JP2001156031A - Platen with web release apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To generally provide a method and an apparatus for releasing polishing material in a polishing device. SOLUTION: In one embodiment, this apparatus includes a platen having one or more nozzles coupled thereto. The platen has a support surface adapted to support the polishing material. The nozzles are adapted to make a fluid flow therethrough, that places the polishing material in a spaced-apart relation to the platen. One or more nozzles further include a centerline that forms an acute angle with the support surface. In another embodiment, the method includes the steps of supporting at least a portion of the polishing material on the platen, supplying a fluid between the polishing materials, and lifting the polishing material to a spaced-apart relation to the platen.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001] This application claims the benefit of US Provisional Patent Application No. 60 / 157,303, filed October 1, 1999, which is incorporated herein by reference in its entirety.

[0002]

BACKGROUND OF THE INVENTION Field of the Invention Embodiments of the present invention generally relate to a web lift apparatus and method for releasing a web from a platen in a polishing apparatus.

[0003] In the background semiconductor wafer processing of the present invention, the chemical mechanical planarization i.e. CMP has gained support for enhanced ability to increase the device density in wafer of a semiconductor workpiece i.e. substrate. As the demand for planarization of layers formed on wafers in semiconductor manufacturing increases, so does the demand for higher system (ie, process tool) throughput with less wafer damage and higher wafer planarity. .

[0004] An example of a CMP system that addresses these issues is issued to Tolles et al. On April 15, 1998 and published in US Patent No. 5,804,507, which is incorporated by reference in its entirety. Tolles et al. Disclose a CMP system having a planarization system that is supplied with wafers from a cassette located in a nearby bath filled with liquid.
A transfer mechanism, or robot, facilitates wafer transfer from the bus to a transfer station. The transfer station typically includes a load cup that positions the wafer in one of four processing heads mounted on a carousel. The carousel sequentially moves each processing head over a load cup to receive a wafer. As the processing head is loaded, the carousel moves the processing head and wafer past a planarization station for polishing. The wafer is planarized by moving the wafer with respect to the polishing material in which the polishing liquid is present. Polishing fluids typically include a chemical that aids in removing material from the wafer. The mechanical aspect of the polishing process is generally provided by an abrasive disposed either in the polishing liquid or on the abrasive material. After the completion of the planarization process, the wafer is returned through the transfer station to the appropriate cassette located on the bus.

[0005] One type of abrasive material available for chemical mechanical polishing is known as a fixed abrasive. Fixed abrasive is
A plurality of abrasive grains held in a resin binder disposed within discrete elements on the backing sheet. Where abrasive particles are included in the abrasive material itself, systems using fixed abrasives typically use abrasive fluids that do not include abrasive particles. Such polishing fluids extend the useful life of the fluid delivery system.

[0006] Fixed abrasive polishing materials are generally available in a stick-down format, but may also be used in a web format. Generally, the web is supported by a platen having a central or working area where the polishing process is performed. Unused portions of the web that are not located on the platen
Stored in rolls bonded to the sides of the platen. As the web is consumed by polishing a number of wafers, the web advances to deploy a step length of unused web in the work area of the platen. The used portion of the web remote from the platen is generally wound on a take-up roll disposed on the side of the platen opposite the supply roll.

However, it is sometimes difficult to index the web across the polishing platen. The polishing liquid in contact with the web may create an attractive force between the lower surface of the platen and the web due to surface tension or suction. This surface tension must be counteracted by the web indexing means during web advancement. If the suction between the web and the platen is large, the indexing means may not be able to index the web, or the web may be damaged during the indexing process.

[0008] Accordingly, there is a need for a system and method in a polishing apparatus that overcomes the suction of the web onto the platen.

[0009] Summary One aspect of the present invention generally provides an apparatus for releasing a web of abrasive material. In one embodiment, the device includes a platen having one or more nozzles coupled thereto. The platen has a support surface configured to support the abrasive material. The nozzle is configured to flow fluid through the nozzle from the platen to the back side of the abrasive material to at least partially bias the abrasive material. In another embodiment, the one or more nozzles further include a centerline that forms an acute angle with the support surface that directs flow from the nozzles to the center of the platen.

