CN114379188A - 一种低介低损耗的聚烯烃覆铜板的制备方法 - Google Patents
一种低介低损耗的聚烯烃覆铜板的制备方法 Download PDFInfo
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Abstract
本发明公开了一种低介低损耗的聚烯烃基覆铜板的制备方法,主要步骤包括:陶瓷填料用硅烷偶联剂进行表面处理;将表面改性后的二氧化硅粉料与溶剂、固化剂、助剂、以及按一定比例复配的聚烯烃混合;将混合后的混料充分混合均匀;混合完成后的浆料利用涂膜机涂膜;涂膜完成后进行低温烘干制成生胶膜片;生胶膜片在真空烘箱中半固化后脱模,制成有一定强度的半固化膜片;将上述步骤半固化片层叠达到需求厚度;将层叠后的两面覆上铜箔在真空热压机中热压成型。解决了传统覆铜板比重大,介质损耗高等问题。用此种方法所制备的覆铜板兼具优异的机械强度和介电性能,能够广泛应用于高速高频的现代电子通讯领域。
Description
技术领域
本发明属于覆铜板技术领域,涉及复合材料合成技术领域,具体提供一种低介低损耗的聚烯烃覆铜板的制备方法。
背景技术
在无线通信技术快速发展的今天,随着现代信息技术革命的深入,数字电路逐步进入信息处理的高速化,高频化,所以在现代工业中不仅要求电路小型化,也要求电路信号传输具有非常高的完整性。微波复合介质基板材料广泛地应用于机载雷达装置、相控阵系统、遥感等机载卫星微带平面天线、便携式移动天线等领域。随着5G时代到来,为处理不断增加的信息量,对高频微波复合基板也提出了新的要求。在电磁波传输理论中,绝缘介质的介电常数越低,信号的传输速度越快,介质的损耗越小,介电性能越稳定,信号的传递就越完整。
传统的复合基板中,目前应用较为广泛的是环氧树脂基复合基板以及聚四氟乙烯基复合基板。环氧树脂虽然粘结特性较好,但环氧树脂基覆铜板普遍存在介电常数以及介质损耗偏大等问题,不能满足信号传输高频化、高速化的需求;而聚四氟乙烯基覆铜板虽然高频介电性能优异,但加工较为困难。因此,以聚烯烃为主体的热固性树脂材料,由于其优异的介电性能、尺寸稳定性以及可加工性等,是一类非常有应用前景的高频复合基板材料,得到了广泛的研究。
美国专利US6048807A与US6291374B1中均提到了加入乙丙橡胶可以改善覆铜板的弯曲强度和介电强度的长期保持率,但由于其加入的乙丙橡胶重均分子量较小,导致制备的覆铜板较易老化,在长期使用后,拉伸强度与硬度均有明显变化。虽然一些研究表明,将重均分子量更大的乙丙橡胶加入聚烯烃树脂中可以提高覆铜板的热氧老化性能,但如果比例过多,分子量过大,会导致树脂溶解性下降,覆铜板的制备难度进一步加大。
中国发明专利CN106867173B虽给出了一种合理选择重均分子量的乙丙橡胶来制备聚烯烃覆铜板的方法,但其使用了玻璃纤维布作为增强材料,浸以胶液来制备半固化片。由于聚烯烃常温下一般为黏度较大的液体,对制备工艺提出了较高要求,大多数聚烯烃覆铜板都使用了以玻璃纤维布作为增强材料的成型方法,但以这种工艺制备的覆铜板多存在介质损耗过大,X、Y方向介电性能存在较大差异等问题,无法满足信号高频化的要求。
中国发明专利(申请号为202010402035.3)提供了一种聚烯烃基覆铜板制备方法,但其损耗仍在千分之二以上,不能满足信号传输持续高频化、高速化的需求。
发明内容
本发明的目的在于针对上述存在的问题,提供一种低介电常数、低损耗的聚烯烃基覆铜板的制备方法。本发明提供的聚烯烃组合物具有良好的溶剂溶解性能,工艺操作性好,容易制得半固化片;本发明提供的覆铜板的制备方法制得的覆铜板具有优异的介电性能。
本发明采取的技术构思是:聚烯烃树脂因分子链中C-H的极性小,因此具有优异的介电性能。但另一方面,聚烯烃树脂由于其柔性、非极性碳链结构,导致固化后的产品存在刚性不足、强度低、耐热性差、玻璃化转变温度低、剥离强度低等问题,限制了其使用。由于反应属于自由基聚合,聚合速度快,易爆聚,聚合物分子量分布不均匀,且制品内部大范围的不均匀极易在日常使用中造成不可避免的损坏,如应力开裂等问题。为克服上述现有技术中的不足,采用聚烯烃树脂、固化剂等进行改性反应,合成分子量分布均匀的高耐热性、低介电常数、低介质损耗的聚烯烃树脂半固化片,该聚烯烃树脂预聚物提供了高粘度骨架支撑,非常有利于后期压制板材时形成交联网状结构,以便后续制备聚烯烃基复合基板。本发明选用助剂来提高交联效率与优化交联结构。
