TW472315B - Platen with web release apparatus - Google Patents
Platen with web release apparatus Download PDFInfo
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- TW472315B TW472315B TW89120315A TW89120315A TW472315B TW 472315 B TW472315 B TW 472315B TW 89120315 A TW89120315 A TW 89120315A TW 89120315 A TW89120315 A TW 89120315A TW 472315 B TW472315 B TW 472315B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
472315 Α7 Β7472315 Α7 Β7
五、發明說明() 經濟部智慧財產局員工消費合作社印製 發明領域: 本發明的實施例有關於在研磨萃鉍i L w w τ 士 1试乐統中把膜從平臺釋 放的膜抬舉系統及方法。 發明背景: 在半導體晶圓處理中,化學機械研磨(或稱CMP)的使 用已獲得喜愛’因它能增加在半導體工件或基材(例如晶 圓)上的設備密度。半導體製造中對在晶圓上形成的層狀 物質的平整的需求增加’對有較少晶圓損壞及較佳晶圓平 整的較大系統(亦即處理工具)產能的要求隨之增加。V. Description of the invention () Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economics Field of the Invention: The embodiments of the present invention relate to a membrane lifting system for releasing a membrane from a platform in a milled bismuth i L ww τ 1 method. BACKGROUND OF THE INVENTION: In the processing of semiconductor wafers, the use of chemical mechanical polishing (or CMP) has gained popularity 'because it can increase the density of equipment on semiconductor workpieces or substrates (such as wafers). Increasing demand for planarization of layered substances formed on wafers in semiconductor manufacturing 'demands for larger systems (ie, processing tools) with less wafer damage and better wafer planarization have increased production capacity.
Tolies等人在1 998年4月15日獲准的5,804,5〇7號 美國專利描述一種處理這些問題的CMP系統。Tolies等 人揭示一種有平整系統的C Μ P系統’晶圓從在液體浴中 的昆被送到平整系統。一個運輸機構或機械臂把晶圓從浴 送到運輸站。運輸站包含負載杯把晶圓放入四個被設在轉 盤上的處理頭之一。轉盤依序把每一處理頭送到負載杯以 上以承接晶圓。晶圓被送上處理頭時,轉盤使處理頭及晶 圓通過平整站以研磨。使晶圓在研磨流體中相對研磨材料 移動而使晶圓平整。研磨流體通常包含一些有助於從晶圓 移走物質的化學物。研磨過程的機械部分是把研磨材料放 在研磨流體中或研磨材料上而達成。平整過程完成後,晶 圓經運輸站被送回到在浴中的適當匣中。 化學機械研磨能用的一種研磨材料被稱為固定的研 磨材料。固定的研磨材料包括許多研磨顆粒懸在樹脂粘著 第2頁 本紙張尺度適用T國國家標準(CNS)A4規^^_10 χ 297公楚) --------------裝-----—丨訂--------線 (請先閱讀背面之注意事項再填寫本頁)U.S. Patent No. 5,804,507, approved by Tolies et al. On April 15, 1998, describes a CMP system that addresses these issues. Tolies et al. Disclosed a CMP system 'wafer with a leveling system from a wafer in a liquid bath to a leveling system. A transport mechanism or robotic arm carries the wafers from the bath to the transport station. The transport station contains a load cup to place the wafer into one of four processing heads placed on a turntable. The turntable sequentially sends each processing head above the load cup to receive the wafer. When the wafer is sent to the processing head, the turntable passes the processing head and wafers through a flattening station for grinding. The wafer is moved relative to the abrasive material in the polishing fluid to flatten the wafer. The abrasive fluid usually contains chemicals that help remove material from the wafer. The mechanical part of the grinding process is achieved by placing the abrasive material in or on the abrasive fluid. After the flattening process is complete, the wafers are transported back to the appropriate bins in the bath via the transport station. One type of abrasive that can be used in chemical mechanical polishing is called a fixed abrasive. The fixed abrasive material includes many abrasive particles suspended on the resin. Page 2 This paper is applicable to the national standard of China T (CNS) A4 (^^ 10 x 297). ------------- -Install ------- 丨 Order -------- line (please read the precautions on the back before filling this page)
472315 五、發明說明() 劑中,它被放在若干在支持片上的不連績元件中。系統用 的研磨材料含研磨顆粒時,系統通常用不含研磨材料的研 磨流體。這種研磨流體強化流體輸送系統的服務壽命。 固定的研磨材料通常是下貼式,但經常被做成膜的形 式°通$ ’膜被支持在平臺上,平臺有中心或工作區,研 磨過程在此區中進行。不在平臺上的膜的未用過的部分被 存在一個連到平臺的侧面的輥中。當膜在晶圓的研磨過程 中被消耗’移動膜而把—段未用過的膜放在平臺的工作區 中。離開平臺的膜的被用過的部分被捲在捲膜輥上,捲膜 幸昆與供料輕在平臺的相反側。 然而’在研磨平臺上移動膜在一些時候是困難的。與 膜接觸的研磨流體可能使表面張力或吸力發生在膜與平 臺之間。在移動膜時’膜移動裝置須克服此表面張力。若 在膜與平臺之間的吸力大,則移動裝置可能無法移動膜或 在移動過程中損壞膜。 因此’需要一種在研磨系統中克服膜的吸力的系統及 方法》 爰JO的及fe沭: 本發明的一觀點提供釋放研磨材料膜的設備。在一實 施例中,本設備包括平臺,平臺有—或更多喷嘴與其相 連。平臺有支持面支持研.磨材料。嘴嘴允許流體通過而流 到研磨材料的背面,此流體迫使研磨材料至少部分離開平 臺β在另一實施例中,噴嘴有中心線與支持面形成銳角, 第3頁 本紙張尺度適帛中國國家標準(CNS)A4規格(210 X 297公餐) - -------裝----fc---—訂·--------線' (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 472315472315 Fifth, the invention description () agent, it is placed in a number of non-continuous components on the support film. When the abrasive material used in the system contains abrasive particles, the system usually uses an abrasive fluid that does not contain abrasive material. This abrasive fluid enhances the service life of the fluid delivery system. The fixed abrasive material is usually a bottom-attachment type, but it is often made into the form of a film. The film is supported on a platform, and the platform has a center or a work area, and the grinding process is performed in this area. The unused portion of the film not on the platform is stored in a roller attached to the side of the platform. When the film is consumed during the wafer grinding process, the