CN113748518A - 显示基板及其制作方法、显示装置 - Google Patents
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- CN113748518A CN113748518A CN202080000422.2A CN202080000422A CN113748518A CN 113748518 A CN113748518 A CN 113748518A CN 202080000422 A CN202080000422 A CN 202080000422A CN 113748518 A CN113748518 A CN 113748518A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Filters (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示基板及其制作方法、显示装置,显示基板包括:显示区域和包围所述显示区域的外围区域,显示基板包括:基底和设置在基底上的发光结构层、彩膜层、第一平坦层和光学层;彩膜层位于发光结构层远离基底的一侧,第一平坦层位于彩膜层远离基底的一侧,光学层位于第一平坦层远离基底的一侧,被配置为聚集从彩膜层射出的光线;显示基板还包括:晶体管,晶体管的有源层形成于基底的内部;位于显示区域的彩膜层远离基底的表面不平坦;第一厚度为位于显示区域的彩膜层的最大厚度,第二厚度为位于显示区域的彩膜层的最小厚度;第一厚度与第二厚度之间的差值小于或者等于第一平坦层的厚度。
Description
PCT国内申请,说明书已公开。
Claims (21)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/081840 WO2021189475A1 (zh) | 2020-03-27 | 2020-03-27 | 显示基板及其制作方法、显示装置 |
Publications (2)
Publication Number | Publication Date |
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CN113748518A true CN113748518A (zh) | 2021-12-03 |
CN113748518B CN113748518B (zh) | 2023-04-18 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN202080000422.2A Active CN113748518B (zh) | 2020-03-27 | 2020-03-27 | 显示基板及其制作方法、显示装置 |
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Country | Link |
---|---|
US (1) | US20220140287A1 (zh) |
EP (1) | EP4131397A4 (zh) |
JP (1) | JP2023528694A (zh) |
CN (1) | CN113748518B (zh) |
WO (1) | WO2021189475A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115044328A (zh) * | 2022-07-21 | 2022-09-13 | 京东方科技集团股份有限公司 | 显示装置和填充胶水 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022140028A1 (en) | 2020-12-21 | 2022-06-30 | 10X Genomics, Inc. | Methods, compositions, and systems for capturing probes and/or barcodes |
WO2023150171A1 (en) | 2022-02-01 | 2023-08-10 | 10X Genomics, Inc. | Methods, compositions, and systems for capturing analytes from glioblastoma samples |
WO2023150163A1 (en) | 2022-02-01 | 2023-08-10 | 10X Genomics, Inc. | Methods, compositions, and systems for capturing analytes from lymphatic tissue |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060043068A1 (en) * | 2004-08-31 | 2006-03-02 | Tokyo Electron Limited | Microlens forming method |
CN101153931A (zh) * | 2006-09-29 | 2008-04-02 | 比亚迪股份有限公司 | 一种彩色滤光片 |
JP2010258114A (ja) * | 2009-04-22 | 2010-11-11 | Panasonic Corp | 固体撮像素子 |
CN102034836A (zh) * | 2009-09-30 | 2011-04-27 | 株式会社东芝 | 固体摄像装置 |
CN102339838A (zh) * | 2010-07-16 | 2012-02-01 | 采钰科技股份有限公司 | 图像传感器及其制造方法 |
CN104299980A (zh) * | 2013-07-19 | 2015-01-21 | 索尼公司 | 显示单元、显示单元的制造方法和电子装置 |
CN205787484U (zh) * | 2016-07-08 | 2016-12-07 | 京东方科技集团股份有限公司 | 量子点显示基板和量子点显示装置 |
CN107104199A (zh) * | 2017-04-19 | 2017-08-29 | 武汉华星光电技术有限公司 | 显示面板及其制造方法 |
CN109659346A (zh) * | 2018-12-19 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板及oled显示装置 |
CN109671870A (zh) * | 2018-12-19 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | 有机发光显示装置及其制造方法 |
CN109713026A (zh) * | 2019-02-26 | 2019-05-03 | 京东方科技集团股份有限公司 | 一种硅基电致发光显示面板及其制造方法、显示装置 |
CN110350015A (zh) * | 2019-07-22 | 2019-10-18 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法、显示装置 |
