CN113811578B - 室温固化性有机聚硅氧烷组合物、硅橡胶和物品 - Google Patents

室温固化性有机聚硅氧烷组合物、硅橡胶和物品 Download PDF

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CN113811578B
CN113811578B CN202080034301.XA CN202080034301A CN113811578B CN 113811578 B CN113811578 B CN 113811578B CN 202080034301 A CN202080034301 A CN 202080034301A CN 113811578 B CN113811578 B CN 113811578B
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CN113811578A (zh
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藤原晃嗣
坂本隆文
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
CN202080034301.XA 2019-05-09 2020-04-24 室温固化性有机聚硅氧烷组合物、硅橡胶和物品 Active CN113811578B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-088868 2019-05-09
JP2019088868 2019-05-09
PCT/JP2020/017666 WO2020226076A1 (ja) 2019-05-09 2020-04-24 室温硬化性オルガノポリシロキサン組成物、シリコーンゴム及び物品

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CN113811578A CN113811578A (zh) 2021-12-17
CN113811578B true CN113811578B (zh) 2023-08-11

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US (1) US20220227996A1 (https=)
EP (1) EP3967730B1 (https=)
JP (1) JP7355105B2 (https=)
CN (1) CN113811578B (https=)
WO (1) WO2020226076A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113631638B (zh) * 2019-04-03 2023-09-22 信越化学工业株式会社 两末端乳酸酯甲硅烷基改性有机聚硅氧烷及其制造方法
DE102021131400A1 (de) 2021-11-30 2023-06-01 Nitrochemie Aschau Gmbh Zusammensetzung für Silikonkautschukmassen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717646A (zh) * 2011-08-05 2014-04-09 道康宁公司 填充的有机硅组合物、其制备及用途
CN107033835A (zh) * 2016-11-22 2017-08-11 广州市高士实业有限公司 一种脱乳酸乙酯透明中性硅酮密封胶及其制备方法
CN107523257A (zh) * 2017-09-29 2017-12-29 山东三泽硅胶有限公司 一种室温固化脱乳酸乙酯型硅酮密封胶

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JPS5217358A (en) 1975-07-31 1977-02-09 Yoshinobu Kobayashi Method of reproducing superrhard alloy powder from superrhard alloy scrap
DE3210337A1 (de) * 1982-03-20 1983-09-22 Consortium für elektrochemische Industrie GmbH, 8000 München Silane, verfahren zu ihrer herstellung und massen, die unter verwendung der silane bereitet worden sind
JPS6151056A (ja) * 1984-08-16 1986-03-13 Toray Silicone Co Ltd 室温硬化後塗装可能なオルガノポリシロキサン組成物
JPS6451056A (en) * 1987-08-21 1989-02-27 Nitto Seiko Kk Device for filling bean curd in pack
JP2538152B2 (ja) 1991-10-15 1996-09-25 信越化学工業株式会社 有機けい素化合物
ES2425174T3 (es) 2007-08-31 2013-10-11 Nitrochemie Aschau Gmbh Endurecedor para masas de caucho de silicona
DE102012221375A1 (de) 2012-11-22 2014-05-22 Evonik Industries Ag Feuchtigkeitshärtende Zusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung
EP2774672A1 (de) 2013-03-04 2014-09-10 Nitrochemie Aschau GmbH Katalysator für die Vernetzung von Siliconkautschukmassen
WO2015098118A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device
DE202015009134U1 (de) 2015-03-17 2016-10-24 Henkel Ag & Co. Kgaa Härtbare Silikonzusammensetzungen
DE202015009122U1 (de) 2015-03-17 2016-11-07 Henkel Ag & Co. Kgaa Silane und härtbare Zusammensetzungen, die diese Silane als Vernetzer enthalten
CN105238342A (zh) * 2015-11-13 2016-01-13 广州市白云化工实业有限公司 有机硅胶粘剂及其制备方法
WO2019069706A1 (ja) 2017-10-06 2019-04-11 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物の製造方法、室温硬化性オルガノポリシロキサン組成物及び物品
MX2020012216A (es) 2018-05-18 2021-01-29 Henkel Ag & Co Kgaa Composiciones de silicon curables.
TWI816787B (zh) * 2018-06-06 2023-10-01 美商陶氏有機矽公司 可濕氣固化有機聚矽氧烷組成物及電氣/電子設備
ES2955777T3 (es) 2018-11-30 2023-12-07 Henkel Ag & Co Kgaa Poliorganosiloxanos curables con grupos terminales protegidos

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717646A (zh) * 2011-08-05 2014-04-09 道康宁公司 填充的有机硅组合物、其制备及用途
CN107033835A (zh) * 2016-11-22 2017-08-11 广州市高士实业有限公司 一种脱乳酸乙酯透明中性硅酮密封胶及其制备方法
CN107523257A (zh) * 2017-09-29 2017-12-29 山东三泽硅胶有限公司 一种室温固化脱乳酸乙酯型硅酮密封胶

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JP7355105B2 (ja) 2023-10-03
EP3967730A4 (en) 2023-01-18
US20220227996A1 (en) 2022-07-21
EP3967730B1 (en) 2023-12-06
JPWO2020226076A1 (https=) 2020-11-12
CN113811578A (zh) 2021-12-17
WO2020226076A1 (ja) 2020-11-12
EP3967730A1 (en) 2022-03-16

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