EP2289668A3 - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

Info

Publication number
EP2289668A3
EP2289668A3 EP10251498.1A EP10251498A EP2289668A3 EP 2289668 A3 EP2289668 A3 EP 2289668A3 EP 10251498 A EP10251498 A EP 10251498A EP 2289668 A3 EP2289668 A3 EP 2289668A3
Authority
EP
European Patent Office
Prior art keywords
fluid
work
fluid chamber
polishing
elastic sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10251498.1A
Other languages
German (de)
French (fr)
Other versions
EP2289668B1 (en
EP2289668A2 (en
Inventor
Norihiko Moriya
Kazutaka Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of EP2289668A2 publication Critical patent/EP2289668A2/en
Publication of EP2289668A3 publication Critical patent/EP2289668A3/en
Application granted granted Critical
Publication of EP2289668B1 publication Critical patent/EP2289668B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The polishing apparatus (10) is capable of improving accuracy of polishing a work (W). The work (W) is pressed onto a polishing cloth (11), with an elastic sheet (36), by a pressing force generated by second pressing means (34) and applied to a carrier (28) and inner pressure of a first fluid chamber (38) generated by a fluid supplied thereto, so as to polish the work (W). The fluid, which has been downwardly supplied into the first fluid chamber (38), horizontally flows outward in the first fluid chamber (38), collides with a side wall of a concave part (23) of a board-shaped member (22) and flows upward, and then the fluid is discharged outside from a fluid outlet (44), thereby a fluid feeding member (31) follows movement of the elastic sheet (36) and maintains parallel thereto, and the fluid feeding member (31) is centered in the first fluid chamber (38).
EP10251498.1A 2009-08-31 2010-08-26 Polishing apparatus Active EP2289668B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009200690A JP5392483B2 (en) 2009-08-31 2009-08-31 Polishing equipment

Publications (3)

Publication Number Publication Date
EP2289668A2 EP2289668A2 (en) 2011-03-02
EP2289668A3 true EP2289668A3 (en) 2014-01-22
EP2289668B1 EP2289668B1 (en) 2019-02-06

Family

ID=43034190

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10251498.1A Active EP2289668B1 (en) 2009-08-31 2010-08-26 Polishing apparatus

Country Status (5)

Country Link
US (1) US20110053474A1 (en)
EP (1) EP2289668B1 (en)
JP (1) JP5392483B2 (en)
KR (1) KR101696932B1 (en)
CN (1) CN102001036B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5807580B2 (en) * 2012-02-15 2015-11-10 信越半導体株式会社 Polishing head and polishing apparatus
JP6283957B2 (en) * 2015-04-16 2018-02-28 信越半導体株式会社 Polishing head manufacturing method, polishing head, and polishing apparatus
CN106426026B (en) * 2016-03-07 2018-02-02 江苏省特种设备安全监督检验研究院 The safety valve maintenance platform of station automatic in-position
JP7108450B2 (en) * 2018-04-13 2022-07-28 株式会社ディスコ Polishing equipment
RU206939U1 (en) * 2021-04-16 2021-10-04 Акционерное общество "Национальный центр вертолетостроения им. М.Л. Миля и Н.И. Камова" (АО "НЦВ Миль и Камов") A device for grinding the working surfaces of cylindrical plain bearings

Citations (6)

* Cited by examiner, † Cited by third party
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GB2349839A (en) * 1999-05-10 2000-11-15 Tokyo Seimitsu Co Ltd Apparatus for polishing wafers
JP2002170796A (en) * 2000-12-04 2002-06-14 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
JP2003071705A (en) * 2001-08-27 2003-03-12 Applied Materials Inc Chemical mechanical polishing apparatus
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
EP1582293A2 (en) * 2004-03-31 2005-10-05 Fujikoshi Machinery Corporation Polishing apparatus
EP1860689A1 (en) * 2005-03-14 2007-11-28 Shin-Etsu Handotai Company Limited Polishing head for semiconductor wafer, polishing apparatus and polishing method

