KR20140065655A - Injection nozzle unit and substrate cleaning device with the same - Google Patents

Injection nozzle unit and substrate cleaning device with the same Download PDF

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Publication number
KR20140065655A
KR20140065655A KR1020120131129A KR20120131129A KR20140065655A KR 20140065655 A KR20140065655 A KR 20140065655A KR 1020120131129 A KR1020120131129 A KR 1020120131129A KR 20120131129 A KR20120131129 A KR 20120131129A KR 20140065655 A KR20140065655 A KR 20140065655A
Authority
KR
South Korea
Prior art keywords
nozzle unit
liquid
substrate
chamber
height
Prior art date
Application number
KR1020120131129A
Other languages
Korean (ko)
Inventor
문재권
정현호
Original Assignee
주식회사 케이씨텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020120131129A priority Critical patent/KR20140065655A/en
Publication of KR20140065655A publication Critical patent/KR20140065655A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a spray nozzle unit and a substrate cleaning device having the same, and, more particularly, to a spray nozzle unit and a substrate cleaning device having the same, capable of spraying a liquid to an exact position without an external influence and improving process efficiency. The spray nozzle unit includes a body part fixated to a chamber base; a nozzle unit arranged in the body part to spray the liquid to a substrate; and a height adjusting unit for adjusting the height of the nozzle unit. In this case, the spray nozzle unit further includes a support for collecting a leaked or remaining liquid after the liquid is sprayed on the substrate. In addition, the substrate cleaning device includes a chamber for receiving the substrate; a chamber base arranged at a lower end of the chamber; and the spray nozzle unit. With the above configuration, the liquid can be sprayed at the exact position of the substrate without the external influence. In addition, the leaked or remaining liquid after the cleaning process has been finished is collected, thereby preventing an inner part of the chamber from being contaminated due to the liquid.

Description

[0001] Injection nozzle unit and substrate cleaning apparatus with the same [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spray nozzle unit and a substrate cleaning apparatus having the same, and more particularly to a spray nozzle unit for spraying a liquid at an accurate position without being affected by external factors, Device.

It is necessary to remove unnecessary materials attached to the substrate in the semiconductor manufacturing process. In order to manufacture a semiconductor device, various manufacturing processes such as a patterning process using a resist, an etching process, a deposition process, and the like are used for a substrate, and a cleaning process for removing unnecessary substances or contaminants on the substrate is being performed for each process. For example, a cleaning process for removing the resist after the etching by an ashing process such as an oxygen plasma and removing unnecessary substances and contaminants such as resist residues that can not be removed in the etching process and residues in the etching process from the substrate surface . Here, the cleaning process is performed by a substrate cleaning apparatus.

1 is a schematic view schematically showing a conventional substrate cleaning apparatus.

1, a conventional substrate cleaning apparatus 1 is provided with a chamber 10 for containing a substrate W, a chamber 10 provided at one side of the chamber 10, and a DI water (Deionized Water (Not shown).

Since the substrate W installed in the chamber 10 during the cleaning operation is rotated at a constant speed, the pure water is rotated through the nozzle unit 20 And is sprayed onto the upper surface of the substrate W to remove unnecessary substances or contaminants adhering to the substrate W. [

However, the conventional substrate cleaning apparatus has a problem that the nozzle unit is fixed to the chamber, and the setting value of the nozzle unit is changed due to vibration every time the chamber is moved up and down. In addition, there is a problem that the liquid leaking or remaining in the nozzle unit falls into the chamber and affects the pollution degree in the chamber, thereby lowering the process efficiency.

According to the embodiments of the present invention, there is provided a spray nozzle unit for spraying a liquid onto a precise position of a substrate without being influenced by the outside, and a substrate cleaning apparatus having the same.

It is another object of the present invention to provide a spray nozzle unit and a substrate cleaning apparatus having the same that prevent contamination due to liquid in a chamber by collecting liquid leaking or remaining liquid from the nozzle after completion of cleaning.

The spray nozzle unit according to the above-described embodiments of the present invention includes a body portion fixed to a chamber base, a nozzle portion provided on the body portion, for spraying liquid onto the substrate, and a height adjusting portion for adjusting a height of the nozzle portion . Here, the injection nozzle unit further includes a pedestal for collecting the liquid or residual liquid after ejecting the liquid onto the substrate.

According to an embodiment of the present invention, the pedestal has a drain hole formed in a bottom surface thereof, and a slope is formed in the bottom surface of the pedestal so that the liquid flows into the drain hole.

According to one embodiment, the liquid is discharged to the outside or reused by the drain hole.

