合至喷嘴140,142。 噴嘴1 3 2中的至少一者包含一流量控制機制1 5 〇。 該流量控制機制1 5〇可以是一能夠提供一固定的流率於 喷嘴140, 142之間的裝置,或該流量控制機制15〇可被 調整用以提供動態的流率控制。流量控制機制1 5 〇的例 第10頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) -丨裝· -訂· 經濟部智慧財產局員工消費合作社印製, invention description ((Please read the note on the back and then fill out this page): 116 face up to the polishing head 106. Typically, the abrasive material 1〇8: by the adhesive 'vacuum, mechanical clamping or This is fixed to the β 纟 1G4 during grinding. Optionally, and in particular in the application of the abrasive substance (10): 乍-network, the abrasive substance 1G8 releasably fixes the 'edge 104 The above is typically achieved by a vacuum between the abrasive material 1 〇 8 and the flat wafer 104, as described in the aforementioned U.S. Patent Application Serial No. 09/144,456. It may be a conventional or a stationary abrasive material. The conventional abrasive material 1 is generally composed of a foamed polymer and is disposed on the platform 104 as a mat. In an embodiment The conventional abrasive substance 1〇8 is a foamed polyurethane. This conventional abrasive substance 108 is commercially available from R〇dd Company, Delaware, USA. Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperative, Printing and Grinding The particulate fixed abrasive material 108 is generally suspended by many It is composed of abrasive particles in a resin binder which is disposed in a dispersing member on a backing plate. The abrasive particle-fixed abrasive material 108 can be used in the form of a mat or a net. When it is contained in the abrasive itself, the polishing system using the abrasive particle-fixed abrasive material will no longer use the abrasive fluid containing the abrasive. An example of the abrasive particle-fixed abrasive material is disclosed in Dec. U.S. Patent No. 5,692,950 issued to Rutherford et al., and U.S. Patent No. 5,45,312, issued to Haas et al. In this paper, the abrasive particle-fixed abrasive material is commercially available from the 3rd Company of St. Paul, Minnesota, USA. The first paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). 1261317 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 5, Invention Description () The grinding head 1 0 6 is supported on the platform 1 〇 4. The grinding head 1 〇 6 will be the substrate 112 Hold in a recess 120 that faces the abrasive surface 116. The abrasive head 106 moves typically toward the platform 104 and presses the substrate against the abrasive material during processing. The abrasive head 106 can be stationary. Or a rotatable 'isolated, orbiting, linearly moving, or various combinations of motions simultaneously pressing the substrate 1 2 against the abrasive material 1 〇 8. An example of the polishing head 106 is disclosed in 2010. U.S. Patent No. 6,1,83,354, issued to U.S. Pat. An example of a polishing head 106 is a HEADHEADTM wafer carrier manufactured by Applied Materials, Inc., Santa Clara, California. The abrasive fluid transfer system 102 generally includes a transfer arm 130, a plurality of nozzles 133 disposed on the arms 130, and at least one source of abrasive fluid 134. The transfer arm 130 is configured to control the distribution of the abrasive fluid 1 14 on the abrasive surface 116 of the abrasive material 108. In one embodiment, the transfer arm 130 is measurable with the abrasive fluid 1 1 4 along the arm 130 at different flow rates. Since the abrasive fluid 1 14 is supplied from a single source, the abrasive fluid 1 14 is applied at a uniform concentration but the amount varies along the width (or diameter) of the abrasive 108. The transfer arm 130 is generally coupled to the base 122 proximate the platform 104. The transfer arm 130 generally has at least a portion 136 that is suspended above the abrasive material 108. The transfer arm 130 can be coupled to the remainder of the system 100 as long as the portion 136 can be configured to deliver the abrasive fluid 1 1 4 to the abrasive surface 116. Page 9 This paper scale applies to China National Standard (CNS) A4 specification (210X 297 mm) (Please read the note on the back and fill out this page) 丨装·, 可·线:· 1261317 A7 B7 V. Description of invention () 胄 胄 胄 1 32 is set along the ▲ #刀1 3 6 of the transmission I 1 3 0 set above the 纟 104. In one embodiment, the nozzles are 3 2 I to V and 14 〇 and a second nozzle 142. Typically, the first nozzle 140 is disposed on the arm 13 , at a position radially inward of the second nozzle M2 with respect to the center of rotation of the abrasive substance 1 〇 8 . The dispersion of the polishing fluid 114 over the entire abrasive mass 1 is controlled by flowing the grinding fluid 114 from the first nozzle 140 at a different flow rate than flowing through the second nozzle 142. As shown in FIG. 2, the first nozzle 140 causes the polishing fluid 114 to flow to a first portion 2〇2 of the polishing surface 116 at a first flow rate, and the second nozzle 142 is ground at a second flow rate. Fluid 114 flows to a second portion 2〇4 of the abrasive surface 116. In this way, the distribution of the grinding fluid 丨丨4 across the width of the abrasive substance 108 can be adjusted. Returning to Fig. 1, leaving the first and second nozzles 丨4 〇, the flow rates of 丨4 2 are different from each other. The flow rates can be fixed or controllable relative to each other. In one embodiment, the fluid transfer arm 130 includes a grinding fluid supply line 124 that is divided into the first and second fluids 14, 142. A T-shaped kit 126 is coupled to the supply line 124 and has a first delivery line 144 and a delivery line 146 that are branched out and coupled to the nozzles 140, 142, respectively. At least one of the nozzles 132 has a flow control mechanism 15 〇. The flow control mechanism 15 can be a device capable of providing a fixed flow rate between the nozzles 140, 142, or the flow control mechanism 15 can be adjusted to provide dynamic flow rate control. Flow Control Mechanism 1 5 〇 Example Page 10 This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) (please read the note on the back and fill out this page) - 丨装· -订· Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing

、發明説明( 1261317 子包括固足的孔口’壓緊閥(pinchvalve),比例閥,限流器, 針閥’計量幫浦,質量流控制器及類此者。或者,該流 里控制機制1 5 0可由镇合每一噴嘴1 4 〇,1 4 2及T形套件 U6之流體輸送管路144 , 146之間的相對壓降差來提供。 該研磨流體源1 34典型地被設置在該系統丨〇〇的外 部。在一實施例中,該研磨流體源1 34大致上包括一容 斋1 5 2及一幫浦1 5 4。該繁浦丨5 4將研磨流體丨丨4從該 容器152中泵出穿過供應管路124到達噴嘴132。 裝在該如容器1 52中的研磨流體丨丨4典型地為具有 化學添加劑之去離子水,用以提供有助於將物質從被研 磨的基材1 1 2的表面上去除掉的化學作用。當研磨流體 114從一單一的來源(即,容器152)被供應至噴嘴132時, 從喷角1 3 2流出的流體1 1 4是均質的,即在化學反應物 或研磨顆粒的濃度上不會有所不同。非必要地,研磨流 體可包括研磨物用以幫助該基材的表面上之物質的機械 性移除。研磨流體可從數個商業來源獲得,如設在美國 依利諾州Aurom市的Cabot公司,德拉瓦州Newark市的R〇dei 公司,日本的日立化學公司,美國德拉瓦州Wilmingt〇市的 杜邦公司等。 在操作時,基材1 1 2被置於該研磨頭丨〇 6上且被送 至與旋轉平台1〇4上的研磨物質108相接觸。研磨頭1〇6 可將基材保持固定不動’或將基材旋轉或作其它的運動 用以加劇研磨物質108與基材1 12之間的相對運動。研 磨流體傳送系統102讓钎磨流體114流經供應管路124 第11頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁), invention description (1261317 sub-compounds include a fixed orifice 'pinchvalve', proportional valve, restrictor, needle valve 'metering pump, mass flow controller and the like. Or, the flow control mechanism 1 50 may be provided by a relative pressure drop difference between the fluid delivery lines 144, 146 of each of the nozzles 1 4 〇, 14 2 and the T-shaped kit U6. The abrasive fluid source 134 is typically disposed at The external portion of the system 。. In one embodiment, the source of abrasive fluid 134 generally includes a Rong Rong 1 5 2 and a pump 145. The pulverizing fluid 丨丨 4 will grind the fluid 丨丨 4 from The vessel 152 is pumped through the supply line 124 to the nozzle 132. The grinding fluid crucible 4 contained in the vessel 152 is typically deionized water with a chemical additive to provide assistance in The chemical action removed from the surface of the ground substrate 112. When the abrasive fluid 114 is supplied from a single source (i.e., container 152) to the nozzle 132, the fluid 1 1 flowing from the spray angle 132 4 is homogeneous, ie there will be no difference in the concentration of chemical reactants or abrasive particles. The abrasive fluid can include abrasives to aid in the mechanical removal of material on the surface of the substrate. The abrasive fluid can be obtained from several commercial sources, such as Cabot Corporation, Delaware, located in Aurom, Illinois, USA. R〇dei Company of Newark City, Japan, Hitachi Chemical Company of Japan, DuPont Company of Wilmington City, Delaware, etc. In operation, the substrate 1 12 is placed on the polishing head 丨〇6 and sent To contact with the abrasive material 108 on the rotating platform 1〇4. The polishing head 1〇6 can hold the substrate stationary or rotate the substrate or perform other movements to aggravate the abrasive substance 108 and the substrate 1 12 Relative movement between the grinding fluid delivery system 102 allows the brazing fluid 114 to flow through the supply line 124. Page 11 This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back) Fill in this page)

經濟部智慧財產局員工消費合作社印製 1261317 五、發明説明( A7 到達第一及第二研磨嘴嘴1 4 〇,1 4 2。 第2圖為該系統丨〇〇的平面圖其顯示到達研磨物質 1〇8的202及2 04部分的研磨流體114流。一第一研磨 流體流206以一第一流率流出第一喷嘴14〇到達該第一 部分202’同時一第二研磨流體流2〇2〇8以一第二流率 流出第二噴嘴142到達該第一部分204。第一研磨流體 流2 06不同於第二研磨流體流2〇8藉以在整個研磨物質 1 08的研磨表面1 1 6上提供一可控制的研磨流體1 1 4分 布。在一實施例中,第一研磨流體流2〇6的流率為第二 研磨流體流2 0 8流率的至少1丨5倍。該研磨物質丨〇 8的 研磨表面1 1 6上之該可控制的研磨流體分布可藉由控制 在研磨物質1 08上之相對的研磨流體流而允許在橫跨基 材1 1 2的寬度上之基材表面上的物質移除可被調整。參 照第2圖’被提供至研磨物質1 〇8的第一部分2〇2的研 磨流體1 1 4比提供至第二部分2 〇 4的研磨流體1 1 4多(或 反之亦可)。非必要地,額外的噴嘴可被用來提供不同數 量的研磨流體114至研磨物質108的不同部分上,其中 至少兩個研磨物質1 〇 8鈞部分上的研磨流體是以不同的 流率來提供的。 在一操作的模式中,被系統丨00所研磨的基材u 2 是用來自於第一噴嘴1 40及第二噴嘴丨42的研磨流體n 4 來處理。研磨流體1 14在第一流率下從第一喷嘴丨4〇施 用於研磨物質1 08上。研磨流體丨丨4同時在一第二流率 下從第二噴嘴1 4 2施用於研磨物質1 〇 8上。在一實施例 '第1頂 本紙張尺度適用中國國家標準(CNS)A4規格(21〇X297公釐) (請先閲讀背面之注意事項再填寫本頁)Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed 1261317 V. Invention description (A7 arrives at the first and second grinding nozzles 1 4 〇, 1 4 2. Figure 2 is a plan view of the system 其 showing the arrival of abrasive substances The grinding fluid 114 of the 202 and 2 04 portions of 1 〇 8 flows. A first grinding fluid stream 206 flows out of the first nozzle 14 at a first flow rate to the first portion 202' while a second grinding fluid stream 2 〇 2 〇 8 exits the second nozzle 142 at a second flow rate to the first portion 204. The first abrasive fluid stream 206 is different from the second abrasive fluid stream 2〇8 to provide over the abrasive surface 1 16 of the entire abrasive mass 108. A controllable abrasive fluid is distributed in a ratio of 14. 4 In one embodiment, the flow rate of the first abrasive fluid stream 2〇6 is at least 1丨5 times the flow rate of the second abrasive fluid stream 20. The abrasive material丨The controllable polishing fluid distribution on the abrasive surface 1 of the crucible 8 can be allowed to surface across the width of the substrate 112 by controlling the relative flow of the abrasive fluid over the abrasive material 108. Material removal on can be adjusted. Refer to Figure 2 to be provided to The grinding fluid 1 1 4 of the first portion 2 〇 2 of the abrasive material 1 〇 8 is more than the grinding fluid 1 1 4 supplied to the second portion 2 〇 4 (or vice versa). Optionally, additional nozzles may be used. A different amount of abrasive fluid 114 is provided to different portions of the abrasive mass 108, wherein the abrasive fluid on at least two of the abrasive materials 1 〇 8 钧 portion is provided at a different flow rate. In an operational mode, The substrate u 2 ground by the system 丨00 is treated with the grinding fluid n 4 from the first nozzle 1400 and the second nozzle 丨 42. The grinding fluid 144 is applied from the first nozzle 第一4 at the first flow rate. On the abrasive substance 108. The grinding fluid 丨丨4 is simultaneously applied to the abrasive substance 1 〇8 from the second nozzle 142 at a second flow rate. In an embodiment, the first top paper size is applicable to the Chinese country. Standard (CNS) A4 specification (21〇X297 mm) (Please read the notes on the back and fill out this page)

