CN114030093B - Crystal cold processing method - Google Patents
Crystal cold processing method Download PDFInfo
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- CN114030093B CN114030093B CN202111451316.9A CN202111451316A CN114030093B CN 114030093 B CN114030093 B CN 114030093B CN 202111451316 A CN202111451316 A CN 202111451316A CN 114030093 B CN114030093 B CN 114030093B
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- tgg crystal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention discloses a crystal cold processing method, in particular to a TGG crystal cold processing method, which sequentially comprises the following surface processing steps: cutting and polishing; wherein: the cutting step comprises the steps of cutting the TGG crystal into a preset size and enabling the optical flat surface to be processed to have surface roughness R a 2.3 μm or less and 2.7 μm or less in surface form; in the polishing step, the optical flat surface to be processed of the TGG crystal obtained in the cutting step is polished by adopting an annular polishing technology, so that the surface roughness R of the optical flat surface to be processed is ensured a 10nm or less and 80nm or less in surface form. The invention only combines the three processes of rough grinding, rough polishing and fine polishing through a one-step cutting process and a one-step annular polishing process, and only adopts the one-step annular polishing process to replace the three processes, so that the surface processing of the TGG crystal can meet the requirement that the planeness of the TGG crystal is lower than lambda/8, the processing time is equivalent to that of the prior art, and even can be reduced by 80-90 minutes.
Description
Technical Field
The invention belongs to the field of magneto-optical crystal processing, and particularly relates to a crystal cold processing method, in particular to a TGG crystal cold processing method.
Background
The TGG crystal is a magneto-optical crystal used for an industrial laser, can effectively inhibit reflection, has a high extinction ratio, and can effectively reduce light source damage. The application of the TGG crystal in the laser field requires that the flatness of the crystal is lower than lambda/8, and the surface is free from damage and defects.
The prior TGG crystal polishing technology adopts a traditional optical part processing technology and mainly comprises the following steps: cutting, hanging the disc, roughly grinding, roughly polishing and finely polishing. The cutting process mainly comprises the steps of cutting a raw material crystal bar into semi-finished products with certain grinding and polishing allowance sizes, wherein the upper disc mainly fixes a workpiece, the rough grinding is to grind the surface of the workpiece to form a damage layer, the rough polishing mainly continues to grind the damage layer to reach a certain surface profile, and the fine polishing mainly removes surface pits to reach a smooth surface and a good finish.
In order to meet the requirement of machining precision, the machining processes are more, the machining period is longer, one grinding and polishing powder needs to be used in each process, and more than three grinding and polishing powders are needed to be finally used.
Disclosure of Invention
Aiming at the defects or improvement requirements in the prior art, the invention provides a TGG crystal cold processing method, which aims to reduce the steps of TGG crystal optical flat surface processing technology by controlling cutting technology and polishing technology parameters, thereby simplifying the working procedures and reducing the use types of grinding and polishing powder, thereby solving the technical problems that the prior art needs multi-stage surface processing steps to meet the surface flatness requirement of the TGG crystal, the processing procedures are more, the processing period is longer, and the used grinding and polishing powder has multiple types and is complex to operate.
To achieve the above object, according to one aspect of the present invention, there is provided a TGG crystal cold working method comprising surface working steps sequentially comprising: cutting and polishing; wherein:
the cutting step is to cut the TGG crystal into a preset size and enable the optical flat surface to be processed to have surface roughness R a 2.3 μm or less and 2.7 μm or less in surface form;
in the polishing step, the optical flat surface to be processed of the TGG crystal obtained by the cutting step is polished by adopting an annular polishing technology, so that the surface roughness R of the optical flat surface to be processed is ensured a 10nm or less and 80nm or less in surface form.
Preferably, in the TGG crystal cold working method, the cutting step adopts a tension control line cutting system for cutting, and the diamond wire diameter is 0.21-0.25 mm, the lifting speed of a workbench is 25-30 mm/h, the linear rotating speed is 1000-1200 m/min, and the tangential tension is 32-38N.
Preferably, in the TGG crystal cold working method, the polishing step adopts a marble workpiece ring and a separator for ring polishing, and the separator of the polishing machine adopts a circular workpiece made of polytetrafluoroethylene; the circular groove of the polishing machine is of a symmetrical structure.
Preferably, in the TGG crystal cold processing method, the marble plate rotating speed in the polishing step is 1-5 r/min, and the separator autorotation speed is 1-5 r/min.