In another aspect of the present invention, a method is provided for releasing a web of abrasive material. In one embodiment, the method comprises supporting at least a portion of the abrasive material on a platen, providing a fluid between the abrasive materials, and biasing at least a portion of the abrasive material away from the platen. including. In one embodiment, the web is moved in a spaced relationship to the platen.

[0011]

DETAILED DESCRIPTION FIG. 1 shows a plan view of one embodiment of a chemical mechanical polisher 100 incorporating at least one lifting device 108. A polisher 100 adapted to benefit from the present invention is a FLATLAND ^R 8200 chemical mechanical polisher manufactured by Applied Materials, Inc. of Santa Clara, California. Although the lift device 108 is described in one chemical mechanical polishing machine configuration, those skilled in the art will appreciate that other chemical mechanical polishing utilizing a web or pad of abrasive material as taught and described herein. The lift device 108 may be advantageously adapted for use on a machine.

An exemplary polisher 100 adapted to benefit from the present invention is described by Sommer in February 29, 1999.
No. 60 / 185,812 (Attorney Docket No. 4606), filed on even date, the entire text of which is incorporated herein by reference. Polisher 100 generally includes a drive system 102 and a polishing media magazine 104.
And a platen 10 having one or more lifting devices 108
6 is provided. Drive system 102 generally includes a polishing head 110 that holds a substrate 122 during processing. Abrasive media magazine 104 generally includes a web of abrasive material 136 disposed between supply roll 140 and take-up roll 142 across platen 106. Polishing head 110
Supports the substrate 122 against a portion of the web 136 disposed on the platen 106, while the drive system 102 moves the polishing head 110 and the substrate 122 in a polishing pattern for the web 136.

One embodiment of a polishing media magazine 104 that can be adapted to benefit from the present invention is the Donohue
Et al., US Patent Application No. 08/08, filed April 4, 1997.
No. 833,278 (Attorney Docket No. 4244), which is hereby incorporated by reference in its entirety. The polishing media magazine 104 generally includes a platen 1
Tensioning the web of abrasive material 136 across
Adjust this before moving forward. Abrasive media magazine 10
4 (MinnesotaManufact, St. Paul, Minnesota)
Although generally described with a magazine that handles a web of fixed abrasive polishing material 136 (such as that available from the uring and Mining Company), the lift device 108 uses conventional foamed polyurethane polishing material (Rodel inc., Newark, Del.). (As available from.) Has been found to have similar utility. The reader should also note that the lift device 108 can be utilized with a polisher having a stick down pad made of abrasive material to assist in removing the pad from polishing.

Generally, the unused portion of the web 136 is wound on a supply roll 140 and the used portion is wound on a take-up roll 142. The supply roll 140 and the take-up roll 142 are connected to driving devices 150 and 152, respectively.
The drive tensions and feeds web 136 across platen 106 between rolls 140 and 142.
The driving devices 150 and 152 may be stepping motors, pneumatic motors, servomotors, or similar motors.

The polishing media magazine 104 generally includes guide members 144 disposed on opposite sides of the platen 106.
Guide member 144 positions web 136 in a substantially parallel orientation in proximity to platen 106. The web 136 is advanced across the platen 106 as portions of the web 136 disposed on the platen 106 are consumed during the polishing process. Advancement of web 136 extends web 13 from feed roll 140 to the top of platen 106.
6 while the unused portion of the web 136 wound on the take-up roll 142 is removed.

The polishing media magazine 104 also includes a conditioner 146. Conditioner 146 generally maintains the surface of web 136 with a uniform polishing result. For example, if the web 136 comprises a fixed abrasive, the web 136 must be adjusted prior to its use to uniformly expose the abrasive grains entrained by the plurality of abrasive elements disposed thereon. No. A conditioner 146, which may comprise a cylinder having a brush, smooth or embossed surface or other surface, is brought into contact with the web 136 to dress the surface of the web 136 in front of the portion of the web 136 that contacts the substrate 122. It is placed in contact with the web 136 for (sharpening). Such a conditioner 146 is typically provided in a conventional polishing system.