为此,本发明提供一种低介低损耗的的聚烯烃覆铜板的制备方法。
具体的制备步骤为:陶瓷填料用硅烷偶联剂进行表面处理;将表面改性后的二氧化硅粉料与溶剂、固化剂、助剂、以及按一定比例复配的聚烯烃混合;将混合后的混料充分混合均匀;混合完成后的胶料利用涂膜机涂膜;涂膜完成后进行低温烘干制成生胶膜片;生胶膜片在真空烘箱中半固化后脱模,制成有一定强度的半固化膜片;将上述步骤半固化片层叠达到需求厚度;将层叠后的两面覆上铜箔在真空热压机中热压成型。
本发明中,所述覆铜板各组分比例为:
二氧化硅:60wt%~70wt%;
硅烷偶联剂:0.6wt%~0.9wt%;
固化剂:3%wt~6wt%;
聚烯烃:20wt%~30wt%;
助剂:3%wt~6wt%。
本发明中,所述二氧化硅粉料的粒径为5μm~25μm。
本发明中,所述硅烷偶联剂为Z6124、A171、KH550、KH560、KH570中的一种或几种。
本发明中,所述溶剂为甲苯、二甲苯、环己烷中的一种或几种。
本发明中,所述固化剂为过氧化二叔丁基、过氧化二异丙苯中的一种或几种。
本发明中,所述助剂为三烯丙基异氰脲酸酯、三聚氰酸三烯丙酯的一种或几种。
本发明中,所述聚烯烃为三元乙丙橡胶,聚苯乙烯,聚丁二烯,聚苯乙烯-丁二烯共聚物中的一种或几种。
本发明中,所述热压温度为210~250℃,热压压力为4~10Mpa,热压时间为1~3h。
与背景技术部分中提到的诸多现有技术的弊端相比,本发明具有如下有益效果:
本发明制备的覆铜板具有优异的高频介电性能,其介电常数(10GHz)为2.5~3.2,介质损耗(10GHz)可达0.002以下,性能显著高于行业水准。能够广泛地应用于机载雷达装置、相控阵系统、遥感等机载卫星微带平面天线、便携式移动天线等领域。
本发明加入了重均分子量合适且比例合适的乙丙橡胶,使得样品在兼具较好的热老化性能的同时,有更低的介质损耗。
本发明选用了按一定比例复配后的硅烷偶联剂对二氧化硅进行表面改性处理,使其与溶剂和聚烯烃树脂有优秀的相容性,同时在二氧化硅表面接枝了能够参与固化反应的基团,增强了二氧化硅与聚烯烃树脂的结合,减少了界面效应,大大减小了样品的吸水率和孔隙率。
本发明加入了按一定比例复配后的助剂,使得样品充分固化的同时具有均匀的三维网状结构,显著提高了样品的综合力学性能以及耐热氧老化性能。
本发明摒弃玻璃纤维布,使用涂膜工艺制备半固化片,制得的半固化片轻薄且有韧性,可显著提高制备的可操作性与工艺性能,所制备的覆铜板具有优异的均匀一致性。
本发明选用了合适的热压温度以及时间,使聚烯烃的固化反应充分进行,并与陶瓷填料牢固结合,显著提高了覆铜板的致密度,降低了覆铜板的介质损耗。
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具体实施方式
以下通过具体实施例对本发明进行详细说明,然而,该实施例仅作为典型而非限制性的说明。
实施例1
(1)对二氧化硅粉体用硅烷偶联剂进行表面处理;
(2)按比例将二氧化硅粉料固化剂、助剂以及按一定比例复配的聚烯烃混合,加入溶剂调整体系粘度,使用高速搅拌装置将其搅拌均匀,聚烯烃质量为30g,固化剂质量为1.2g,二氧化硅质量为70g,助剂质量为0.6g;
(3)将混合好的胶料进行涂膜,涂膜厚度为0.2mm;
(4)将涂布好的膜片进行烘干,烘干温度为60℃;
(5)将烘干后的膜片放入真空烘箱进行半固化,半固化温度为180℃,时间为2h;
(6)将半固化后的膜片按照需求裁剪后层叠,放入真空热压机热压,热压温度为180℃烧结2h后,热压温度250℃烧结2h,压力6Mpa。
比较例1
比较例1用于说明热压温度过高的效果。比较例1制作工艺与实施例1相同,区别在于后半段的热压温度为270℃。
比较例2
比较例2用于说明热压温度过低的效果。比较例1制作工艺与实施例1相同,区别在于后半段的热压温度为230℃。
比较例3