經濟部智慧財產局員工消費合作社印製 1261317 五 經濟部智慧財產局員工消費合作社印製 B7 發明說明() 中,第一流率約為第二流率的丨.2至2〇倍。使用研磨流 體傳送系統1 0 2之此處理所得到的研磨均勻度4 〇 2被示 於第4圖中。使用一傳統的研磨流體傳送系統(即,研磨 流體只從一單一的噴嘴被輸送至該研磨物質的系統)所獲 得的一傳統的基材研磨的均勻度404被提供以作為比較 之用。如第4圖所示的,相較於傳統的結果4〇4,均勻 度4 02明顯有所改善。 在具有動態(可控制的)控制機制15〇,如比例閥,限 流器,針閥’計量幫浦’質量流控制器及類此者,的結 構中,研磨流體114在研磨物質1〇8上的分布可在處理 期間被控制。例如,來自於第一喷嘴140的研磨流體可 在一第一流率下於該處理、的一部分期間中被施用於該研 磨物質1 0 8上’且在該處理的另一部分期間中被調整至 一第二流率。從第一噴嘴14 2輸送的研磨流體流率同樣 地亦可在研磨處理期間加以改變。應被注意的是,來自 於噴嘴1 40 ’ 1 42的研磨流體的調整是無限的(infmite)。在 第一喷嘴1 40與第二噴嘴1 42之間設置額外的嘴嘴可讓 均勻度獲得進一步的控制且可藉由提供較多或較少的研 磨流體1 1 4至一設置在第一噴嘴1 4 0與第二噴嘴1 4 2之 間的額外喷嘴來加以局部地改變(見下文中參照第3圖之 說明)。 非必要地,對於來自喷嘴1 4 0,1 4 2的流率具有動態 控制的研磨流體傳送系統可包括一度量裝置丨丨8用以提 供處理回饋以進行研磨流體分布之即時調整。典型地, 第13頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) A7 B7 1261317 五、發明説明() 該度量裝置1 1 8偵測一研磨計量(metric),如研磨時間,在 該基材上之被研磨的表面薄膜的厚度,表面拓樸或其它 表面特性。 在一實施例中,研磨物質1〇8可包括一窗口 16〇其 允與該度量裝置1 1 8觀察頂抵著該研磨物質丨〇 8被設置 之基材112的表面。該度‘量裝置118大體上包括一感應 器162其發射出一光束164其可穿過該窗口 16〇到達基 材1 12。該光束164的一第一部分被研磨物質丨〇8的表 面反射回來,而該光束1 64的一第二部分則被該基材n 2 之被研磨的表面底下的一物質層反射回來。被反射的光 束被該感應器1 6 2接收且被反射的光束的兩個部分之間 的波長差被算出用以決定在基材1 1 2的表面上的物質的 厚度。通常,該厚度資訊被提供至一控制器(未示出), 其調整在研磨物質1 0 8上之研磨流體的分布用以在基材 的表面上產生一所想要的研磨結果。一可被有利地使用 之監視系統被描述於Birang等人於1996年八月16日提申 之美國專利申請案第08/689,930號中,該案的内容藉由 此參照而被併於本完中。 非必要地,該度量裝置1 1 8可包括額外的感應器用 來監視橫跨基材1 1 2的寬度的研磨參數。額外的感應器 讓橫跨基材1 1 2的寬度的研磨流體1 1 4的分布可被調整 使得基材 1 1 2上的一部分相較於另一部分而言有更多或 更少的物質被移除。此外,調整來自於噴嘴140,142的 流率的處理在研磨的程序期間可交替地實施用以動態地 第14頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) έ·· 訂· 經濟部智慧財產局員工消費合作社印製 1261317 A7 B7 五、發明説明() 控制在任何時間點整個基材1 1 2上之物質的移除率。例 如,基材中心可在研磨程序的開始時藉由提供較多的研 流體至基材的中心處使該處的物質被較快速地移除,而 基材的周邊則可在研磨程序的終了時藉由提供較多的研 磨流體至基材周邊處來使得在該處的物質可被較快速地 被移除。 第3圖顯示一具有多個噴嘴3 02之研磨流體傳送系 統3 00的另一實施例。該…系統300可被作成與第1圖的 流體傳送系統1 02相似(即,具有一單一的研磨流體供應 管路)或可被作成每一喷嘴302都具有一專屬的供應管 3 0 4概合至流體源3 0 6。流體地轉合至每一供應管路3 〇 4 的為一計量裝置308。該計量裝置308可以是一計量繁 浦,如一齒輪幫浦,蠕動幫浦,一正位移幫浦,一隔膜 幫浦及類此者。每一計量裝置3 08都被耦合至一控制器(未 示出)其控制著被供應至該系統300的每一嘴嘴3〇2的研 磨流體1 14量。因為每一計量裝置3〇8是可獨立地控制 的,所以來自於母一噴嘴3 0 2的研磨流體量即可彼此獨 立地加以控制使得在研磨物質1 〇 8上的研磨流體1 1 4的 分布可獲得細微的控制。 如上所示的,每一計量裝置可在整個研磨處理期間 改變送至研磨物質1 〇8的研磨流體流。例如,喷嘴3〇2 中的一者可在該基材被研磨時提高流經它的研磨流體 流。該等噴嘴中的另一者可在研磨期間減少通過它的研 磨流體流。當然,在任何時間點之噴嘴流率上的微小變 第15頁 本紙張尺度適用中國國家標準(CNS)A4規格(210χ297公釐) .......!::f (請先閱讀背面之注意事項再填寫本頁) 訂· 經濟部智慧財產局員工消費合作社印製 1261317 A7 B7 五、發明説明( 經濟部智慧財產局員工消費合作社印製 化可被加以安排用以產生一所想要的研磨結果。因為研 磨流體流可經由每一噴嘴.3 0 2加以獨立地控制.,所以在 整個基材研磨處理期間橫跨基材寬度,之研磨特性是可被 控制的。 流體輸送源3 0 6可與一度量裝置3 0 8 —起使用,用 以控制物質從被研磨的基材1 1 2的表面3 1 8上被移除的 速率及被移除的位置。通常’沉積在基材丨丨2的表面3】8 上的物質的移除率或剩下的厚度可用該度量裝置3丨8來 偵測且被送至控制器,該控制器接著調整離開每一噴嘴 3 02的不同流率用以產生一所想要的研磨結果,例如, 在基材1 12的周邊研磨的較快。 在一實施例中,研磨物質108可包括一窗口 31〇其 可允許該度量裝置3 1 8觀察頂抵著該研磨物質丨〇 8被設 置之基材112的表面318。該度量裝置318大體上包括 一感應器314其發射出一光束316其可穿過該窗口 31〇 到達基材112。該光束316的一第一部分被研磨物質1〇8 的表面3 1 8反射回來,而該光束3 1 6的一第二部分則被 該基材1 1 2之被研磨的表面3 1 8底下的一物質層3 2 〇反 射回來。被反射的光束被 '該感應器3 1 4接收且被反射的 光束的兩個邵分之間的波長差被算出用以決定在基材1 1 2 的表面上的物質的厚度。通常,該厚度資訊被提供至該 控制器,其調整在研磨物質1 08上之研磨流體的分布用 以在基材的表面3 1 8上產生一所想要的研磨結果。 非必要地,該度量裝置3 0 8可包括額外的感應器用 第16頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1261317 Five Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing B7 invention description (), the first flow rate is about 2. 2 to 2 times the second flow rate. The polishing uniformity 4 〇 2 obtained by this treatment using the abrasive fluid transport system 1 0 2 is shown in Fig. 4. A conventional substrate grinding uniformity 404 obtained using a conventional abrasive fluid delivery system (i.e., a system in which the abrasive fluid is delivered from a single nozzle to the abrasive material) is provided for comparison. As shown in Fig. 4, the uniformity 4 02 is significantly improved compared to the conventional result 4〇4. In a structure with a dynamic (controllable) control mechanism, such as a proportional valve, a flow restrictor, a needle valve 'metering pump' mass flow controller and the like, the grinding fluid 114 is in the abrasive substance 1〇8 The distribution above can be controlled during processing. For example, the abrasive fluid from the first nozzle 140 can be applied to the abrasive substance 108 during a portion of the process at a first flow rate and adjusted to one during another portion of the process. Second flow rate. The flow rate of the polishing fluid delivered from the first nozzle 14 2 can likewise be varied during the grinding process. It should be noted that the adjustment of the abrasive fluid from the nozzles 1 40 ' 1 42 is infmite. Providing an additional nozzle between the first nozzle 140 and the second nozzle 142 allows for greater control of uniformity and can be provided at the first nozzle by providing more or less abrasive fluid 1 1 4 The additional nozzle between 1 40 and the second nozzle 1 4 2 is locally changed (see description of Figure 3 below). Optionally, the abrasive fluid delivery system having dynamic control of the flow rate from the nozzles 140, 14 can include a metering device 8 for providing processing feedback for immediate adjustment of the abrasive fluid distribution. Typically, page 13 applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm). A7 B7 1261317 V. Invention Description (1) The measuring device 1 1 8 detects a grinding metric such as grinding Time, the thickness of the surface film being polished on the substrate, surface topography or other surface characteristics. In one embodiment, the abrasive material 1 8 may include a window 16 that allows the metering device 1 18 to view the surface of the substrate 112 against which the abrasive material 8 is disposed. The 'measurement device 118 generally includes a sensor 162 that emits a beam of light 164 that can pass through the window 16 to the substrate 1 12 . A first portion of the beam 164 is reflected back by the surface of the abrasive material 丨〇8, and a second portion of the beam 164 is reflected back by a layer of material beneath the surface of the substrate n2 being ground. The reflected beam is received by the inductor 162 and the wavelength difference between the two portions of the reflected beam is calculated to determine the thickness of the material on the surface of the substrate 112. Typically, the thickness information is provided to a controller (not shown) that adjusts the distribution of the abrasive fluid on the abrasive material 108 to produce a desired abrasive result on the surface of the substrate. A monitoring system that can be used in an advantageous manner is described in U.S. Patent Application Serial No. 08/689,930, the entire disclosure of which is incorporated herein by reference. in. Optionally, the metrology device 118 may include additional sensors for monitoring the grinding parameters across the width of the substrate 112. An additional inductor allows the distribution of the abrasive fluid 1 14 across the width of the substrate 112 to be adjusted such that a portion of the substrate 112 has more or less material than the other portion. Remove. In addition, the process of adjusting the flow rate from the nozzles 140, 142 can be alternately implemented during the grinding process to dynamically apply the Chinese National Standard (CNS) A4 specification (210X297 mm) on page 14 of this paper size (please Read the notes on the back and fill out this page. έ·················································································· Except rate. For example, the center of the substrate can be removed at the beginning of the grinding process by providing more grinding fluid to the center of the substrate, while the periphery of the substrate can be at the end of the grinding process. The material there can be removed more quickly by providing more abrasive fluid to the periphery of the substrate. Figure 3 shows another embodiment of a grinding fluid delivery system 300 having a plurality of nozzles 302. The system 300 can be made similar to the fluid delivery system 102 of Figure 1 (i.e., having a single abrasive fluid supply line) or can be configured to have a dedicated supply tube for each nozzle 302. Get to the fluid source 3 0 6 . Fluidly coupled to each supply line 3 〇 4 is a metering device 308. The metering device 308 can be a metering pump such as a gear pump, a peristaltic pump, a positive displacement pump, a diaphragm pump and the like. Each metering device 308 is coupled to a controller (not shown) that controls the amount of grinding fluid 1 14 supplied to each nozzle 3〇2 of the system 300. Since each metering device 3〇8 is independently controllable, the amount of grinding fluid from the parent-nozzle 320 can be controlled independently of each other such that the grinding fluid 1 1 4 on the abrasive substance 1 〇8 The distribution gives you fine control. As indicated above, each metering device can vary the flow of abrasive fluid delivered to the abrasive material 1 〇 8 throughout the grinding process. For example, one of the nozzles 3〇2 can increase the flow of abrasive fluid therethrough as the substrate is ground. The other of the nozzles can reduce the flow of the grinding fluid therethrough during grinding. Of course, the nozzle flow rate at any point in time is slightly changed. Page 15 This paper scale applies to the Chinese National Standard (CNS) A4 specification (210χ297 mm) .......!::f (please read the back first) Note: Please fill out this page) Order · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1261317 A7 B7 V. Invention Description (Ministry of Commerce, Intellectual Property Bureau, employee consumption cooperative printing can be arranged to generate a desired The result of the grinding. Since the flow of the grinding fluid can be independently controlled via each nozzle .30, the grinding characteristics can be controlled across the width of the substrate throughout the substrate grinding process. Fluid delivery source 3 0 6 can be used with a metrology device 3 0 8 to control the rate at which material is removed from the surface 3 1 8 of the substrate 1 1 2 being removed and the location to be removed. Usually 'deposited on the base The removal rate or the remaining thickness of the material on the surface 3] 8 of the material 2 can be detected by the measuring device 3丨8 and sent to the controller, which then adjusts the movement away from each nozzle 03. Different flow rates are used to produce a desired grinding result, For example, the periphery of the substrate 1 12 is ground faster. In one embodiment, the abrasive material 108 can include a window 31 that allows the metering device 3 18 to be viewed against the abrasive substance 8 The surface 318 of the substrate 112. The metrology device 318 generally includes an inductor 314 that emits a beam 316 that passes through the window 31 to the substrate 112. A first portion of the beam 316 is abraded. The surface 3 1 8 of 8 is reflected back, and a second portion of the beam 3 16 is reflected back by a substance layer 3 2 底 under the ground surface 3 18 of the substrate 112. The wavelength difference between the two tracks of the beam received by the sensor 3 14 and reflected is used to determine the thickness of the substance on the surface of the substrate 1 1 2 . Typically, the thickness information is Provided to the controller, which adjusts the distribution of the abrasive fluid on the abrasive material 108 to produce a desired abrasive result on the surface 3 18 of the substrate. Optionally, the metrology device 3 0 8 can Includes additional sensors for use on page 16 of this paper scale for Chinese countries Associate (CNS) A4 size (210X297 mm) (Please read the back issues of the note and then fill in this page)

1261317 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明() 來監視橫跨基材丨i 2的寬度的研磨參數。額外的感應器 讓橫跨基材1 1 2的寬度的研磨流體1 1 4的分布可被調整 使得基材1 1 2上的一部分相較於另一部分而言有更多或 更少的物質被移除。此外,調整來自於噴嘴3 02的流率 的處理在研磨的程序期間可交替地實施用以動態地控制 在任何時間點整個基材丨丨2上之物質的移除率。例如’ 基材中心可在研磨程序的開始時藉由提供較多的研流體 至基材的中心處使該處的物質被較快速地移除,而基材 的周邊則可在研磨程序的終了時藉由提供較多的研磨流 體至基材周邊處來使得在該處的物質可被較快速地被移 除。 第5圖顯示一研磨流體傳送系統500的另一實施例。 系統500包括一臂502真被設計來將多個研磨流體輸送 管5 06設置在一研磨表面570上方。該臂502被建構成 可選擇性地提供研磨流體至研磨表面570的不同位置 處’藉以控制在研磨表面5 70的寬度(直徑)上之研磨流 體的分布,及研磨率。在一實施例中,在研磨表面570 上的研磨流體分布可藉由將管506設置在可讓研磨流體 流到預定的位置處來加以控制。在另一實施例中,通過 管子506的流體可被選擇性地開啟及關閉。 在第5圖所示的實施例中,臂5 0 2具有多個研磨流 體輸送管容納孔504,管506可選擇性地穿過該等孔。 通常,臂502具有之孔504的數量多於管506的數量, 用以讓管506能夠選擇性地沿著臂502被設置。因為管 第17頁 (請先閲讀背面之注意事項再填寫本頁) ;裝· 、可1261317 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 5. Inventive Note () to monitor the grinding parameters across the width of the substrate 丨i 2 . An additional inductor allows the distribution of the abrasive fluid 1 14 across the width of the substrate 112 to be adjusted such that a portion of the substrate 112 has more or less material than the other portion. Remove. Furthermore, the process of adjusting the flow rate from the nozzle 312 can be alternately implemented during the grinding process to dynamically control the removal rate of the material on the entire substrate 丨丨2 at any point in time. For example, the center of the substrate can be removed at the beginning of the grinding process by providing more grinding fluid to the center of the substrate, and the periphery of the substrate can be at the end of the grinding process. The material there can be removed more quickly by providing more abrasive fluid to the periphery of the substrate. FIG. 5 shows another embodiment of a abrasive fluid delivery system 500. System 500 includes an arm 502 that is designed to position a plurality of abrasive fluid delivery tubes 506 over an abrasive surface 570. The arm 502 is constructed to selectively provide a flow of abrasive fluid to different locations of the abrasive surface 570 to control the distribution of the abrasive fluid over the width (diameter) of the abrasive surface 570, and the rate of polishing. In one embodiment, the distribution of the abrasive fluid on the abrading surface 570 can be controlled by placing the tube 506 at a location that allows the abrasive fluid to flow to a predetermined location. In another embodiment, fluid passing through tube 506 can be selectively opened and closed. In the embodiment illustrated in Figure 5, the arm 502 has a plurality of abrasive fluid delivery tube receiving apertures 504 through which the tubes 506 can selectively pass. Generally, arm 502 has a number of holes 504 that is greater than the number of tubes 506 to enable tube 506 to be selectively disposed along arm 502. Because the tube is page 17 (please read the notes on the back and fill out this page);

