CN113841469B - 电子控制装置 - Google Patents

电子控制装置 Download PDF

Info

Publication number
CN113841469B
CN113841469B CN202080036380.8A CN202080036380A CN113841469B CN 113841469 B CN113841469 B CN 113841469B CN 202080036380 A CN202080036380 A CN 202080036380A CN 113841469 B CN113841469 B CN 113841469B
Authority
CN
China
Prior art keywords
cover
circuit board
electronic component
electronic control
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080036380.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN113841469A (zh
Inventor
河合义夫
秋叶谅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of CN113841469A publication Critical patent/CN113841469A/zh
Application granted granted Critical
Publication of CN113841469B publication Critical patent/CN113841469B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
CN202080036380.8A 2019-05-31 2020-05-22 电子控制装置 Active CN113841469B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-102441 2019-05-31
JP2019102441 2019-05-31
PCT/JP2020/020238 WO2020241474A1 (ja) 2019-05-31 2020-05-22 電子制御装置

Publications (2)

Publication Number Publication Date
CN113841469A CN113841469A (zh) 2021-12-24
CN113841469B true CN113841469B (zh) 2024-01-02

Family

ID=73553444

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080036380.8A Active CN113841469B (zh) 2019-05-31 2020-05-22 电子控制装置

Country Status (3)

Country Link
JP (1) JP7210722B2 (https=)
CN (1) CN113841469B (https=)
WO (1) WO2020241474A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023132023A (ja) * 2022-03-10 2023-09-22 東洋電装株式会社 電子部品保護構造およびスイッチ装置

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316662A (ja) * 1995-05-24 1996-11-29 Fujitsu Ltd 電子装置
JP2001332832A (ja) * 2000-05-19 2001-11-30 Olympus Optical Co Ltd 医用電気機器
JP2007300032A (ja) * 2006-05-02 2007-11-15 Hitachi Cable Ltd 光モジュール及びその製造方法
CN101103661A (zh) * 2005-01-13 2008-01-09 富士胶片株式会社 用于将屏蔽壳连接至电路板的结构及方法、电子元件模块和便携式电话
JP2008090437A (ja) * 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2010267927A (ja) * 2009-05-18 2010-11-25 Denso Corp 電子装置
CN201854514U (zh) * 2010-11-01 2011-06-01 国营第三八八厂 一种具有电磁屏蔽和散热功能的高频地波雷达机箱
JP2012238821A (ja) * 2011-05-13 2012-12-06 Tdk Corp シールドケース固定構造及びそれを備える電子装置
CN102943969A (zh) * 2012-11-21 2013-02-27 深圳华瀚新能源材料有限公司 使用导热高分子材料散热的led灯
CN202799558U (zh) * 2012-07-16 2013-03-13 苏州东福电子有限公司 一种条状铝箔
JP2014075496A (ja) * 2012-10-05 2014-04-24 Hitachi Automotive Systems Ltd 車載電子制御装置
JP2014120677A (ja) * 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
JP2014203998A (ja) * 2013-04-05 2014-10-27 日立オートモティブシステムズ株式会社 車載電子制御装置
CN204598570U (zh) * 2015-04-10 2015-08-26 广东昕海科技有限公司 一种抗干扰屏蔽装置
CN204668299U (zh) * 2015-06-18 2015-09-23 厦门华联电子有限公司 一种红外线接收头
CN105051938A (zh) * 2013-03-15 2015-11-11 日立汽车系统株式会社 蓄电组件
CN105472866A (zh) * 2014-09-30 2016-04-06 太阳诱电株式会社 电路组件及其制造方法
CN109156091A (zh) * 2016-05-04 2019-01-04 三星电子株式会社 用于不同类型的电路元件的中空屏蔽结构及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131198U (https=) * 1987-02-17 1988-08-26
JP3898912B2 (ja) * 2001-06-11 2007-03-28 株式会社ケンウッド 電子機器
JP2007258615A (ja) * 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
JP2014033025A (ja) * 2012-08-01 2014-02-20 Alps Electric Co Ltd 電子回路モジュール
CN108029228A (zh) * 2015-09-29 2018-05-11 日立汽车系统株式会社 电子控制装置
JP2019133858A (ja) * 2018-01-31 2019-08-08 株式会社アドヴィックス 電子制御装置

