KR102022953B1 - unit for supplying Chemical , Apparatus and Method for treating substrate with the unit - Google Patents

unit for supplying Chemical , Apparatus and Method for treating substrate with the unit Download PDF

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Publication number
KR102022953B1
KR102022953B1 KR1020120154832A KR20120154832A KR102022953B1 KR 102022953 B1 KR102022953 B1 KR 102022953B1 KR 1020120154832 A KR1020120154832 A KR 1020120154832A KR 20120154832 A KR20120154832 A KR 20120154832A KR 102022953 B1 KR102022953 B1 KR 102022953B1
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South Korea
Prior art keywords
chemical liquid
liquid
specific gravity
storage space
value
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KR1020120154832A
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Korean (ko)
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KR20140084863A (en
Inventor
조원필
박귀수
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세메스 주식회사
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Publication of KR20140084863A publication Critical patent/KR20140084863A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The practice of the present invention provides an apparatus and method for treating a substrate using a chemical liquid. The liquid supply unit includes a regeneration tank provided with a liquid storage space for storing the chemical liquid, a purge gas line for supplying purge gas to the liquid storage space, and a pressure sensor for measuring the pressure of the gas region in the liquid storage space. Thus, by measuring the concentration of the chemical liquid provided to the regeneration tank, it is possible to prevent the chemical liquid that does not meet the concentration reference value to be supplied to the buffer tank.

Description

Liquid supply unit, substrate processing apparatus and method having the same {unit for supplying Chemical, Apparatus and Method for treating substrate with the unit}

The present invention relates to an apparatus and method for processing a substrate, and more particularly, to an apparatus and method for processing a substrate using a chemical liquid.

In order to manufacture a semiconductor device or a liquid crystal display, various processes such as photolithography, etching, ashing, and cleaning are performed on the substrate. These processes supply various chemical liquids on the substrate, and the chemical liquids used are separated and recovered and reused.

FIG. 1 is a view showing a general liquid supply unit. Referring to FIG. 1, a chemical liquid is used in a process, and then is recovered to a regeneration tank 2. The chemical liquid filled in the regeneration tank 2 has a concentration value different from the concentration reference value to be used in the process. As a result, the recovered chemical liquid that has not reached the concentration reference value may be supplied to the buffer tank 4 to be reused or mixed with the chemical liquid adjusted to the concentration reference value.

In addition, the chemical liquid provided to the regeneration tank 2 is sulfuric acid (H 2 SO 4 ) or a chemical containing sulfuric acid, which generates a lot of fume. However, it is difficult to accurately measure the concentration of the chemical that generates a large amount of fume with a general concentration measuring member.

The present invention is to provide an apparatus and method capable of measuring the concentration of the recovered chemical liquid in the regeneration tank.

The practice of the present invention provides an apparatus and method for treating a substrate using a chemical liquid. The liquid supply unit includes a regeneration tank provided with a liquid storage space for storing the chemical liquid, a purge gas line for supplying purge gas to the liquid storage space, and a pressure sensor for measuring the pressure of the gas region in the liquid storage space.

The liquid supply unit is connected to the regeneration tank, the drain line for draining the chemical liquid filled in the liquid storage space to the outside, the liquid supply line is connected to the regeneration tank, supply the chemical liquid filled in the liquid storage space, the drain line Receiving the actual pressure value measured from the pressure sensor for the amount of the chemical liquid equal to the reference value and the drain valve for opening and closing the liquid supply line, the supply valve for opening and closing the liquid supply line, and comparing the measured value calculated from the actual pressure value with the reference value. In comparison, it may further include a controller for controlling the drain valve or the supply valve. The apparatus may further include a level sensor measuring an actual level value of the chemical liquid filled in the liquid storage space and providing information about the actual level value to the controller. The measured value may be provided as a specific gravity value of the gas region. The chemical liquid may be provided with sulfuric acid or a chemical including sulfuric acid.

The substrate treating apparatus includes a liquid supply unit for supplying a chemical liquid on a substrate to process the substrate, and a liquid supply unit for regenerating and supplying the chemical liquid discharged from the process processing unit to the process processing unit. A filter member for filtering the chemical liquid recovered from the process unit, a regeneration tank provided with a liquid storage space receiving the chemical liquid from the filter member, a buffer tank provided with a buffer space receiving the chemical liquid from the regeneration tank, and the liquid storage space. A purge gas line for supplying a purge gas to the pressure, and a pressure sensor for measuring the pressure of the gas region in the liquid storage space.

The substrate processing apparatus is connected to the regeneration tank, the drain line for draining the chemical liquid filled in the liquid storage space to the outside, the regeneration tank and the buffer tank, respectively, and the chemical liquid filled in the liquid storage space to the buffer space The actual pressure value measured by the pressure sensor is supplied to the liquid supply line for supplying, the drain valve for opening and closing the drain line, the supply valve for opening and closing the liquid supply line, and the amount of the chemical liquid equal to the reference value, and the actual pressure The controller may further include a controller configured to control the drain valve or the supply valve by comparing the measured value calculated from the value with a reference value. The measured value may be provided as a specific gravity value of the gas region, and the chemical liquid may be provided as sulfuric acid or a chemical including sulfuric acid.

In the substrate processing method for measuring the concentration of the chemical liquid, a predetermined amount of the chemical liquid having a predetermined concentration is filled in the liquid storage space of the regeneration tank, and a preset specific gravity value is measured for the gas region except the liquid region in the liquid storage space. Step, the chemical liquid supply step of supplying the same amount of the chemical liquid to the reference specific gravity value in the empty liquid storage space, the specific gravity measurement step of measuring the actual specific gravity value of the gas region filled with the chemical liquid in the chemical liquid supply step, and the reference Comprising a concentration measurement step of measuring the concentration of the chemical liquid by comparing the specific gravity value and the actual specific gravity value.

After the concentration measurement step, if the actual specific gravity value is higher than the reference specific gravity value, the chemical liquid for the actual specific gravity value is supplied to the nozzle, and if the actual specific gravity value is lower than the reference specific gravity value, The method may further include a chemical treatment step of draining the chemical solution to the outside. The purge gas may be continuously provided to the liquid storage space.

According to the embodiment of the present invention, by measuring the concentration of the chemical liquid provided to the regeneration tank, it is possible to prevent the chemical liquid that does not meet the concentration reference value to be supplied to the buffer tank.

In addition, according to the embodiment of the present invention, it is possible to measure the concentration of the chemical liquid that is difficult to measure by a general concentration measuring member.

1 is a view showing a general liquid supply unit.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
3 is a cross-sectional view showing the process processing unit of FIG.
4 is a sectional view showing the liquid supply unit of FIG.
FIG. 5 is a block diagram illustrating a process in which the controller of FIG. 4 adjusts the concentration of a chemical liquid.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape and the like of the components in the drawings are exaggerated to emphasize a more clear description.

Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 2 to 5.

2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing facility 1 has an index module 10 and a process processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a row. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process module 20 are arranged is referred to as a first direction 12, and when viewed from the top, perpendicular to the first direction 12. The direction is called the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is called the third direction 16.

The carrier 130 in which the substrate W is accommodated is mounted in the load port 140. A plurality of load ports 120 are provided and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint of the process module 20. The carrier 130 is formed with a plurality of slots (not shown) for accommodating the substrates W in a state in which the substrates W are disposed horizontally with respect to the ground. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The conveyance chamber 240 is disposed in parallel with the first direction 12 in the longitudinal direction thereof. Process chambers 260 are disposed on both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the process chambers 260 are provided to be symmetrical with respect to the transfer chamber 240. One side of the transfer chamber 240 is provided with a plurality of process chambers 260. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are arranged to be stacked on each other. That is, the process chambers 260 may be arranged in an array of A X B on one side of the transfer chamber 240. Where A is the number of process chambers 260 provided in a line along the first direction 12 and B is the number of process chambers 260 provided in a line along the third direction 16. When four or six process chambers 260 are provided at one side of the transfer chamber 240, the process chambers 260 may be arranged in an arrangement of 2 × 2 or 3 × 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided as a single layer on one side and both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space where the substrate W stays between the transfer chamber 240 and the transfer frame 140 before the substrate W is transferred. The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed. A plurality of slots (not shown) are provided to be spaced apart from each other along the third direction 16. The buffer unit 220 has a surface facing the transfer frame 140 and a surface facing the transfer chamber 240 are opened.

The transfer frame 140 transports the substrate W between the carrier 130 seated on the load port 120 and the buffer unit 220. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided in parallel with the second direction 14 in the longitudinal direction thereof. The index robot 144 is installed on the index rail 142 and is linearly moved in the second direction 14 along the index rail 142. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. Body 144b is coupled to base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. In addition, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and provided to move forward and backward with respect to the body 144b. The plurality of index arms 144c are provided to be individually driven. The index arms 144c are stacked to be spaced apart from each other along the third direction 16. Some of the index arms 144c are used when the substrate W is transferred from the process processing module 20 to the carrier 130, and some of the index arms 144c are transferred from the carrier 130 to the process processing module 20. ) Can be used when returning. This can prevent particles generated from the substrate W before the process treatment from being attached to the substrate W after the process treatment while the index robot 144 loads and unloads the substrate W.

The transfer chamber 240 transports the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rail 242 is disposed such that its length direction is parallel to the first direction 12. The main robot 244 is installed on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242. Body 244b is coupled to base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. In addition, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, which is provided to be capable of moving forward and backward with respect to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are stacked to be spaced apart from each other along the third direction 16.

In the process chamber 260, a substrate processing apparatus 300 that performs a cleaning process on the substrate W is provided. The substrate processing apparatus 300 may have a different structure according to the type of cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, so that the substrate processing apparatuses 300 in the process chamber 260 belonging to the same group are the same, and the substrate processing apparatuses in the process chamber 260 belonging to different groups. The structures of 300 may be provided differently from each other.

The substrate processing apparatus 300 includes a process processing unit 302 and a liquid supply unit 304. The processing unit 302 processes the chemical liquid on the substrate W, and the liquid supply unit 304 circulates the chemical liquid used in the processing unit 302 to recover and reuse it. 3 is a cross-sectional view showing the process processing unit of FIG. The process unit 302 includes a housing 320, a spin head 340, a lifting unit 360, and an injection unit 380. The housing 320 has a space in which a substrate treatment process is performed, and an upper portion thereof is opened. The housing 320 has an inner recovery container 322 and an outer recovery container 328. Each recovery container 322,328 recovers different chemical liquids from among the chemical liquids used in the process. The inner recovery container 322 is provided in an annular ring shape surrounding the spin head 340, and the outer recovery container 328 is provided in an annular ring shape surrounding the inner recovery container 322. The inner space 322a of the inner recovery container 322 and the space 328a between the inner recovery container 322 and the outer recovery container 328 are chemical recovery fluids into the inner recovery container 322 and the external recovery container 328, respectively. It functions as an inlet for inflow. Each recovery container 322,328 is connected to the recovery line (322b, 328b) extending vertically in the bottom direction. Each of the recovery lines 322b and 328b discharges the chemical liquid introduced through the respective recovery vessels 322 and 328. The discharged chemical liquid is reused through the liquid supply unit.

The spin head 340 supports the substrate W and rotates the substrate W during the process. The spin head 340 has a body 342, a support pin 344, a chuck pin 346, and a support shaft 348. Body 342 has a top surface that is provided generally circular when viewed from the top. A support shaft 348 rotatable by the motor 349 is fixedly coupled to the bottom of the body 342.

The support pin 344 is provided in plurality. The support pins 344 are spaced apart at predetermined intervals from the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 344 are arranged to have an annular ring shape as a whole by combining with each other. The support pin 344 supports the rear edge of the substrate W so that the substrate W is spaced apart from the upper surface of the body 342 by a predetermined distance.

A plurality of chuck pins 346 are provided. The chuck pins 346 are disposed farther from the support pins 344 in the center of the body 342. The chuck pins 346 are provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W does not deviate laterally from the home position when the spin head 340 is rotated. The chuck pins 346 are provided to enable linear movement between the standby position and the support position along the radial direction of the body 342. The standby position is a position far from the center of the body 342 relative to the support position. When the substrate W is loaded or unloaded from the spin head 340, the chuck pins 346 are positioned at the standby position, and when the process is performed on the substrate W, the chuck pins 346 are positioned at the support position. The chuck pins 346 are in contact with the side of the substrate W at the support position.

The lifting unit 360 linearly moves the housing 320 in the vertical direction. As the housing 320 is moved up and down, the relative height of the housing 320 relative to the spin head 340 is changed. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly installed on the outer wall of the housing 320, and the movement shaft 364 which is moved in the vertical direction by the driver 366 is fixedly coupled to the bracket 362. The housing 320 is lowered so that the spin head 340 protrudes above the housing 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. In addition, when the process is in progress, the height of the housing 320 is adjusted to allow the chemical liquid to flow into the predetermined recovery container 360 according to the kind of the chemical liquid supplied to the substrate W. Optionally, the lifting unit 360 may move the spin head 340 in the vertical direction.

The injection unit 380 sprays the chemical liquid onto the substrate W. The injection unit 380 includes a support shaft 386, a support 392, and a nozzle 394. The support shaft 386 is disposed on one side of the housing 320. The support shaft 386 has a rod shape whose longitudinal direction is provided in the vertical direction. The support shaft 386 may be rotated and lifted by the driving member 388. In contrast, the support shaft 386 may be linearly moved and lifted in the horizontal direction by the driving member 388. A support 392 supports the nozzle 394. The support 392 is coupled to the support shaft 386, and the nozzle 394 is fixedly coupled to the bottom of the end. The nozzle 394 may be swing-moved by the rotation of the support shaft 386. In one embodiment, the chemical liquid may be a liquid having a strong acid properties. The chemical liquid may be a mixed solution containing sulfuric acid (H 2 SO 4 ) or sulfuric acid (H 2 SO 4 ).

The liquid supply unit 304 regenerates the chemical liquid introduced through each recovery line 328b and then supplies it to the injection unit 380. 4 is a sectional view showing the liquid supply unit of FIG. Referring to FIG. 4, the liquid supply unit 304 includes a filter member 410, a regeneration tank 420, a specific gravity measuring unit 440, a controller 460, and a buffer tank 480. The chemical liquid introduced through the recovery line 328b is provided to the injection unit 380 through the filter member 410, the regeneration tank 420, and the buffer tank 480 sequentially.

The filter member 410 and the opening / closing valve 412 are installed on the recovery line 328b. The filter member 410 removes foreign substances from the chemical liquid introduced through the recovery line 328b. The regeneration tank 420 is connected to the end of the recovery line 328b. The open / close valve 412 is provided between the filter member 410 and the regeneration tank 420 to open and close the recovery line 328b. The chemical liquid from which foreign substances are removed from the filter member 410 is provided to the regeneration tank 420. The regeneration tank 420 has a tubular shape and provides a liquid storage space therein. The chemical liquid from which the foreign substance was removed flows into the liquid storage space. The first drain line 422 is connected to the bottom of the regeneration tank 420. The chemical liquid filled in the liquid storage space is discharged to the outside through the first drain line 422. Hereinafter, for convenience of description, the region filled with the chemical liquid in the liquid storage space is referred to as the liquid region b, and the upper region of the liquid region b is referred to as the gas region a.

The specific gravity measurement unit 440 measures the specific gravity of the gas region a in the liquid storage space. The specific gravity measurement unit 440 includes a purge gas supply member 442, a pressure sensor 448, and a level sensor 450. The purge gas supply member 442 supplies the purge gas to the liquid storage space. The purge gas supply member 442 has a purge gas supply line 444 and a purge gas storage unit 446. The purge gas supply line 444 is connected to the purge gas storage 446 and the regeneration tank 420, respectively. The purge gas stored in the purge gas storage unit 446 is introduced into the liquid storage space through the purge gas supply line 444. In one example, the purge gas may be continuously purged in the liquid storage space. The purge gas may be an inert gas. For example, the purge gas may be nitrogen gas (N 2 ).

The pressure sensor 448 is installed in the regeneration tank 420 to measure the pressure of the gas region a in the liquid storage space. The level sensor 450 measures the level of the chemical liquid filled in the liquid storage space. The level sensor 450 is installed in the regeneration tank 420.

