JPH08215964A - Inclination adjusting mechanism for base plate - Google Patents

Abstract

PURPOSE: To freely adjust the inclination of the upper face of a base plate in a micron unit by dividing an adjusting plate into an upper adjusting plate and a lower adjusting plate in the circumferential direction through a taper plane, and fixedly securing the respective adjusting plates by means of fixing tools mounted on the outer circumference of the adjusting plates. CONSTITUTION: A plurality of fixing parts 10 are formed along the outer circumference of a pair of divided adjusting plates 5a, 5b at regular intervals, fixing tools 11 are threadedly fitted to the respective fixing parts 10, and the upper and lower adjusting plates 5a, 5b are detachably fixed to each other. When the upper and lower adjusting plates 5a, 5b are symmetrically fitted together, the upper face and the lower face are truely in parallel with each other, and when the upper and lower adjusting plates 5a, 5b are fitted together in the same direction, inclination between the upper face and the lower face becomes maximum. Further when the upper and lower adjusting plates are crossingly fitted together, the half inclination is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base plate for processing a thin plate-like hard and brittle work such as a semiconductor wafer serving as a substrate for VLSI or the like with a true parallel precision between the upper surface and the lower surface. The present invention relates to a tilt adjusting mechanism, and more specifically, it is applied to a base plate such as a grinding machine, a lapping machine, and a polishing machine.

[0002]

2. Description of the Related Art A semiconductor wafer, which is a work of this type according to the present invention, is used in electronic circuits such as computers, integrated circuits such as so-called OA equipment, and its development is advancing day by day, and the equipment itself is miniaturized. Therefore, there is a demand for ultra-thinning, more uniform ultra-parallel accuracy, ultra-flat accuracy and ultra-planar accuracy from the viewpoint of yield, or further diameter expansion from the viewpoint of workability.

In general, a silicon semiconductor wafer is prepared by first slicing a cylindrical silicon crystal into a disk having a constant thickness and grinding the disk-shaped semiconductor wafer to a desired thickness. Processing, and then lapping to process semiconductor wafers after grinding with extremely high precision,
Alternatively, polishing processing such as polishing is performed.

[0004]

[Problems to be solved] Normally, the grinding process is divided into rough grinding and finish grinding by a cup wheel type diamond grindstone, and after the grinding process, further ultra-high precision machining required recently is performed. Wrapping, or
Although polishing is performed, the parallelism between the upper surface and the lower surface of the semiconductor wafer may be distorted due to product accuracy, environmental changes, proficiency, etc. of each part of the grinding and polishing equipment itself in each processing step. It often happens that the processed surface is tapered, and when the semiconductor chip is processed later, there is a problem in achieving ultra-high precision and uniform quality.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and as a result of diligent research, it solves these problems. A workpiece after being processed by a grinding machine, a lapping machine, a polishing machine, etc. When the upper surface and the lower surface are processed in a non-parallel state, that is, when a tapered surface occurs, the adjustment plate is provided on the base plate to grind and polish in a parallel state, and the taper of the upper surface of the workpiece is performed. It is an object of the present invention to provide and provide an inclination adjusting mechanism that makes a surface in a state of being truly parallel to a horizontal traveling direction of a processing device such as a grinding machine, a lapping machine, or a polishing machine.

[0006]

The structure of the first embodiment of the present invention comprises a substrate,
To the base body, a spindle shaft casing, a spindle shaft, an adjusting plate, a plate receiving base, a recessed portion, a vacuum base for chucking a work, and a vacuum communication hole. In the base plate, the adjusting plate has an upper surface and a lower surface. Are formed in a disk shape in a true parallel state, the adjusting plate is divided into an upper adjusting plate and a lower adjusting plate through a tapered surface, and a plurality of fixing portions are formed on the adjusting plate. It is configured such that a fixing tool is attached to the fixing portion and each adjustment plate is fixed.

