CN114269967A - 蒸气输送方法与设备 - Google Patents
蒸气输送方法与设备 Download PDFInfo
- Publication number
- CN114269967A CN114269967A CN202080057610.9A CN202080057610A CN114269967A CN 114269967 A CN114269967 A CN 114269967A CN 202080057610 A CN202080057610 A CN 202080057610A CN 114269967 A CN114269967 A CN 114269967A
- Authority
- CN
- China
- Prior art keywords
- disposed
- line
- vapor
- delivery
- showerhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002716 delivery method Methods 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 88
- 238000012545 processing Methods 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000007921 spray Substances 0.000 claims abstract description 18
- 238000007740 vapor deposition Methods 0.000 claims abstract description 15
- 239000011368 organic material Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 51
- 239000012808 vapor phase Substances 0.000 claims description 48
- 238000012546 transfer Methods 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 238000003672 processing method Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 230000015654 memory Effects 0.000 description 9
- 239000012159 carrier gas Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000007790 solid phase Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000005019 vapor deposition process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 239000003708 ampul Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 238000005389 semiconductor device fabrication Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/16—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening having selectively- effective outlets
- B05B1/1681—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening having selectively- effective outlets with a selecting mechanism comprising a gate valve, sliding valve or cock and a lift valve
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/18—Roses; Shower heads
- B05B1/185—Roses; Shower heads characterised by their outlet element; Mounting arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B11/00—Single-unit hand-held apparatus in which flow of contents is produced by the muscular force of the operator at the moment of use
- B05B11/0005—Components or details
- B05B11/0008—Sealing or attachment arrangements between sprayer and container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962898098P | 2019-09-10 | 2019-09-10 | |
US62/898,098 | 2019-09-10 | ||
PCT/US2020/049561 WO2021050395A1 (en) | 2019-09-10 | 2020-09-04 | Vapor delivery methods and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114269967A true CN114269967A (zh) | 2022-04-01 |
Family
ID=74850352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080057610.9A Pending CN114269967A (zh) | 2019-09-10 | 2020-09-04 | 蒸气输送方法与设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210069745A1 (ja) |
JP (1) | JP7472272B2 (ja) |
KR (1) | KR20220041218A (ja) |
CN (1) | CN114269967A (ja) |
TW (1) | TW202117062A (ja) |
WO (1) | WO2021050395A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210381107A1 (en) * | 2020-06-03 | 2021-12-09 | Micron Technology, Inc. | Material deposition systems, and related methods and microelectronic devices |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040025787A1 (en) * | 2002-04-19 | 2004-02-12 | Selbrede Steven C. | System for depositing a film onto a substrate using a low pressure gas precursor |
KR101134277B1 (ko) * | 2010-10-25 | 2012-04-12 | 주식회사 케이씨텍 | 원자층 증착 장치 |
TW201641736A (zh) * | 2015-03-17 | 2016-12-01 | Asm智慧財產控股私人有限公司 | 原子層沉積設備 |
