CN114270493B - 移动放置系统、移动放置装置以及移动放置方法 - Google Patents
移动放置系统、移动放置装置以及移动放置方法 Download PDFInfo
- Publication number
- CN114270493B CN114270493B CN202080059470.9A CN202080059470A CN114270493B CN 114270493 B CN114270493 B CN 114270493B CN 202080059470 A CN202080059470 A CN 202080059470A CN 114270493 B CN114270493 B CN 114270493B
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- CN
- China
- Prior art keywords
- moving
- rack
- placement
- main body
- mobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3408—Docking arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-154520 | 2019-08-27 | ||
| JP2019154520 | 2019-08-27 | ||
| PCT/JP2020/023646 WO2021039040A1 (ja) | 2019-08-27 | 2020-06-16 | 移載システム、移載装置及び移載方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114270493A CN114270493A (zh) | 2022-04-01 |
| CN114270493B true CN114270493B (zh) | 2025-03-07 |
Family
ID=74683648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080059470.9A Active CN114270493B (zh) | 2019-08-27 | 2020-06-16 | 移动放置系统、移动放置装置以及移动放置方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11776832B2 (https=) |
| EP (1) | EP4023569A4 (https=) |
| JP (1) | JP7272445B2 (https=) |
| CN (1) | CN114270493B (https=) |
| TW (1) | TWI849204B (https=) |
| WO (1) | WO2021039040A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230122254A (ko) * | 2022-02-14 | 2023-08-22 | 삼성전자주식회사 | 로더 장치 및 기판 운송 시스템 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011278U (https=) * | 1973-05-30 | 1975-02-05 | ||
| WO2012060146A1 (ja) * | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228698B2 (https=) | 1973-05-30 | 1977-07-28 | ||
| US4926545A (en) | 1989-05-17 | 1990-05-22 | At&T Bell Laboratories | Method of manufacturing optical assemblies |
| JP2592760Y2 (ja) | 1992-08-28 | 1999-03-24 | 川崎重工業株式会社 | 伸縮フォーク |
| JP2742552B2 (ja) * | 1995-02-02 | 1998-04-22 | 東京ニチユ株式会社 | ワーク荷役装置 |
| JP3314325B2 (ja) * | 1995-05-17 | 2002-08-12 | 新明和工業株式会社 | 物品格納設備 |
| JPH11106007A (ja) | 1997-10-06 | 1999-04-20 | Hirokazu Dezuki | 荷物やパレットを収納棚に搬入搬出する方法 |
| ATE296762T1 (de) * | 1998-03-30 | 2005-06-15 | Toyota Steel Ct Co Ltd | Fahrzeug für schwere gegenstände und palette für spulenförmige schwere gegenstände |
| US6808356B2 (en) * | 2000-12-28 | 2004-10-26 | Toyota Steel Center Co., Ltd. | Device for carrying article into and from container, method for introducing and discharging article into and from container, and pallet for carrying article |
| KR20070054683A (ko) * | 2004-08-23 | 2007-05-29 | 브룩스 오토메이션 인코퍼레이티드 | 승강기 기반의 도구 적재 및 버퍼링 시스템 |
| US7793906B2 (en) * | 2008-03-31 | 2010-09-14 | Shinko Electric Co., Ltd. | Clamping mechanism |
| JP5626464B2 (ja) * | 2011-05-31 | 2014-11-19 | 村田機械株式会社 | 引出し装置及び保管装置 |
| WO2015071951A1 (ja) * | 2013-11-12 | 2015-05-21 | 株式会社ダイフク | 物品収納設備（article storage facility） |
| JP6784277B2 (ja) * | 2018-06-11 | 2020-11-11 | 村田機械株式会社 | ストッカ及び搬送車システム |
-
2020
- 2020-06-16 WO PCT/JP2020/023646 patent/WO2021039040A1/ja not_active Ceased
- 2020-06-16 US US17/635,251 patent/US11776832B2/en active Active
- 2020-06-16 CN CN202080059470.9A patent/CN114270493B/zh active Active
- 2020-06-16 JP JP2021542030A patent/JP7272445B2/ja active Active
- 2020-06-16 EP EP20855981.5A patent/EP4023569A4/en active Pending
- 2020-08-25 TW TW109128870A patent/TWI849204B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011278U (https=) * | 1973-05-30 | 1975-02-05 | ||
| WO2012060146A1 (ja) * | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4023569A1 (en) | 2022-07-06 |
| JPWO2021039040A1 (https=) | 2021-03-04 |
| CN114270493A (zh) | 2022-04-01 |
| WO2021039040A1 (ja) | 2021-03-04 |
| TW202120404A (zh) | 2021-06-01 |
| JP7272445B2 (ja) | 2023-05-12 |
| TWI849204B (zh) | 2024-07-21 |
| US20220293445A1 (en) | 2022-09-15 |
| US11776832B2 (en) | 2023-10-03 |
| EP4023569A4 (en) | 2023-11-08 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |