CN111703150A - 一种降低聚烯烃复合基板材料介电损耗的方法 - Google Patents

一种降低聚烯烃复合基板材料介电损耗的方法 Download PDF

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CN111703150A
CN111703150A CN202010402035.3A CN202010402035A CN111703150A CN 111703150 A CN111703150 A CN 111703150A CN 202010402035 A CN202010402035 A CN 202010402035A CN 111703150 A CN111703150 A CN 111703150A
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唐先忠
邓婷
胡文成
王妮
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Abstract

本发明公开了一种降低聚烯烃复合基板材料介电损耗的方法。所述聚烯烃为聚丁二烯树脂组合物，通过加入适当的引发剂用量，在合适的固化温度和固化时间下，使聚合物达到充分的固化。利用该聚烯烃树脂组合物制备的介电材料具有优异的介电性能，能够满足基板材料在高频下的性能要求。

Description

一种降低聚烯烃复合基板材料介电损耗的方法
技术领域
本发明属于覆铜板技术领域，具体涉及一种降低聚烯烃复合基板材料介电损耗的方法。
背景技术
目前，随着信息化时代的飞速发展，特别是5G时代的推动,电子设备系统中信息传输最显著的特性就是高速高频化。在高频信号传输的电路中，电信号的传输损失，通过介电损失，导体损失和放射损失之和表示。电信号的频率越高，介电损失，导体损失和放射损失越大。由于传输损失易造成信号衰减，损害信号的可靠性，因此必须减小介电损失，导体损失和放射损失。在高频电路中，由信号传输损耗公式可知，电信号的介电损失与形成电路的绝缘材料的相对介电常数的平方根，介电损耗角正切以及所使用的信号的频率的积成正比。因此，可以通过选定相对介电常数以及介电损耗角正切小的材料作为绝缘材料来减小介电损失。
CN101328277A采用丁苯树脂，聚丁二烯树脂和马来酸酐接枝的共聚物混合制备高频电路基板，虽然基板的抗剥离强度有所提高，但是极性马来酸酐共聚物的添加也使基板的介电性能有所降低。US5571609采用低分子量的1，2-聚丁二烯树脂或聚异丁二烯，和高分子量的丁二烯与苯乙烯的共聚物配合制备电路基板，基板具有较低的吸水率，但是介电损耗较高。US6569943采用分子末端带有乙烯基的胺基改性的液体聚丁二烯树脂与低分子量的单体制备的电路基板，具有较高的剥离强度，但是同样存在介电损耗较高的缺陷。
以上的技术方案中，所制备的基板材料虽然具有各自的优异性能，但是都存在介电损耗较高的缺陷。在上述基板材料的制备过程中，通过加入引发剂实现体系的固化交联，虽然聚丁二烯树脂较高的乙烯基含量有利于提高固化交联的反应程度，但是当引发剂用量不足时，聚丁二烯树脂中的乙烯基并不能完全的参与固化交联反应。由于C＝C双键中的π电子在电场中极化而消耗电能，因此，聚合物中未反应的乙烯基会使基板材料的介电损耗增大。
发明内容
为了解决上述问题，本发明提供了一种降低聚烯烃复合基板材料介电损耗的方法。包括以下步骤：
(1)将聚丁二烯，苯乙烯-丁二烯共聚物，三元乙丙橡胶在溶剂中混合，再加入引发剂，抗氧剂，阻燃剂，填料充分混合，配成适当浓度的树脂胶液，将玻纤布浸渍于上述树脂胶液，并置于烘箱经80℃烘干得到半固化片。
(2)取上述数张半固化片叠合，两面覆以铜箔，置于液压机上程序升温固化，热压得到覆铜层压板。
本发明中，所述聚丁二烯分子量小于9000，乙烯基含量大于70％。
本发明中，所述引发剂的添加量，以树脂作为100重量份，优选范围为3.5-5重量份。
本发明中，所述引发剂为过氧化二异丙苯或1,4-双叔丁基过氧异丙基苯中的至少一种。
本发明中，所述固化温度为150-280℃，固化压力为40-100kg/cm2，热压时间为2-3h。
与现有技术相比，本发明具有如下有益效果：
本发明采用介电性能优异的聚烯烃树脂为基体，通过加入充足的引发剂，在合适的固化温度和固化时间下，使聚合物达到了充分的固化，减少了聚合物中未反应乙烯基含量，有效的降低了基板材料的介电损耗。
具体实施方式
以下通过具体实施例对本发明进行详细说明，然而，该实施例仅作为典型而非限制性的说明。
本实施例所选用的材料如表1：
表1
Figure BDA0002489853710000021
实施例1
将70g聚丁二烯(B3000)，20g苯乙烯-丁二烯共聚物(D1118)，10g三元乙丙橡胶(
Figure BDA0002489853710000022
65)在溶剂中混合，再加入3.6g引发剂(BIPB)，25g阻燃剂(BT-93W)，150g填料(SE-3)充分混合，配成适当浓度的树脂胶液，用1080玻纤布浸渍于上述树脂胶液，并置于烘箱经80℃烘干得到半固化片。取8张半固化片叠合，两面覆以1oz厚度的铜箔，置于液压机上程序升温固化，固化压力为80kg/cm2，在180℃固化1h，然后升温到250℃，固化1h，制得覆铜层压板。
实施例2
实施例2制作工艺与实施例1相同，区别在于聚丁二烯中的乙烯基含量不同。材料配比及测试结果如表2所示。
比较例1
比较例1用于说明引发剂用量过高的效果。比较例1制作工艺与实施例1相同，材料配比及测试结果如表2所示。
比较例2
比较例2用于说明引发剂用量不足的效果。比较例1制作工艺与实施例2相同，材料配比及测试结果如表2所示。
表2
Figure BDA0002489853710000023
Figure BDA0002489853710000031
从表2的测试结果可以看出，实施例1和实施例2，根据聚丁二烯树脂中乙烯基含量加入适当的引发剂用量，基板材料具有优异的介电性能，尤其是介电损耗角正切非常的低；实施例1与比较例1相比，在相同的树脂含量下，加入过量的引发剂，可能会引起副反应的发生而使材料的介电性能降低；实施例2与比较例2相比，在相同的树脂含量下，加入引发剂的量不足，可能会使体系中的乙烯基并不能完全的参与固化交联反应，而未反应的乙烯基使基板材料的介电常数和介电损耗增大。
以上实施例，并非对本发明的组合物含量作任何限制，凡是依据本发明的技术实质或组合物成分或含量对以上实施例所做的任何细微修改，等同变化与修饰，均属于本发明技术方案的范围内。
申请人声明，本发明通过上述实施例来说明本发明的详细组成，但本发明并不局限于上述详细组成，对本发明的任何改进，对本发明产品原料的等效替换及辅助产品的添加，具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (5)