比较例3用于说明使用玻璃纤维布作为增强材料的效果。比较例3大部分制作工艺与实施例1相同,区别在于用玻璃纤维布浸渍胶料后烘干制备半固化片而非涂膜。
其中,覆铜板的主要介电性能指标如下表所示。
从表中可以看出,实施例1具有优异的介电性能,在拥有较低的介电常数的同时,拥有极低的介质损耗;实施例1与比较例1相比,在相同的制备工艺下,固化温度过高会导致固化剂分解过快,从而导致固化反应发生过快,固化反应不能均匀的向外辐射成交联网状结构,导致覆铜板内部结构较差,介质损耗变高;实施例1与比较例1相比,在相同的制备工艺下,固化温度过低会导致固化反应不充分,聚烯烃中的乙烯基不能完全的参与固化交联反应,而未反应的乙烯基使得覆铜板的介电常数和介质损耗增大。实施例1与比较例3相比,在使用了玻璃纤维布的情况下,覆铜板的介电性能明显下降,其介质损耗大幅增大。
以上实施例,并非对本发明的组合物含量作任何限制,凡是依据本发明的技术实质或组合物成分或含量对以上实施例所做的任何细微修改,等同变化与修饰,均属于本发明技术方案的范围内。
本发明制备条件容易实现,生产成本较低,易于批量化、规模化生产,具有良好的工业化生产基础和广阔的应用前景。
Claims (10)
1.一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述混料组成成分由二氧化硅粉料与硅烷偶联剂、溶剂、固化剂、助剂以及按一定比例复配的聚烯烃混合组成。
2.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述覆铜板各组分比例为:
二氧化硅:60wt%~70wt%;
硅烷偶联剂:0.6wt%~0.9wt%;
固化剂:3%wt~6wt%;
聚烯烃:20wt%~30wt%;
助剂:3%wt~6wt%。
3.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述二氧化硅粉料的粒径为5μm~25μm。
4.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述硅烷偶联剂为Z6124、A171、KH550、KH560、KH570中的一种或几种。
5.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述溶剂为甲苯、二甲苯、环己烷、乙醇中的一种或几种。
6.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述固化剂为过氧化二叔丁基、过氧化二异丙苯中的一种或几种。
7.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述助剂为三烯丙基异氰脲酸酯、三聚氰酸三烯丙酯的一种或几种。
8.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述聚烯烃为三元乙丙橡胶,聚苯乙烯,聚丁二烯,聚苯乙烯-丁二烯共聚物中的一种或几种。
9.根据权利要求1所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,制备步骤为:
(1)对二氧化硅粉体用硅烷偶联剂进行表面处理,硅烷偶联剂的含量为二氧化硅粉体质量的0.6wt%~0.9wt%;
(2)按比例将二氧化硅粉料固化剂、助剂以及聚烯烃混合,加入溶剂调整体系粘度,使用高速搅拌装置将其搅拌均匀,聚烯烃质量百分比为20wt%~30wt%,固化剂质量百分比为3%wt~6wt%,二氧化硅质量百分比为60wt%~70wt%,助剂质量百分比为3%wt~6wt%;
(3)将混合好的胶料进行涂膜,涂膜厚度为0.2mm~0.8mm;
(4)将涂好的膜片进行烘干,烘干温度为60℃;
(5)将烘干后的膜片放入真空烘箱进行半固化,半固化温度为150℃~180℃,时间为2~4h;
(6)将半固化后的膜片按照需求裁剪后层叠,放入真空热压机热压,热压温度为210℃~250℃,保温1~3h,压力4~10Mpa。
10.根据权利要求9所述的一种低介低损耗的聚烯烃覆铜板的制备方法,其特征在于,所述制备的覆铜板的介电常数为2.5~3.2,介质损耗低于0.002。