本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1317 126 A7 B7 發明説明( 5 0 6沿著臂5 0 2的位置可決定哪、 直」,天疋哪些邵分的研磨表面570 (請先閲讀背面之注意事項再填寫本頁) 可在研磨期間接受到研磨流體,所以選擇哪些孔5〇4來 放置管506可控制研磨流體在研磨表面57〇上的分布, 且可在基材574(以虛線表示)的寬度上之局部的研磨率。 管 506可藉由其它的裝冒式+、、上 /、匕的馱置或万法,如夾件,滑套件,帶 夾及槽,而被固定或沿著臂5〇2被調整。 臂502包括一第一側冑5〇8及一相對的第二側邊51〇 其典型地與研磨表面570垂直。一遠端512連結兩側邊 508,5 1 0。研磨流體輸送管容納孔5〇4至少是沿著一側 邊508, 5 1 0被設置。臂5〇2可包括一沿著其長度的弯折 用以提供一研磨頭572用的餘裕,該研磨頭在研磨期間 將基材5 7 4 (以虛線表示)保持頂抵該研磨表面5 7 〇。 經濟部智慧財產局員工消費合作社印製 在第5圖所示的實施例中,孔5 〇 4被安排在臂5 0 0 的側邊508,510及端部512上。一孔504的第一組514 係沿著第一側邊508被設,置,孔504的第二組516係沿 著第二側邊5 1 0被設置,孔5 〇4的第三組5 1 8係沿著端 部5 12被設置。孔5 08的數量及位置可改變用以將管5〇6 以預定的間距設置,而在研磨期間提供預定的研磨均勻 度。例如,第一孔組514可包含九(9)個孔504以半英寸 的間距被設置,第二孔組516可包含十(1〇)個孔504以 半英寸的間距被設置及第三孔組5 1 8可包含兩(2)個孔 504。因此,管506沿著臂502的位置可被選擇用以將研 磨流體流至研磨表面上分開的部分上,藉以控制在基材 的寬度上之局部的研磨率。 第18頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1317 126 經濟部智慧財產局員工消費合作社印製 A7 B7 發明説明() 在第5圖所示的實施例中,管5 〇 6可被放置在一預 足的孔5 04組群中用以產生一所想要的研磨均勻度於基 材5 74上。一第一管506A被放置在第一孔組514中的一 孔内用以將研磨流體流至該研磨表面5 7 0的一第一部分 5 62處。一第二管506B被放置在第一孔組514中的另一 孔内用以將研磨流體流至該研磨表面5 7 〇的一第二部分 564處。一第三管506c被放置在第二孔組516中的一孔 内用以將研磨流體流至該研磨表面5 7 0的一第三部分5 6 6 處。一第四管506D被放亶在第三孔組5 1 8中的一孔内用 以將研磨流體流至該研磨表面57〇的一第一部分562處。 藉由將管506A-D的任何一者移動至另一孔504,研磨流 體在研磨表面5 7 0上的分布即可被改變且相應地改變在 基材574的直徑上之物質移除率。管506A-D的位置可沿 著臂5 02移動用以在研磨一單一的基材時產生一所想要 的研磨結果,當研磨不同的物質時增加該系統使用上的 彈性’及在調整一特定的處理上提供更大的彈性以獲得 一特定的研磨均勻度或被研磨的基材輪廓。例如,管 5 06 A-D可從第一孔組514被重新放置到第二孔組516以 作為基材表面特性改變的回應,如從氧化物研磨變為銅 研磨,在進入的基材之間的表面輪廓上的改變或特徵結 構寬度上的改變等。This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) 1317 126 A7 B7 Description of invention (5 0 6 Which position can be determined along the position of arm 502), which abrasive surface of Scorpio 570 (Please read the note on the back and fill out this page) The grinding fluid can be received during grinding, so which holes 5〇4 are selected to place the tube 506 can control the distribution of the grinding fluid on the grinding surface 57〇, and can be The local abrasive rate on the width of the substrate 574 (shown in phantom). The tube 506 can be mounted by other squirting +, upper/, 匕 or 10,000 methods, such as clips, sliding kits, belt clips. And the slot is fixed or adjusted along the arm 5〇 2. The arm 502 includes a first side turn 5〇8 and an opposite second side 51 which is typically perpendicular to the abrasive surface 570. A distal end 512 The two sides 508, 5 1 0 are joined. The grinding fluid delivery tube receiving hole 5〇4 is disposed at least along one side 508, 510. The arm 5〇2 may include a bend along its length for Providing a margin for the polishing head 572 that maintains the substrate 5 7 4 (shown in phantom) during the grinding process Grinding surface 5 7 〇. Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed in the embodiment shown in Figure 5, the holes 5 〇 4 are arranged on the sides 508, 510 and end 512 of the arm 500. A first set 514 of apertures 504 is disposed along the first side 508, a second set 516 of apertures 504 is disposed along the second side 5 1 0, and a third set 5 of apertures 5 〇4 The 18 series are disposed along the end portion 5 12. The number and position of the apertures 508 can be varied to provide the tubes 5〇6 at a predetermined spacing to provide a predetermined degree of grinding uniformity during grinding. For example, the first aperture The set 514 can include nine (9) holes 504 that are disposed at a half inch spacing, and the second hole set 516 can include ten (1 inch) holes 504 that are disposed at a half inch spacing and the third hole set 5 1 8 can be Two (2) holes 504 are included. Thus, the position of the tube 506 along the arm 502 can be selected to flow the abrasive fluid onto separate portions of the abrasive surface to control localized abrasive rates across the width of the substrate. Page 18 This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) 1317 126 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperation PRINTED A7 B7 DESCRIPTION OF THE INVENTION () In the embodiment shown in Figure 5, the tube 5 〇6 can be placed in a pre-filled hole group 04 04 to produce a desired degree of grinding uniformity. On the material 5 74. A first tube 506A is placed in a hole in the first hole group 514 for flowing the grinding fluid to a first portion 5 62 of the grinding surface 507. A second tube 506B is The other hole in the first set of holes 514 is placed to flow the abrasive fluid to a second portion 564 of the abrasive surface 57. A third tube 506c is placed in a hole in the second set of holes 516 for flowing the abrasive fluid to a third portion 566 of the abrasive surface 507. A fourth tube 506D is placed in a hole in the third set of holes 518 to flow the abrasive fluid to a first portion 562 of the abrasive surface 57A. By moving any one of the tubes 506A-D to the other aperture 504, the distribution of the abrasive fluid on the abrasive surface 507 can be altered and the material removal rate on the diameter of the substrate 574 can be varied accordingly. The position of tubes 506A-D can be moved along arm 502 to produce a desired abrasive result when grinding a single substrate, increasing the flexibility of the system when grinding different materials' and adjusting one Greater flexibility is provided for a particular treatment to achieve a particular abrasive uniformity or profile of the substrate being abraded. For example, the tube 506 AD can be repositioned from the first set of holes 514 to the second set of holes 516 as a response to changes in the surface properties of the substrate, such as from oxide grinding to copper grinding, between the incoming substrates. A change in the surface profile or a change in the width of the feature structure, and the like.