CN108630581A (zh) * | 2017-03-16 | 2018-10-09 | 朗姆研究公司 | 衬底处理系统的前体蒸气供应系统中流监测的系统和方法 |
CN109642319A (zh) * | 2016-08-13 | 2019-04-16 | 应用材料公司 | 用于控制流至工艺腔室的气流的方法及装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000512076A (ja) * | 1996-05-21 | 2000-09-12 | シメトリックス・コーポレーション | 薄膜の噴霧液体源蒸着を高い歩留まりを伴って行うための方法と装置 |
US6110556A (en) * | 1997-10-17 | 2000-08-29 | Applied Materials, Inc. | Lid assembly for a process chamber employing asymmetric flow geometries |
US20030101938A1 (en) * | 1998-10-27 | 2003-06-05 | Applied Materials, Inc. | Apparatus for the deposition of high dielectric constant films |
JP4230596B2 (ja) * | 1999-03-12 | 2009-02-25 | 東京エレクトロン株式会社 | 薄膜形成方法 |
JP2001023905A (ja) * | 1999-07-06 | 2001-01-26 | Matsushita Electric Ind Co Ltd | Cvd装置及び膜の形成方法 |
KR100450068B1 (ko) * | 2001-11-23 | 2004-09-24 | 주성엔지니어링(주) | Cvd 장치의 멀티섹터 평판형 샤워헤드 |
JP4090346B2 (ja) * | 2002-02-28 | 2008-05-28 | 株式会社日立国際電気 | 半導体装置の製造方法及び基板処理装置 |
US6749906B2 (en) * | 2002-04-25 | 2004-06-15 | Eastman Kodak Company | Thermal physical vapor deposition apparatus with detachable vapor source(s) and method |
JP4292777B2 (ja) * | 2002-06-17 | 2009-07-08 | ソニー株式会社 | 薄膜形成装置 |
JP2004014245A (ja) * | 2002-06-05 | 2004-01-15 | Sony Corp | 有機膜形成装置および有機膜形成方法 |
KR100473806B1 (ko) * | 2002-09-28 | 2005-03-10 | 한국전자통신연구원 | 유기물 박막 및 유기물 소자를 위한 대면적 유기물 기상증착 장치 및 제조 방법 |
JP5280861B2 (ja) * | 2006-01-19 | 2013-09-04 | エーエスエム アメリカ インコーポレイテッド | 高温aldインレットマニホールド |
US20090047429A1 (en) * | 2007-08-16 | 2009-02-19 | Forrest Stephen R | Apparatus and Method for Deposition For Organic Thin Films |
JP2010153420A (ja) * | 2008-12-24 | 2010-07-08 | Hitachi Kokusai Electric Inc | 基板処理装置、バルブの制御方法及びそのプログラム |
US8997775B2 (en) * | 2011-05-24 | 2015-04-07 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
US9206512B2 (en) * | 2011-06-21 | 2015-12-08 | Applied Materials, Inc. | Gas distribution system |
WO2013022669A2 (en) * | 2011-08-05 | 2013-02-14 | 3M Innovative Properties Company | Systems and methods for processing vapor |
US20160148813A1 (en) * | 2014-11-25 | 2016-05-26 | Lam Research Corporation | Gas injection method for uniformly processing a semiconductor substrate in a semiconductor substrate processing apparatus |
JP6919498B2 (ja) * | 2017-10-27 | 2021-08-18 | 東京エレクトロン株式会社 | 成膜装置及び成膜方法 |
-
2020
- 2020-09-04 WO PCT/US2020/049561 patent/WO2021050395A1/en active Application Filing
- 2020-09-04 CN CN202080057610.9A patent/CN114269967A/zh active Pending
- 2020-09-04 JP JP2022514989A patent/JP7472272B2/ja active Active
- 2020-09-04 US US17/013,462 patent/US20210069745A1/en active Pending
- 2020-09-04 KR KR1020227008066A patent/KR20220041218A/ko not_active Application Discontinuation
- 2020-09-09 TW TW109130902A patent/TW202117062A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040025787A1 (en) * | 2002-04-19 | 2004-02-12 | Selbrede Steven C. | System for depositing a film onto a substrate using a low pressure gas precursor |
KR101134277B1 (ko) * | 2010-10-25 | 2012-04-12 | 주식회사 케이씨텍 | 원자층 증착 장치 |
TW201641736A (zh) * | 2015-03-17 | 2016-12-01 | Asm智慧財產控股私人有限公司 | 原子層沉積設備 |
CN109642319A (zh) * | 2016-08-13 | 2019-04-16 | 应用材料公司 | 用于控制流至工艺腔室的气流的方法及装置 |
CN108630581A (zh) * | 2017-03-16 | 2018-10-09 | 朗姆研究公司 | 衬底处理系统的前体蒸气供应系统中流监测的系统和方法 |
Also Published As
Publication number | Publication date |
---|---|
US20210069745A1 (en) | 2021-03-11 |
JP2022546742A (ja) | 2022-11-07 |
TW202117062A (zh) | 2021-05-01 |
JP7472272B2 (ja) | 2024-04-22 |
KR20220041218A (ko) | 2022-03-31 |
WO2021050395A1 (en) | 2021-03-18 |
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