CN113748507A - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
CN113748507A
CN113748507A CN202080000385.5A CN202080000385A CN113748507A CN 113748507 A CN113748507 A CN 113748507A CN 202080000385 A CN202080000385 A CN 202080000385A CN 113748507 A CN113748507 A CN 113748507A
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China
Prior art keywords
pad
layer
electrode
silicon
display
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CN202080000385.5A
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CN113748507B (zh
Inventor
朱志坚
卢鹏程
敖雨
李云龙
田元兰
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN202210812348.5A priority Critical patent/CN115207060A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70Testing, e.g. accelerated lifetime tests
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs

Abstract

本公开关于一种显示装置、显示面板及其制造方法,该显示面板包括:硅基衬底、驱动层、第一电极层、有机发光层、第二电极层、多个焊盘。驱动层形成于硅基衬底中,且包括位于显示区的多个第一晶体管;各第一电极与各第一晶体管电连接;第二电极层于有机发光层背离驱动层的一侧,且包括位于显示区的第二电极和位于外围区的电极环;多个焊盘位于显示区至少一侧的外围区,多个焊盘包括显示信号接入焊盘和测试信号接入焊盘;其中显示信号接入焊盘被配置为在显示阶段接入显示信号,测试信号接入焊盘至少包括第一组测试阶段接入焊盘,第一组测试阶段接入焊盘包括第一焊盘和第二焊盘,第一焊盘与电极环电连接,第二焊盘与硅基衬底电连接。

Description

PCT国内申请,说明书已公开。

Claims (16)

  1. PCT国内申请,权利要求书已公开。
CN202080000385.5A 2020-03-27 2020-03-27 显示面板及显示装置 Active CN113748507B (zh)

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CN202210812348.5A CN115207060A (zh) 2020-03-27 2020-03-27 显示面板及显示装置

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PCT/CN2020/081858 WO2021189486A1 (zh) 2020-03-27 2020-03-27 显示面板及显示装置

Related Child Applications (1)

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CN202210812348.5A Division CN115207060A (zh) 2020-03-27 2020-03-27 显示面板及显示装置

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CN113748507A true CN113748507A (zh) 2021-12-03
CN113748507B CN113748507B (zh) 2022-08-23

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US (2) US11957013B2 (zh)
EP (1) EP4131375B1 (zh)
CN (2) CN115207060A (zh)
WO (1) WO2021189486A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114973970A (zh) * 2022-06-28 2022-08-30 合肥维信诺科技有限公司 显示面板

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JP2002098999A (ja) * 2000-09-26 2002-04-05 Toshiba Corp 液晶表示装置
US20030122975A1 (en) * 2001-12-29 2003-07-03 Jeong-Rok Kim Liquid crystal display device formed on glass substrate having improved efficiency
KR20050026588A (ko) * 2003-09-09 2005-03-15 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
CN103972260A (zh) * 2013-01-31 2014-08-06 三星显示有限公司 集成有触摸屏面板的有机发光显示器
CN104965321A (zh) * 2015-07-01 2015-10-07 深圳市华星光电技术有限公司 显示面板检测系统及检测方法
CN108461480A (zh) * 2017-02-07 2018-08-28 三星显示有限公司 有机发光显示装置
CN108873525A (zh) * 2018-07-17 2018-11-23 深圳市华星光电半导体显示技术有限公司 一种阵列基板的栅极线的测试线路
CN109256045A (zh) * 2017-07-12 2019-01-22 三星显示有限公司 显示装置
US20190198582A1 (en) * 2017-12-27 2019-06-27 Lg Display Co., Ltd. Display Apparatus and Electroluminescence Display
CN110634840A (zh) * 2019-09-24 2019-12-31 京东方科技集团股份有限公司 检测基板及其制备方法、检测装置和检测方法

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JP2010010611A (ja) 2008-06-30 2010-01-14 Toshiba Corp プリント回路板及び電子機器
KR102043180B1 (ko) * 2013-04-25 2019-11-12 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
KR102246365B1 (ko) * 2014-08-06 2021-04-30 삼성디스플레이 주식회사 표시장치와 그의 제조방법
KR102284142B1 (ko) * 2015-01-13 2021-07-30 삼성디스플레이 주식회사 표시 패널 및 그 리페어 방법
CN105185816A (zh) * 2015-10-15 2015-12-23 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置
US10692411B2 (en) 2017-12-21 2020-06-23 Lg Display Co., Ltd. Display device, test circuit, and test method thereof
CN209016060U (zh) * 2018-12-06 2019-06-21 京东方科技集团股份有限公司 有机发光二极管阵列基板及电子装置
KR102581763B1 (ko) * 2018-12-13 2023-09-25 삼성디스플레이 주식회사 표시 모듈의 검사 장치, 그것을 포함하는 검사 시스템 및 그것의 검사 방법

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098999A (ja) * 2000-09-26 2002-04-05 Toshiba Corp 液晶表示装置
US20030122975A1 (en) * 2001-12-29 2003-07-03 Jeong-Rok Kim Liquid crystal display device formed on glass substrate having improved efficiency
KR20050026588A (ko) * 2003-09-09 2005-03-15 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
CN103972260A (zh) * 2013-01-31 2014-08-06 三星显示有限公司 集成有触摸屏面板的有机发光显示器
CN104965321A (zh) * 2015-07-01 2015-10-07 深圳市华星光电技术有限公司 显示面板检测系统及检测方法
CN108461480A (zh) * 2017-02-07 2018-08-28 三星显示有限公司 有机发光显示装置
CN109256045A (zh) * 2017-07-12 2019-01-22 三星显示有限公司 显示装置
US20190198582A1 (en) * 2017-12-27 2019-06-27 Lg Display Co., Ltd. Display Apparatus and Electroluminescence Display
CN108873525A (zh) * 2018-07-17 2018-11-23 深圳市华星光电半导体显示技术有限公司 一种阵列基板的栅极线的测试线路
CN110634840A (zh) * 2019-09-24 2019-12-31 京东方科技集团股份有限公司 检测基板及其制备方法、检测装置和检测方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114973970A (zh) * 2022-06-28 2022-08-30 合肥维信诺科技有限公司 显示面板

Also Published As

Publication number Publication date
EP4131375A1 (en) 2023-02-08
CN113748507B (zh) 2022-08-23
CN115207060A (zh) 2022-10-18
US20220140051A1 (en) 2022-05-05
EP4131375A4 (en) 2023-05-31
US11957013B2 (en) 2024-04-09
EP4131375B1 (en) 2024-05-08
US20230017885A1 (en) 2023-01-19
WO2021189486A1 (zh) 2021-09-30

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