或者,研磨流體在研磨表面5 70上的分布可藉由依 序地讓研磨流體流經管5 06來加以改變。例如,研磨流 骨豆可在研磨處理的一第' 部分期間被提供流經管5 0 6 A - C 第19頁 本紙張尺度適用中國國家標準(CNS)A4規格(210χ 297公釐) (請先閲讀背面之注意事項再填寫本頁)Alternatively, the distribution of the abrasive fluid on the abrasive surface 570 can be varied by sequentially flowing the abrasive fluid through the tube 506. For example, the grinding flow bean can be supplied through the tube during a part of the grinding process. 5 0 6 A - C Page 19 This paper scale applies to the Chinese National Standard (CNS) A4 specification (210χ 297 mm) (please Read the notes on the back and fill out this page)

1261317 A7 B7 五、發明説明() 用以在一預定的研磨率下研磨基材5 74橫跨該基材的直 徑(即,在橫跨基材直徑的不同點時研磨率是不同的)。 在研磨處理的一第二部分期間,通過第四管506D的流體 流是被提供來改變在研磨表面5 70上的研磨流體分布, 用以改變研磨率輪廓。通過管506Α-Ι)的流體流可以不同 的組合被開啟或關閉,用以產生一相應的研磨性能。通 過管506A-D的流體流順序可被控制以回應一被偵測到的 研磨計量(metric)。或者,通過管506A-D的流體流順序可 被選擇用以藉由補償會影響局部研磨率之其它處理參數 上的改變來獲得均勻的基材研磨。 參照第6圖,臂502、大體上是被一柱602所支撑, 其利於將該臂502旋轉於研磨表面570之上。臂5〇2被 定向為與柱602垂直,且在一實施例中被偏位或沿著其 長度被彎折。柱602額外地提供一導管用來將管5〇6導 引至臂502。 形成於臂502上的孔504典型地包括一上螺紋部6〇6 及一下部604。下部604的直徑小於上部606的直徑, 在孔506内形成一級階608。下部604大體上被建構成 可讓管506緊貼由其中通過。上部606包括一螺紋段612。 每一管506利用一管夾610被固定在孔504中。 額外參照第5圖,管夾610具有一大致斜的圓柱形 狀且具有一螺紋外部5 02。管夾610從一中心環5 〇6向 一窄端504傾斜。管夾610的窄端504包括多個槽5〇8 其界定出多個從中心環5 06延伸出的指件5 1 〇。環5 〇6 第20頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁} -訂· 線 經濟部智慧財產局員工消費合作社印製 A7 B7 1261317 五、發明説明() 被建構成可緊貼地嵌套於管506上。在管506被插入孔 5 04中一適當的深度之後,管夾6丨〇與孔5 04的螺紋段6 1 2 相卡合。當管夾6 1 0被旋入孔5 0 4的上部時,管夾6 1 0 之推拔形狀造成指件5 1 0被朝内迫擠抵住管5 0 6,藉以 將管506夾在孔504内。 管夾610允許管506延伸至臂502底下一段預定的 長度。因此,管5 06的一出口 614可被穩穩地放在靠近 該研磨表面的位置,而臂5 02則被保持在一離該研磨表 面較允的距離處且遠離會沉積到臂 5 02上的污染物及其 它殘骸與稍後的污染物,及/或在研磨期間傷及基材。在 一實施例中,管506的出口 614至少延伸至臂502底下 1英寸。· 第6及8圖顯示被用來防止研磨流體及其它污染物 進入沒有被任何管506使用之孔504中的插塞620的實 施例。插塞620大體上包括一圓柱形本體622其具有一 同心柱624從一第一端628延伸出及一螺紋孔630其同 心地形成在一第二端632上。柱624被建構成可緊貼地 填入孔5 04的下部604中以防止研磨流體及其它污染物 進入孔504内。柱624典型地與臂502面向研磨表面570 的底側644齊平或稍微突出。一定位螺絲626被旋入孔 5 04的上部606並迫擠插塞620頂住級階608將插塞固 定在孔5 0 4中。插塞6 2 0可藉由取下定位螺絲6 2 6並插 入一有螺紋的物件(未示出)於插塞6 2 0的螺紋孔6 3 0内 來將其從孔504中取出。 第21頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再場寫本頁) -丨裝· 訂· 經濟部智慧財產局員工消費合作社印製 1261317 五、發明説明( 參照第6圖,臂5 0 2可# ,, 2 了包括一非必要的噴灑系統64〇。 該喷壤系,统640大體上包括―f⑷其搞合至該臂5〇2 的上側644。管642包括多個噴嘴646其耗合至或以一 定間隔形成於管642上。瞢/丄 ^ g 642經由一通過註002的導 & 650而被耦口至/青潔流體源648。該清潔流體源648 經由噴嘴646提供加壓的清潔流體,如去離子水,至研 磨表面570來將污染物或殘骸從研磨表面上驅除。可用 來實施本發明的一噴灑系統被描述於2〇〇〇年十月Η日 授予Kennedy之美國專利第6,319,4〇6號中,該專利的内 谷藉由此參照而被併於本文中。 第9圖顯示一研磨流體傳送設備9〇〇的另一實施例 的剖面圖。設備900包括一臂9〇2其具有一第一側邊9〇4 , 一相對的第二側邊9 0 6及一位在侧邊9 〇 4,9 0 6之間的底 側其面向一研磨表面910。側邊9〇4,9〇6界定該臂9〇2 的一長度’該長度的一部分延伸超過該研磨表面。 一耦合至一研磨流體源(未示出)的岐管9丨2沿著臂 9 02的該長度延伸。岐管912可被耦合至臂902,其可被 設置在臂902上或與臂902 —體形成。岐管912包括多 個以間隔開來的形式沿著該岐管9丨2的長度被設置之出 口 9 1 4。出口 9 1 4被設計成可讓研磨流體從岐管9丨2流 至研磨表面9 1 0的不同部分。 每一出口 9 1 4都包括一與其相搞合之流量控制機制 9 1 6。該流量控制機制9 1 6可以是一手動的或自動式的流 量控制裝置,如一壓緊閥(pinch valve),比例閥,斷流閥, 第22頁 (請先閲讀背面之注意事項再填寫本頁) -裝· -訂· 經濟部智慧財產局員工消費合作社印製 12613171261317 A7 B7 V. INSTRUCTION DESCRIPTION () The diameter of the substrate 5 74 is traversed across the substrate at a predetermined polishing rate (i.e., the polishing rates are different across different points in the diameter of the substrate). During a second portion of the grinding process, fluid flow through the fourth tube 506D is provided to alter the distribution of the abrasive fluid on the abrasive surface 570 to change the abrasive rate profile. The fluid flow through tube 506Α-Ι can be turned on or off in different combinations to produce a corresponding abrasive performance. The sequence of fluid flow through tubes 506A-D can be controlled in response to a detected metric. Alternatively, the sequence of fluid flow through tubes 506A-D can be selected to achieve uniform substrate grinding by compensating for changes in other processing parameters that affect local grinding rates. Referring to Figure 6, the arm 502, generally supported by a post 602, facilitates rotation of the arm 502 over the abrading surface 570. The arm 5〇2 is oriented perpendicular to the post 602 and is deflected or bent along its length in one embodiment. Column 602 additionally provides a conduit for guiding tube 5〇6 to arm 502. The aperture 504 formed in the arm 502 typically includes an upper threaded portion 6〇6 and a lower portion 604. The lower portion 604 has a smaller diameter than the upper portion 606 and forms a first order 608 within the bore 506. The lower portion 604 is generally constructed to allow the tube 506 to pass snugly therethrough. Upper portion 606 includes a threaded section 612. Each tube 506 is secured in bore 504 by a tube clamp 610. Referring additionally to Figure 5, the pipe clamp 610 has a generally oblique cylindrical shape and has a threaded outer portion 502. The pipe clamp 610 is inclined from a center ring 5 〇 6 toward a narrow end 504. The narrow end 504 of the tube clamp 610 includes a plurality of slots 5〇8 that define a plurality of fingers 5 1 延伸 extending from the center ring 506. Ring 5 〇6 Page 20 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the note on the back and fill out this page) - Set · Department of Economic Affairs, Intellectual Property Bureau, employee consumption cooperative A7 B7 1261317 V. Description of the invention () is constructed to fit snugly over the tube 506. After the tube 506 is inserted into the hole 504 at an appropriate depth, the tube clamp 6 丨〇 and the thread of the hole 504 The segment 6 1 2 is engaged. When the pipe clamp 6 10 is screwed into the upper portion of the hole 5 0 4 , the push-pull shape of the pipe clamp 6 1 0 causes the finger 5 10 to be forced inward against the pipe 5 0 . 6. The tube 506 is thereby clamped within the aperture 504. The tube clamp 610 allows the tube 506 to extend a predetermined length under the arm 502. Thus, an outlet 614 of the tube 506 can be placed securely adjacent the abrasive surface. And the arm 052 is held at a relatively distance from the abrasive surface and away from contaminants and other debris deposited on the arm 502 and later contaminants, and/or damage to the base during grinding In one embodiment, the outlet 614 of the tube 506 extends at least 1 inch below the arm 502. Figures 6 and 8 show the use of An embodiment of the plug 620 that stops grinding fluid and other contaminants from entering the aperture 504 that is not used by any of the tubes 506. The plug 620 generally includes a cylindrical body 622 having a concentric post 624 extending from a first end 628 A threaded aperture 630 is concentrically formed on a second end 632. The post 624 is configured to fit snugly into the lower portion 604 of the aperture 504 to prevent abrasive fluid and other contaminants from entering the aperture 504. 624 is typically flush or slightly projecting with the bottom side 644 of the arm 502 facing the abrasive surface 570. A set screw 626 is threaded into the upper portion 606 of the bore 504 and forces the plug 620 against the step 608 to secure the plug to the bore. 5 0 4 . The plug 6 2 0 can be removed from the hole by removing the set screw 6 2 6 and inserting a threaded object (not shown) into the threaded hole 6 3 0 of the plug 6 2 0 Take out in 504. Page 21 This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the back note first to write this page) - Armor · Booking · Ministry of Economic Affairs Intellectual Property Bureau employees Consumer cooperatives printed 1261317 V. Invention description (refer to Figure 6, arm 5 0 2 can #,, 2 An optional spray system 64A is included. The spray system 640 generally includes a "f(4) that engages to the upper side 644 of the arm 5〇2. The tube 642 includes a plurality of nozzles 646 that are consuming or spaced at intervals Formed on tube 642. 瞢/丄^ g 642 is coupled to/green fluid source 648 via a guide & 650 through 002. The cleaning fluid source 648 provides a pressurized cleaning fluid, such as deionized water, through a nozzle 646 to a grinding surface 570 to drive contaminants or debris away from the abrasive surface. A spray system that can be used in the practice of the present invention is described in U.S. Patent No. 6,319, issued toK. . Fig. 9 is a cross-sectional view showing another embodiment of a grinding fluid transfer device 9A. Apparatus 900 includes an arm 9〇2 having a first side edge 9〇4, an opposite second side edge 906 and a bottom side between the side edges 〇4, 906. The surface 910 is ground. The sides 9 〇 4, 9 〇 6 define a length of the arm 9 〇 2 ' a portion of the length extends beyond the abrasive surface. A manifold 9丨2 coupled to a source of abrasive fluid (not shown) extends along the length of the arm 092. The manifold 912 can be coupled to an arm 902 that can be disposed on or integrally formed with the arm 902. The manifold 912 includes a plurality of outlets 9 1 4 that are spaced apart along the length of the manifold 9丨2. The outlet 916 is designed to allow the grinding fluid to flow from the manifold 9丨2 to different portions of the abrasive surface 910. Each outlet 9 1 4 includes a flow control mechanism 9 1 6 that is integrated with it. The flow control mechanism 9 16 can be a manual or automatic flow control device, such as a pinch valve, a proportional valve, a shut-off valve, page 22 (please read the notes on the back and fill in the form) Page) - Loading · - Booking · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 1261317