film is moved and an unused piece of film is placed in the work area of the platform. The used part of the film leaving the platform is wound on a film roll, and the film is fortunately on the opposite side of the platform from the feed. However, it is sometimes difficult to move the film on the grinding platform. Abrasive fluids in contact with the membrane may cause surface tension or suction to occur between the membrane and the platform. When moving the film, the film moving device must overcome this surface tension. If the suction between the membrane and the platform is large, the mobile device may not be able to move the membrane or damage the membrane during the movement. Therefore, there is a need for a system and method for overcoming the suction of a film in a polishing system. "Jo and Fe": An aspect of the present invention provides an apparatus for releasing a film of an abrasive material. In one embodiment, the device includes a platform, the platform having-or more nozzles connected to it. The platform has a support surface to support grinding and grinding materials. The mouth allows fluid to flow through to the back of the abrasive material. This fluid forces the abrasive material to leave the platform at least partially. In another embodiment, the nozzle has a centerline and an acute angle with the support surface. Page 3 This paper is suitable for China. Standard (CNS) A4 specification (210 X 297 meals)-------- installation ---- fc ---- order · -------- line '(Please read the note on the back first Please fill in this page for further information.) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 472315
五、發明說明() 這使流體從喷嘴流向平臺的中心β 本發明的另-觀點提供釋放研磨材料膜的方法。在— 實施例中’本方法包括若干步驟:支持研磨材料的至少部 分於平臺上,提供流體於研磨材料之間;及抬起研磨材料 的至少部分離開平臺。在一實施例中,研磨材料被移離開 平臺。 圖式簡單說明: 第1圖是本發明的化學機械研磨系統的立面圖。 第2圖是平臺的一實施例的橫剖圖。 第3圖是沿第2圖的剖線3 - 3所取的部分橫剖圖,描繒'抬 舉系統的一實施例。 第4圖是沿第2圖的剖線4-4所取的剖分橫剖圖。 第5圖是抬舉系統的另一實施例的部分橫剖圖。 第6Α及6Β圖是平臺的橫剖圖,顯示在處理及分離方位 的膜。 第7圖是抬舉系統的另一實施例的橫剖圖。 第8圖是另一個有抬舉系統的化學機械研磨設備的立面 圖。 經濟部智慧財產局員工消費合作社印製 圖號對照說明 100 化學機械研磨機 102 驅動系統 104 研磨媒體匣 106 平臺 108 抬舉設備 110 研磨頭 第4頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 472315 A7 B7 五、發明說明() 經濟部智慧財產局員工消費合作杜印製 112 載具板 114 台 116 軌 118 支持件 122 基材 124 中央凹處 126 流體供應器 128 噴嘴 130 次塾 132 次板 136 研磨,材料膜 138 膜 140 供料輥 142 捲膜輥 144 導件 146 調節器 150 驅動器 152 驅動器 154 第一側凹處 156 第二侧凹處 158 胚料 160 頂面 202 第一侧 204 第二側 206 側邊 208 溝 2 10 通道 212 通道 224 安裝孔 226 孔 228 通道 230 平臺 252 研磨材料 302 側壁 304 管子 306 真空源 308 本體 310 頂面 3 12 第一側 3 14 第二側 3 16 底 3 18 固定器 320 螺孔 322 角 330 喷嘴 332 頂角 402 第一端 404 第二端 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) — — — — — — — — — — - — III·-------— I —--- (請先閱讀背面之注意事項再填寫本頁) 472315 A7 B7 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明( 406 塞子 408 配件 500 抬舉系統 502 本體 504 噴嘴 506 孔 508 管 510 配件 512 流體供應器 514 流量控制機構 516 膜 518 平臺 700 研磨機 702 膜 704 旋轉平臺 706 研磨頭 708 基材 710 抬舉設備 800 研磨機 802 下貼式墊 804 旋轉平臺 808 基材 8 1 0 抬舉設備 發明詳細說明: 第1圖是一個採用至少一個抬舉設備1 〇 8的化學機械 研磨機100。一個能從本發明獲益的研磨機1〇〇是在5. Description of the invention () This allows the fluid to flow from the nozzle to the center of the platform β. Another aspect of the invention provides a method for releasing a film of abrasive material. In the-embodiment, the method includes several steps: supporting at least a portion of the abrasive material on the platform, providing fluid between the abrasive materials, and lifting at least a portion of the abrasive material away from the platform. In one embodiment, the abrasive material is removed from the platform. Brief description of the drawings: Fig. 1 is an elevation view of a chemical mechanical polishing system of the present invention. Fig. 2 is a cross-sectional view of an embodiment of the platform. Fig. 3 is a partial cross-sectional view taken along section line 3-3 of Fig. 2 and depicts an embodiment of the 'lifting system'. Fig. 4 is a sectional cross-sectional view taken along section line 4-4 of Fig. 2. Fig. 5 is a partial cross-sectional view of another embodiment of the lifting system. Figures 6A and 6B are cross-sectional views of the platform, showing the membrane in the processing and separation orientation. Fig. 7 is a cross-sectional view of another embodiment of the lifting system. Figure 8 is an elevation view of another chemical mechanical polishing equipment with a lifting system. Printed reference number printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 100 Chemical mechanical grinder 102 Drive system 104 Grinding media cassette 106 Platform 108 Lifting equipment 110 Grinding head Page 4 This paper applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) 472315 A7 B7 V. Description of the invention () Consumption cooperation with employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Du printed 112 Carrier boards 114 Taiwan 116 Rails 118 Supports 122 Substrates 124 Central recesses 126 Fluid supply 128 Nozzles 130 times 塾 132 