Next, the structure of the second embodiment of the present invention comprises a base body, a spindle shaft casing for the base body, a spindle shaft, an adjusting plate, a plate receiving base, a liquid sticking plate, and a liquid communication hole. In the base plate provided with, the adjusting plate is formed into a disk shape with the upper surface and the lower surface in a true parallel state, and the adjusting plate is divided into an upper adjusting plate and a lower adjusting plate through a tapered surface. In this configuration, a plurality of fixing parts are formed on the adjusting plate, and fixing tools are attached to the fixing parts to fix the adjusting plates.

[0008]

According to the present invention, the adjusting plate is formed in a disk shape in a true parallel state, divided through the tapered surface to form a plurality of fixing portions at regular intervals, and the fixing tool is attached. The inclination of the upper surface of the base plate in units of microns can be adjusted freely.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The base plate inclination adjusting mechanism of the present invention which achieves the above object will be described below with reference to the drawings of the embodiments.

FIG. 1 is a schematic side view of a base plate tilt adjusting mechanism according to a first embodiment of the present invention, and FIG. 2 is a schematic side view of a base plate tilt adjusting mechanism according to a second embodiment of the present invention. 3 is a plan view of a main part of the adjustment plate,
4 is a side view of the upper adjusting plate and the lower adjusting plate, FIG. 5 is a side view showing the positional relationship between the upper adjusting plate and the lower adjusting plate, and FIG. 6 shows a further different positional relationship. It is a side view of each upper adjustment plate and lower adjustment plate shown.

The present invention relates to an inclination adjusting mechanism of a base plate for processing a thin plate-like hard and brittle work such as a semiconductor wafer serving as a substrate of VLSI or the like with a true parallel accuracy between the upper surface and the lower surface. More specifically, it is carried out on a base plate such as a grinding machine, a lapping machine, and a polishing machine. In the first embodiment, the base body 2 and the spindle shaft casing 3 fixed to the base body 2 are used.
A spindle shaft 4 rotatably pierced through the spindle shaft casing 3, an adjustment plate 5 detachably fixed to the upper end of the spindle shaft 4, and an adjustment plate 5 detachably attached to the upper end of the adjustment plate 5. A fixed plate pedestal 6,
Recessed portion 7 formed on the center side of the upper surface of the plate pedestal 6
In the base plate 1 including the vacuum table 8 that is fitted into the recessed portion 7 and chucks the work W, and the vacuum communication hole 9 that communicates the lower part of the vacuum table 8 and the vacuum mechanism, the adjustment plate 5 Is the top 5
c and the lower surface 5d are formed in a disk shape in a true parallel state, and the circumferential direction of the adjusting plate 5 is divided into an upper adjusting plate 5a and a lower adjusting plate 5b via a tapered surface, and Adjusting plate 5a. 5b, a plurality of fixed portions 10.10. Form ...
The respective fixing portions 10.10. ... to the respective fastener 11.1
1. ... and each adjusting plate 5a. 5b is fixed.

In the second embodiment of the present invention, the base 2 and the spindle shaft casing 3 fixed to the base 2,
A spindle shaft 4 rotatably pierced through the spindle shaft casing 3, an adjusting plate 5 removably fixed to the upper end of the spindle shaft 4, and a removably fixed upper end of the adjusting plate 5. And a liquid receiving plate 8A formed of a water-permeable member that is detachably fixed to the upper end of the plate receiving base 6, and the lower part of the liquid attaching plate 8A and the water passage mechanism are communicated with each other. In the base plate 1 having the liquid communication holes 9A, the adjusting plate 5 is formed into a disk shape with the upper surface 5c and the lower surface 5d in a true parallel state, and the adjusting plate 5 has a tapered surface in the circumferential direction. Via the upper adjustment plate 5a and the lower adjustment plate 5b via the adjustment plate 5a. A plurality of fixed portions 1 at regular intervals along the outer periphery of 5b.
0.10. Are formed, and the respective fixed portions 10.10. …
Fasteners 11.11. ... and each adjusting plate 5a. 5b is fixed.

