JP7272445B2 - 移載システム、移載装置及び移載方法 - Google Patents
移載システム、移載装置及び移載方法 Download PDFInfo
- Publication number
- JP7272445B2 JP7272445B2 JP2021542030A JP2021542030A JP7272445B2 JP 7272445 B2 JP7272445 B2 JP 7272445B2 JP 2021542030 A JP2021542030 A JP 2021542030A JP 2021542030 A JP2021542030 A JP 2021542030A JP 7272445 B2 JP7272445 B2 JP 7272445B2
- Authority
- JP
- Japan
- Prior art keywords
- shelf
- transfer
- transferred
- pair
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Description
[収納システムの構成]
[移載システム及び移載装置の構成]
[移載方法]
[作用及び効果]
[変形例]
Claims (8)
- 上下方向に配列され且つ水平な一方向における一方の側から物品が移載される複数の棚を有し、前記複数の棚のそれぞれが、前記上下方向及び前記一方の側に開口する開口領域が形成され且つ前記物品が載置される載置部と、前記上下方向における前記載置部の位置に応じて設けられた取付部と、を含む収納装置と、
前記複数の棚のそれぞれを移載対象の棚とし、前記移載対象の棚に対して前記一方の側から前記物品を移載するために用いられる移載装置と、を備え、
前記移載装置は、
前記移載対象の棚の前記取付部に前記一方の側から取り付けられる本体部と、
作業者が把持して前記一方向に沿って力を作用させることが可能な把持部を含み、前記物品を支持可能であり、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記一方向に沿って前記本体部と前記移載対象の棚との間で移動する移動部と、
前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記移載対象の棚の前記開口領域を通って前記移動部を昇降させる昇降部と、
1対のアタッチメントと、
を有し、
前記1対のアタッチメントのそれぞれは、
前記移載対象の棚の前記取付部に取り付けられる接続部と、
前記接続部から前記一方の側に延在し、前記本体部を支持する延在部と、を含み、
前記本体部は、前記1対のアタッチメントを介して前記取付部に取り付けられる、
移載システム。 - 前記接続部は、前記上下方向に沿って延在し、
前記1対のアタッチメントのそれぞれは、前記接続部と前記延在部との間に掛け渡された補強部を更に含む、請求項1に記載の移載システム。 - 前記昇降部は、エアジャッキである、請求項1又は2に記載の移載システム。
- 前記移載装置は、前記一方向に沿って前記移動部を案内するガイドを更に有し、
前記ガイドは、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記本体部から前記移載対象の棚の前記開口領域の直下に延在するように、構成されている、請求項1~3のいずれか一項に記載の移載システム。 - 前記ガイドは、リニアガイドである、請求項4に記載の移載システム。
- 前記物品は、半導体ウエハを格納した容器である、請求項1~5のいずれか一項に記載の移載システム。
- 上下方向に配列され且つ水平な一方向における一方の側から物品が移載される複数の棚を有し、前記複数の棚のそれぞれが、前記上下方向及び前記一方の側に開口する開口領域が形成され且つ前記物品が載置される載置部と、前記上下方向における前記載置部の位置に応じて設けられた取付部と、を含む収納装置において、前記複数の棚のそれぞれを移載対象の棚とし、前記移載対象の棚に対して前記一方の側から前記物品を移載するために用いられる移載装置であって、
前記移載対象の棚の前記取付部に前記一方の側から取り付けられる本体部と、
作業者が把持して前記一方向に沿って力を作用させることが可能な把持部を含み、前記物品を支持可能であり、前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記一方向に沿って前記本体部と前記移載対象の棚との間で移動する移動部と、
前記本体部が前記移載対象の棚の前記取付部に取り付けられた状態で前記移載対象の棚の前記開口領域を通って前記移動部を昇降させる昇降部と、
1対のアタッチメントと、
を備え、
前記1対のアタッチメントのそれぞれは、
前記移載対象の棚の前記取付部に取り付けられる接続部と、
前記接続部から前記一方の側に延在し、前記本体部を支持する延在部と、を含み、
前記本体部は、前記1対のアタッチメントを介して前記取付部に取り付けられる、
移載装置。 - 請求項1~6のいずれか一項に記載の移載システムにおいて実施される移載方法であって、
作業者が前記移載装置を準備する第1ステップと、
前記第1ステップの後に、作業者が前記移載対象の棚の前記取付部に前記1対のアタッチメントを介して前記一方の側から前記本体部を取り付ける第2ステップと、
前記第2ステップの後に、前記移動部を下降させた状態で、作業者が前記把持部を把持して前記一方向に沿って力を作用させることで前記一方向に沿って前記移載対象の棚の前記開口領域の直下に前記移動部を移動させる第3ステップと、
前記第3ステップの後に、作業者が前記昇降部を用いることで、前記移載対象の棚の前記開口領域を通って前記移動部を上昇させ、前記移動部に前記物品を支持させる第4ステップと、
前記第4ステップの後に、前記移動部を上昇させた状態で、作業者が前記把持部を把持して前記一方向に沿って力を作用させることで前記一方向に沿って前記本体部に前記移動部を移動させる第5ステップと、を含む、
移載方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019154520 | 2019-08-27 | ||
JP2019154520 | 2019-08-27 | ||
PCT/JP2020/023646 WO2021039040A1 (ja) | 2019-08-27 | 2020-06-16 | 移載システム、移載装置及び移載方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021039040A1 JPWO2021039040A1 (ja) | 2021-03-04 |
JPWO2021039040A5 JPWO2021039040A5 (ja) | 2022-06-01 |
JP7272445B2 true JP7272445B2 (ja) | 2023-05-12 |
Family
ID=74683648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021542030A Active JP7272445B2 (ja) | 2019-08-27 | 2020-06-16 | 移載システム、移載装置及び移載方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11776832B2 (ja) |
EP (1) | EP4023569A4 (ja) |
JP (1) | JP7272445B2 (ja) |
CN (1) | CN114270493A (ja) |
TW (1) | TW202120404A (ja) |