、發明説明( 針閥,計量t浦及質量流控制器等。該流量控制機制9i6 容許來自於每一出口 914的流體被選擇性的開啟或關閉 用以控制橫跨該研磨表面9 1 0的寬度‘之研磨流體分布, 其在一被研磨的基材的表面910上的研磨輪廓的控制上 由相對應地結果。 在一實施例中,該流量控制機制9 1 6為一螺線管闊 其被搞合至一控制器918。控制器918讓每—流量控制 機制916能夠以一預定的順序被打開或關閉,以便於控 制橫跨一被研磨的基材的直徑之物質的移除率。使用栌 制器918可對移除率輪廓作現第(in-situ)調整。例如,# 制器918可被耦合至一第i圖所示的度量裝置ιΐ8用以 改變研磨輪廓以回應一研磨計量,如研磨時間,在該其 材上之被研磨的表面薄膜的厚度,表面拓樸或其它表面 特性。 一噴灑系統920亦可被耦合至該臂902且被設計來 噴灑清潔流體於該研磨表面91 0上。該噴灑系統92〇與 參照第6圖所示的喷灑系統640相似。 (請先閲讀背面之注意事項再填寫本頁) •裝· -訂· 線 經濟部智慧財產局員工消費合作社印製 質的布藉上,區 物分分,臂流一 的部的量該體另 間同體體之流比 期不流流面的率 磨的磨磨表管磨 研面研研磨於研 在表。對研自的 許磨率相該來域 .允研除的過閉區 統至移來超關 一 系送之送伸或的 頂 送體度置延 W 材 勒 傳流寬位在&基 體磨的同管 Μ 該 流研材不送Μ讓 磨制基的輸its以 研控跨臂體*用 該由橫從流藉 , , 藉制制磨il制 此可控控研 Γ 控 因率來由變置以 除布藉改位加 移分可由的來 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公爱) 1261317Description of the Invention (Needle Valve, Metering T-Pulse and Mass Flow Controller, etc. The flow control mechanism 9i6 allows fluid from each outlet 914 to be selectively opened or closed for control across the abrasive surface 9 1 0 The width of the abrasive fluid distribution is correspondingly controlled by the control of the abrasive profile on the surface 910 of the ground substrate. In one embodiment, the flow control mechanism 9 16 is a solenoid wide It is coupled to a controller 918. The controller 918 allows each flow control mechanism 916 to be opened or closed in a predetermined sequence to facilitate control of the removal rate of material across the diameter of a substrate being ground. The removal rate profile can be adjusted in-situ using a controller 918. For example, the # 918 can be coupled to an metric device ι 8 shown in Figure ii to change the grinding profile in response to a Grinding, such as grinding time, thickness of the surface film being polished on the material, surface topography or other surface characteristics. A spray system 920 can also be coupled to the arm 902 and designed to spray a cleaning fluid to the Grinding surface 91 0 The spray system 92 is similar to the spray system 640 shown in Fig. 6. (Please read the note on the back and fill out this page) • Install······································ The quality of the cloth is borrowed, the area is divided into parts, and the amount of the part of the arm flow is the same as that of the body, and the flow rate of the body is not the flow rate. The grinding table is ground and ground. The grinding rate of the research itself is in the domain. The research and development of the pass-through zone system to the transfer of the super-closed line of the delivery or the top-loading body-degree delay W material Leliu flow width in & The same pipe of the base mill Μ The flow material is not sent to the mill base to feed it to research the cross-arm body*. The rate is changed by the change of the cloth. The paper size can be applied to the Chinese National Standard (CNS) A4 specification (210X 297 public) 1261317

五、發明説明() 經濟部智慧財產局員工消費合作社印製 域來的快些。藉由產生一更為有彈性的處理窗口,控制 研磨流體的分部可有利地減少研磨流體在研磨期間的消 耗量,因此可降低處理成本。 雖然本發明的教導已於本文中被詳細的說明及展 π,但熟悉此技藝者仍可在利用到這些教導及不偏離本 發明的範圍及精神下輕易地完成其它的實施例。 1式簡軍說明: 本發明之一更為特定的描述可藉由參照顯示於附圖 中之貫施例而被作成,使得本發明之上述特徵,優點及 目地可被詳地地瞭解。然而,應注意的是,附圖中所示 者為本發明之典型的實施例,因此不應被認為是本發明 範圍的限制’因為本發明可以有其它等效的實施例。 第1圖為一具有一研磨流體傳送系統的實施例之研磨系 統的簡化示意圖; 第2圖為第1圖中之系統的平面圖; 第3圖為另一研磨流體.傳送系統的簡化示意圖; 第4圖為在傳統的研磨系統及在第1圖的系統上被研磨 的基材之研磨均勻度的比較; 第5圖為研磨流體傳送系統的另一實施例的頂視圖; 第6圖為第5圖中之研磨流體傳送設備沿著6-6線所取 之剖面圖, 第7圖為將研磨流體傳送管固裝於該研磨流體傳送設備 上的筒夾的立體圖; 第24頁 本紙張尺度適用中國國家標準(CNS)A4規格(210Χ297公釐) (請先閲讀背面之注意事項再填寫本頁) ^. 訂·V. Description of the invention () The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, printed the domain faster. By creating a more flexible processing window, controlling the portion of the abrasive fluid can advantageously reduce the amount of wear of the abrasive fluid during milling, thereby reducing processing costs. While the teachings of the present invention have been described and illustrated in detail herein, other embodiments may be readily made by those skilled in the art without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The above-described features, advantages and objects of the present invention will become more apparent from the detailed description of the invention. It is to be understood, however, that the invention is not limited by the scope of the invention 1 is a simplified schematic view of a polishing system having an embodiment of a polishing fluid delivery system; FIG. 2 is a plan view of the system of FIG. 1; and FIG. 3 is a simplified schematic view of another polishing fluid delivery system; Figure 4 is a comparison of the polishing uniformity of the substrate being ground in the conventional polishing system and the system of Figure 1; Figure 5 is a top view of another embodiment of the abrasive fluid delivery system; 5 is a cross-sectional view of the abrasive fluid transfer device taken along line 6-6, and FIG. 7 is a perspective view of the collet for attaching the abrasive fluid transfer tube to the abrasive fluid transfer device; page 24 Applicable to China National Standard (CNS) A4 specification (210Χ297 mm) (Please read the note on the back and fill out this page) ^.

1261317 A7 B7 五、發明説明() 第8圖為第5圖中之研磨流體傳送設備沿著8-8線所取 之部分剖面圖;及 第9圖為一研磨流體傳送設備的另一、實施例的一切開立 體圖。 為了便於暸解起見,相同的標號被用來標示圖式中 經濟部智慧財產局員工消費合作社印製 相同 的元 件 〇 圖號 對照 說 明 * 100 研 磨 系 統 102 流 體 輸 送 系 統 104 平 台 106 研 磨 頭 108 研 磨 物 質 112 基 材 114 研 磨 流 體 116 研 磨 表 面 118 度 量 裝 置 120 凹 部 122 基 座 124 供 應 管 路 126 T 形 套 件 130 臂 132 噴 嘴 134 流 體 源 136 部 分 140 第 一 噴 嘴 142 第 二 喷 嘴 144 •第 一 輸 送 管 路 146 第 二 輸 送管路 150 流 量 控 制 機 制 152 容 器 154 幫 浦 160 窗 口 162 感 應 器 164 光 束 202 第 一 部 分 204 第 二 部 分 300 研 磨 系 統 302 噴 嘴 304 供 應 管 路 第25頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) -訂·1261317 A7 B7 V. INSTRUCTIONS (8) Figure 8 is a partial cross-sectional view of the abrasive fluid transfer device taken along line 8-8 of Figure 5; and Figure 9 is another embodiment of a polishing fluid transfer device. Everything in the example is a perspective view. For the sake of easy understanding, the same reference numerals are used to indicate that the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumer Cooperatives print the same components. Figure No. Comparison Description * 100 Grinding System 102 Fluid Delivery System 104 Platform 106 Grinding Head 108 Abrasive Material 112 Substrate 114 Abrasive Fluid 116 Abrasive Surface 118 Metric Device 120 Concave 122 Base 124 Supply Line 126 T-Shaped Kit 130 Arm 132 Nozzle 134 Fluid Source 136 Portion 140 First Nozzle 142 Second Nozzle 144 • First Delivery Line 146 Second delivery line 150 Flow control mechanism 152 Container 154 Pump 160 Window 162 Sensor 164 Beam 202 Part 1 204 Part 2 300 Grinding System 302 Nozzle 304 Supply Line Page 25 This paper scale applies to China National Standard (CNS) A4 size (210X297 mm) (please read the notes on the back and fill out this page) - Booking·