One embodiment of a drive system 102 that can be adapted to benefit from the present invention is described generally in US patent application Ser. No. 08 / 961,606 to Sommer (Attorney Docket No. 4247), the entire text of which is hereby incorporated by reference. Are incorporated herein by reference. Drive system 102 generally imparts movement of polishing material relative to web 136 to polishing head 110. Drive system 102 generally includes a stage 114 and a carrier plate 112. Stage 114 is 2
Book parallel rails (and bearings) 116 (only one shown)
Above, a linear motion is made along the position of the web 136.
Each rail 116 is mounted on a support 118 that is coupled to the platen 106. First driver (not shown)
Is coupled to stage 114 and controls the movement of stage 114 along rail 116. The first driver generates one or more “soyers (Sa) that generate and control the linear motion.
wyer) "motors, ball screws, cylinders, belts, rack / pinion gears, servo motors, stepper motors, and other devices. Generally, a portion of the first driver is connected to the support 118 and a second portion is connected to the stage 114.

The carrier plate 112 is typically coupled to the stage 114 by two parallel rails (and bearings) 138. Rails 138 are mounted between carrier plate 112 and stage 114 to allow carrier plate 112 to move perpendicular to the movement of stage 114. The second driver (not shown)
Usually, the rail 1 is connected to the carrier plate 112.
Control the movement of carrier plate 112 along.
The second driver is typically configured similarly to the first driver. Generally, a portion of the second driver is connected to the carrier plate 112 and the second portion is
Connected to.

The carrier plate 112 generally supports the polishing head 110. Polishing head 110 is coupled to an actuator (not shown) so that a substrate held in polishing head 110 can be placed in contact with web 136 during polishing. Examples of polishing heads that can be used with the polisher 100 are a TITAN HEAD® wafer carrier and a DIAMOND HEAD® wafer carrier, both of which are available from Apparel of Santa Clara, California.
Manufactured by lied Materials, Inc. In one embodiment, the combined movement of stage 114 and carrier plate 112 causes polishing head 11 with respect to web 136 to move.
X of the substrate 112 held at 0 with respect to the web 136
Causing a polishing movement in the y-direction, ie in the orbital direction.

In general, one or more nozzles 128 are disposed on polisher 100 to supply a polishing fluid between substrate 122 and web 136 during polishing. Nozzle 12
8 may be coupled to drive system 102 or platen 106 or may be located at another location where the flow of polishing fluid from nozzle 128 is directed onto web 138. The polishing fluid generally includes deionized water and, optionally, one or more chemical reagents that assist in removing material from the wafer. The polishing may include an abrasive.

The platen 106 is a generally flat surface on which the substrate 122 is polished. Platen 106
Is typically composed of aluminum. Platen 106 has a top surface 160 that supports web 136. The upper surface 160 has a central recess 124 and a first side recess 15.
4 and a second side recess 156. Sub pad 130
And the sub-plate 132 are disposed in the central recess 124. The subpad 130 is typically a plastic such as polycarbonate or polyurethane foam. Generally, the hardness or durometer of the subpad 130 combined with the subplate 132 can be selected to achieve a particular polishing result. Sub pad 130
Is generally the substrate 122 held in the polishing head 110.
A web 136 of abrasive material is maintained parallel to the plane of
Promotes 22 global flattening. Sub plate 1
Because 32 is positioned between subpad 130 and the bottom of recess 124, upper surface 160 of platen 106 encompasses the upper surface of subpad 130 (ie, is coplanar).

At least one of the side recesses 154 and 156 stores the lift device 108. Lifting device 10
8 is generally coupled to a fluid supply 126. Lifting device 108 moves between platen 106 and web 136,
A fluid such as air or nitrogen may be supplied to drive web 136 away from platen 106. Fluid flowing from the lifting device 108 releases suction between the platen 106 and the web 136 (eg, membrane suction or surface tension due to fluid below the web). In one embodiment, the fluid from the lifting device 108 includes the web 136.
Are arranged in a spaced relationship with the platen 106.