According to an embodiment of the present invention, the height adjusting unit includes a bracket for forming a step on a lower end, a height adjusting bolt for adjusting a height of the nozzle unit by a step of the bracket, and a fixing screw for fixing the bracket or the nozzle unit.

According to an embodiment, the nozzle unit is provided with an angle adjusting screw at one side thereof, and the angle of the nozzle unit is adjusted using the angle adjusting screw.

According to one embodiment, the liquid is characterized by the use of deionized water.

According to another aspect of the present invention, there is provided a substrate cleaning apparatus including a chamber for accommodating a substrate, a chamber base provided at a lower end of the chamber, and an injection nozzle unit according to claim 1.

According to another embodiment, the injection nozzle unit is provided in a chamber base outside the chamber, and the substrate provided inside the chamber is cleaned.

According to another embodiment, the jet nozzle unit ejects liquid, and the liquid uses pure water.

With this configuration, the liquid can be injected to the precise position of the substrate without being affected by the outside. Further, by collecting the liquid leaking or residual liquid from the nozzle after the completion of cleaning, it is possible to prevent the contamination due to the liquid in the chamber.

As described above, according to the embodiments of the present invention, the liquid can be injected to the precise position of the substrate without being affected by external influences.

Further, by collecting the liquid leaking or residual liquid from the nozzle after the completion of cleaning, it is possible to prevent the contamination due to the liquid in the chamber.

1 is a schematic view schematically showing a conventional substrate cleaning apparatus.
FIG. 2 is a cross-sectional view of a spray nozzle unit according to an embodiment of the present invention.
3 is a perspective view showing a state of the spray nozzle unit according to an embodiment of the present invention.
FIG. 4 is an exemplary view showing discharge of residual liquid in the spray nozzle unit according to an embodiment of the present invention. FIG.
5 is a schematic view schematically showing a substrate cleaning apparatus according to another embodiment of the present invention.

Hereinafter, the injection nozzle unit according to one embodiment of the present invention will be described in detail.

FIG. 2 is a cross-sectional view of a spray nozzle unit according to an embodiment of the present invention, and FIG. 3 is a perspective view illustrating a spray nozzle unit according to an embodiment of the present invention.

2 to 3, the injection nozzle unit 100 includes a body 110 fixed to the chamber base 300, a nozzle 110 disposed on the body 110, And a height adjusting unit 130 for adjusting the height of the nozzle unit 120. [0028] The apparatus further includes a pedestal (140) for collecting the liquid or residual liquid after ejecting the liquid onto the substrate (W).

For example, the injection nozzle unit 100 may include a body 110, a nozzle 120, and a height adjuster 130, and may be positioned on the upper surface of the chamber base 300.

The body 110 is fixed to the chamber base 300 and is capable of moving forward and backward with respect to the substrate W with respect to the body W, The position of the body 110 can be adjusted.

The nozzle unit 120, the height adjusting unit 130, and the pedestal 140 are provided on the body 110, and the nozzle unit 120 and the height A guide 111 for guiding the movement of the regulating unit 130 may be formed.

The nozzle unit 120 is provided on the body 110 and can be moved up and down by the height adjuster 130. The nozzle unit 120 is moved upward or downward or leftward or rightward along the guide 111 formed on the body 110 and the nozzle unit 120 is elevated by the height adjusting unit 130 And the nozzle unit 120 can be fixed.

The nozzle unit 120 is provided with an angle adjusting screw 121 at one side thereof and the angle of the nozzle unit 120 can be adjusted using the angle adjusting screw 121. The angle adjusting screw 121 can control the angle of spray of the liquid sprayed from the nozzle unit 120 by adjusting the upward / downward angle of the end portion of the nozzle unit 120. Therefore, by adjusting the spraying angle of the liquid, the radial width of the sprayed liquid can be enlarged or reduced. Here, the liquid may be deionized water.

Further, a separate tube (not shown) may be inserted into the nozzle unit 120, and the liquid may be injected through the tube. Here, the tube is connected to an external liquid supply device (not shown), and the liquid can be supplied through the liquid supply device.