1261317 A7 B7 五、發明説明() 經濟部智慧財產局員工消費合作社印製 306 流體源 308 計量裝置 310 窗口 3 12 度量裝置 314 感應器 3 16 光束 318 表面 3 20 物質層 402 均勻度結果 404 傳統結果 500 研磨流體傳送系統 502 臂 504 孔 506 研磨流體輸送管 506A 第一管 506B 第二管 506C 第三管 506D 第四管 508 側邊 510 側邊 512 遠端 514 第一孔組 516 第二孔組 518 第三孔組 562 第一部分 564 第二部分 570 研磨表面 572 研磨頭 574 基材 602 柱 604 下部 606 上螺紋部 608 級階 610 管夾 614 出订 620 插塞 622 圓柱形本體 624 同心柱 628 第一端 630 螺紋孔 632 第二端 640 喷灑系統 642 管 644 底側 648 清潔流體源 900 研磨流體輸送設 902 臂 904 第一側邊 第26頁 (請先閲讀背面之注意事項再填寫本頁) 訂·1261317 A7 B7 V. INSTRUCTIONS () Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 306 Fluid Source 308 Metering Device 310 Window 3 12 Metric Device 314 Sensor 3 16 Beam 318 Surface 3 20 Material Layer 402 Uniformity Results 404 Traditional Results 500 Abrasive Fluid Delivery System 502 Arm 504 Hole 506 Abrasive Fluid Delivery Tube 506A First Tube 506B Second Tube 506C Third Tube 506D Fourth Tube 508 Side 510 Side 512 Remote End 514 First Hole Set 516 Second Hole Set 518 Third hole group 562 first portion 564 second portion 570 grinding surface 572 grinding head 574 substrate 602 column 604 lower portion 606 upper thread portion 608 step 610 pipe clamp 614 book 620 plug 622 cylindrical body 624 concentric column 628 first End 630 Threaded Hole 632 Second End 640 Spray System 642 Tube 644 Bottom Side 648 Cleaning Fluid Source 900 Grinding Fluid Delivery Set 902 Arm 904 First Side Page 26 (Please read the back note first and then fill out this page) ·

本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 1261317 A7 B7 五、發明説明() 906 相對的第二側邊 908 底側 910 研磨表面 912 岐管 914 出口 916 流量控制機制 918 控制器 經濟部智慧財產局員工消費合作社印製 第27頁 (請先閲讀背面之注意事項再填寫本頁)This paper scale applies to China National Standard (CNS) A4 specification (210X 297 mm) 1261317 A7 B7 V. Invention description () 906 opposite second side 908 bottom side 910 grinding surface 912 manifold 914 outlet 916 flow control mechanism 918 Controller Economics Department Intellectual Property Bureau Staff Consumer Cooperative Printed on page 27 (please read the notes on the back and fill out this page)

本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm)

Claims (1)