Generally, one or more lifting devices 108 include:
The platen 106 can be disposed near one or more ends. In one embodiment, one lifting device 10
8 is a concave portion 1 of the platen 106 near the take-up roll 140.
54. Usually, the blank 158 is disposed in the second recess 156. Optionally, another lifting device 1
08 may be disposed in the second recess 156 instead of the blank 158 and disposed on one side or adjacent sides of the platen 106 or a combination thereof.

FIG. 2 is a plan view of one embodiment of the platen 106. The upper surface 160 of the platen 106 generally includes a first side 202 near the supply roll 140,
The second side 204 has a pair of transverse sides 206 near the second side 204. The upper surface 160 of the platen 106 further includes a groove 208 disposed near an end of the platen 106 below the web 136 of abrasive material. Groove 208 includes two channels 210 formed in upper surface 160 near transverse side 206 of platen 106. The groove 208 has a side recess 154, 1
Two channels 21 that can have a portion of 56
2 is also included. Optionally, the channel 212 has a recess 154,1
It may be formed on top surface 160 inside 56.

Referring to the cross-sectional view of FIG. 3, in one embodiment of the groove 208, the channel 212 is
8 between the first side surface 312 and the side wall 302 of the recess 154. Channel 212 is in communication with port 304 that is coupled to a vacuum source 306. Vacuum source 306 optionally provides a vacuum to groove 208 that secures web 136 to platen 106 during processing. An example of an abrasive material holding system utilizing grooves in the platen is described by Sommer et al.
U.S. Patent Application Serial No. 09 / 258,036 filed February 25, 9
And incorporated herein by reference in its entirety. The reader will note that other types of devices are available that can releasably secure abrasive material 252 to platen 230, such as, for example, releasable adhesives, bonds, electrostatic chucks, mechanical clamps, and other releasable mechanisms. Should.

The lifting device 108 that defines one side of the channel 212 generally includes one or more nozzles 330 through which fluid flows. Fluid exiting the nozzle 300 from the feeder 126 is drawn by suction between the web 108 and the platen 106 and the subpad 130 and surface tension between the elements due to the fluid (eg, polishing fluid) underlying the web 138. From the platen 106 to the web 108
Release forcefully.

In one embodiment, the lifting device 10
8 is a first side surface 312, a second side surface 314, and an upper surface 31.
And a body 308 having a zero and a bottom 316. The plurality of fasteners 318 are provided from the upper surface 310 of the main body 308 via the mounting holes 224, and are screwed into the counterpart screw holes 320 provided in the first recess 154. A seal or gasket (not shown) is commonly used between lift member 108 and platen 106 to prevent leakage between them. Alternatively, the lifting device 108 may be secured to the platen 106 using screws, rivets, clamps, adhesives, and the like.

Typically, the second side 314 and the body 308
Upper surface 310 forms a corner 322 having a radius, ie, a chamfer. The radius of the corner 322 minimizes the generation of particulates or the potential for damage to the web 136 as the web 136 moves upward.

The passage 228 is provided through the main body 308. One or more apertures 226 are disposed in body 308 and traverse passage 228. Normally, aperture 226
Terminates in a nozzle 330 disposed on the first side 312 of the body 308. Generally, aperture 226 is disposed at an acute angle α with upper surface 160 of platen 106. The orientation of the aperture 226 is generally
Inward towards the center of the. The orientation of the aperture 226 is further determined by the expanded diameter of the aperture 226 and the groove 2
The upper corner 332 of the wall opposite to 08 is cleaned.

Alternatively, nozzle 330 may be attached to body 308
May be disposed on the upper surface 310. The configuration of the lift assembly 108 with the nozzle 300 disposed on the upper surface 310 of the body 308 is particularly useful for platens where no grooves are disposed.