That is, to explain in detail based on the first embodiment of the inclination adjusting mechanism of the base plate of the present invention, the upper surface and the lower surface of the work W which is a semiconductor wafer which has been demanded recently, can be realized with ultra-high accuracy of true parallelism. In order to adjust the inclination of the base plate 1 for performing grinding and polishing, a through hole is formed in the upper surface of a box-shaped base 2 such as a grinding machine and a polishing machine,
A spindle shaft casing 3 in which a flange-shaped fixing portion is bulged to a cylindrical outer periphery is fixed to the through hole by a bolt or the like, and a spindle is rotatably penetrated through the spindle shaft casing 3 through a bearing. It was set up.

A through hole is formed in the center of the spindle shaft 4, and the through hole serves as a vacuum communication hole 9 which communicates with a vacuum mechanism described later, and
Below the spindle shaft 4 is provided a drive source transmission means connected to a drive source such as a motor (not shown) by an endless belt or the like.

The upper end of the spindle shaft 4 is slightly bulged to form a mounting table for the adjusting plate 5, and the adjusting plate 5 is detachably fixed to the upper part thereof by a fixing tool. The fixing means has a suitable fixing hole formed therein, and the fixing tool is mounted in the fixing hole in a buried state. In the embodiment, a bolt is screwed into the screw hole in a buried state so that the fixing means is removable. There is something.

Further, a plate receiving stand 6 is mounted on the upper end of the adjusting plate 5, and the adjusting plate 5 and the plate receiving stand 6 are detachably fixed to each other. A disk-shaped recess 7 is formed on the center side of the upper surface of the base 6, and the vacuum base 8 described later is fitted into the recess 7. The bottom surface of the recess 7 has a workpiece. A vacuum communication hole 9 communicating with the vacuum mechanism for adsorbing W onto the vacuum table 8 is passed through the spindle shaft 4.

The vacuum table 8 is made of a material such as porous ceramic having air permeability and is formed into a disk shape. The vacuum table 8 is fitted into the concave portion 7 of the plate receiving table 6 so that the upper surface thereof becomes a flat surface, and the work W Is carried on and the vacuum mechanism is operated to securely chuck.

In the disk-shaped adjusting plate 5 which is the main part of the present invention, the upper surface 5c and the lower surface 5d are formed in a substantially parallel state, and then, the circumferential direction of the adjusting plate 5 is provided with a tapered surface in between. Upper adjustment plate 5a and lower adjustment plate 5b
And the pair of adjustment plates 5a. 5b along the outer periphery of the plurality of fixed portions 10.10. Are formed, and the respective fixed portions 10.10. A thread is formed on the thread, and a fastener 11.11.
The upper adjusting plate 5a and the upper adjusting plate 5b are detachably fixed by screwing the ... In a buried state.

The plurality of fixing portions 10.10. ... is shown in Figure 3.
As shown in FIG. 12, 12 holes are provided at regular intervals, but the number is not particularly limited, and they match when the upper adjusting plate 5a and the upper adjusting plate 5b are attached. It is provided at the position where

That is, when the upper adjusting plate 5a and the upper adjusting plate 5b are attached symmetrically as shown in FIG. 4, the upper surface 5c and the lower surface 5d are in a true parallel state and are shown in FIG. When the upper adjusting plate 5a and the upper adjusting plate 5b are attached to each other in the same direction as described above, the inclination of the upper surface 5c and the lower surface 5d becomes the maximum, and the upper and lower plates 5a and 5b are cross-attached as shown in FIG. In this case, the inclination is half the above.

For example, when the height difference of the tapered surface of the adjusting plate 5 of the present invention is set to 30 μm, the upper adjusting plate 5a and the lower adjusting plate 5b are rotated to fix the fixing portions 10.10. … And fixture 11.11. It becomes possible to change the upper surface 5c and the lower surface 5d from the state of being parallel to a maximum of 60 microns by attaching them by ..., and the error of 50 microns or less, which was impossible in the past, is corrected to about 5 microns. It is possible to do.

In the present invention, when the work is processed in the state shown in FIG. 1, the work is removed and measured, and if the work W has an inclination, the angle of the adjusting plate 5 is set to the fixing portion 10.
10. … And fixture 11.11. When the upper surface 5b of the upper adjustment plate 5a is adjusted to be flat and processed by the adjustment, the apparatus that is processed in an inclined state can process the work W in a parallel state.