Preferably, in the TGG crystal cold working method, W0.5 alumina is used as polishing powder in the polishing step, and the weight is added according to the proportion of 1.
Preferably, in the TGG crystal cold processing method, the diameter of the disc surface of the ring polishing machine is 0.8-1.2 m, and a polyurethane polishing skin with the thickness of 1.5-2.0 mm and the groove of 20-40 mm is paved on the disc surface; the outer diameter of the separator is less than 275mm; the inner diameter of a workpiece ring of the ring polishing machine is smaller than 280mm.
Preferably, in the TGG crystal cold working method, the polishing step uses a polished workpiece holding and polishing the TGG crystal, and preferably, the diameter of the circular groove of the polishing machine is 1 to 3mm larger than the diameter of the held workpiece placed therein.
Preferably, in the TGG crystal cold working method, the TGG crystals clamped on the polishing workpiece are preferably arranged closely, and the polishing workpiece is preferably circular microcrystalline glass.
Preferably, in the TGG crystal cold working method, the polished workpiece with the TGG crystals includes circular glass ceramics, tightly arranged TGG crystal arrays, and cosound glass sheets, the bottom surface of the circular glass ceramics is bonded with the TGG crystal arrays, and the peripheries of the TGG crystal arrays are clamped by the cosound glass sheets with the same height as the TGG crystals;
preferably, the thickness of the circular glass ceramics is 2-18 mm, and the diameter is 100 mm-110 mm.
In general, compared with the prior art, the above technical solution contemplated by the present invention can achieve the following beneficial effects:
the invention only uses one-step cutting process and one-step annular polishing process, combines three processes of rough grinding, rough polishing and fine polishing, and only uses one-step annular polishing process to replace the three processes, thereby realizing that the surface processing of the TGG crystal reaches the requirement that the planeness of the TGG crystal is lower than lambda/8, and the processing time is equivalent to the prior art, and even can be reduced by 80-90 minutes. The invention greatly simplifies the processing steps of the optical flat surface, only uses one grinding and polishing powder and reduces the requirements on processing auxiliary materials.
According to the preferred scheme, the tightly arranged TGG crystals are clamped on the circular microcrystalline glass to serve as an annular polishing workpiece, the circular microcrystalline glass provides adjustable self weight, the tightly arranged TGG crystals not only effectively utilize the area of the circular microcrystalline glass and improve the polishing efficiency, but also form a plane to be processed, the flatness of which meets the requirements of an annular polishing process, so that the polishing time is shortened.
Drawings
FIG. 1 is a schematic view of clamping of a ring-shaped polished workpiece;
FIG. 2 is a schematic diagram of a separator for the ring polishing process.
The same reference numbers will be used throughout the drawings to refer to the same elements or structures, wherein:
1 is TGG crystal; 2, grinding the glass sheet; and 3 is microcrystalline glass.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The invention provides a TGG crystal cold processing method, the surface processing steps of which sequentially comprise: cutting and polishing; wherein:
the cutting step is to cut the TGG crystal into a preset size and enable the optical flat surface to be processed to have surface roughness R a 2.3 μm or less and 2.7 μm or less in surface form; preferably, a tension control wire cutting system is adopted for cutting, wherein the wire diameter of a diamond wire is 0.21-0.25 mm, the lifting speed of a workbench is 25-30 mm/h, the linear rotating speed is 1000-1200 m/min, and the tangential tension is 32-38N, preferably 32-35N.
The polishing step of subjecting TGG crystals obtained by the cutting step to additionPolishing the optical flat surface by adopting an annular polishing technology to ensure that the surface roughness R of the optical flat surface to be processed a 10nm or less and 80nm or less, preferably 48nm or less; the polishing technology adopts a marble workpiece ring and a separator for ring polishing, and the separator of the polishing machine adopts a circular workpiece made of polytetrafluoroethylene; the circular groove of the polishing machine is of a symmetrical structure; the rotation speed of the marble plate is 1-4 r/min, preferably 3.5r/min, the autorotation speed of the separator is 1-5 r/min, and W0.5 aluminum oxide is preferably adopted as grinding polishing powder to carry out self-weight polishing according to the proportion of 1; the diameter of the disc surface of the ring polishing machine is 0.8-1.2 m, and a polyurethane polishing skin with the thickness of 1.5-2 mm and the groove of 20-40 mm is paved on the disc surface; the outer diameter of the separator is less than 275mm; the inner diameter of a workpiece ring of the ring polishing machine is smaller than 280mm, and the ambient temperature is controlled at room temperature.