The height adjusting unit 130 includes a bracket 131 for forming a step on the lower end of the height adjusting bolt 132 and a height adjusting bolt 132 for adjusting the height of the nozzle unit 120 by a step of the bracket 131, And a fixing screw 133 for fixing the nozzle unit 131 or the nozzle unit 120. [

For example, the bracket 131 is formed with a projection 131a having a step at the lower end, and the lower portion of the nozzle unit 120 is positioned on the projection 131a. Accordingly, the nozzle unit 120 can be moved up and down by the protrusion 131a as the bracket 131 moves up and down. The height adjusting bolt 132 is connected to the bracket 131 and adjusts the height adjusting bolt 132 to move the bracket 131 up and down. (120) can be moved up and down. The fixing screw 133 is provided at one side of the bracket 131 and can fix the nozzle unit 120 and the bracket 131 after adjusting the height of the nozzle unit 120. [

Accordingly, the height adjusting unit 130 adjusts the height of the bracket 131 using the height adjusting bolt 132 and adjusts the height of the nozzle unit 120 by the bracket 131 .

The pedestal 140 is provided at a lower end of the nozzle unit 120 and has a drain hole 141 formed in a bottom surface 142 of the pedestal 140. The liquid sprayed through the nozzle unit 120 may leak, A liquid can be collected and discharged to the outside through the drain hole 141.

The pedestal 140 may be inclined with respect to the drain hole 141 on the bottom surface 142 and may be inclined by the inclination of the bottom surface 142 when the liquid falls off the bottom surface 142 So that the liquid may flow into the drain hole 141. That is, the slope at the side of the drain hole 141 is relatively lower than that at the other side, so that the liquid dropped to the pedestal 140 flows into the drain hole 141. Here, the liquid flowing into the drain hole 141 may be discharged to the outside or reused.

Hereinafter, the process of discharging the liquid through the drain hole 141 in the injection nozzle unit 100 according to an embodiment of the present invention will be described in detail.

FIG. 4 is an exemplary view showing the discharge of residual liquid in the injection nozzle unit 100 according to an embodiment of the present invention.

4, the injection nozzle unit 100 includes a body part 110 fixed to the chamber base 300, a nozzle part provided on the body part 110 for spraying liquid onto the substrate W, 120 and a height adjusting unit 130 for adjusting the height of the nozzle unit 120. The apparatus further includes a pedestal (140) for collecting the liquid or residual liquid after ejecting the liquid onto the substrate (W).

For example, the injection nozzle unit 100 injects liquid through the nozzle unit 120, and the liquid cleans the substrate W with a cleaning liquid, that is, pure water. The nozzle unit 120 discharges a predetermined amount of liquid to the nozzle unit 120 by a water-saving function after spraying the liquid to complete the cleaning of the substrate W, (140). The liquid dropped to the pedestal 140 is collected into the drain hole 141 due to the inclination of the pedestal bottom surface 142 and the collected liquid is discharged to the outside or re- .

Hereinafter, a substrate cleaning apparatus according to another embodiment of the present invention will be described in detail.

5 is a schematic view schematically showing a substrate cleaning apparatus according to another embodiment of the present invention.

5, the substrate W cleaning apparatus 400 includes a chamber 200 for receiving a substrate W, a chamber base 300 provided at a lower end of the chamber 200, And a nozzle unit (100).

For example, the substrate W cleaning apparatus 400 includes a chamber 200, a chamber base 300, and a spray nozzle unit 100. The spray nozzle unit 100 includes a chamber base 300, Respectively. The injection nozzle unit 100 includes a body 110 fixed to the chamber base 300, a nozzle unit 120 provided in the body 110 for spraying liquid onto the substrate W, And a height adjusting unit 130 for adjusting the height of the display unit 120. The apparatus further includes a pedestal (140) for collecting the liquid or residual liquid after ejecting the liquid onto the substrate (W).

The injection nozzle unit 100 is provided outside the chamber 200 to clean the substrate W provided in the chamber 200. That is, the substrate W can be cleaned by spraying liquid from the spray nozzle unit 100 toward the substrate W rotating in the chamber 200. Here, the liquid may be pure water.

Accordingly, since the injection nozzle unit 100 is fixed to the chamber base 300 even if vibration occurs during the lifting / lowering of the chamber 200 or the substrate W, The setting value can be maintained.

With this configuration, the liquid can be injected to a predetermined position of the substrate without being influenced by the outside. Further, by collecting the liquid leaking or residual liquid from the nozzle after the completion of cleaning, it is possible to prevent the contamination due to the liquid in the chamber.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The present invention is not limited to the above-described embodiments, and various modifications and changes may be made thereto by those skilled in the art to which the present invention belongs. Therefore, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, are included in the scope of the present invention.