Next, the inclination adjusting mechanism of the base plate 1 according to the second embodiment of the present invention shown in FIG. 2 is the base plate 1 having a so-called water cooling mechanism, which is used in place of the vacuum table 8 of the first embodiment. The plate is provided with a liquid sticking plate 8A formed of a water-permeable porous ceramic or the like, and the plate receiving base 6 having the recessed portion 7 is replaced with a flat plate receiving base 6 at the upper surface, and the vacuum communication hole 9 is the liquid communication hole 9A. The work W is attached with a liquid such as pure water, and other structures, actions, effects, etc. are the same as those in the first embodiment.

[0024]

According to the present invention, which has the above-described structure, the adjusting plate is formed into a disk shape in a true parallel state, and is divided into an upper adjusting plate and a lower adjusting plate through a tapered surface, and is fixed. It is possible to freely adjust the inclination of the upper surface of the base plate in micron units by a simple means of forming a plurality of fixing parts at intervals and mounting a fixing tool and rotating and fixing each adjustment plate. I did it,
An invention that enables ultra-high precision parallelism of workpieces such as semiconductor wafers and that makes it possible to make the final finished product uniform, and its contribution is immeasurable and an extremely significant effect. Is.

[Brief description of drawings]

FIG. 1 is a schematic side view of a tilt adjusting mechanism for a base plate according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of a tilt adjusting mechanism for a base plate according to a second embodiment of the present invention.

FIG. 3 is a plan view of an essential part of an adjustment plate.

FIG. 4 is a side view of an upper adjustment plate and a lower adjustment plate.

FIG. 5 is a side view showing a positional relationship between an upper adjustment plate and a lower adjustment plate.

FIG. 6 is a side view of the upper adjusting plate and the lower adjusting plate showing further different positional relationships.

[Explanation of symbols]

 W Work 1 Base plate 2 Base 3 Spindle shaft casing 4 Spindle shaft 5 Adjustment plate 5a Up adjustment plate 5b Down adjustment plate 5c Upper surface 5d Lower surface 6 Plate cradle 7 Recessed portion 8 Vacuum stand 8A Liquid sticking plate 9 Vacuum communication hole 9A Liquid communication hole 10 Fixing part 11 Fixing tool

Claims (2)

[Claims] 1. A base body, a spindle shaft casing fixed to the base body, a spindle shaft rotatably penetrating the spindle shaft casing, and an adjusting plate detachably fixed to the upper end of the spindle shaft. A plate pedestal detachably fixed to the upper end of the adjustment plate, a concave portion formed on the center side of the upper surface of the plate pedestal, and a vacuum table that is fitted into the concave portion and chucks a workpiece,
In a base plate having a vacuum communication hole that communicates the lower side of the vacuum table and a vacuum mechanism, the adjustment plate is formed into a disk shape in which the upper surface and the lower surface are in a true parallel state, and the circle of the adjustment plate. The circumferential direction is divided into an upper adjusting plate and a lower adjusting plate through a tapered surface, and a plurality of fixing portions are formed at regular intervals along the outer circumference of each adjusting plate, and the fixing portions are attached to the respective fixing portions. An inclination adjusting mechanism for a base plate, characterized in that a fixing tool is attached to fix each adjusting plate. 2. A base body, a spindle shaft casing fixed to the base body, a spindle shaft rotatably pierced through the spindle shaft casing, and an adjusting plate detachably fixed to the upper end of the spindle shaft. A plate holder that is detachably fixed to the upper end of the adjustment plate, a liquid sticking plate formed of a water-permeable member that is detachably fixed to the upper end of the plate receiver, and a liquid sticking plate In a base plate having a liquid communication hole that communicates a lower portion with a water passage mechanism, the adjustment plate is formed into a disk shape in which the upper surface and the lower surface are exactly parallel to each other, and the adjustment plate has a circumferential direction. The plate is divided into an upper adjusting plate and a lower adjusting plate via a tapered surface, and a plurality of fixing portions are formed at regular intervals along the outer circumference of each adjusting plate. The base plate of the tilt adjustment mechanism, characterized in wearing the fastener be affixed to adjustment each plate to the fixing portion of the.