times plate 136 grinding, material film 138 film 140 feed roller 142 film roll 144 guide 146 regulator 150 driver 152 driver 154 first side recess 156 second side recess 158 blank 160 top surface 202 First side 204 Second side 206 Side 208 Groove 2 10 Channel 212 Channel 224 Mounting hole 226 Hole 228 Channel 230 Platform 252 Abrasive material 302 Side wall 304 Pipe 306 Vacuum source 308 Body 310 Top surface 3 12 First side 3 14 Second Side 3 16 bottom 3 18 holder 320 screw hole 322 angle 330 nozzle 332 top angle 402 first end 404 second end page 5 this Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) — — — — — — — — — — — — III · -------— I —--- (Please read the back first Please pay attention to this page, please fill in this page) 472315 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (406 Stopper 408 Accessories 500 Lifting System 502 Body 504 Nozzle 506 Hole 508 Pipe 510 Accessories 512 Fluid Supply 514 Flow Control Mechanism 516 Membrane 518 Platform 700 Grinder 702 Membrane 704 Rotary platform 706 Grinding head 708 Substrate 710 Lifting equipment 800 Grinder 802 Lower pad 804 Rotating platform 808 Substrate 8 1 0 Lifting equipment Detailed description of the invention: Figure 1 is a A chemical mechanical grinder 100 using at least one lifting device 108. A grinder 100 that can benefit from the present invention is
Santa Clara,California 的 Applied Materials, Inc·製造的 FLAT LAND® 8200化學機械研磨機。雖然抬舉設備被 描述在特定化學機械研磨機中,熟悉此技術者可能把在此 描述的抬舉設備用在其他採用研磨材料膜或|的化 學機械研磨機。 邊從本發明獲益的研磨機丨〇〇的—例是1999年2月 29日申請並讓與Sommer的美國專利申請案號6〇/185,812 描述的研磨機,該案被用在本案中成為參考。研磨機1〇〇 第6頁 (請先閱讀背面之注意事項再填寫本頁) 裝 --------—訂------I--線' 經濟部智慧財產局員工消費合作社印製 472315 A7 ______ - B7 五、發明說明() 包括驅動系統1 02、研磨媒體匣1 04及平臺1 〇6(有—戋更 多抬舉系統1 08)。驅動系統1 02包括研磨頭1丨〇,它在處 理中維持基材122。研磨媒體匣104包括一張研磨材料膜 136 ’被置於供料輥140與捲膜輥142之間而橫跨平臺 106。研磨頭11〇保持基材122抵住膜136在平臺1〇6上 的邵分,在同時’驅動系統1 〇2依研磨圖案使研磨頭j j 〇 及基材1 22相對膜1 36移動。 研磨媒體匣1 04的一例見於Donohue等人在1997年 4月4日申請的〇8/833,278號美國專利申請案。研磨媒體 匣104拉、調解並使研磨材料膜136通過平臺1〇6。雖然 在此描述的研磨媒體匣1〇4處理有固定的研磨材料的膜 136(例如 Minnesoa Manufacturing and Mining company, Saint Paul,Minnesota提供者),抬舉設備i〇8還能採用傳 統發泡的聚氨酯研磨材料(例如R〇del Inc., Newark, Delaware提供者)。讀者還應注意研磨機的抬舉設備1 〇8 可能另採用研磨材料的下黏膜(stick-down pad)以協助從 研磨材料移走塾子。 一般而言,膜136的不用的部分被繞在供料輥140上 而被用的部分被繞在捲膜輥142上。供料輥140及捲膜輟 142分別連到驅動器150及152而提供張力給跨過平臺 106在輥140與142之間的膜136。驅動器150及152可 能是步進馬達、氣動馬達、伺服馬達或類似者。 研磨媒體匣104通常包括導件144在平臺106的每一 侧。導件144使膜136平行於平臺106。隨著在平臺1〇6 第7頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ^----------^---------線 (請先閱讀背面之注意事項再填寫本頁) 47231 A7FLAT LAND® 8200 Chemical Mechanical Grinder manufactured by Applied Materials, Inc. of Santa Clara, California. Although lifting equipment is described in specific chemical mechanical grinders, those skilled in the art may use the lifting equipment described herein in other chemical mechanical grinders using abrasive material films or |. An example of a grinder that benefits from the present invention is the grinder described in US Patent Application No. 60 / 185,812, filed on February 29, 1999 and assigned to Sommer, which was used in this case to become reference. Grinding machine 100 page 6 (please read the precautions on the back before filling this page) ---------- Order ------ I--line 'Consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative 472315 A7 ______-B7 V. Description of the invention () Including drive system 102, grinding media box 104 and platform 1 06 (yes-more lifting system 1 08). The drive system 102 includes a grinding head 10, which maintains the substrate 122 during processing. The abrasive media cassette 104 includes a sheet of abrasive material 136 'placed between the feed roll 140 and the film roll 142 across the platform 106. The polishing head 110 holds the substrate 122 against the shaw of the film 136 on the platform 106, and at the same time, the driving system 1 02 moves the polishing head j j 0 and the substrate 1 22 relative to the film 1 36 according to the polishing pattern. An example of abrasive media cassette 104 is found in U.S. Patent Application No. 08 / 833,278, filed April 4, 1997, by Donohue et al. The abrasive media cassette 104 pulls, mediates, and passes the abrasive material film 136 through the platform 106. Although the grinding media cassette 104 described herein handles a fixed abrasive material film 136 (eg, Minnesoa Manufacturing and Mining company, Saint Paul, Minnesota), the lifting device i 08 can also be ground using conventional foamed polyurethane. Materials (eg Rodel Inc., Newark, Delaware provider). The reader should also note that the lifting device 1 08 of the grinder may additionally use a stick-down pad of the abrasive material to assist in removing the ladle from the abrasive material. Generally, the unused portion of the film 136 is wound on the supply roll 140 and the used portion is wound on the film roll 142. The feed roll 140 and the roll film 142 are connected to drives 150 and 152, respectively, to provide tension to the film 136 across the platform 106 between the rolls 140 and 142. The drivers 150 and 152 may be stepper motors, air motors, servo motors, or the like. The abrasive media cassette 104 generally includes guides 144 on each side of the platform 106. The guide 144 makes the film 136 parallel to the platform 106. With the paper size on the platform 106, page 7, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ^ ---------- ^ --------- (Please read the precautions on the back before filling this page) 47231 A7