10: chamber 132: height adjusting bolt
20: Nozzle unit 133: Fixing screw
100: jet nozzle unit 140: pedestal
110: body portion 141: drain hole
111: concave and convex 142: bottom surface
120: nozzle unit 200: chamber
121: Angle adjusting screw 300: Chamber base
130: Height adjuster 400: Substrate cleaner
131: Bracket W: Substrate

Claims (10)

A body portion fixed to the chamber base;
A nozzle unit provided in the body part, for spraying liquid onto the substrate; And
A height adjusting unit for adjusting a height of the nozzle unit;
And a spray nozzle unit. The method according to claim 1,
Further comprising a pedestal for collecting the liquid leaking or remaining after ejecting the liquid onto the substrate. 3. The method of claim 2,
Wherein the pedestal has a drain hole formed on a bottom surface thereof and forms a slope on the bottom surface so that the liquid flows into the drain hole. The method of claim 3,
Wherein the liquid is discharged to the outside or reused by the drain hole. The method according to claim 1,
The height-
A bracket forming a step at a lower end;
A height adjusting bolt for adjusting a height of the nozzle unit by a step of the bracket; And
A fixing screw for fixing the bracket or the nozzle unit;
And a spray nozzle unit. The method according to claim 1,
Wherein the nozzle unit is provided with an angle adjusting screw at one side thereof, and the angle of the nozzle unit is adjusted using the angle adjusting screw. The method according to claim 1,
Wherein the liquid is pure water (Deionized Water). A chamber for receiving a substrate;
A chamber base provided at a lower end of the chamber; And
An injection nozzle unit according to claim 1;
And a substrate cleaning apparatus. 9. The method of claim 8,
Wherein the injection nozzle unit is provided in a chamber base outside the chamber, and cleans a substrate provided in the chamber. 9. The method of claim 8,
Wherein the spray nozzle unit ejects liquid, and the liquid uses pure water.
KR1020120131129A 2012-11-19 2012-11-19 Injection nozzle unit and substrate cleaning device with the same KR20140065655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120131129A KR20140065655A (en) 2012-11-19 2012-11-19 Injection nozzle unit and substrate cleaning device with the same

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Application Number Priority Date Filing Date Title
KR1020120131129A KR20140065655A (en) 2012-11-19 2012-11-19 Injection nozzle unit and substrate cleaning device with the same

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KR20140065655A true KR20140065655A (en) 2014-05-30

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105289896A (en) * 2015-11-24 2016-02-03 余储 Water outlet nozzle component with adjustable speed of water heater
CN105289897A (en) * 2015-11-24 2016-02-03 曾增宗 Abrasion-proof water outlet nozzle assembly provided with storage battery and used for water heater
CN105289898A (en) * 2015-11-24 2016-02-03 邱林新 Water heater water outlet nozzle component having guide chute and capable of adjusting speed
CN105289865A (en) * 2015-11-24 2016-02-03 吴美俊 Water heater water outlet shower assembly capable of preventing power failure
CN105327799A (en) * 2015-11-24 2016-02-17 吴美俊 Water heater water spray head assembly capable of receiving contact-type commands
CN105363612A (en) * 2015-11-24 2016-03-02 余储 Water outlet spray head assembly provided with LED lamp and anti-abrasion layer and applied to water heater
US9842751B2 (en) 2014-10-28 2017-12-12 Tokyo Electron Limited Substrate liquid processing apparatus
CN113053776A (en) * 2019-12-29 2021-06-29 南亚科技股份有限公司 Wet cleaning device and method for using same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9842751B2 (en) 2014-10-28 2017-12-12 Tokyo Electron Limited Substrate liquid processing apparatus
CN105289896A (en) * 2015-11-24 2016-02-03 余储 Water outlet nozzle component with adjustable speed of water heater
CN105289897A (en) * 2015-11-24 2016-02-03 曾增宗 Abrasion-proof water outlet nozzle assembly provided with storage battery and used for water heater
CN105289898A (en) * 2015-11-24 2016-02-03 邱林新 Water heater water outlet nozzle component having guide chute and capable of adjusting speed
CN105289865A (en) * 2015-11-24 2016-02-03 吴美俊 Water heater water outlet shower assembly capable of preventing power failure
CN105327799A (en) * 2015-11-24 2016-02-17 吴美俊 Water heater water spray head assembly capable of receiving contact-type commands
CN105363612A (en) * 2015-11-24 2016-03-02 余储 Water outlet spray head assembly provided with LED lamp and anti-abrasion layer and applied to water heater
CN113053776A (en) * 2019-12-29 2021-06-29 南亚科技股份有限公司 Wet cleaning device and method for using same
CN113053776B (en) * 2019-12-29 2024-03-01 南亚科技股份有限公司 Wet cleaning device and method for using same

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