KR100600239B1 - Device for surface treatment of substrate - Google Patents

Abstract

The present invention relates to a surface treatment apparatus of a substrate, which is fixed and horizontally rotated chuck, the rinse ring is installed so that the vertical reciprocating movement while the chuck is located therein, the chamber and the substrate is installed with the external pipe while the rinse ring is located inside By including a plurality of injectors initially set to face the center of the same, one operation is performed on one member, thereby avoiding interference between power sources linked to the chuck and rinse ring, as well as stable and accurate operation of each member. Operation, the injection of the preceding medium is terminated and the injection of the following medium is started, so that precise surface treatment is performed on the substrate, and defects due to breakage and process error are significantly reduced, and also occur during the surface treatment process of the substrate. Process liquid and gas can be collected in a separate outlet, and The discharge from the tip of the inlet is discharged directly to the space other than the set and the non-emission is to be removed.

 Substrate, Wafer, Etch, Rinse, Chuck

Description

Device for surface treatment of substrate             

1 is a partial perspective view schematically showing a surface treatment apparatus of a substrate according to an embodiment of the present invention,

2 is a perspective view schematically showing a main member of the surface treatment apparatus of FIG.

Figure 3 is a side cross-sectional perspective view of the inside of the surface treatment apparatus of Figure 1,

Figure 4 is a side cross-sectional perspective view schematically showing a substrate surface treatment apparatus according to another embodiment of the present invention,

5 is a state diagram used in the surface treatment apparatus of FIG.

<Description of Symbols for Main Parts of Drawings>

10.Surface treatment unit 20 ...

22 ... spindle 30 ... rinse ring,

32 ... catchment 34 ... annular groove,

36 ... through hole 40 ... chamber,

41, 42, 43, 44 ... Exhaust pipe 45 ... Piping

50 ... Distributor 52,54,56 ... Injector.

The present invention relates to a surface treatment apparatus for a substrate, and more particularly, a substrate is mounted so that the treatment liquid and dry gas is sprayed onto the surface of the substrate such as a semiconductor wafer, and the apparatus for discharging the treatment liquid and dry gas It is about.

In general, a substrate such as a wafer for a semiconductor is subjected to surface treatment such as etching and cleaning on the surface, and the substrate is fixed and rotated for surface treatment of the substrate, and the treatment liquid and dry gas sprayed onto the rotated substrate Surface treatment apparatus is required so that the same medium is separated and discharged.

Conventional surface treatment apparatus of the substrate was provided with a chuck mounted on the substrate is mounted so as to enable vertical reciprocating movement and horizontal rotation, and the chamber is formed with a plurality of discharge path in the vertical direction as the chuck is located inside.

The lower side of the chuck was mounted with a motor for rotating the chuck, and a cylinder was installed to vertically reciprocate the chuck and the motor.

However, by simultaneously performing two operations in which the chuck on which the substrate is seated is rotated and vertically reciprocated at the same time, between each power source to be operated, that is, rotation is adversely affected by vertical reciprocating movement and vertical reciprocating movement is caused by And the cylinder is easily aged, and thus, the chuck is exerted, which makes it difficult to carry out an accurate operation. In addition, an incorrect operation of the chuck may cause a process error on the substrate seated on the chuck. There was a problem that can cause unexpected damage.

The present invention devised in view of the above problems includes a fixed and horizontally rotated chuck, a rinse ring installed to move vertically reciprocating while the chuck is positioned therein, and a chamber in which an external pipe is installed while the rinse ring is positioned inside Due to the separate operation of the chuck and the rinse ring, each power source can not only reduce interference with each other but also control the precise operation with minimal load. The purpose of the present invention is to provide a surface treatment apparatus for a substrate such that a difference in the end and start times of spraying between two media for surface treatment of the substrate is consistent with a set value, thereby achieving a high quality surface treatment.

Surface treatment apparatus for a substrate according to the present invention for achieving the above object, Chuck disposed so that the substrate is required to the surface treatment process is rotated at a fixed height; A rinse ring arranged to move the chuck vertically and to move the chuck vertically so that the discharge generated in the surface treatment process is collected by type; And a chamber in which the rinsing ring is positioned inside, and a discharge path communicating with an external pipe is formed so that the discharged matter divided by the rinse ring is discharged.

The rinse ring is mounted so as to be lifted and lowered by an elevator positioned at a lower side, and is formed as a continuous groove on the upper surface of the rinsing channel and communicates with the selected discharge passage, and a continuous groove which is opened upwardly under the inner surface of the frame. An annular groove formed in communication with the water collecting channel and at least one through hole is formed on an inwardly inclined surface formed from the annular groove.

