CN114303307A - 相机模组及其制备方法 - Google Patents

相机模组及其制备方法 Download PDF

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Publication number
CN114303307A
CN114303307A CN202080059985.9A CN202080059985A CN114303307A CN 114303307 A CN114303307 A CN 114303307A CN 202080059985 A CN202080059985 A CN 202080059985A CN 114303307 A CN114303307 A CN 114303307A
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CN
China
Prior art keywords
layer
circuit substrate
circuit
layer circuit
coil
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Pending
Application number
CN202080059985.9A
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English (en)
Inventor
戴俊
杨梅
何明展
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Original Assignee
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Publication date
Application filed by Avary Holding Shenzhen Co Ltd, Qing Ding Precision Electronics Huaian Co Ltd filed Critical Avary Holding Shenzhen Co Ltd
Publication of CN114303307A publication Critical patent/CN114303307A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K33/00—Motors with reciprocating, oscillating or vibrating magnet, armature or coil system
    • H02K33/02—Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moved one way by energisation of a single coil system and returned by mechanical force, e.g. by springs
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种相机模组(100)包括支架(10)、镜头(20)、多个磁铁(25)以及电路板组件(30)。支架(10)具有一内腔(11)以及外壁(12)；镜头(20)容置于内腔(11)中；磁铁(25)设置于外壁(12)上；电路板组件(30)包括外层线路基板(323)、第一内层线路基板(321)以及第二内层线路基板(351)，第一内层线路基板(321)设置于外层线路基板(323)朝向支架(10)的表面，第一内层线路基板(321)包括第一介电层(3211)及第一内层线路层(3212)；其中，第一内层线路层(3212)包括由导电线路卷绕形成的多个线圈(3213)，每一线圈(3213)与其中一磁铁(25)对应设置；第二内层线路基板(351)与第一内层线路基板(321)位于外层线路基板(323)的同一表面，第二内层线路基板(351)与第一内层线路基板(321)之间具有第一开口(34)，第二内层线路基板(351)包括第二内层线路层(3512)；其中，线圈(3213)的厚度大于第二内层线路层(3512)的厚度。还提供一种相机模组(100)的制备方法。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN202080059985.9A 2020-06-23 2020-06-23 相机模组及其制备方法 Pending CN114303307A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/097799 WO2021258303A1 (zh) 2020-06-23 2020-06-23 相机模组及其制备方法

Publications (1)

Publication Number Publication Date
CN114303307A true CN114303307A (zh) 2022-04-08

Family

ID=79282706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080059985.9A Pending CN114303307A (zh) 2020-06-23 2020-06-23 相机模组及其制备方法

Country Status (4)

Country Link
US (1) US11902644B2 (zh)
CN (1) CN114303307A (zh)
TW (1) TWI754313B (zh)
WO (1) WO2021258303A1 (zh)

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* Cited by examiner, † Cited by third party
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US11743565B1 (en) * 2021-09-24 2023-08-29 Apple Inc. Coil structure of camera actuators

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CN102570762A (zh) * 2010-12-29 2012-07-11 鸿富锦精密工业（深圳）有限公司 音圈马达
CN105048765A (zh) * 2015-08-19 2015-11-11 南昌欧菲光电技术有限公司 摄像模组及其音圈电机
CN107820362A (zh) * 2016-09-14 2018-03-20 鹏鼎控股(深圳)股份有限公司 镂空柔性电路板及制作方法
US20180211762A1 (en) * 2017-01-23 2018-07-26 Samsung Electro-Mechanics Co., Ltd. Coil component and method for manufacturing the same
CN109891708A (zh) * 2016-10-26 2019-06-14 阿莫泰克有限公司 利用多层基板的层叠型定子和利用其的车载传感器
CN110383959A (zh) * 2017-03-08 2019-10-25 住友电工印刷电路株式会社 柔性印刷电路板

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JP2006211754A (ja) * 2005-01-25 2006-08-10 Nitto Denko Corp ボイスコイルモータ用コイルおよびボイスコイルモータ
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Also Published As

Publication number Publication date
US11902644B2 (en) 2024-02-13
WO2021258303A1 (zh) 2021-12-30
US20220191361A1 (en) 2022-06-16
TWI754313B (zh) 2022-02-01
TW202201059A (zh) 2022-01-01

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