KR20220119387A - 래핑장치의 세정장치 - Google Patents

래핑장치의 세정장치 Download PDF

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Publication number
KR20220119387A
KR20220119387A KR1020227021626A KR20227021626A KR20220119387A KR 20220119387 A KR20220119387 A KR 20220119387A KR 1020227021626 A KR1020227021626 A KR 1020227021626A KR 20227021626 A KR20227021626 A KR 20227021626A KR 20220119387 A KR20220119387 A KR 20220119387A
Authority
KR
South Korea
Prior art keywords
cleaning
surface plate
nozzle
cleaning nozzle
ring
Prior art date
Application number
KR1020227021626A
Other languages
English (en)
Korean (ko)
Inventor
미치오 스즈키
Original Assignee
신에쯔 한도타이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20220119387A publication Critical patent/KR20220119387A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Nozzles (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020227021626A 2020-01-09 2020-11-09 래핑장치의 세정장치 KR20220119387A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-002108 2020-01-09
JP2020002108A JP7218731B2 (ja) 2020-01-09 2020-01-09 ラッピング装置の洗浄装置
PCT/JP2020/041761 WO2021140737A1 (ja) 2020-01-09 2020-11-09 ラッピング装置の洗浄装置

Publications (1)

Publication Number Publication Date
KR20220119387A true KR20220119387A (ko) 2022-08-29

Family

ID=76787846

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227021626A KR20220119387A (ko) 2020-01-09 2020-11-09 래핑장치의 세정장치

Country Status (5)

Country Link
JP (1) JP7218731B2 (ja)
KR (1) KR20220119387A (ja)
CN (1) CN114786871B (ja)
TW (1) TW202130461A (ja)
WO (1) WO2021140737A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016055381A (ja) 2014-09-09 2016-04-21 信越半導体株式会社 ラッピング方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3366061B2 (ja) * 1993-06-30 2003-01-14 澄夫 田中 両面研磨機定盤の洗浄装置
JP3030608B2 (ja) * 1995-08-21 2000-04-10 株式会社荏原製作所 ラップ機の定盤洗浄装置
JPH11347938A (ja) * 1998-06-08 1999-12-21 Ebara Corp 研磨生成物の排出機構及び研磨装置
JP3894141B2 (ja) * 2003-03-14 2007-03-14 東京エレクトロン株式会社 塗布装置
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
JP2010052090A (ja) * 2008-08-28 2010-03-11 Epson Toyocom Corp 研磨装置および研磨方法
JP2010228058A (ja) * 2009-03-27 2010-10-14 Fujikoshi Mach Corp 研磨布の洗浄装置および洗浄方法
US9704730B2 (en) * 2013-05-28 2017-07-11 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method and non-transitory storage medium
JP6305040B2 (ja) * 2013-12-04 2018-04-04 株式会社ディスコ 洗浄装置
US9700988B2 (en) * 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
JP6369263B2 (ja) * 2014-09-25 2018-08-08 株式会社Sumco ワークの研磨装置およびワークの製造方法
KR101596598B1 (ko) * 2014-11-10 2016-02-22 주식회사 엘지실트론 웨이퍼 연마장치
CN209831364U (zh) * 2019-04-30 2019-12-24 青岛嘉星晶电科技股份有限公司 组合式晶片研磨盘

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016055381A (ja) 2014-09-09 2016-04-21 信越半導体株式会社 ラッピング方法

Also Published As

Publication number Publication date
JP2021109271A (ja) 2021-08-02
JP7218731B2 (ja) 2023-02-07
TW202130461A (zh) 2021-08-16
CN114786871B (zh) 2024-03-08
CN114786871A (zh) 2022-07-22
WO2021140737A1 (ja) 2021-07-15

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