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CN115610045A (zh) * | 2022-12-20 | 2023-01-17 | 中国电子科技集团公司第四十六研究所 | 一种含核壳结构粉体的低损耗和低吸水率覆铜板制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070032883A (ko) * | 2005-09-20 | 2007-03-23 | 삼성전기주식회사 | 허니컴 구조를 가지는 무기 보강재를 포함하는 프리프레그및 동박적층판 |
JP2015013474A (ja) * | 2013-06-07 | 2015-01-22 | 古河電気工業株式会社 | 高周波基板用銅張り積層板及び表面処理銅箔 |
CN108752827A (zh) * | 2018-05-17 | 2018-11-06 | 常州中英科技股份有限公司 | 一种高导热的可交联树脂组合物及其制备的半固化片和热固型覆铜板 |
CN111333965A (zh) * | 2020-04-16 | 2020-06-26 | 陕西湍流电子科技有限公司 | 基于三元乙丙橡胶的介电材料、半固化片及积层板 |
CN111471264A (zh) * | 2020-04-26 | 2020-07-31 | 无锡睿龙新材料科技有限公司 | 一种填料改性碳氢半固化片及其制备方法及采用其制备高频高速覆铜板的方法 |
CN111703150A (zh) * | 2020-05-13 | 2020-09-25 | 电子科技大学 | 一种降低聚烯烃复合基板材料介电损耗的方法 |
CN113897015A (zh) * | 2021-12-06 | 2022-01-07 | 中国电子科技集团公司第四十六研究所 | 高热稳定性和低吸水率的热固性聚烯烃覆铜板的制备方法 |
-
2022
- 2022-03-08 CN CN202210221045.6A patent/CN114379188A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070032883A (ko) * | 2005-09-20 | 2007-03-23 | 삼성전기주식회사 | 허니컴 구조를 가지는 무기 보강재를 포함하는 프리프레그및 동박적층판 |
JP2015013474A (ja) * | 2013-06-07 | 2015-01-22 | 古河電気工業株式会社 | 高周波基板用銅張り積層板及び表面処理銅箔 |
CN108752827A (zh) * | 2018-05-17 | 2018-11-06 | 常州中英科技股份有限公司 | 一种高导热的可交联树脂组合物及其制备的半固化片和热固型覆铜板 |
CN111333965A (zh) * | 2020-04-16 | 2020-06-26 | 陕西湍流电子科技有限公司 | 基于三元乙丙橡胶的介电材料、半固化片及积层板 |
CN111471264A (zh) * | 2020-04-26 | 2020-07-31 | 无锡睿龙新材料科技有限公司 | 一种填料改性碳氢半固化片及其制备方法及采用其制备高频高速覆铜板的方法 |
CN111703150A (zh) * | 2020-05-13 | 2020-09-25 | 电子科技大学 | 一种降低聚烯烃复合基板材料介电损耗的方法 |
CN113897015A (zh) * | 2021-12-06 | 2022-01-07 | 中国电子科技集团公司第四十六研究所 | 高热稳定性和低吸水率的热固性聚烯烃覆铜板的制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115610045A (zh) * | 2022-12-20 | 2023-01-17 | 中国电子科技集团公司第四十六研究所 | 一种含核壳结构粉体的低损耗和低吸水率覆铜板制备方法 |
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