Preferably, the TGG crystal is clamped and polished by a polishing workpiece which is clamped with the TGG crystal, the TGG crystal clamped on the polishing workpiece is preferably arranged closely, and the polishing workpiece is preferably circular microcrystalline glass.
The polishing workpiece with the TGG crystals comprises circular glass ceramics, tightly arranged TGG crystal arrays and grinding glass sheets, wherein the bottom surfaces of the circular glass ceramics are bonded with the TGG crystal arrays, and the grinding glass sheets with the same height as the TGG crystals are clamped around the TGG crystal arrays; the thickness of the circular glass ceramics is 2-18 mm, the diameter of the glass ceramics is 100 mm-110 mm, and the circular glass ceramics is used for providing polishing balance weight;
when the scheme is applied, the cutting of the clamped glass sheet is synchronously completed in the cutting step, and the clamped glass sheet has the same height as the crystal, is used for clamping the cut TGG crystal on the circular microcrystalline glass and is combined into a polishing workpiece; the microcrystalline glass has small expansion coefficient, small deformation and high size stability, and is matched with clamping of a grinding glass sheet, so that the flatness of the whole to-be-processed plane of the TGG crystal array meets the requirement of a polishing step, and the processing time of the polishing step is within an acceptable range.
The diameter of the circular groove of the polishing machine is 1-3 mm larger than the diameter of a clamping workpiece placed in the circular groove.
Generally speaking, the optical flat surface needs to be processed in multiple stages, namely, after cutting, the optical flat surface is processed according to different processing technologies from coarse to fine in precision degree to be processed for mechanical grinding, so that the processing requirement of the traditional optical part is met, the rough grinding surface type reaches 10-20 micrometers, the surface roughness is 2.5-5 micrometers, the rough grinding surface type requirement is less than 6.3 micrometers, the surface roughness is 1.25-2.5 micrometers, the processing technologies with different precision degrees adopt grinding and polishing powder with different grain diameters, different surface roughness requirements are met, and the polishing requirement of the optical flat surface and the optical front surface is met as quickly as possible. Aiming at the characteristics of small optical flat surface area and regular shape of TGG crystal to be processed, the invention discovers that the fine cutting process can realize the surface roughness Ra of the cutting surface below 2.3 mu m and the surface type of the cutting surface below 2.7 mu m under the accurate parameter control, namely the worst value is equivalent to the surface obtained by adopting a loose grain abrasive material with the granularity of W14-28, the surface layer of the TGG crystal is not required to be damaged by rough grinding, the annular polishing technology can be directly adopted to polish by matching with the regular clamping process, the one-step polishing can be realized, the optical flat front surface processing of the TGG crystal can be realized within the time acceptable range by matching with the conventional multi-stage progressive complex polishing process, the process steps are simple, and the grinding and polishing powder is single.
The following are examples: example of processing of 3 x 3.5 x 3mm size TGG crystals
A cold working method of TGG crystal comprises the following steps:
cutting: when a multi-wire cutting machine is adopted for processing, the grooved wheels are provided with 3 specifications of sheet thickness sizes (certain grinding and polishing allowance is reserved to be 5.2mm, 3.15mm and 3.65 mm), and the adopted crystal processing technological parameters are as follows:
the results of the crystal surface processed by the multi-wire saw using the zygo profiler are shown in the following table:
meanwhile, the grinding glass sheets with the same height are processed in the process of processing the crystals, and the small square TGG crystals are fixed on the round glass ceramics with a certain thickness by clamping the grinding glass sheets to form an inner square to participate in subsequent polishing.
Clamping: the processed TGG crystal is put on a circular glass-ceramic by a wax tray according to the figure 1, the periphery is clamped by grinding glass sheets with the same height, and the glass sheets are bonded by UV glue. And heating the round microcrystalline glass on the square crystal plate, paving a layer of inlet wax on the round microcrystalline glass, and closely arranging the square TGG crystals to form the TGG crystal array. The microcrystalline glass with different thicknesses can also be applied with different weights to accelerate the subsequent rough polishing process. The diameter is mainly determined by the number of square crystals needing to be loaded on the disc. In a traditional TGG crystal clamping workpiece which is arranged dispersedly, because the distance between crystals is large, the crystals cannot be regarded as the same plane in a polishing process, and thus, multi-stage processing is needed; different from the prior TGG crystal clamping workpieces which are arranged dispersedly, the TGG clamping workpieces which are arranged tightly because the TGG surface is worst equal to the surface obtained by adopting the loose grain grinding material with the granularity of W14-28 through the corresponding requirement of the surface roughness, so that the traditional rough grinding process can be omitted and the polishing process can be directly carried out in the polishing process, particularly the annular polishing process.