經濟部智慧財產局員工消費合作社印製 五、發明說明() 上的膜1 3 6的部分在研磨過程中被消耗,膜丨3 6步進地被 送過平臺106。膜136的前進把一段新的未用過的膜136 從供料輥1 4 0送到平臺1 〇 6的頂部並把—段用過的膜1 3 6 移走’用過的膜I 36被捲膜輥1 42捲起來。 研磨媒體匣104還包括調節器146。調節器146通常 維持膜1 3 6的表面在產生均勻研磨結果的狀態中。舉例而 言’在膜1 3 6包括固定的研磨材料的例子中,在使用前須 調節膜136,以均勻暴露一些在膜136上的研磨件所帶的 研磨顆粒。調節器146(可能包括刷子、有平面或紋面或其 他面的柱子)接觸膜136而在膜136接觸基材122以先處 理膜1 36的面》這樣調節器1 46通常被用在傳統研磨系統 中〇Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The part of the film 1 3 6 on the description of the invention is consumed during the grinding process, and the film 36 is sent to the platform 106 step by step. The advancement of the film 136 brings a new piece of unused film 136 from the supply roller 1 40 to the top of the platform 1 06 and removes the used film 1 3 6 'the used film I 36 is The film roll 1 42 is rolled up. The abrasive media cassette 104 also includes a regulator 146. The regulator 146 generally maintains the surface of the film 136 in a state that produces a uniform polishing result. For example, in the case where the film 1 3 6 includes a fixed abrasive material, the film 136 must be adjusted before use to uniformly expose some abrasive particles of the abrasive member on the film 136. The regulator 146 (which may include a brush, a post with a flat or textured surface or other surface) contacts the membrane 136 and the membrane 136 contacts the substrate 122 to pre-treat the surface of the membrane 1 36. Such a regulator 1 46 is usually used in conventional grinding In the system
Sommer在1 997年10月31日申請的08/961,6〇6號 美國專利申請案描述一種從本發明獲益的驅動系統i 〇2 的實施例。驅動系統1 02使研磨頭1 1 〇相對研磨材料的膜 1 3 6移動。驅動系統1 〇2通常包括台丨丨4及載具板i丨2。 台114在二平行軌116(及軸承)上沿網136的輪廓線性移 動。每一軌116連到支持件118,支持件118連到平臺1〇6。 第一驅動器(未被描繪)連到台11 4並控制台沿轨丨丨6的移 動。第一驅動器可能包括一或更多Sawyer馬達、竹服馬 達' 步進馬達及其他設備以產生並控制線性移 勒。第一驅 動器的一部分連到支持件丨1 8而第二部分連到Α J 〇 114。 載具板11 2經二平行軌1 38(及軸承)連到Α , J 〇 1 1 4。軌 138被設在載具板112與台U4之間,允許恭直j 秋丹板1 2相對 第8頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公楚) " --------- I-----I I ---I ^ ----- I--^---------線 (請先閱讀背面之注杳?事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 472315 A7 ____ _ B7 五、發明說明() 台11 4的移動垂直移動。第二驅動器(未被描缯)連到載具 板11 2並控制載具板11 2沿軌1 3的移動。第二驅動器與 第一驅動器有相同構造。第二驅動器的一部分連到載具板 11 2而第二部分連到台1 1 4。 載具板11 2支持研磨_頭11 〇。研磨頭11 〇_連到未被描 缯·的啟動器’以致在研磨頭中的基材可能在研磨過程中接 觸膜1 3 6。可能被用在研磨機1 〇 〇中的研磨頭的若干例子 是 Applied Materials, Inc.,of Santa Clara,California 製造 的TITAN HEADtm晶圓載具及DIAMOND HEADtm晶圓載 具。在一實施例中,台114及載具板112的結合的動作造 成研磨頭110抓著的基材112相對膜136的χ-y或軌道研 廢動作。 一或更多噴嘴1 28被設在研磨機1 〇〇中而在研磨過程 中提供研磨流體於基材122與膜136之間。噴嘴128可能 連到驅動系統I 02、平臺1 06或被設在其他位置而使研磨 流體從噴嘴12流到膜138。研磨流體包括去離子的水及 一或更多種有助於把材料從晶圓移走的化學劑。研磨流體 可能包括研磨材料。 平臺106是平面’基材122在此平面上被研磨。平臺 106通常由鋁做成。平臺1〇6有頂面160支持膜136。頂 面1 60包括中央凹處1 24及第一侧凹處1 54及第二侧凹處 1 5 6 »次墊1 3 0及次板丨3.2被設在中央凹處1 24中。次墊 1 3 0通常是塑膠,例如聚碳酸酯及發泡的聚氨基鉀酸酯。 次墊1 3 0(與次板1 3 2結合)的硬度可能被選成以產生特定 第9貫 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) I I 1!-裝----t----訂------!-線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 472315 A7 ---- B7 五、發明說明() 研磨結果。次墊1 3 0維持研磨材料的膜丨3 6平行於研磨頭 110抓住的基材122的平面並促進基材122的全面平面 化。次板1 3 2被放在次墊丨3 〇與凹處1 2 4的底部之間,以 致次墊1 30的頂面在平臺1 〇6的頂面1 60中,亦即共面。 側凹處1 5 4及_ 1 5 6的至少一個包住抬舉設備1 〇 8。抬 舉設備1 0 8連到流體供應器12 6。抬舉設備1 〇 8可能被啟 動以提供流體(例如空氣、氮及類似者)於平臺1 0 6與膜1 3 6 之間以迫使膜1 3 6離開平臺1 〇 6。從抬舉設備1 〇 8離開的 流體釋放在膜1 3 6與平臺1 〇 6之間的吸引力(例如在膜下 的流體造成的膜吸引力或表面張力)。在一個實施例中, 從抬舉設備1 0 8離開的流體使膜1 3 6從平臺1 0 6分開。 一或更多抬舉設備108可能被放在平臺1〇6的一或更 多邊附近。在一實施例中,抬舉設備1 〇 8在平臺1 0 6的凹 處154中,接近捲膜輥140。典型地,胚料158在第二凹 處156中。選擇地,另一抬舉設備1〇8可能取代胚料158 而被放在第二凹處中,在平臺106的一或二相鄰侧上,或 其組合。 第2圖是平臺1 0 6的一實施例的俯視圖。平臺1 〇 6的 頂面有第一側202接近供料輥140,還有第二侧204接近 捲膜輥142,另有一對側邊206。平臺1 〇6的頂面160又 包括溝208接近平臺106的邊,其在研磨材料膜136下。 溝208包括兩條通道210在頂面160中,接近平臺的 侧邊206。溝208還包括兩條通道2 1 2,其可能包括侧凹 處154及156的部分。通道212可能在頂面16〇中’從凹 第101 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) — II I-----裝----I---—訂---I-----線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 472315 A7 ________B7 五、發明說明() 處154及156向内。 參考第3圖,在溝208的一實施例中,通道212被界 定在凹處154的一側壁302與抬舉設備1〇8的第—侧312 之間。通道212連通管子304,其連到真空源、3〇6真空源 3 06選擇地提供真空給溝2〇8,其在處理中使膜〖%附著 平臺1 06。研磨材料維持系統的一例見於以也⑺以等人在 1999年2月25日申請的〇9/2 58,036號美國專利申請案》 謂者應汪意可能採用其他型設備以可釋放地把研磨材料 252固定到平臺230,例如可釋放的黏劑、靜電吸盤、機 械夹及其他可釋放的維持機構。 界定通道2 1 2的一側的抬舉設備丨〇 8包括一或更多噴 嘴330以噴出流體。從供應器丨26而來並從噴嘴3〇〇喷出 的流體迫使膜108離開平臺106,克服在膜1〇8、平臺1〇6 與次塾1 3 0之間的吸引力及任何可能呈現在膜丨3 8以下的 流體(例如研磨流體)造成的表面張力。 在一實施例中’抬舉設備108包括本體308,本體3〇8 有第一側3 12、第二侧3 i 4、頂面3 1 0及底3 1 6。若干固 定器318從本體308的頂面穿過安裝孔224,並被鎖入在 第一凹處154中的配對的螺孔320。密封件或墊片(未被描 繪)被用在抬舉件1 〇 8與平臺1 〇 6之間以防止其間的戍 露。