CN114271038B - 电子电路装置及其制造方法 - Google Patents

电子电路装置及其制造方法 Download PDF

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Publication number
CN114271038B
CN114271038B CN201980099440.8A CN201980099440A CN114271038B CN 114271038 B CN114271038 B CN 114271038B CN 201980099440 A CN201980099440 A CN 201980099440A CN 114271038 B CN114271038 B CN 114271038B
Authority
CN
China
Prior art keywords
mounting surface
inclined mounting
circuit element
adhesive
reflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980099440.8A
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English (en)
Chinese (zh)
Other versions
CN114271038A (zh
Inventor
市野慎次
岩城范明
滨根刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of CN114271038A publication Critical patent/CN114271038A/zh
Application granted granted Critical
Publication of CN114271038B publication Critical patent/CN114271038B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201980099440.8A 2019-08-23 2019-08-23 电子电路装置及其制造方法 Active CN114271038B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/033067 WO2021038631A1 (ja) 2019-08-23 2019-08-23 電子回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN114271038A CN114271038A (zh) 2022-04-01
CN114271038B true CN114271038B (zh) 2024-05-03

Family

ID=74685010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980099440.8A Active CN114271038B (zh) 2019-08-23 2019-08-23 电子电路装置及其制造方法

Country Status (4)

Country Link
EP (1) EP4021153A4 (https=)
JP (1) JP7432609B2 (https=)
CN (1) CN114271038B (https=)
WO (1) WO2021038631A1 (https=)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187483A (ja) * 1989-01-13 1990-07-23 Matsushita Electric Ind Co Ltd 電子部品用接着剤
JPH02281684A (ja) * 1989-04-21 1990-11-19 Tokyo Electric Co Ltd 部品実装方法
JPH05335694A (ja) * 1992-05-27 1993-12-17 Mitsubishi Electric Corp 立体構造基板
JPH06196851A (ja) * 1992-12-25 1994-07-15 Taiyo Yuden Co Ltd 回路基板に金属部材を取り付けるはんだ付け方法
JPH06237061A (ja) * 1993-02-09 1994-08-23 Sony Corp 半導体装置の実装構造とその実装方法
JP2002335068A (ja) * 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd 電子部品の位置矯正方法、および電子部品の位置矯正装置
CN1723551A (zh) * 2003-01-16 2006-01-18 索尼株式会社 半导体器件及其制造方法
JP2007048962A (ja) * 2005-08-10 2007-02-22 Fujitsu Ltd 半導体装置の製造方法および半導体装置
DE102006015676A1 (de) * 2006-04-04 2007-06-14 Siemens Ag Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen
JP2009032865A (ja) * 2007-07-26 2009-02-12 Hitachi Ltd 電子装置及び電子装置の製造方法
JP2010016013A (ja) * 2008-06-30 2010-01-21 Sharp Corp 半導体デバイスの実装方法、半導体素子モジュールおよび電子情報機器
CN102456960A (zh) * 2010-10-26 2012-05-16 泰科电子(上海)有限公司 连接端子和端子安装装置
JP2013069636A (ja) * 2011-09-26 2013-04-18 Koito Mfg Co Ltd 車輌用灯具
CN103176114A (zh) * 2011-12-20 2013-06-26 夏普株式会社 预烧装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226274U (https=) * 1988-08-04 1990-02-21
EP0378233B1 (en) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same
JPH0729591Y2 (ja) * 1990-09-28 1995-07-05 ホシデン株式会社 チップ形コネクタ
JPH0818208A (ja) * 1994-06-30 1996-01-19 Suzuki Motor Corp 実装部品倒れ防止治具
JP6890249B2 (ja) * 2017-02-24 2021-06-18 パナソニックＩｐマネジメント株式会社 塗布装置及び塗布方法
WO2018163323A1 (ja) 2017-03-08 2018-09-13 株式会社Ｆｕｊｉ ３次元実装関連装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187483A (ja) * 1989-01-13 1990-07-23 Matsushita Electric Ind Co Ltd 電子部品用接着剤
JPH02281684A (ja) * 1989-04-21 1990-11-19 Tokyo Electric Co Ltd 部品実装方法
JPH05335694A (ja) * 1992-05-27 1993-12-17 Mitsubishi Electric Corp 立体構造基板
JPH06196851A (ja) * 1992-12-25 1994-07-15 Taiyo Yuden Co Ltd 回路基板に金属部材を取り付けるはんだ付け方法
JPH06237061A (ja) * 1993-02-09 1994-08-23 Sony Corp 半導体装置の実装構造とその実装方法
JP2002335068A (ja) * 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd 電子部品の位置矯正方法、および電子部品の位置矯正装置
CN1723551A (zh) * 2003-01-16 2006-01-18 索尼株式会社 半导体器件及其制造方法
JP2007048962A (ja) * 2005-08-10 2007-02-22 Fujitsu Ltd 半導体装置の製造方法および半導体装置
DE102006015676A1 (de) * 2006-04-04 2007-06-14 Siemens Ag Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen
JP2009032865A (ja) * 2007-07-26 2009-02-12 Hitachi Ltd 電子装置及び電子装置の製造方法
JP2010016013A (ja) * 2008-06-30 2010-01-21 Sharp Corp 半導体デバイスの実装方法、半導体素子モジュールおよび電子情報機器
CN102456960A (zh) * 2010-10-26 2012-05-16 泰科电子(上海)有限公司 连接端子和端子安装装置
JP2013069636A (ja) * 2011-09-26 2013-04-18 Koito Mfg Co Ltd 車輌用灯具
CN103176114A (zh) * 2011-12-20 2013-06-26 夏普株式会社 预烧装置

Also Published As

Publication number Publication date
JP7432609B2 (ja) 2024-02-16
WO2021038631A1 (ja) 2021-03-04
EP4021153A4 (en) 2022-09-07
CN114271038A (zh) 2022-04-01
EP4021153A1 (en) 2022-06-29
JPWO2021038631A1 (https=) 2021-03-04

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