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US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
EP0881039B1 (en) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus with retainer ring
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6663466B2 (en) * 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US7029381B2 (en) * 2000-07-31 2006-04-18 Aviza Technology, Inc. Apparatus and method for chemical mechanical polishing of substrates
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
JP2002187060A (en) * 2000-10-11 2002-07-02 Ebara Corp Substrate holding device, polishing device and grinding method
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
JP3969069B2 (en) * 2000-12-04 2007-08-29 株式会社東京精密 Wafer polishing equipment
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
JP2002343750A (en) * 2001-05-11 2002-11-29 Tokyo Seimitsu Co Ltd Wafer-polishing method and apparatus thereof
EP1260315B1 (en) * 2001-05-25 2003-12-10 Infineon Technologies AG Semiconductor substrate holder for chemical-mechanical polishing comprising a movable plate
KR100470227B1 (en) * 2001-06-07 2005-02-05 두산디앤디 주식회사 Carrier Head for Chemical Mechanical Polishing
JP3970561B2 (en) * 2001-07-10 2007-09-05 株式会社荏原製作所 Substrate holding device and substrate polishing device
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
KR100939556B1 (en) * 2001-12-06 2010-01-29 가부시키가이샤 에바라 세이사꾸쇼 Elastic Membrane And Flexible Membrane
JP4163485B2 (en) * 2002-10-25 2008-10-08 不二越機械工業株式会社 Double-side polishing apparatus and polishing method using the same
KR100481872B1 (en) * 2003-01-14 2005-04-11 삼성전자주식회사 Polishing head and chemical mechanical polishing apparatus
US7074114B2 (en) * 2003-01-16 2006-07-11 Micron Technology, Inc. Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
KR100916829B1 (en) * 2003-02-10 2009-09-14 가부시키가이샤 에바라 세이사꾸쇼 Elastic membrane
US7008309B2 (en) * 2003-05-30 2006-03-07 Strasbaugh Back pressure control system for CMP and wafer polishing
JP2005011977A (en) * 2003-06-18 2005-01-13 Ebara Corp Device and method for substrate polishing
JP4108023B2 (en) * 2003-09-09 2008-06-25 株式会社荏原製作所 Pressure control system and polishing apparatus
JP3889744B2 (en) * 2003-12-05 2007-03-07 株式会社東芝 Polishing head and polishing apparatus
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7201642B2 (en) * 2004-06-17 2007-04-10 Systems On Silicon Manufacturing Co. Pte. Ltd. Process for producing improved membranes
JP2006332520A (en) * 2005-05-30 2006-12-07 Toshiba Ceramics Co Ltd Polishing equipment and method of semiconductor wafer
JP4757580B2 (en) * 2005-09-16 2011-08-24 株式会社荏原製作所 Polishing method, polishing apparatus, and program for controlling polishing apparatus
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
JP5009101B2 (en) * 2006-10-06 2012-08-22 株式会社荏原製作所 Substrate polishing equipment
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7731572B2 (en) * 2007-05-24 2010-06-08 United Microelectronics Corp. CMP head
KR101358645B1 (en) * 2007-09-04 2014-02-05 삼성전자주식회사 carrier apparatus for polishing wafer and chemical mechanical polishing equipment used the same
JP2009131920A (en) * 2007-11-29 2009-06-18 Ebara Corp Polishing apparatus and polishing method
JP2009194134A (en) * 2008-02-14 2009-08-27 Ebara Corp Polishing method and polishing apparatus
JP5145131B2 (en) * 2008-06-24 2013-02-13 信越半導体株式会社 Manufacturing method of polishing head
JP4833355B2 (en) * 2008-08-29 2011-12-07 信越半導体株式会社 Polishing head and polishing apparatus
KR101004434B1 (en) * 2008-11-26 2010-12-28 세메스 주식회사 Substrate supporting unit, and apparatus and method for polishing substrate using the same
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5648954B2 (en) * 2010-08-31 2015-01-07 不二越機械工業株式会社 Polishing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2349839A (en) * 1999-05-10 2000-11-15 Tokyo Seimitsu Co Ltd Apparatus for polishing wafers
JP2002170796A (en) * 2000-12-04 2002-06-14 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
JP2003071705A (en) * 2001-08-27 2003-03-12 Applied Materials Inc Chemical mechanical polishing apparatus
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
EP1582293A2 (en) * 2004-03-31 2005-10-05 Fujikoshi Machinery Corporation Polishing apparatus
EP1860689A1 (en) * 2005-03-14 2007-11-28 Shin-Etsu Handotai Company Limited Polishing head for semiconductor wafer, polishing apparatus and polishing method

Also Published As

Publication number Publication date
US20110053474A1 (en) 2011-03-03
EP2289668B1 (en) 2019-02-06
CN102001036B (en) 2014-09-24
KR101696932B1 (en) 2017-02-01
KR20110023785A (en) 2011-03-08
EP2289668A2 (en) 2011-03-02
JP2011051047A (en) 2011-03-17
CN102001036A (en) 2011-04-06
JP5392483B2 (en) 2014-01-22

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