替代地’可能採用其他裝置(例如螺栓、鉚釘、夾、 黏劑及類似者)把抬舉設備1 〇8固定到平臺1 〇6。 典型地’本體308的第二側3 1 4與頂面3 1 0形成一個 有半徑的角或削角。角322的半徑使膜1 36從該處經過時 第11貰 本紙張尺度適用中國國家祙準(CNS〉A4規格(210 X 297公釐)US Patent Application No. 08 / 961,606, filed by Sommer on October 31, 997, describes an embodiment of a drive system i 02 that benefits from the present invention. The drive system 102 moves the polishing head 1 10 relative to the film 1 3 6 of the polishing material. The drive system 102 generally includes a platform 丨 4 and a carrier board 丨 2. The stage 114 moves linearly along the outline of the net 136 on the two parallel rails 116 (and the bearings). Each track 116 is connected to a support 118, which is connected to the platform 106. The first driver (not depicted) is connected to the stage 11 4 and the console moves along the track 6. The first driver may include one or more Sawyer motors, bamboo servo motors, and other equipment to generate and control linear displacement. A part of the first drive is connected to the supporting member 18 and a second part is connected to AJ 114. The carrier plate 11 2 is connected to A, J 〇 1 1 4 through two parallel rails 1 38 (and bearings). The rail 138 is set between the carrier plate 112 and the table U4, allowing respectfully j Qiudan plate 1 2 relative to page 8. This paper size applies the Chinese National Standard (CNS) A4 specification (21〇X 297). --------- I ----- II --- I ^ ----- I-^ --------- line (Please read the note on the back first? Matters Refill this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 472315 A7 ____ _ B7 V. Description of the invention () The movement of the platform 11 4 moves vertically. A second driver (not depicted) is connected to the carrier plate 112 and controls the movement of the carrier plate 112 along the rail 13. The second driver has the same structure as the first driver. A part of the second driver is connected to the carrier board 11 2 and the second part is connected to the stage 1 1 4. The carrier plate 112 supports a grinding head 11. The grinding head 11 〇_ is connected to an unillustrated starter 'so that the substrate in the grinding head may contact the film 1 3 6 during the grinding process. Several examples of grinding heads that may be used in the grinding machine 1000 are the TITAN HEADtm wafer carrier and the DIAMOND HEADtm wafer carrier manufactured by Applied Materials, Inc., of Santa Clara, California. In one embodiment, the combined action of the stage 114 and the carrier plate 112 causes the x-y or orbital scraping action of the substrate 112 held by the polishing head 110 with respect to the film 136. One or more nozzles 1 28 are provided in the grinder 100 to provide a grinding fluid between the substrate 122 and the film 136 during the grinding process. Nozzle 128 may be connected to drive system 02, platform 106, or otherwise located to allow the abrasive fluid to flow from nozzle 12 to membrane 138. The abrasive fluid includes deionized water and one or more chemicals that help remove material from the wafer. Abrasive fluids may include abrasive materials. The platform 106 is a flat surface. The substrate 122 is ground on this flat surface. The platform 106 is typically made of aluminum. The platform 106 has a top surface 160 supporting film 136. The top surface 1 60 includes a central recess 1 24 and a first side recess 1 54 and a second side recess 1 5 6. The secondary pad 1 30 and the secondary plate 3.2 are provided in the central recess 1 24. The secondary pad 1 3 0 is usually plastic, such as polycarbonate and foamed polyurethane. The hardness of the secondary pad 1 3 0 (combined with the secondary plate 1 3 2) may be selected to produce a specific 9th paper size applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) II 1! -Pack ---- t ---- Order ------! -Line (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 472315 A7 ---- B7 V. Description of the invention () Grinding results. The secondary pad 1 3 0 maintains a film of the abrasive material 3 6 parallel to the plane of the substrate 122 held by the polishing head 110 and promotes the overall planarization of the substrate 122. The secondary plate 1 3 2 is placed between the secondary pad 1 30 and the bottom of the recess 1 2 4 so that the top surface of the secondary pad 1 30 is in the top surface 1 60 of the platform 1 06, that is, coplanar. At least one of the undercuts 1 5 4 and _ 1 5 6 surrounds the lifting device 108. A lifting device 1 0 8 is connected to the fluid supply 12 6. The lifting device 108 may be activated to provide a fluid (such as air, nitrogen, and the like) between the platform 106 and the membrane 1 36 to force the membrane 1 36 to leave the platform 106. The fluid leaving from the lifting device 108 releases the attraction between the membrane 136 and the platform 106 (for example, the membrane attraction or surface