In one embodiment, at least 3
A book nozzle 330 is disposed on the main body 308. About 30 to about 50 pounds of fluid pressure per square inch is provided to a nozzle 330 having a diameter of about 0.03 to about 0.13 inches. If too high a pressure or flow rate is supplied to the nozzle 330, the flow may cause undesirable oscillations in the web 136.

With further reference to FIG.
In one embodiment, the passage 228 includes a first end 40.
2 and a second end 404. Plug 406 is in passage 2
28 is disposed within first end 402 such that fluid disposed within 28 does not exit through first end 402. A fitting 408 is disposed within the second end 404 of the passage 226. The coupling 408 generally connects the fluid supply 1
26 to facilitate connection.

FIG. 5 shows another embodiment of the lift device 500. Generally, the lifting device 500 is shown in FIGS.
It is disposed on a platen 106 similar to the lift device 108 described with reference to FIG. Lift system 500
A body 502 having one or more nozzles 504 disposed therein
Is provided. Each nozzle 504 is coupled to a port 508 by an aperture 506. Fitting 510 is port 50
8 and coupled to a fluid supply 512. In order to control the flow of the fluid through each nozzle 504, a flow control mechanism 5 such as a regulator, an orifice, a proportional valve, etc.
14 is optionally disposed between the supply 512 and the port 508. In this way, the lift of the web 516 disposed near the lift system 500 can
6 can be adjusted to lift more than others. That is, adjustments can be made to ensure uniform flow through all nozzles 504 with lift system 500. For example, in a lift system with three or more nozzles 504, the flow rate of the central nozzle may be higher to provide more fluid (eg, air) below the central portion of web 516. The high flow rate in the center produces a correspondingly higher lift to overcome fluid tension at the center of platen 518 located furthest from nozzle 504. Alternatively, fittings 510 in each port 508 may be connected together to have a single fluid line coupling fitting 510 to fluid supply 512.

Referring to FIGS. 6A and 6B, a vacuum is applied to groove 208 during operation. The vacuum in groove 208 reduces the downward force 60 that secures web 136 to the platen during polishing.
2 (see FIG. 6A). Once polishing is complete and it is desired to advance web 136, vacuum is removed from groove 208 (ie, pressure is applied to the groove or the groove is vented to atmosphere) and fluid is supplied from fluid supply 126. It is supplied to the lift device 108. Fluid from supply 126 enters body 308 and exits nozzle 330 as a stream or jet of fluid 600. Fluid stream 600 is typically air, and web 138
And the web 130 is separated from the platen 106.
Generally, stream 600 releases web 138 from platen 106 so that at least a portion of web 138 is lifted from platen 106. In one embodiment, stream 600 lifts web 138 in spaced relation to platen 106.

The angle α at which stream 600 strikes web 136 has a first vector 604 that provides an upward force. Stream 600 further comprises stream 600
Has a second vector directing the web 136 to a central portion of the web 136 to move the liquid under the web 136 and overcome the suction of the web 136 to the platen 106 caused by surface tension and other forces. The angle α of the nozzle 330 is such that the lift device 108 is capable of polishing areas that are sensitive to surface deformations (ie,
Away from the area covering the subpad 140)
36 and the periphery of the platen 106. Further, a lifting device 108 at the periphery of the platen 106
Is located at the center of the platen 106, the subpad 130,
Since no complicated manufacturing technique for sending air through the sub-plate 132 is required, this contributes to simplification of the design.

FIG. 7 shows another polisher 700 that utilizes a web 702 disposed on a rotating platen 704. Generally, the polishing head 706 moves the platen 70 during polishing.
4 and the substrate 708 is held. At least one lifting device 710 is coupled to the platen 704. The lift device 710 is configured similarly to the lift device 108 described with reference to FIGS. 1 to 6B. Lifting device 7
One such polisher 700, which can be adapted to benefit from the US Patent No. 10, is Birang et al.
No. 09 / 224,456, filed on even date, the entire text of which is incorporated herein by reference. The lift device 710 moves the platen 704 from the web 7
02 can be activated. In one embodiment, the lifting device 710 places the web 702 in a spaced relationship to the platen 704 to facilitate advancement of the web 702.