The upper edge of the frame outer portion of the rinse ring forms a sharp shape so that the discharge at the step can slide smoothly along the upper surface of the rinse ring.

The chamber further includes one or more holes formed in the upper portion of the chamber to allow the floating gas to flow therein, and an exhaust pipe installed to communicate the one or more discharge paths so that the gas introduced into the holes is discharged.

The chamber may include a first discharge passage formed between an inner surface of the chamber and an outer surface of the rinse ring, a second discharge passage formed to communicate with the collecting passage, a third discharge passage formed to communicate with the through hole, and A fourth discharge path is formed to be connected to the lower end of the inclined surface and formed to be a continuous groove, and each discharge path is configured to communicate with at least one place with an external pipe.

Dispensers installed in communication with the source of the medium for the surface treatment of the circular substrate seated on the chuck, and a plurality of injection pipes disposed in communication with the dispenser to inject the medium, each of the injection pipes are the same horizontal line The phases are excluded and the open ends having different inclinations are initially mounted so as to face the center of the substrate at the same time.

Hereinafter, a surface treatment apparatus of a substrate according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a partial perspective view schematically showing a surface treatment apparatus of a substrate according to a preferred embodiment of the present invention, Figure 2 is a perspective view schematically showing a main member of the surface treatment apparatus of Figure 1, Figure 3 is FIG. The inside of the surface treatment apparatus of the side cross-sectional perspective view shown with the chuck removed.

In the surface treatment apparatus 10 of a substrate according to the present invention, a substrate for surface treatment is placed on the chuck 20, and a rinse ring 30 is disposed such that an upper portion of the chuck 20 is accommodated, and the rinse ring ( The chamber 40 is arranged to accommodate the upper portion of the 30.

The chuck 20 has a spindle 22 having one end interlocked with a driving device located below the chamber 40 and a rotating body mounted horizontally with the other end of the spindle 22 interlocked. 24 is included, and the rotating body 24 is fixed at a constant height so that only the horizontal rotation.

The rinse ring 30 is mounted to be lifted and lowered by an elevator located below while the rotor 24 is positioned therein, and a collecting passage 32 is formed to communicate with the discharge passage 42 to be described later. An annular groove 34 is formed below the inner surface to communicate with the water collecting passage 32 through a plurality of holes, and one or more through holes 36 are formed on the inclined surface formed inwardly from the annular groove 34.

The rinse ring 30 is a vertical reciprocating movement of the height is set so that the processing liquid and the gas generated during the process provided to the substrate seated on the chuck 20 are separated and discharged into the corresponding discharge path. Here, the rinse ring 30 is a term referred to for convenience and is not necessarily made of a ring shape, but may be formed in various shapes.

The rinse ring 30 is engaged with at least one shaft 38 penetrating the lower portion of the chamber 40, and the rinse ring 30 is vertically reciprocated while the shaft 38 is extended or reduced in length by an elevator. Is made to move. The vertical reciprocating movement of the rinse ring 30 can be used in a variety of other forms, including the way in which the chamber 40 and a part of the rinsing ring can be vertically moved while being rotated by screwing.

The water collecting passage 32 is a shape in which a groove having a predetermined depth is continuously formed on the upper surface of the frame of the rinse ring 30 having a hollow shape, and is inserted into the discharge passage 42 at a lower portion thereof to vertically reciprocate the rinsing ring 30. An extension portion 31a is formed to smoothly flow out of the discharge path 42 and the discharge of the water collecting passage 32, and the extension portion 31a may be formed at least one.

In addition, the annular groove 34 communicated with the water collecting passage 32 while being formed as a continuous groove to be opened upward below the inner surface of the frame of the rinse ring 30 has a small amount of residual flowing along the inner surface of the rinse ring 30. The treatment liquid is collected and is formed to guide the collected discharge into the discharge passage 42 through the collecting passage 32.

The through hole 36 is formed during the surface treatment process of the substrate so as to allow the infiltrating gas to flow in and out.

Meanwhile, a plurality of discharge paths 41, 42, 43, and 44 are formed in the chamber 40, and a plurality of external pipes 45 are mounted to communicate with the discharge paths 41, 42, 43, and 44. . The discharged out through the predetermined discharge path by this pipe 45 is circulated and reused, and the discharged out through the other discharge path is completely dumped.