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316662A (ja) * 1995-05-24 1996-11-29 Fujitsu Ltd 電子装置
JP2001332832A (ja) * 2000-05-19 2001-11-30 Olympus Optical Co Ltd 医用電気機器
CN101103661A (zh) * 2005-01-13 2008-01-09 富士胶片株式会社 用于将屏蔽壳连接至电路板的结构及方法、电子元件模块和便携式电话
JP2007300032A (ja) * 2006-05-02 2007-11-15 Hitachi Cable Ltd 光モジュール及びその製造方法
JP2008090437A (ja) * 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2010267927A (ja) * 2009-05-18 2010-11-25 Denso Corp 電子装置
CN201854514U (zh) * 2010-11-01 2011-06-01 国营第三八八厂 一种具有电磁屏蔽和散热功能的高频地波雷达机箱
JP2012238821A (ja) * 2011-05-13 2012-12-06 Tdk Corp シールドケース固定構造及びそれを備える電子装置
CN202799558U (zh) * 2012-07-16 2013-03-13 苏州东福电子有限公司 一种条状铝箔
JP2014075496A (ja) * 2012-10-05 2014-04-24 Hitachi Automotive Systems Ltd 車載電子制御装置
CN102943969A (zh) * 2012-11-21 2013-02-27 深圳华瀚新能源材料有限公司 使用导热高分子材料散热的led灯
JP2014120677A (ja) * 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
CN105051938A (zh) * 2013-03-15 2015-11-11 日立汽车系统株式会社 蓄电组件
JP2014203998A (ja) * 2013-04-05 2014-10-27 日立オートモティブシステムズ株式会社 車載電子制御装置
CN105472866A (zh) * 2014-09-30 2016-04-06 太阳诱电株式会社 电路组件及其制造方法
CN204598570U (zh) * 2015-04-10 2015-08-26 广东昕海科技有限公司 一种抗干扰屏蔽装置
CN204668299U (zh) * 2015-06-18 2015-09-23 厦门华联电子有限公司 一种红外线接收头
CN109156091A (zh) * 2016-05-04 2019-01-04 三星电子株式会社 用于不同类型的电路元件的中空屏蔽结构及其制造方法

Also Published As

Publication number Publication date
CN113841469A (zh) 2021-12-24
JPWO2020241474A1 (https=) 2020-12-03
WO2020241474A1 (ja) 2020-12-03
JP7210722B2 (ja) 2023-01-23

Similar Documents

Publication Publication Date Title
CN107026136B (zh) 具有压力施加体的功率半导体模块及其布置
CN101090109B (zh) 带有相互电绝缘的连接元件的功率半导体模块
CN109786341B (zh) 具有开关装置的功率半导体模块及其配置
CN109256372B (zh) 具有dc和ac电压端子元件的功率电子子模块及其组件
US7589418B2 (en) Pressure contact power semiconductor module
US6522544B1 (en) Power module
US7780469B2 (en) Arrangement of at least one power semiconductor module and a printed circuit board
CN1700453B (zh) 与功率半导体模块形成压力接触的结构
EP0881674A2 (en) High power semiconductor module device
JP6757742B2 (ja) パワーモジュールおよびパワーモジュールの製造方法
US9633919B2 (en) Package structure with an elastomer with lower elastic modulus
KR20090050987A (ko) 기판 및 가압 장치를 구비하는 전력 반도체 모듈
CN111668176B (zh) 用于半导体封装的安装装置
CN106486439A (zh) 包括两部分式壳体的功率电子子模块
CN101740531A (zh) 具有预紧的辅助接触弹簧的功率半导体模块
CN113841469B (zh) 电子控制装置
CN108172550B (zh) 用于电力电子开关装置的压力装置、开关装置及其配置
US6674344B2 (en) Electronic device
JP7212165B2 (ja) 電子制御装置
CN101084578A (zh) 半导体开关模块
CN104023854B (zh) 静电雾化装置
US20240291414A1 (en) Power circuit assembly for a vehicle
WO2020178121A1 (en) Lighting device with high flexibility in connecting electrical components
JP2002344177A (ja) 電子装置
JP6715218B2 (ja) 圧力検出装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant