JP7272445B2 - 移載システム、移載装置及び移載方法 - Google Patents

移載システム、移載装置及び移載方法 Download PDF

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Publication number
JP7272445B2
JP7272445B2 JP2021542030A JP2021542030A JP7272445B2 JP 7272445 B2 JP7272445 B2 JP 7272445B2 JP 2021542030 A JP2021542030 A JP 2021542030A JP 2021542030 A JP2021542030 A JP 2021542030A JP 7272445 B2 JP7272445 B2 JP 7272445B2
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shelf
transfer
transferred
pair
moving
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Japanese (ja)
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JPWO2021039040A1 (https=
JPWO2021039040A5 (https=
Inventor
泰斗 上野山
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Murata Machinery Ltd
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Murata Machinery Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2021542030A 2019-08-27 2020-06-16 移載システム、移載装置及び移載方法 Active JP7272445B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019154520 2019-08-27
JP2019154520 2019-08-27
PCT/JP2020/023646 WO2021039040A1 (ja) 2019-08-27 2020-06-16 移載システム、移載装置及び移載方法

Publications (3)

Publication Number Publication Date
JPWO2021039040A1 JPWO2021039040A1 (https=) 2021-03-04
JPWO2021039040A5 JPWO2021039040A5 (https=) 2022-06-01
JP7272445B2 true JP7272445B2 (ja) 2023-05-12

Family

ID=74683648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542030A Active JP7272445B2 (ja) 2019-08-27 2020-06-16 移載システム、移載装置及び移載方法

Country Status (6)

Country Link
US (1) US11776832B2 (https=)
EP (1) EP4023569A4 (https=)
JP (1) JP7272445B2 (https=)
CN (1) CN114270493B (https=)
TW (1) TWI849204B (https=)
WO (1) WO2021039040A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230122254A (ko) * 2022-02-14 2023-08-22 삼성전자주식회사 로더 장치 및 기판 운송 시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592760Y2 (ja) 1992-08-28 1999-03-24 川崎重工業株式会社 伸縮フォーク
WO2012060146A1 (ja) 2010-11-04 2012-05-10 ムラテックオートメーション株式会社 スタッカークレーン及び物品の搬出入方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5011278U (https=) * 1973-05-30 1975-02-05
JPS5228698B2 (https=) 1973-05-30 1977-07-28
US4926545A (en) 1989-05-17 1990-05-22 At&T Bell Laboratories Method of manufacturing optical assemblies
JP2742552B2 (ja) * 1995-02-02 1998-04-22 東京ニチユ株式会社 ワーク荷役装置
JP3314325B2 (ja) * 1995-05-17 2002-08-12 新明和工業株式会社 物品格納設備
JPH11106007A (ja) 1997-10-06 1999-04-20 Hirokazu Dezuki 荷物やパレットを収納棚に搬入搬出する方法
ATE296762T1 (de) * 1998-03-30 2005-06-15 Toyota Steel Ct Co Ltd Fahrzeug für schwere gegenstände und palette für spulenförmige schwere gegenstände
US6808356B2 (en) * 2000-12-28 2004-10-26 Toyota Steel Center Co., Ltd. Device for carrying article into and from container, method for introducing and discharging article into and from container, and pallet for carrying article
KR20070054683A (ko) * 2004-08-23 2007-05-29 브룩스 오토메이션 인코퍼레이티드 승강기 기반의 도구 적재 및 버퍼링 시스템
US7793906B2 (en) * 2008-03-31 2010-09-14 Shinko Electric Co., Ltd. Clamping mechanism
JP5626464B2 (ja) * 2011-05-31 2014-11-19 村田機械株式会社 引出し装置及び保管装置
WO2015071951A1 (ja) * 2013-11-12 2015-05-21 株式会社ダイフク 物品収納設備（article storage facility）
JP6784277B2 (ja) * 2018-06-11 2020-11-11 村田機械株式会社 ストッカ及び搬送車システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592760Y2 (ja) 1992-08-28 1999-03-24 川崎重工業株式会社 伸縮フォーク
WO2012060146A1 (ja) 2010-11-04 2012-05-10 ムラテックオートメーション株式会社 スタッカークレーン及び物品の搬出入方法

Also Published As

Publication number Publication date
EP4023569A1 (en) 2022-07-06
JPWO2021039040A1 (https=) 2021-03-04
CN114270493A (zh) 2022-04-01
CN114270493B (zh) 2025-03-07
WO2021039040A1 (ja) 2021-03-04
TW202120404A (zh) 2021-06-01
TWI849204B (zh) 2024-07-21
US20220293445A1 (en) 2022-09-15
US11776832B2 (en) 2023-10-03
EP4023569A4 (en) 2023-11-08

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