FIG. 8 shows another polisher 800 using a stick down pad 802 of abrasive material disposed on a rotating platen 804. Generally, the polishing head 806
Holds the substrate 808 against the platen 804 during polishing. Lift device 810 is coupled to platen 804. One such polisher 800 that can be adapted to benefit from the lifting device 810 is described by Tolles in 19
US Patent Application No. 5,804,507 filed on April 15, 1998
No. 4,078,098, the entire text of which is incorporated herein by reference. The lifting device 810 includes a platen 80
4 can be actuated to lift the pad 802, overcoming the adhesion between them and facilitating removal and replacement of the pad 802.

Although the teachings of the present invention have been shown and described in detail herein, those skilled in the art will still be able to incorporate the teachings without departing from the scope and spirit of the invention. Various other embodiments may be easily devised.

BRIEF DESCRIPTION OF THE DRAWINGS The teachings of the present invention will be more readily apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings.

FIG. 1 is an elevation view of the chemical mechanical planarization system of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a platen.

FIG. 3 is a cross-sectional view of one embodiment of the lift system, taken along section line 2-2 of FIG. 2;

FIG. 4 is a partial cross-sectional view of the lift system, taken along section line 4-4 in FIG. 2;

FIG. 5 is a partial cross-sectional view of another embodiment of the lift system.

FIG. 6A is a cross-sectional view of a platen showing a web in a process.

FIG. 6B is a cross-sectional view of the platen showing a separating direction.

FIG. 7 is a cross-sectional view of another embodiment of a lift system.

FIG. 8 is an elevation view of another chemical mechanical polisher having a lift system. To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures.

[Explanation of symbols]

100, 700, 800: polisher, 102: drive system, 104: polishing media magazine, 106, 23
0,518,704: Platen, 108,500,71
0,810: Lift system, Lift device, 110,7
06,806: Polishing head, 112: Carrier plate, 114: Stage, 116, 138: Rail, 11
8: support, 122, 708, 808: substrate, 124:
Central recess, 126, 512: fluid supply device, 128, 3
00, 330, 504: nozzle, 130: subpad,
132: sub plate, 136, 516, 702: web, 140: supply roll, 142: take-up roll, 14
4: Guide member, 146: Conditioner, 150, 1
52: drive device, 154: first side recess, 156: second
Side recess, 158: blank, 160, 310: top,
202, 312: first side surface, 204, 314: second side surface, 206: transverse side surface, 208: groove, 210, 212:
Channel, 224: mounting hole, 226, 506: aperture, 228: passage, 252: abrasive material, 302: side wall,
304, 508: port, 306: vacuum source, 308, 5
02: body, 316: bottom, 318: fastener, 320:
Screw holes, 322, 332: corner, 402: first end, 404: second end, 406: plug, 408, 51
0: joint, 600: jet, 604: first vector, 60
6: second vector, 802: stick down pad,
804: Rotating platen.

Continuation of front page (72) Inventor Philipp Earl. Sommer United States, California, Newark, Hazle Nut Drive 7811 (72) Inventor Todd Petite 1155 Lincoln Street, San Jose, California, United States of America

Claims (31)