1261317 六、申請專利範圍 系 的 面 表 磨 研 械 機 學 化 1 至 送 傳 體V _ 含 包 磨 / 研至 將其 •Iml· 種, 一 統 磨 , 研臂 質 物 研 該 在 置 設 地 分 部 少 至 是 分 β! 立口 送 輸 1 有 具 其 成 -tt 設 被 且 上 分 β, 立口 送 輸 該 在 置 設 被 其 , jinn ;^ 方喷 上- 質 物 磨 第 下 率 流 磨 研 一 之 第度· 一濃及 在定 ., 可預域 一 區 有一 具第 義一 定的 以上 藉 質 體物 流磨 磨研 研該 該於 通體 流⑤ (請先-H讀背面之注意事項再本頁) 經濟部智慧財產局員工消費合作社印製 至少一第二喷嘴其被設置在該輸送部分上且被設 計成可在一不同於該第一流率的第二流率下流通該 研磨流體,藉以定義具有與該第一區域中研磨流體相 同濃度之研磨流體於該研磨物質上的一第二區域。 2. 如申請專利範圍第1項所述之系統,其中該第一喷嘴 或該第二喷嘴中的至少一者更包含一與其相耦合的 流量控制裝置。 3. 如申請專利範圍第2項所述之系統,其中該流量控制 裝置係選自於由孔口 、針閥、比例閥、壓緊閥(Pinch valve)、限流器、質量哮控制器及一計量幫浦所組成的 組群中。 4. 如申請專利範圍第1項所述之系統,其中該臂更包含 第28頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉1261317 VI. Surface area of the application for patents grinding machine mechanics 1 to the delivery of the body V _ including the package grinding / research to the Iml · species, a unified grinding, research arm material research in the establishment of the branch As little as is divided into β! The mouth is delivered 1 has its own -tt set and the upper part is β, the mouth is sent and placed in the setting, jinn ;^ square spray on - the mass of the material is the next rate flow grinding research The first degree · a concentrated and in the fixed., can be pre-domain one area has a certain meaning of more than the mass of the body flow grinding research and development should be in the whole body flow 5 (please first -H read the back of the note and then this page The Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative prints at least one second nozzle disposed on the conveying portion and designed to circulate the grinding fluid at a second flow rate different from the first flow rate, thereby defining A second region having a polishing fluid of the same concentration as the polishing fluid in the first region on the abrasive material. 2. The system of claim 1, wherein at least one of the first nozzle or the second nozzle further comprises a flow control device coupled thereto. 3. The system of claim 2, wherein the flow control device is selected from the group consisting of an orifice, a needle valve, a proportional valve, a pinch valve, a flow restrictor, a mass controller, and A group of metering pumps. 4. For the system described in claim 1, wherein the arm further includes page 28. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 六、申請萆利範圍 經濟部智慧財產局員工消費合作社印製 一研磨流體輸送管,其耦合至第一及第二噴嘴。 5. 如申請專利範圍第1項所述之系統,其更包含一耦合 至第一喷嘴之第一流體源及一耦合至第二噴嘴之第 二流體源。 6. 如申請專利範圍第1項所述之系統,其更包含多個被 設計來在一控制下的流率流通研磨流體之喷嘴,其中 每一喷嘴係可被獨立地控制。 7. 如申請專利範圍第1項所述之系統,其更包含一旋轉 平台,其被設計來支撐該研磨物質,該研磨物質包含 一研磨表面。 8. 如申請專利範圍第1項所述之系統,其中該第一喷嘴 相對於該研磨墊的旋轉中心而言是設置在第二喷嘴 的徑向朝内的位置處,且其中該第一流率比該第二流 率至少大1 · 1 5倍。 9. 如申請專利範圍第1項所述之系統,其中該第一流率 是該第二流率的I·2至、2〇倍。 1 0.如申請專利範圍第1項所述之系統,其更包含一度量 裝置被設計來提供用來控制流經喷嘴的至少一流量 _第29頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉 ----I---:---.---裝-----1 (請先朋讀背面之注意事項再本頁) 訂------線 A8 B8 C8 D8 1261317 六、申請專利範圍 的資訊。 1 1. 一種將研磨流體傳送至一化學機械研磨表面的系 統,其至少包含: 一支撐該研磨表面的平台; 一被設置在該平台上方的研磨頭; 一臂,其具有一輸送部分是至少部分地設置在該研 磨表面上方; 一第一喷嘴,其被設置在該輸送部分上且被設計成 可在一第一流率下流通該研磨流體,藉以定義具有一 預定濃度之研磨流體穿越該研磨頭下方而於該研磨 物質上的一第一區域; 至少一第二喷嘴其被設置在該輸送部分上且被設 計成可在一不同於該第一流率的第二流率下流通該 研磨流體,藉以定義具有與該第一區域中研磨流體相 同濃度之研磨流體穿越該研磨頭下方而於該研磨物 質上的一第二區域;及 一度量裝置,其被設計來提供用來控制流經喷嘴的 至少一流量的資訊。 1 2. —種將研磨流體傳送至一化學機械研磨表面的系 統,其至少包含: 一臂,其具有一面向該研磨表面的底侧及多個管容 納件;及 第30頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項 本頁) 丨裝 經濟部智慧財產局員工消費合作社印製VI. Application for Profits The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, prints a grinding fluid delivery tube that is coupled to the first and second nozzles. 5. The system of claim 1, further comprising a first fluid source coupled to the first nozzle and a second fluid source coupled to the second nozzle. 6. The system of claim 1, further comprising a plurality of nozzles designed to flow the abrasive fluid at a flow rate under control, wherein each nozzle system is independently controllable. 7. The system of claim 1, further comprising a rotating platform designed to support the abrasive material, the abrasive material comprising an abrasive surface. 8. The system of claim 1, wherein the first nozzle is disposed at a radially inward position of the second nozzle relative to a center of rotation of the polishing pad, and wherein the first flow rate It is at least 1 · 15 times larger than the second flow rate. 9. The system of claim 1, wherein the first flow rate is 1⁄2 to 2 times the second flow rate. The system of claim 1, further comprising a metering device designed to provide at least one flow rate for controlling flow through the nozzle - page 29 of the paper size applicable to China National Standard (CNS) A4 Specifications (210 X 297 mm) ----I---:---.---Package-----1 (please read the back note on the front page again) Order----- -Line A8 B8 C8 D8 1261317 VI. Information on the scope of the patent application 1 1. A system for conveying abrasive fluid to a chemical mechanical polishing surface, comprising at least: a platform supporting the abrasive surface; An upper grinding head; an arm having a conveying portion at least partially disposed above the grinding surface; a first nozzle disposed on the conveying portion and designed to circulate at a first flow rate Grinding a fluid to define a first region having a predetermined concentration of abrasive fluid passing under the polishing head on the abrasive material; at least one second nozzle disposed on the delivery portion and designed to be different Second flow rate at the first flow rate Flowing the grinding fluid to define a second region having a polishing fluid having the same concentration as the polishing fluid in the first region traversing the polishing head over the abrasive material; and a metering device designed to provide Controlling at least one flow of information through the nozzle. 1 2. A system for delivering abrasive fluid to a chemical mechanical polishing surface, comprising at least: an arm having a bottom side facing the abrasive surface and a plurality of tubes Holder; and page 30 of this paper size applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the note on the back page first) Printed by the Intellectual Property Office of the Ministry of Economic Affairs f 4 E] 利範圍 至少一管,其被設計來讓耦合至該臂之研磨流體流 過,且在至少兩管容納件之間為可再置放的。 1 3.如申請專利範圍第12項所述之系統,其中該至少兩 管容納件界定了: 一第一組管固持孔且是沿著臂的第一側被間隔開 來;且其中至少兩個其它的管容納件界定了: 一第二組管固持孔其被形成在該臂上且沿著與該 第一側相對之臂的第二側以等間距的方式被間隔開。 1 4.如申請專利範圍第1 2項所述之系統,其更包含: 一設置在每一管容納件内之管夾,其具有一管穿過 其間並將該管耦合至該臂。 1 5.如申請專利範圍第1 2項所述之系統,其更包含: 至少一插塞其設置在沒有被管佔用的孔内。 16.如申請專利範圍第15項所述之系統,其中該插塞更 包含: 一中央本體;及 一柱,其從該中央丰體延伸出,該柱被設置成與該 臂齊平或突伸超過該臂,且其中每一孔更包含: 一第一部分,其具有一螺紋段; 一第二部分,其被設置成與第一部分同軸且具有一 第31頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----I-----I------ (請先朋讀背面之注意事項再Hi本頁) 訂——1-——1!線· 經濟部智慧財產局員工消費合作社印製 B8 C8 D8 1261317 ¥請專利範圍 小於第一部分的直徑之直徑,該插塞的柱塞滿該第二 部分; 一級階,其被界定在第一部分與第二部分之間的界 面處;及 一定位螺絲,其與螺紋段相卡合且迫擠該插塞的中 央本體頂抵該級階。 1 7.如申請專利範圍第1 2項所述之系統,其更包含: 一用來選擇性地改變由研磨流體流經之管的組合 的機構。 1 8. —種將研磨流體傳送至一化學機械研磨表面的系 統,其至少包含: 一臂; 多個研磨流體輸送管; 多個形成在該臂上的孔用來容納該等研磨流輸送 管,每一管係被設置穿過一孔且耦合至臂;及 其中在研磨流體輸送管與孔之間的關係可用以下 的式子來表示: A/B〉l,其中A是孔的數量,及B為研磨流體輸送 管的數量。 1 9. 一種將研磨流體供應至一化學機械研磨表面的方 法,該方法至少包含: 第32肓 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉 ----1I11J---l·— - · 1 1 (請先·Μ讀背面之注意事項再本頁) ·- --線- 經濟部智慧財產局員工消費合作社印?取 \p6mm Η Β8 C8 D8 經濟部智慧財產局員工消費合作社印製 A m命,利範圍 在一第一流率下將具有一預定濃度之研磨流體流 至該墊子上的一第一位置處;及 在一不同於該第一流率的第二流率下將研磨流體 流至該墊子上的一第二位置處,其中於第一位置與第 二位置之研磨流體具有相同濃度。 20. 如申請專利範圍第19項所述之方法,其中該第一流 率可相對於該第二流率被獨立地控制。· 21. 如申請專利範圍第20項所述之方法,其中該調整步 驟更包含: 在研磨期間回應一研磨計量(metric)而調整流率。 22. —種將一研磨流體輸送至一化學機械研磨器的研磨 表面上的方法,該方法至少包含: 提供一研磨流體輸送臂,其具有多個管固持位置其 數量超過耦合至該臂之研磨流體輸送管的數量; 從該等管固持位置中,選擇沿著該臂之至少一第一 及一第二研磨流體輸送管之間的相對間距用以產生 所想要的研磨結果;及 將一基材與一單一濃度研磨流體之體積分佈予以 接觸,該單一濃度研磨流體係輸送自該研磨流體輸送 管輸送。 第33頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -------I ^---:---裳--------訂·1ι — (請先Μ讀背面之注意事項再θ本頁) 線 «· 六、申請專利範圍 B8 C8 D8 23.如中請專利範圍第22項所述之方法,其中該等研磨 流體輸送管中的至少一者被移動至沿著該臂的一不 同位置以回應被研磨的基材在表面特性上的改變。 經濟部智慧財產局員工消費合作社印?π 24. 如申請專利範圍第22項所述之方法,其中該等研磨 流體輸送管中的至少一者被移動至沿著該臂的一不 同位置用以改變橫跨一基材的直徑之局部研磨率。 25. —種將一研磨流體輸送至一化學機械研磨器的研磨 表面上的方法,該方法至少包含: 讓研磨流體流入一岐管,該岐管耦合至多個以間隔 開來的方式设置在該研磨表面上的出口; 允許研磨流體流通遶至少一出口; 防止研磨流體流通過該等出口中的至少一出口,其 中該至少一出口具有一條件,該條件會因為有研磨流 體流或沒有研磨流體流通過該出口而被改變成一相 反的條件;及 將一位於該研磨表面上之基材與一單一濃度研磨 流體之體積分佈予以接觸,該單一濃度研磨流體係輸 送自該出口。 第34頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱〉 (請先朋讀背面之注意事項再$本頁) 裝 訂----.—-ιά «·f 4 E] Range of at least one tube designed to allow the flow of grinding fluid coupled to the arm to flow and to be repositionable between at least two tube holders. The system of claim 12, wherein the at least two tube receiving members define: a first set of tube retaining holes and spaced apart along a first side of the arm; and at least two of The other tube holders define: a second set of tube retaining holes formed on the arm and spaced apart equidistantly along the second side of the arm opposite the first side. 1 4. The system of claim 12, further comprising: a tube clamp disposed within each tube holder having a tube therethrough and coupling the tube to the arm. 1 5. The system of claim 12, further comprising: at least one plug disposed in a hole that is not occupied by the tube. 16. The system of claim 15 wherein the plug further comprises: a central body; and a post extending from the central body, the post being configured to be flush with the arm or protruding Extending beyond the arm, and each of the holes further comprises: a first portion having a threaded section; a second portion disposed coaxially with the first portion and having a page 31 of the present paper size applicable to Chinese national standards ( CNS)A4 specification (210 X 297 mm) -----I-----I------ (Please read the back note on the first page and then on the Hi page) Order 1-- 1! Line · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed B8 C8 D8 1261317 ¥ Please patent the diameter is smaller than the diameter of the first part of the diameter, the plug of the plug is full of the second part; the first order, which is defined in the first a portion between the portion and the second portion; and a set screw that engages with the threaded segment and forces the central body of the plug to abut the step. The system of claim 12, further comprising: a mechanism for selectively changing a combination of tubes through which the abrasive fluid flows. 1 8. A system for delivering a grinding fluid to a chemical mechanical polishing surface, comprising: at least: an arm; a plurality of abrasive fluid delivery tubes; a plurality of apertures formed in the arms for receiving the abrasive flow delivery tubes Each tube is disposed through a hole and coupled to the arm; and wherein the relationship between the abrasive fluid delivery tube and the aperture is represented by the following equation: A/B>l, where A is the number of holes, And B is the number of grinding fluid delivery tubes. 1 9. A method of supplying a grinding fluid to a chemical mechanical polishing surface, the method comprising at least: the 32nd paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----1I11J- --l·— - · 1 1 (Please read the back note on this page first) ·- --Line - Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative print? Take \p6mm Η Β8 C8 D8 Ministry of Economics intellectual property The employee consortium of the bureau prints an Am life, wherein the polishing fluid having a predetermined concentration flows to a first position on the mat at a first flow rate; and a second difference from the first flow rate Flowing at a flow rate to a second position on the mat, wherein the first level is at the same concentration as the second level of the grinding fluid. 20. The method of claim 19, wherein The first flow rate is independently controllable with respect to the second flow rate. The method of claim 20, wherein the adjusting step further comprises: adjusting a grinding metric during grinding Flow rate. 22. A method of delivering a grinding fluid to an abrasive surface of a chemical mechanical grinder, the method comprising: providing a grinding fluid delivery arm having a plurality of tube holding locations in excess of the number of abrasive fluid delivery tubes coupled to the arm From among the tube holding positions, selecting a relative spacing between at least one of the first and second grinding fluid delivery tubes along the arm to produce a desired polishing result; and placing a substrate with a single The volume distribution of the concentration abrasive fluid is contacted, and the single concentration slurry flow system is transported from the abrasive fluid delivery tube. Page 33 The paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---- ---I ^---:---Shang--------Book·1ι — (Please read the notes on the back and then θ page) Line «· VI. Patent application scope B8 C8 D8 The method of claim 22, wherein at least one of the abrasive fluid delivery tubes is moved to a different position along the arm in response to surface characteristics of the substrate being ground. Change. Ministry of Economics intellectual property The method of claim 22, wherein the method of claim 22, wherein at least one of the abrasive fluid delivery tubes is moved to a different position along the arm for changing across a base Partial grinding rate of the diameter of the material. 25. A method of delivering a grinding fluid to an abrasive surface of a chemical mechanical grinder, the method comprising: flowing the grinding fluid into a manifold, the manifold being coupled to the plurality of An outlet disposed on the abrasive surface in a spaced apart manner; allowing the abrasive fluid to circulate around at least one outlet; preventing the flow of the abrasive fluid through at least one of the outlets, wherein the at least one outlet has a condition that may be due to Having a flow of abrasive fluid or no flow of abrasive fluid through the outlet is changed to an opposite condition; and contacting a substrate on the abrasive surface with a volume distribution of a single concentration of abrasive fluid, the single concentration abrasive flow system transporting Since the exit. Page 34 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public love) (please read the back note and then $this page) Binding----..--ιά «·
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US10/131,638 US7086933B2 (en) 2002-04-22 2002-04-22 Flexible polishing fluid delivery system

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