CN113798118B - 浸渍处理装置以及利用了该装置的电子部件的制造方法 - Google Patents

浸渍处理装置以及利用了该装置的电子部件的制造方法 Download PDF

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Publication number
CN113798118B
CN113798118B CN202110658171.3A CN202110658171A CN113798118B CN 113798118 B CN113798118 B CN 113798118B CN 202110658171 A CN202110658171 A CN 202110658171A CN 113798118 B CN113798118 B CN 113798118B
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China
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holder
jig
paste
respect
component
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CN202110658171.3A
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English (en)
Chinese (zh)
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CN113798118A (zh
Inventor
青山宽之
竹野干雄
田中淳也
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
CN202110658171.3A 2020-06-17 2021-06-11 浸渍处理装置以及利用了该装置的电子部件的制造方法 Active CN113798118B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020104576A JP7405011B2 (ja) 2020-06-17 2020-06-17 ディップ処理装置およびこれを用いた電子部品の製造方法
JP2020-104576 2020-06-17

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CN113798118A CN113798118A (zh) 2021-12-17
CN113798118B true CN113798118B (zh) 2023-04-07

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CN202110658171.3A Active CN113798118B (zh) 2020-06-17 2021-06-11 浸渍处理装置以及利用了该装置的电子部件的制造方法

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JP (1) JP7405011B2 (ja)
CN (1) CN113798118B (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260377A (ja) * 1993-02-12 1994-09-16 Sumitomo Metal Ind Ltd チップ形電子部品の端子電極形成方法
JP3457421B2 (ja) * 1995-05-17 2003-10-20 ローム株式会社 電子部品の製造方法、電子部品に対する導電ペーストの塗布方法、およびこれらに用いる装置
JP3808318B2 (ja) * 2001-03-16 2006-08-09 京セラ株式会社 巻線型チップインダクタ
US9028666B2 (en) * 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
CN107731482B (zh) * 2014-08-19 2019-11-22 株式会社村田制作所 卷线型线圈部件

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JP7405011B2 (ja) 2023-12-26
CN113798118A (zh) 2021-12-17
JP2021197508A (ja) 2021-12-27

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