tension caused by the fluid under the membrane). In one embodiment, the fluid exiting from the lifting device 108 separates the membrane 13 from the platform 106. One or more lifting devices 108 may be placed near one or more sides of the platform 106. In one embodiment, the lifting device 108 is close to the film roll 140 in the recess 154 of the platform 106. Typically, the blank 158 is in the second recess 156. Alternatively, another lifting device 108 may replace the blank 158 and be placed in the second recess, on one or two adjacent sides of the platform 106, or a combination thereof. Fig. 2 is a plan view of an embodiment of the platform 106. The top surface of the platform 106 has a first side 202 close to the feed roll 140, a second side 204 close to the film roll 142, and a pair of side edges 206. The top surface 160 of the platform 106 includes the edge of the trench 208 close to the platform 106 under the abrasive material film 136. The trench 208 includes two channels 210 in the top surface 160, near the side 206 of the platform. The trench 208 also includes two channels 2 1 2 which may include portions of undercuts 154 and 156. The channel 212 may be in the top surface 160. 'Concave 101' This paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) — II I ----- installation ---- I --- —Order --- I ----- line (please read the notes on the back before filling this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 472315 A7 ________B7 V. Description of the invention () 154 and 156 inward . Referring to Fig. 3, in one embodiment of the trench 208, the channel 212 is defined between a side wall 302 of the recess 154 and the first side 312 of the lifting device 108. The channel 212 communicates with a tube 304, which is connected to a vacuum source, 3 06 vacuum source 3 06, and optionally provides a vacuum to the groove 20 8, which causes the membrane to adhere to the platform 10 06 during processing. An example of an abrasive material maintenance system is found in U.S. Patent Application No. 09/2 58,036, filed February 25, 1999 by Ye Yeyi et al. The claimant should use other types of equipment to release the abrasive material releasably 252 is fixed to platform 230, such as releasable adhesive, electrostatic chucks, mechanical clips, and other releasable holding mechanisms. The lifting device defining one side of the channel 2 12 includes one or more nozzles 330 to spray fluid. The fluid coming from the feeder 26 and ejected from the nozzle 300 forces the membrane 108 to leave the platform 106, overcoming the attraction between the membrane 108, the platform 106 and the time 130, and any possible presentation Surface tension caused by fluids (such as abrasive fluids) below the membrane. In one embodiment, the 'lifting device 108 includes a main body 308. The main body 308 has a first side 3 12, a second side 3 i 4, a top surface 3 1 0, and a bottom 3 1 6. A plurality of fasteners 318 pass through the mounting holes 224 from the top surface of the body 308 and are locked into the mating screw holes 320 in the first recess 154. A seal or gasket (not depicted) is used between the lifting member 108 and the platform 106 to prevent exposure therebetween. Alternatively ' other means (such as bolts, rivets, clips, adhesives, and the like) may be used to secure the lifting device 108 to the platform 106. Typically, the second side 3 1 4 of the body 308 and the top surface 3 1 0 form a radiused or chamfered angle. The radius of the corner 322 allows the film 1 36 to pass through from there. The 11th paper size applies to the Chinese national standard (CNS> A4 size (210 X 297 mm)
In —---裝! -----—訂-----I I--線 (請先閱讀背面之注意事項再填寫本頁} 472315In —--- install! -----— Order ----- I I--line (Please read the notes on the back before filling this page} 472315
五、發明說明() 經濟部智慧財產局員工消費合作社印製 發生損壞的可能性降到最低β 通道228貫穿本體308。一或更容3丨+ 4文多孔226在本體3〇8 中並切過通道228。典型地,孔226的古地®丄 札的末端變成噴嘴33〇 而它在本體308的第一側。孔226血平喜1%·^ 興十壹106的頂面160 夾一個銳角α。孔26向内指向平臺丨〇6的中央部。孔2% 的方向使孔226的延伸的直徑離開溝2〇8的對壁的頂角 332。 ' 替代地,噴嘴3 3 0可能被設在本體3〇8的頂面31〇。 抬舉設備108有噴嘴330在本體308的頂面,此種構造在 無溝的平臺中特別有用。 在一實施例中’至少三個喷嘴33〇被設在本體3〇8 中。噴嘴3 3 0有約0 _ 03到〇 · 1 3吋的直徑而受到每平方对 約3 0到5 0磅的壓力。若噴嘴3 3 0受到太高壓力或流率, 則膜1 3 6可能振動。 參考第4圖,在抬舉設備1 〇 8的一實施例中,通道 228有第一端402及第二端4〇4。一個塞子406被設在第 一端402以防止在通道228中的流體從第一端402離開。 配件408被設在通道226的第二端404中。配件408有利 於通道226與流體供應器126之連通。 第5圖描繪抬舉系統的另一實施例500。抬舉系統5〇〇 被設在平臺106上,類似參考第1 -4圖所述的抬舉系統 108。抬舉系統500包括本體502,其中有一或更多噴嘴 504。每一噴嘴504經孔506連管5〇8。配件510被設在 管5 0 8中並連到流體供應器5 1 2。可選擇地’流量控制機 第12頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 裝----k----訂---------線 (請先閱讀背面之注意事項再填寫本頁) 472315V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The possibility of damage is reduced to a minimum β channel 228 runs through the body 308. One or more volume 3 丨 4 pores 226 are in the body 308 and cut through the channel 228. Typically, the end of the Gourmet® tab of the hole 226 becomes the nozzle 33 ° and it is on the first side of the body 308. The hole 226 is about 1% blood, and the top surface 160 of Xingshiyi 106 has an acute angle α. The hole 26 points inward to the center of the platform 〇〇6. The direction of the hole 2% causes the diameter of the extension of the hole 226 to leave the apex angle 332 of the opposite wall of the groove 208. 'Alternatively, the nozzle 330 may be provided on the top surface 31 of the body 308. The lifting device 108 has a nozzle 330 on the top surface of the body 308, and this configuration is particularly useful in trenchless platforms. In one embodiment, 'at least three nozzles 33 are provided in the body 308. Nozzle 3 3 0 has a diameter of about 0 to 03 to 13 inches and is subjected to a pressure of about 30 to 50 pounds per square pair. If the nozzle 3 3 0 receives too high pressure or flow rate, the film 1 3 6 may vibrate. Referring to Fig. 4, in an embodiment of the lifting device 108, the channel 228 has a first end 402 and a second end 404. A plug 406 is provided at the first end 402 to prevent fluid in the channel 228 from leaving the first end 402. An accessory 408 is provided in the second end 404 of the channel 226. The fitting 408 facilitates communication between the channel 226 and the fluid supply 126. Figure 5 depicts another embodiment 500 of a lifting system. The lifting system 500 is provided on the platform 106, similar to the lifting system 108 described with reference to FIGS. 1-4. The lifting system 500 includes a body 502 with one or more nozzles 504 therein. Each nozzle 504 is connected to a tube 508 through a hole 506. A fitting 510 is provided in the tube 5 0 8 and connected to the fluid supply 5 1 2. Optional 'Flow controller page 12 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm). ---- k ---- order --------- line (Please read the notes on the back before filling this page) 472315
五、發明說明( (請先閱讀背面之注意事項再填寫本頁) 構5 1 4 (例如調節器、孔、比例閥或類似者)被設在供應器 5 12與管508之間以控制通過每一噴嘴504的流體的流 動°因此’可能微調接近抬舉系統5 〇 〇的膜5 1 6的抬舉, 以致膜5 1 6的一部分高於另一部分,或確保流體均勻通過 抬舉系統500的全部噴嘴504的。舉例而言,在包括三或 更多個喷嘴504的抬舉系統中,中央喷嘴可能有較高的流 率以提供更多流體(例如空氣)在膜5丨6的中心以下。在中 心的較高流率對應地較大升力以克服在平臺5丨8的中心 (離噴嘴504最遠)的流體張力。替代地,在每一管5〇8中 的配件可能被接在一起,.單流體管把配件5 1 〇連到流體供 應器512。 經濟部智慧財產局員工消費合作社印製 參考第6A及6B圖,在作業中,真空被送到溝208。 在溝208中的真空產生向下力602而使膜136在研磨過程 中貼著平臺(看第6A圖)。一旦完成研磨並要移動膜136, 從溝208移走真空(亦即施壓力於溝或使溝通大氣)並從流 體供應器1 26送流體到抬舉設備1 〇8。從供應器1 26而來 的流體流入本體308並從噴嘴300喷出。流600(通常是氣 流)衝擊膜1 3 8並使膜1 30離開平臺1 06。流600從平臺 106釋放膜138,以致至少膜138的一部分從平臺1〇6被 抬起。在一實施例中’流600抬起膜138而使它離開平臺 106 » 流600衝擊膜136的角α有第一向量604提供向上的 力°流600另有第二向量606迫使流600向上到膜136的 中心部,使液體流到膜1 3 6以下,並克服表面張力及其他 第13頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 472315 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明( 力造成的膜1 36與平臺i〇6的吸引。噴嘴330的角α允許 抬舉設備108被放在平臺106及膜136的周圍’離開對表 面變化敏感(可能造成研磨不均勻)的研磨區(亦即在次墊 1 4 0以上的區域)。又,在平臺丨〇 6的周圍的抬舉設備丨〇 8 的位置辅助設計的簡化’因無需複雜技術使空氣流過平臺 106、次塾130及次板132。 第7圖描繪另一研磨機700,它採用膜702於旋轉平 臺704上。研磨頭706在研磨過程中維持基材7〇8抵住平 臺7 04。至少一個抬舉設備7丨〇連到平臺7〇4。構造上, 抬舉設備7 1 0近似參考第1 _6B圖所述的抬舉設備1 〇8。 Birang等人於1999年2月4曰申請之09/244,456號美國 專利申請案描述一種可能從抬舉設備7 1 0獲益的研磨機 700。抬舉設備710可能被啟動而把膜702從平臺704推 走。在一實施例中,抬舉設備7 1 0使膜702離開平臺704 以便利膜702的前進。 第8圖描繪另一研磨機8 0 0,它採用研磨材料的下貼 式墊802於旋轉平臺804上。研磨頭806在研磨過程中維 持基材808抵住平臺804。抬舉設備810連到平臺804。 抬舉設備8 1 0就構造而言近似參考第1-6B圖所述的抬舉 設備108。Tolies等人於1 998年4月15日獲准之5,804,507 號美國專利描述一種可能從抬舉設備8 1 0獲益的研磨機 800。抬舉設備810可能被啟動而把膜802從平臺804抬 起,克服其間的粘著,便利墊8 0 2的間歇移走及置換。 第 141" 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) I I I III ^--— It---t· — !---I I ^ {請先閱讀背面之注意事項再填寫本頁)V. Description of the invention ((Please read the notes on the back before filling this page) Structure 5 1 4 (such as regulator, hole, proportional valve or the like) is set between the supply 5 12 and the tube 508 to control the passage The flow of the fluid at each nozzle 504 is therefore 'possible to fine-tune the lifting of the film 5 1 6 close to the lifting system 5 00 such that a portion of the film 5 1 6 is higher than the other, or to ensure that the fluid passes uniformly through all the nozzles of the lifting system 500 504. For example, in a lifting system that includes three or more nozzles 504, the central nozzle may have a higher flow rate to provide more fluid (such as air) below the center of the membrane 5 丨 6. The higher flow rate corresponds to a larger lift to overcome the fluid tension in the center of the platform 5 丨 8 (farthest from the nozzle 504). Alternatively, the fittings in each tube 508 may be connected together. The single-fluid tube connects the fitting 5 10 to the fluid supplier 512. The Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed reference to Figures 6A and 6B. In operation, a vacuum is sent to the trench 208. The vacuum in the trench 208 is generated Downward force 602 causes film 136 to grind The platform is attached in the process (see Figure 6A). Once the grinding is completed and the membrane 136 is to be