[Claims] 1. An apparatus for releasing a web of abrasive material, comprising: a platen having a support surface suitable for supporting the abrasive material; and one or more nozzles coupled on the platen. An apparatus, wherein the nozzle is adapted to flow a fluid therethrough, the fluid biasing the abrasive material at least partially away from the platen. 2. The method according to claim 1, wherein the one or more nozzles arrange the abrasive material in spaced relation to the platen.
An apparatus according to claim 1. 3. The apparatus of claim 1, wherein the one or more nozzles have a centerline that forms an acute angle with the support surface. 4. The apparatus further comprises a nozzle body having at least one nozzle disposed therein, wherein the nozzle body comprises:
The apparatus of claim 1, having an upper surface that is substantially coplanar with the support surface. 5. The apparatus of claim 4, wherein said support surface further comprises a recess having said nozzle disposed therein. 6. The support surface further comprises a first end having a recess, wherein the nozzle body is disposed in the recess.
The device according to claim 4. 7. The apparatus of claim 1, wherein the support surface further comprises a groove coupled to a vacuum port, wherein the groove is disposed in the support surface. 8. A nozzle body having at least one nozzle therein and a groove disposed in the platen, wherein the nozzle body comprises at least a portion of at least one wall of the groove. An apparatus according to claim 1. 9. The nozzle body further comprises: an upper surface suitable for supporting the abrasive material, and a side surface communicating with the groove, wherein the one or more nozzles are disposed on the side surface of the nozzle body. Provided: device according to claim 8. 10. The nozzle body further comprising: a side surface communicating with the groove, and an upper surface suitable for supporting an abrasive material, wherein the one or more nozzles are disposed on the upper surface of the nozzle body. The apparatus according to claim 8. 11. The nozzle body comprises a plurality of nozzles,
The device according to claim 4. 12. The apparatus according to claim 1, further comprising a first nozzle body disposed on a first side of the platen, and a second nozzle body disposed on a second side opposite to the platen. The described device. 13. The apparatus of claim 12, wherein the first and second nozzle bodies have an upper surface that is substantially coplanar with the support surface. 14. The apparatus of claim 1, wherein the diameter of the nozzle is from about 0.03 to about 0.13 inches. 15. The apparatus of claim 1, wherein said one or more nozzles comprises three nozzles. 16. The apparatus of claim 1, wherein said fluid is air or nitrogen. 17. The method of claim 1, wherein the fluid comprises about 3 per square inch.
The device of claim 1, wherein the device is provided at 0 to about 50 pounds. 18. An apparatus for releasing a web of polishing media having a polishing side and a back side, comprising: a platen having a support surface suitable for supporting an abrasive material, and polishing in spaced relation to the platen. Means for disposing at least a portion of the material. 19. The apparatus of claim 18, wherein said means further comprises one or more fluid jets projecting upwardly from a platen. 20. An apparatus for releasing abrasive material, comprising: a platen having an upper surface; a groove formed in the upper surface of the platen, wherein the groove is coupled to a vacuum port;
An apparatus comprising: one or more nozzles coupled to the platen, the nozzles configured to cause a fluid to flow and a fluid to place at least a portion of the abrasive material in spaced relation to the abrasive material. . 21. The apparatus of claim 20, wherein the one or more nozzles have a centerline that forms an acute angle with the support surface. 22. The apparatus of claim 20, further comprising a body having at least one nozzle disposed therein, the body having an upper surface substantially coplanar with the support surface.
An apparatus according to claim 1. 23. The apparatus of claim 20, wherein said at least one nozzle further comprises three nozzles disposed at one end of said platen. 24. A method for releasing abrasive material from a platen, the method comprising: supporting at least a portion of the abrasive material on the platen; providing a fluid between the abrasive materials; Lifting at least a portion of the abrasive material in a spaced relationship. 25. The method of claim 24, wherein supplying the fluid further comprises angling the flow of the fluid at an acute angle to the platen. 26. The method of claim 24, wherein the providing step further comprises flowing at least a portion of the fluid toward a center of the platen. 27. The method of claim 26, wherein the supplying step further comprises flowing at least a portion of the fluid at right angles to the platen. 28. The method of claim 2, wherein the providing step further comprises the step of impinging the abrasive material with a jet of fluid.
4. The method according to 4. 29. The supplying step further comprises flowing air or nitrogen through one or more nozzles disposed at least partially below the abrasive material.
A method according to claim 24. 30. The air or nitrogen flowing through one or more nozzles comprises from about 30 to about 50 per square inch.
25. The method of claim 24, having a supply pressure of pounds. 31. The method of claim 24, further comprising advancing the abrasive material across the platen.