The clamping parameters of the polished workpiece are shown in the following table:
polishing: placing the mixture in a separator shown in FIG. 2 for rough polishing, and controlling the working temperature at 19+6 ℃.
A marble workpiece ring and a separator are used for ring polishing, and the separator of the polishing machine is a circular workpiece made of polytetrafluoroethylene; the circular groove of the polishing machine is of a symmetrical structure, polyurethane polishing leather and W0.5 aluminum oxide polishing powder are adopted, and the polishing parameters are as follows:
the proportion of the polishing powder influences the polishing time and can be adjusted according to the real-time working condition of processing.
Example 1 the results of spot inspection using a zygo profiler on a qualified crystal surface after polishing are shown in the following table:
example 2 the results of spot inspection using the zygo profiler on a crystal surface that is qualified after polishing are shown in the following table:
after rough polishing, the surface type is 47-80 nm, the surface roughness is 7-11 nm, the requirement that the planeness of the TGG crystal is lower than lambda/8 is met, only one-step polishing is adopted, and the processing time is reduced by 80-90 minutes.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A TGG crystal cold working method is characterized in that the surface processing step comprises a step of cutting and a step of polishing, and the steps are as follows in sequence: cutting and polishing; wherein:
the cutting step is to cut the TGG crystal into a preset size and enable the optical flat surface to be processed to have surface roughness R a 2.3 μm or less and 2.7 μm or less in surface form;
in the polishing step, the optical flat surface to be processed of the TGG crystal obtained in the cutting step is polished by adopting an annular polishing technology, so that the surface roughness R of the optical flat surface to be processed is ensured a Is 10nm or less and has a surface shape of 80nm or less; in the polishing step, a marble workpiece is annularly polished by a separator, and the separator of the polishing machine adopts a circular workpiece made of polytetrafluoroethylene;
the cutting step adopts a tension control line cutting system to cut, and adopts a diamond wire with the wire diameter of 0.21-0.25 mm, the lifting speed of a workbench of 25-30 mm/h, the linear rotating speed of 1000-1200 m/min and the tangential tension of 32-38N.
2. The TGG crystal cold working method of claim 1, wherein the circular groove of the polishing machine has a symmetrical structure.
3. The TGG crystal cold working method according to claim 2, wherein the polishing step marble plate rotation speed is 1 to 5r/min and the separator rotation speed is 1 to 5r/min.
4. The TGG crystal cold working method according to claim 2, wherein the polishing step uses W0.5 alumina as polishing powder, and the polishing is performed by gravity polishing in a ratio of 1.
5. The TGG crystal cold working method according to claim 2, wherein the diameter of the disc surface of the polishing machine is 0.8-1.2 m, a polyurethane polishing skin with the thickness of 1.5-2.0 mm and the groove of 20-40 mm is laid on the disc surface; the outer diameter of the separator is less than 275mm; the inner diameter of a workpiece ring of the polishing machine is smaller than 280mm.
6. A TGG crystal cold working method according to claim 1, wherein the polishing step is performed by clamping and polishing a polished workpiece holding the TGG crystal.
7. The TGG crystal cold working method of claim 6, wherein the diameter of the circular groove of the polisher is 1 to 3mm larger than the diameter of the work to be clamped placed therein.
8. The TGG crystal cold working method of claim 7, wherein the TGG crystals clamped on the polished workpiece are closely arranged, and the polished workpiece is circular glass-ceramics.
9. The TGG crystal cold working method according to claim 8, wherein the polished work piece with TGG crystals clamped therein comprises a circular glass-ceramics with the TGG crystal array bonded to the bottom surface thereof, an array of TGG crystals closely arranged, and a cosurface glass plate, and the TGG crystal array is clamped around with the cosurface glass plate at the same height as the TGG crystals.
10. A TGG crystal cold working method according to claim 8 or 9, characterized in that the circular glass-ceramics has a thickness of 2-18 mm and a diameter of 100-110 mm.
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