moved, the vacuum is removed from the groove 208 (ie, pressure is applied to the groove or the atmosphere is communicated) and the fluid is sent from the fluid supply 126 to the lift Apparatus 1 0. Fluid from the supplier 1 26 flows into the body 308 and is ejected from the nozzle 300. A stream 600 (usually a gas stream) impacts the membrane 1 3 8 and leaves the membrane 1 30 off the platform 10 06. The flow 600 from the platform The film 138 is released by 106 so that at least a portion of the film 138 is lifted from the platform 106. In one embodiment, the 'flow 600 lifts the film 138 away from the platform 106 »The angle α of the flow 600 impacting the film 136 has the first The vector 604 provides an upward force, flow 600, and a second vector 606 forces the flow 600 upward to the center of the membrane 136, so that the liquid flows below the membrane 1 36, and overcomes the surface tension and other. National Standard (CNS) A4 specification (210 X 297 mm) 472315 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (the attraction of the membrane 1 36 and the platform i06 by force. The angle of the nozzle 330 α allows lifting device 108 to be placed around platform 106 and membrane 136 ' Leave the grinding area sensitive to surface changes (which may cause uneven grinding) (that is, the area above the sub-pad 140). Also, the position of the lifting equipment around the platform 丨 〇6 simplifies the design 'Because no complicated technology is required to allow air to flow through the platform 106, the secondary 130, and the secondary plate 132. Figure 7 depicts another grinding machine 700, which uses a film 702 on a rotating platform 704. The grinding head 706 maintains the substrate during the grinding 7〇8 resisted the platform 7 04. At least one lifting device 70 is connected to the platform 704. Structurally, the lifting device 7 1 0 is approximately similar to the lifting device 1 08 described in FIG. 1_6B. Birang et al., U.S. Patent Application Serial No. 09 / 244,456, filed February 4, 1999, describes a grinder 700 that may benefit from lifting equipment 710. The lifting device 710 may be activated to push the membrane 702 away from the platform 704. In one embodiment, the lifting device 7 1 0 removes the film 702 from the platform 704 to facilitate the advancement of the film 702. Figure 8 depicts another grinding machine 800, which uses a lower-attach pad 802 of abrasive material on a rotating platform 804. The grinding head 806 keeps the substrate 808 against the platform 804 during the grinding process. The lifting device 810 is connected to the platform 804. The lifting device 8 1 0 is similar in construction to the lifting device 108 described in Figs. 1-6B. U.S. Patent No. 5,804,507, approved by Tolies et al. On April 15, 1998, describes a grinder 800 that may benefit from lifting equipment 810. The lifting device 810 may be activated to lift the film 802 from the platform 804, overcome the adhesion therebetween, and facilitate the intermittent removal and replacement of the pad 802. Section 141 " This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) III III ^ --— It --- t · —! --- II ^ {Please read the precautions on the back before (Fill in this page)
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US15730399P | 1999-10-01 | 1999-10-01 |
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TW472315B true TW472315B (en) | 2002-01-11 |
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ID=22563167
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TW89120315A TW472315B (en) | 1999-10-01 | 2000-12-18 | Platen with web release apparatus |
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EP (1) | EP1088622A3 (en) |
JP (1) | JP2001156031A (en) |
TW (1) | TW472315B (en) |
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JP5248127B2 (en) | 2008-01-30 | 2013-07-31 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
CN117532500A (en) * | 2023-09-27 | 2024-02-09 | 盖德新材料科技南通有限公司 | Hardware tool finished product processing burnishing and polishing device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
JPH0425375A (en) * | 1990-05-16 | 1992-01-29 | Showa Alum Corp | Polishing device |
US5804507A (en) * | 1995-10-27 | 1998-09-08 | Applied Materials, Inc. | Radially oscillating carousel processing system for chemical mechanical polishing |
US6379221B1 (en) * | 1996-12-31 | 2002-04-30 | Applied Materials, Inc. | Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system |
-
2000
- 2000-09-29 EP EP00121213A patent/EP1088622A3/en not_active Withdrawn
- 2000-10-02 JP JP2000302329A patent/JP2001156031A/en not_active Withdrawn
- 2000-12-18 TW TW89120315A patent/TW472315B/en not_active IP Right Cessation
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JP2001156031A (en) | 2001-06-08 |
EP1088622A2 (en) | 2001-04-04 |
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