The buffer tank 480 temporarily stores the chemical liquid before supplying the chemical liquid to the injection unit 380. The buffer tank 480 has a cylindrical shape and provides a buffer space therein. The buffer tank 480 is connected to the regeneration tank 420 by a liquid supply line. The chemical liquid introduced from the liquid storage space through the liquid supply line is provided to the buffer space. The chemical liquid provided in the buffer space is supplied to the nozzle of the injection unit 380. The chemical liquid refill line 462 and the second drain line 464 are connected to the buffer tank 480. The chemical liquid supply line 462 supplies the chemical liquid that is insufficient in the buffer space, and discharges the chemical liquid provided in the second drain line 464 buffer space to the outside. For example, the chemical liquid supplied through the chemical liquid refilling line 462 may be a liquid having a predetermined concentration. The concentration tank (not shown) is installed in the buffer tank 480. A concentration meter (not shown) measures the concentration of the chemical solution provided in the buffer space. When the concentration of the chemical liquid is out of the predetermined range by the measured value, the chemical liquid provided to the buffer space is discharged to the outside through the second drain line 464.

The controller 460 determines a supply path of the chemical liquid filled in the liquid storage space according to the concentration of the chemical liquid filled in the liquid storage space. The controller 460 controls the drain valve installed in the first drain line 422 or the supply valve installed in the liquid supply line according to the concentration of the chemical liquid filled in the liquid storage space. FIG. 5 is a block diagram illustrating a process in which the controller of FIG. 4 adjusts the concentration of a chemical liquid. Referring to Figure 5, the liquid storage space is filled with a predetermined amount of the chemical liquid of a predetermined concentration. The level sensor 450 measures a reference level value of the chemical liquid, and the pressure sensor 448 measures a reference pressure value of the liquid storage space. The controller 460 receives the reference level value from the level sensor 450 to calculate the volume of the gas region a, and calculates the volume of the gas region a and the reference pressure value provided from the pressure sensor 448. The reference specific gravity value of the gas region a is calculated through (S10).

Thereafter, the process proceeds, and the chemical liquid recovered from the collecting container is provided to the liquid storage space, and the controller 460 adjusts the opening / closing valve 412 to provide the chemical liquid in the liquid storage space equal to the reference level value (S20). ). If the amount of the chemical liquid provided to the liquid storage tank is provided with the same amount as when calculating the reference level value, the pressure sensor 448 measures the actual pressure value of the gas region a. The controller 460 receives the actual pressure value to calculate an actual specific gravity value of the gas region a (S30), and compares it with the reference specific gravity value (S40). For example, when the chemical liquid is a mixture of sulfuric acid and pure water, sulfuric acid and pure water have different specific gravity values. Therefore, when the ratio between sulfuric acid and pure water is different from the reference value, the actual specific gravity value is different from the reference specific gravity value. For example, the more sulfuric acid in the fume state in the gas region a, the higher the specific gravity value of the gas region a is.

The controller 460 compares the actual specific gravity value with the reference specific gravity value, and opens either one of the drain valve and the supply valve according to the comparison result and closes the other (S50). According to an example, when the actual specific gravity value is higher than the reference specific gravity value, the controller 460 may open the supply valve to supply the chemical liquid provided to the regeneration tank 420 to the buffer tank 480. On the contrary, if the actual specific gravity value is lower than the reference specific gravity value, the controller 460 opens the drain valve to discharge the chemical liquid provided to the regeneration tank 420 to the outside.

302: process processing unit 304: liquid supply unit
410: filter member 420: regeneration tank
444: purge gas line 446: pressure sensor
460: buffer tank

Claims (14)