1.一种降低聚烯烃复合基板材料介电损耗的方法，其特征在于，制备方法为将聚丁二烯，苯乙烯-丁二烯共聚物，三元乙丙橡胶在溶剂中混合，再加入引发剂，抗氧剂，阻燃剂，填料充分混合，配成适当浓度的树脂胶液，将玻纤布浸渍于上述树脂胶液，并置于烘箱经80℃烘干得到半固化片。取上述数张半固化片叠合，两面覆以铜箔，置于液压机上程序升温固化，热压得到覆铜层压板。
2.根据权利要求1所述的一种降低聚烯烃复合基板材料介电损耗的方法，其特征在于，所述聚丁二烯分子量小于9000，乙烯基含量大于70％。
3.根据权利要求1所述的一种降低聚烯烃复合基板材料介电损耗的方法，其特征在于，所述引发剂的添加量，以树脂作为100重量份，优选范围为3.5-5重量份。
4.根据权利要求1所述的一种降低聚烯烃复合基板材料介电损耗的方法，其特征在于，所述引发剂为过氧化二异丙苯或1,4-双叔丁基过氧异丙基苯中的至少一种。
5.根据权利要求1所述的一种降低聚烯烃复合基板材料介电损耗的方法，其特征在于，所述固化温度为150-280℃，固化压力为40-100kg/cm2，热压时间为2-3h。
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CN114379188A (zh) * 2022-03-08 2022-04-22 电子科技大学 一种低介低损耗的聚烯烃覆铜板的制备方法
CN114889273A (zh) * 2022-03-23 2022-08-12 电子科技大学 无玻纤的陶瓷/碳氢树脂基微波介质基板及其制备方法
CN116334949A (zh) * 2021-12-24 2023-06-27 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备及其应用

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CN106867173A (zh) * 2017-03-10 2017-06-20 广东生益科技股份有限公司 一种复合材料、用其制作的高频电路基板及制作方法

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CN116334949A (zh) * 2021-12-24 2023-06-27 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备及其应用
CN114379188A (zh) * 2022-03-08 2022-04-22 电子科技大学 一种低介低损耗的聚烯烃覆铜板的制备方法
CN114889273A (zh) * 2022-03-23 2022-08-12 电子科技大学 无玻纤的陶瓷/碳氢树脂基微波介质基板及其制备方法

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Application publication date: 20200925