WO (1) | WO2021039040A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2592760Y2 (ja) | 1992-08-28 | 1999-03-24 | 川崎重工業株式会社 | 伸縮フォーク |
WO2012060146A1 (ja) | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5228698B2 (ja) | 1973-05-30 | 1977-07-28 | ||
JPS5011278U (ja) * | 1973-05-30 | 1975-02-05 | ||
US4926545A (en) | 1989-05-17 | 1990-05-22 | At&T Bell Laboratories | Method of manufacturing optical assemblies |
JPH11106007A (ja) | 1997-10-06 | 1999-04-20 | Hirokazu Dezuki | 荷物やパレットを収納棚に搬入搬出する方法 |
US7793906B2 (en) * | 2008-03-31 | 2010-09-14 | Shinko Electric Co., Ltd. | Clamping mechanism |
KR101634600B1 (ko) * | 2011-05-31 | 2016-06-29 | 무라다기카이가부시끼가이샤 | 인출 장치 및 보관 장치 |
WO2015071951A1 (ja) * | 2013-11-12 | 2015-05-21 | 株式会社ダイフク | 物品収納設備(article storage facility) |
JP6784277B2 (ja) * | 2018-06-11 | 2020-11-11 | 村田機械株式会社 | ストッカ及び搬送車システム |
-
2020
- 2020-06-16 WO PCT/JP2020/023646 patent/WO2021039040A1/ja unknown
- 2020-06-16 JP JP2021542030A patent/JP7272445B2/ja active Active
- 2020-06-16 EP EP20855981.5A patent/EP4023569A4/en active Pending
- 2020-06-16 CN CN202080059470.9A patent/CN114270493A/zh active Pending
- 2020-06-16 US US17/635,251 patent/US11776832B2/en active Active
- 2020-08-25 TW TW109128870A patent/TW202120404A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2592760Y2 (ja) | 1992-08-28 | 1999-03-24 | 川崎重工業株式会社 | 伸縮フォーク |
WO2012060146A1 (ja) | 2010-11-04 | 2012-05-10 | ムラテックオートメーション株式会社 | スタッカークレーン及び物品の搬出入方法 |
Also Published As
Publication number | Publication date |
---|---|
US11776832B2 (en) | 2023-10-03 |
WO2021039040A1 (ja) | 2021-03-04 |
JPWO2021039040A1 (ja) | 2021-03-04 |
EP4023569A4 (en) | 2023-11-08 |
US20220293445A1 (en) | 2022-09-15 |
CN114270493A (zh) | 2022-04-01 |
TW202120404A (zh) | 2021-06-01 |
EP4023569A1 (en) | 2022-07-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20210021266A (ko) | 웨이퍼를 처리하는 장치 및 방법 | |
KR101879021B1 (ko) | 반송 방법 및 기판 처리 장치 | |
KR102312786B1 (ko) | 용기 반송 설비 | |
JP2019018982A (ja) | 搬送車及び搬送設備 | |
JP2002512446A (ja) | ウエハ処理装置とともに使用するための自動化ウエハバッファ | |
KR102091915B1 (ko) | 기판 반송 로봇 및 기판 처리 시스템 | |
JP2020007082A (ja) | 物品搬送装置 | |
KR20160056828A (ko) | 물품 수납 설비 | |
KR101409752B1 (ko) | 기판 이송 로봇을 이용한 멀티 챔버 기판 처리 장치 | |
CN114334715A (zh) | 冷却单元、使用该冷却单元的基板处理装置及方法 | |
KR20220058223A (ko) | 캐리지 로봇 및 이를 포함하는 타워 리프트 | |
JP7272445B2 (ja) | 移載システム、移載装置及び移載方法 | |
KR102608078B1 (ko) | 반도체 웨이퍼 폴리싱 장치 및 방법 | |
KR20120022598A (ko) | 기판 처리 장치 및 반도체 장치의 제조 방법 | |
CN115881569A (zh) | 晶圆测试系统 | |
KR20220133843A (ko) | 기판 리프팅 방법 및 기판 처리 장치 | |
JP6429013B2 (ja) | ストック装置 | |
WO2006032930A1 (en) | Substrate handling device for a charged particle beam system | |
KR101421435B1 (ko) | 기판보관용 챔버 | |
CN215158910U (zh) | 治具拆卸机的载料盘输送机构 | |
TWI534946B (zh) | Plasma processing device | |
JP2004296646A (ja) | 基板処理装置 | |
KR102247041B1 (ko) | 크레인 어셈블리 및 이를 포함하는 스토커 | |
CN217807340U (zh) | 一种搬送机构及真空镀膜机 | |
CN219066762U (zh) | 一种晶圆升降传片装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20220201 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220201 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230104 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230328 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230410 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7272445 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |