CN114080868A - 通孔填充基板的制造方法以及导电糊的套装 - Google Patents

通孔填充基板的制造方法以及导电糊的套装 Download PDF

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Publication number
CN114080868A
CN114080868A CN202080006624.8A CN202080006624A CN114080868A CN 114080868 A CN114080868 A CN 114080868A CN 202080006624 A CN202080006624 A CN 202080006624A CN 114080868 A CN114080868 A CN 114080868A
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CN
China
Prior art keywords
metal
metal component
conductive
filling
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080006624.8A
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English (en)
Chinese (zh)
Inventor
矢野雅也
小林广治
豆崎修
森阳光
林耀广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Belting Ltd
Original Assignee
Mitsuboshi Belting Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Belting Ltd filed Critical Mitsuboshi Belting Ltd
Publication of CN114080868A publication Critical patent/CN114080868A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202080006624.8A 2020-06-05 2020-06-05 通孔填充基板的制造方法以及导电糊的套装 Pending CN114080868A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022308 WO2021245912A1 (ja) 2020-06-05 2020-06-05 ビア充填基板の製造方法および導電ペーストのキット

Publications (1)

Publication Number Publication Date
CN114080868A true CN114080868A (zh) 2022-02-22

Family

ID=78830758

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080006624.8A Pending CN114080868A (zh) 2020-06-05 2020-06-05 通孔填充基板的制造方法以及导电糊的套装

Country Status (3)

Country Link
JP (1) JP7152501B2 (ja)
CN (1) CN114080868A (ja)
WO (1) WO2021245912A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7430670B2 (ja) 2020-08-05 2024-02-13 三ツ星ベルト株式会社 ビア充填基板の製造方法および導電ペーストのキット
WO2024190406A1 (ja) * 2023-03-15 2024-09-19 株式会社レゾナック 導電ビア付基板の製造方法、及び導電ビア付配線基板の製造方法
WO2024190405A1 (ja) * 2023-03-15 2024-09-19 株式会社レゾナック 導電ビア付基板の製造方法、導電ビア付基板及び金属ペースト

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043740A (ja) * 2000-07-24 2002-02-08 Matsushita Electric Works Ltd セラミック基板のスルーホールへの金属充填方法
JP5693940B2 (ja) * 2010-12-13 2015-04-01 株式会社トクヤマ セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法
JP2013153051A (ja) * 2012-01-25 2013-08-08 Tokuyama Corp メタライズドセラミックスビア基板及びその製造方法
JP6541530B2 (ja) * 2015-09-24 2019-07-10 三ツ星ベルト株式会社 ビア充填基板並びにその製造方法及び前駆体
JP6396964B2 (ja) * 2015-09-29 2018-09-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法
JP6654613B2 (ja) * 2016-12-22 2020-02-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法

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Publication number Publication date
JPWO2021245912A1 (ja) 2021-12-09
WO2021245912A1 (ja) 2021-12-09
JP7152501B2 (ja) 2022-10-12

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