CN110854298A (zh) * | 2019-11-26 | 2020-02-28 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004363049A (ja) * | 2003-06-06 | 2004-12-24 | Seiko Epson Corp | 有機エレクトロルミネッセンス表示装置の製造方法及び、有機エレクトロルミネッセンス表示装置並びに、有機エレクトロルミネッセンス表示装置を備える表示装置 |
US8405748B2 (en) * | 2010-07-16 | 2013-03-26 | Omnivision Technologies, Inc. | CMOS image sensor with improved photodiode area allocation |
JP2013120731A (ja) * | 2011-12-08 | 2013-06-17 | Canon Inc | 表示装置 |
KR102189819B1 (ko) * | 2014-09-01 | 2020-12-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104898292B (zh) * | 2015-06-30 | 2018-02-13 | 京东方科技集团股份有限公司 | 3d显示基板及其制作方法、3d显示装置 |
KR102647969B1 (ko) * | 2016-10-28 | 2024-03-18 | 삼성디스플레이 주식회사 | 광 필드 표시 장치 및 이의 제조 방법 |
CN107394049A (zh) * | 2017-07-06 | 2017-11-24 | 深圳市华星光电技术有限公司 | 一种白光oled器件 |
KR20210098446A (ko) * | 2018-11-30 | 2021-08-10 | 소니그룹주식회사 | 표시 장치 |
KR20200089379A (ko) * | 2019-01-16 | 2020-07-27 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
KR20200110505A (ko) * | 2019-03-13 | 2020-09-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20200145978A (ko) * | 2019-06-21 | 2020-12-31 | 삼성전자주식회사 | 이미지 센서 |
CN111223904B (zh) * | 2019-12-20 | 2023-04-18 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置及其控制方法 |
TW202137598A (zh) * | 2020-02-26 | 2021-10-01 | 日商索尼半導體解決方案公司 | 發光元件及顯示裝置、與顯示裝置之製造方法 |
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2020
- 2020-03-27 EP EP20904239.9A patent/EP4131397A4/en active Pending
- 2020-03-27 JP JP2021568358A patent/JP2023528694A/ja active Pending
- 2020-03-27 WO PCT/CN2020/081840 patent/WO2021189475A1/zh active Application Filing
- 2020-03-27 US US17/257,860 patent/US20220140287A1/en active Pending
- 2020-03-27 CN CN202080000422.2A patent/CN113748518B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060043068A1 (en) * | 2004-08-31 | 2006-03-02 | Tokyo Electron Limited | Microlens forming method |
CN101153931A (zh) * | 2006-09-29 | 2008-04-02 | 比亚迪股份有限公司 | 一种彩色滤光片 |
JP2010258114A (ja) * | 2009-04-22 | 2010-11-11 | Panasonic Corp | 固体撮像素子 |
CN102034836A (zh) * | 2009-09-30 | 2011-04-27 | 株式会社东芝 | 固体摄像装置 |
CN102339838A (zh) * | 2010-07-16 | 2012-02-01 | 采钰科技股份有限公司 | 图像传感器及其制造方法 |
CN104299980A (zh) * | 2013-07-19 | 2015-01-21 | 索尼公司 | 显示单元、显示单元的制造方法和电子装置 |
CN205787484U (zh) * | 2016-07-08 | 2016-12-07 | 京东方科技集团股份有限公司 | 量子点显示基板和量子点显示装置 |
CN107104199A (zh) * | 2017-04-19 | 2017-08-29 | 武汉华星光电技术有限公司 | 显示面板及其制造方法 |
CN109659346A (zh) * | 2018-12-19 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板及oled显示装置 |
CN109671870A (zh) * | 2018-12-19 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | 有机发光显示装置及其制造方法 |
CN109713026A (zh) * | 2019-02-26 | 2019-05-03 | 京东方科技集团股份有限公司 | 一种硅基电致发光显示面板及其制造方法、显示装置 |
CN110350015A (zh) * | 2019-07-22 | 2019-10-18 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法、显示装置 |
CN110854298A (zh) * | 2019-11-26 | 2020-02-28 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115044328A (zh) * | 2022-07-21 | 2022-09-13 | 京东方科技集团股份有限公司 | 显示装置和填充胶水 |
Also Published As
Publication number | Publication date |
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EP4131397A4 (en) | 2023-08-09 |
WO2021189475A1 (zh) | 2021-09-30 |
US20220140287A1 (en) | 2022-05-05 |
JP2023528694A (ja) | 2023-07-06 |
EP4131397A1 (en) | 2023-02-08 |
CN113748518B (zh) | 2023-04-18 |
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