A regeneration tank provided with a liquid storage space in which the chemical liquid is stored;
A purge gas line for supplying purge gas to the liquid storage space;
A pressure sensor measuring a pressure of a gas region in the liquid storage space;
A level sensor for measuring an actual level value of the chemical liquid filled in the liquid storage space;
And a controller for measuring the concentration of the chemical liquid based on the actual pressure value measured from the pressure sensor and the actual water level value measured from the level sensor. The method of claim 1,
A drain line connected to the regeneration tank and draining the chemical liquid filled in the liquid storage space to the outside;
A liquid supply line connected to the regeneration tank and supplying a chemical liquid filled in the liquid storage space;
A drain valve for opening and closing the drain line;
Further comprising a supply valve for opening and closing the liquid supply line,
And the controller calculates an actual specific gravity value of the gas region based on the actual pressure value and the actual water level value, and controls the drain valve or the supply valve by comparing the actual specific gravity value with a reference value. delete delete The method according to claim 1 or 2,
The chemical solution is a liquid supply unit provided with sulfuric acid or a chemical containing sulfuric acid. A processing unit for supplying a chemical liquid onto the substrate to process the substrate;
It includes a liquid supply unit for reproducing the chemical liquid discharged from the process processing unit to provide to the process processing unit,
The liquid supply unit,
A filter member for filtering the chemical liquid recovered from the processing unit;
A regeneration tank provided with a liquid storage space for receiving the chemical liquid from the filter member;
A buffer tank provided with a buffer space supplied with the chemical liquid from the regeneration tank;
A purge gas line for supplying purge gas to the liquid storage space;
A pressure sensor measuring a pressure of a gas region in the liquid storage space;
A level sensor for measuring an actual level value of the chemical liquid filled in the liquid storage space;
And a controller for measuring the concentration of the chemical liquid based on the actual pressure value measured from the pressure sensor and the actual water level value measured from the level sensor. The method of claim 6,
A drain line connected to the regeneration tank and draining the chemical liquid filled in the liquid storage space to the outside;
A liquid supply line connected to the regeneration tank and the buffer tank and supplying the chemical liquid filled in the liquid storage space to the buffer space;
A drain valve for opening and closing the drain line;
Further comprising a supply valve for opening and closing the liquid supply line,
The controller further includes a controller that calculates an actual specific gravity value of the gas region based on the actual pressure value and the actual water level value, and controls the drain valve or the supply valve by comparing the actual specific gravity value with a reference value. Substrate processing apparatus. The method according to claim 6 or 7,
The chemical solution is a substrate processing apparatus provided with a chemical containing sulfuric acid or sulfuric acid. In the method of measuring the concentration of the chemical liquid,
A preset step of filling the liquid storage space of the regeneration tank with a predetermined concentration of the chemical liquid and measuring a reference specific gravity value for the gas region except the liquid region in the liquid storage space;
A chemical liquid supplying step of supplying the same amount of the chemical liquid to the reference specific gravity value in the empty liquid storage space;
A specific gravity measurement step of measuring an actual specific gravity value of the gas region filled with the chemical liquid in the chemical liquid supplying step;
And a concentration measuring step of measuring the concentration of the chemical liquid by comparing the reference specific gravity value with the actual specific gravity value. The method of claim 9,
After the concentration measurement step,
When the actual specific gravity value is higher than the reference specific gravity value, the chemical liquid for the actual specific gravity value is supplied to the nozzle,
If the actual specific gravity value is lower than the reference specific gravity value, further comprising a chemical liquid treatment step of draining the chemical liquid with respect to the actual specific gravity value to the outside. The method of claim 9 or 10,
The substrate processing method of the purge gas is continuously provided in the liquid storage space. In the method of processing a substrate by supplying a chemical liquid,
Supplying the chemical liquid to the substrate to treat the substrate, recovering the chemical liquid used for the liquid treatment into a storage tank, and reusing the chemical liquid based on the concentration of the recovered chemical liquid,
The concentration of the chemical liquid is calculated by measuring the specific gravity value of the gas region excluding the liquid region filled with the chemical liquid in the storage tank. The method of claim 12,
And a specific gravity value of the gas region is calculated based on the pressure of the gas region and the chemical liquid level of the liquid region. The method according to claim 12 or 13,
When the specific gravity value is larger than the reference value, the chemical liquid is supplied to the nozzle so that the chemical liquid is reused,
And discharging the chemical liquid to the outside when the specific gravity value is lower than the reference value.

KR1020120154832A 2012-12-27 2012-12-27 unit for supplying Chemical , Apparatus and Method for treating substrate with the unit KR102022953B1 (en)

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KR20090032288A (en) * 2007-09-27 2009-04-01 세메스 주식회사 Chemical processing apparatus and method of cleaning for the same
JP2010109303A (en) * 2008-10-31 2010-05-13 Horiba Ltd Material gas concentration controller
KR20110136677A (en) * 2010-06-14 2011-12-21 세메스 주식회사 Substrate processing apparatus
KR20120008707U (en) * 2011-06-10 2012-12-20 김재규 Concentration control system using the hydrometer

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