The discharge paths 41, 42, 43, and 44 may be a surface treatment step of a substrate, that is, an etching or cleaning step requiring a medium, a rinse step, a drying step in which gas is injected along with rotation or rotation. The emissions generated in the step and the emissions generated during the process are divided to be discharged.

Here, the discharge path is a first discharge path 41 formed between the chamber 40 and the rinse ring 30 to allow the discharge in the etching or cleaning step, and the rinse ring 30 so that the discharge in the rinsing step flows in. A second discharge passage 42 in communication with the collecting channel 32 of the c), a third discharge passage 43 formed in communication with the through hole 36 of the rinse ring 30, and the rinse ring 30 The fourth discharge path 44 is formed to be connected to the end of the inclined surface of the discharge and finally collected and discharged for the discharge that may remain in the chamber 40, and each discharge path 41, 42, 43, 44, at least one external pipe 45 is coupled to each other.

In addition, the first and second discharge passages 41 and 42 may be used by changing their roles as the set height changes of the rinse ring 30 according to each step.

Meanwhile, as shown in FIG. 4, a plurality of exhaust holes 46 are formed in the upper portion of the chamber 40 to collect floating gas generated during the process, and the upper portions in which the exhaust holes 46 are formed protrude toward the center. Preferably, the exhaust hole 46 is formed in the third discharge path 43 so that the through hole 36 and the external pipe 45 communicate with each other through the discharge port 43a and the exhaust pipe 47. .

Here, at least one portion of an exhaust pipe 47 connected to the exhaust hole 46, an outlet 43a connected to the exhaust hole 46, and a portion at which the exhaust pipe 47 and the outlet 43a are joined. A predetermined adjustment member is installed in the control unit, and by adjusting the adjustment member, the discharge of the gas through any selected path can be controlled. At this time, the adjustment member may be any member that includes an on-off valve or a damper (damper) to control the flow rate of the gas.

5 is provided with a distributor 50 in communication with the processing liquid and the gas supply source so that the processing liquid and gas are ejected on the upper surface of the substrate seated on the chuck 20 for surface treatment of the substrate. At the same time, a plurality of injection pipes 52, 54, 56 protrude from the top end of the substrate so that the open end is positioned downward.

The injection pipes 52, 54, and 56 in order to ensure that the end and start times of the medium injection between the plurality of injection pipes 52, 54, and 56 installed in stages for the surface treatment of the substrate correspond to a preset time. It is preferred that the initial position of the open end of is located at the center of the substrate.

That is, since the ejection of the medium for the surface treatment of the substrate should always start from the center of the substrate, it is preferable that the open ends of the injection tubes 52, 54, 56 are positioned downward so as to face the center of the substrate at the same time. The injection pipes 52, 54 and 56 communicating with the distributor 50 are bent downward by differently bent portions as desired while being positioned with the same horizontal line excluded, and the bent open ends have different inclinations. do.

Here, for example, the injection pipes 54 and 56 may be connected to each other and may be formed in the same manner, and different inclinations from the injection pipes 52 may be formed. In addition, the injection pipes 52, 54, 56 may be disposed to be spaced apart from each other, and may have different inclinations.

On the other hand, when the injection of the medium from one of the preceding injection tube is controlled so that the medium is injected from the following one or more injection tube, wherein the open ends of the injection pipe (52, 54, 56) at the same time toward the center of the substrate It is positioned so that the trailing jetting tube at the initial position may inject the medium to the center of the substrate according to the time set after the media injection of the preceding jetting tube is finished. In particular, at the same time as the medium injection of the preceding injection pipe, the medium of the subsequent injection pipe can be injected to the center of the substrate, so that the surface treatment of the substrate by the medium can be precisely and accurately performed.

Hereinafter, the operation of the surface treatment apparatus of the substrate according to the present invention will be briefly described.

The injection pipes 52, 54, 56 are formed so that the chuck 20 rotates horizontally while the substrate requiring surface treatment is seated on the chuck 20, and the medium is sprayed on the substrate according to the setting. Rotate on the surface interlocked.

At this time, when the medium for the surface treatment of the substrate is changed in stages and sprayed on the surface of the substrate, the rinse ring 30 is moved vertically to correspond to this step, and the first discharge for each medium by the movement of the rinse ring 30. The discharge 41 is separated into the second discharge passage 42 through the furnace 41, the collecting passage 32 and the annular groove 34, and the remaining treatment liquid is finally collected and discharged through the fourth discharge passage 44. The gas generated during the process is discharged to the third discharge path 43 through the exhaust hole 46 formed in the upper portion of the chamber 40 and the through hole 36 formed in the rinse ring 30.

For example, the outer upper end of the rinse ring 30 is located at a level below the horizontal of the upper surface of the chuck 20 so that the discharge generated in a predetermined step flows into the first discharge path 41, and then rinse An upper surface of the chuck 30 is positioned between the inner upper end and the outer upper end of the ring 30 so that the discharge generated in the next step flows into the collecting passage 32 and then flows into the second discharge passage 42. The inner upper end of the rinsing ring 30 is positioned higher than the upper surface of the chuck 30 so that the undischarged discharged to the first discharge passage 41 and the second discharge passage 42 are collected in the annular groove 34 and discharged. While the discharge remaining in the chamber 40 is finally collected and discharged in the fourth discharge path 44, and the gas generated during the substrate processing is discharged through the exhaust hole 46 and the through hole 36 Flow to the discharge path 43 to be discharged.

Here, the type of the medium flowing into the first discharge passage 41 or the second discharge passage 42 may be changed according to the setting change of the height change of the rinse ring 30.

The discharge passages 41, 42, 43, and 44 are in communication with the external pipes 45, respectively, and some of the discharges are circulated and reused as necessary, and some of the discharges are completely dumped.

In addition, when the treatment liquid sprayed on the substrate is detached from the substrate, a small amount of discharge is agglomerated through the sharp upper end of the rinse ring 30 to prevent it from being dropped into discharge passages other than the discharge passage.

On the other hand, the gas generated during the surface treatment process of the substrate is exhausted separately from the processing liquid in the upper and lower portions of the chamber 40.

According to the present invention configured as described above, the horizontal rotation and the vertical movement required for the surface treatment of the substrate are each made by the chuck and the rinse ring, that is, one operation is performed on one member to control the operation of the chuck and the rinse ring. As well as avoiding adverse influences caused by interference between power sources, stable and accurate operation of each member can be achieved, precise surface treatment of the substrate can be performed accurately, and defects caused by breakage and process errors can be significantly reduced. This is improved.

In addition, a discharge path for separating and discharging the gas and the treatment liquid generated during the surface treatment process of the substrate is formed separately, so that the discharge and recirculation to the outside is made smoothly as necessary, and from the inlet end of the substrate or discharge path It is directly underneath and flows into the space other than the scheduled space of the discharge, eliminating the phenomenon of remaining or not discharged inside, and the difference between the end and start time of the injection between the two media for the surface treatment of the substrate is consistent with the set value, so that It has an effect.

Claims (6)

A chuck placed on the substrate on which the surface treatment process is required and disposed to rotate at a fixed height; A rinse ring arranged to move the chuck vertically and to move the chuck vertically so that the discharge generated in the surface treatment process is collected by type; A chamber in which the rinsing ring is positioned inside and in which a discharge path communicating with an external pipe is formed so as to discharge discharged matter divided by the rinsing ring; Surface treatment apparatus of the substrate is provided. The method of claim 1, The rinse ring is mounted so as to be lifted and lowered by an elevator positioned at a lower side, and is formed as a continuous groove on the upper surface of the rinsing channel and communicates with the selected discharge passage, and a continuous groove which is opened upwardly under the inner surface of the frame. And an annular groove formed in communication with the catchment channel and at least one through hole formed on an inwardly inclined surface formed from the annular groove. The method according to claim 1 or 2, The frame outer upper end portion of the rinse ring surface treatment apparatus of the substrate, characterized in that forming a sharp shape so that the discharge in the step can slide smoothly along the upper surface of the rinse ring. The method of claim 2, The chamber further comprises at least one hole formed in the upper portion of the chamber so that the floating gas flows, and the exhaust pipe is installed to communicate with the hole and the at least one discharge passage so that the gas flowed into the hole further comprises a substrate Surface treatment equipment. The method according to claim 2 or 4, The chamber may include a first discharge passage formed between an inner surface of the chamber and an outer surface of the rinse ring, a second discharge passage formed to communicate with the collecting passage, a third discharge passage formed to communicate with the through hole, and And a fourth discharge path formed up into a continuous groove while being connected to the lower end of the inclined surface, wherein each discharge path is formed in communication with the external pipe at one or more places. The method of claim 1, Dispensers are provided in communication with the source of the medium for the surface treatment of the substrate seated on the chuck, and a plurality of injection pipes disposed in communication with the dispenser to inject the medium, each of the injection pipes are on the same horizontal line Surface treatment apparatus for the substrate, characterized in that the initial stage is set to be initially set so that the open ends having different inclination mutually different to the center of the substrate at the same time.

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