CN1137176A - 表面安装型发光二极管 - Google Patents

表面安装型发光二极管 Download PDF

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CN1137176A
CN1137176A CN 96102727 CN96102727A CN1137176A CN 1137176 A CN1137176 A CN 1137176A CN 96102727 CN96102727 CN 96102727 CN 96102727 A CN96102727 A CN 96102727A CN 1137176 A CN1137176 A CN 1137176A
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substrate
casting mold
terminal
surface mounting
limit
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CN1078388C (zh
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田口佳子
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Stanley Electric Co Ltd
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Abstract

一种发光二极管(1)，与基板(2)接合的铸型部分(6)的边中，连续平行于安设各端子部分(3a)处的基板边的两个边，直接接合基板(2)至少0.1mm，其余部分与导电型板接合；而垂直于相对安设各端子部分(3a)处的基板边的另外两个边，则全部与基板(2)接合。因此改善装置的机械和热阻力，减少基板(2)和铸型部分(6)之间的剥离，消除侵入水分和异物的可能性，于是提高发光二极管的工作可靠性。

Description

表面安装型发光二极管
本发明涉及发光二极管的构形，更确切地说，发明涉及在不需要在印刷线路板上制成配合孔的情况下，就可安装在印刷线路板表面上的表面安装型发光二极管。
图5和图6表示所考虑类型中已知的表面安装型发光二极管90的结构，其构成是在基板91上形成导电型板92，基板是91是典型的玻璃环氧树脂印刷线路板，导电型板92包括分别安设在基板91两对边上的一对端子部分92a，一个端子部分92a连接一小块92b，另一端子部分92a连接接线部分92c。
所述的导电型板92通常是镀金的，发光二极管(LED)芯片93安设在所述安装部分92b。通过金导线94将芯片和接线部分92c连接以后，构成透明环氧树脂的大致呈直角的平行六面体铸型部分95，以便覆盖所述的发光二极管芯片93和所述的金导线94，并制成一个完整的表面安装型发光二极管90。
当在工业基础上实际生产这种装置时，一次供应许多如图示的相互连接的基板91，将各LED芯片93分别装配在基板上，并分别用金导线94连线。此后，以连续隆脊的方式预制各铸型部分95，然后借助切割器80进行切割，从而制造出单个的装置。
然而，如上述方法制备的传统表面安装型发光二极管90存在以下问题，即和所述基板91与所述铸型部分95相互之间不产生局部剥离相比较，经常更多地使水分和异物侵入内部，其结果损害了表面安装型发光二极管90的使用寿命。
通过观察剥离的后果发现，镀金的铜箔端子部分92a没有良好地附着环氧树脂铸型部分95，当装置接通而发射热时，由于导电型板92和铸型部分95的材料热膨胀系数不同，所以二者以不同的速率膨胀，从而产生应力，该应力造成剥离。
此外，如果包括许多装置的整体是这样构成时，在用上述切割器将整体切割成单个装置时，装置的导电型板92将外露出。每个导电型板92和相应的铸型部分95会由于切割作业产生的应力而剥离。换句话说，这种表面安装型发光二极管在制造时带有一些剥离区域。这些是这种类型的表面安装型发光二极管应考虑需要解决的问题。
根据发明，通过以下方式解决上述问题，即提供一种表面安装型发光二极管，其构成是在基板上安装LED芯片，基板具有分别安排在导电型板两对置边的一对端子部分以及安排在中央的安装部分和接线部分，安装和接线部分分别和所述的各端子部分保持接触，用导线接线所述LED芯片，然后用基本垂直的平行六面体铸型部分覆盖所述芯片和所述导线，其特征是：接合所述基板的所述铸型部分的边中，连续平行于安排所述各端子部分处的所述基板边的两个边，直接接合所述基板至少0.1mm，其余部分接合所述导电型板，而相对垂直于安排所述各端子部分处的所述基板边的其他两个边，全部与基板直接接合。
图1：本发明表面安装型发光二极管实施例的透视图；
图2：简要表示上述实施例中导电型板的形式；
图3：表明上述实施例的试样和传统装置试样进行热试验的比较结果；
图4：简要表示本发明表面安装型发光二极管的另一实施例中导电型板的形成；
图5：与本发明相比较的传统装置透视图；
图6：简要表示上述传统装置中导电型板的形成；
图7：说明这种表面安装型发光二极管制造步骤的局部透视图。
附图中参考号1代表表面安装型发光二极管；2：基板，3：导电型板，3a：端子部分，3b：安装部分，3c：接线部分，3d：过渡线部分，4：LED芯片，5：金导线，6：铸型部分，6a：平行边，6b：垂直边
现在参照表示本发明实施例的附图详尽介绍本发明。首先看图1和图2，图中是本发明安装型发光二极管，由参考号1表示(下面简称发光二极管)，该发光二极管构造是在基板2上带有导电型板3并安装LED芯片，导电型板3包括端子部分3a，安装部分3b和接线部分3c，利用金导线5将他们进行适当地连接，然后如同相比较的传统装置一样构成铸型部分6。
也和相比较的传统装置相同，当以工业基础实际制造这种装置时，每次供应许多相互连接的基板2，各LED芯片4分别装配在基板上，并利用各条金导线5进行连线。此后以连续隆脊的形式预制各个铸型部分6，并借助于切割器进行切割，以便制造单个的装置(参见表示传统发光二极管的图7)。
这样，在利用切割器制造具有选定外形结构的单个发光二极管1时，每个基板上带有基本上呈直角的平行六面体的铸型部分6，铸型部分6有一对相对置安排的边，其长度大致和所述基板2的宽度相等，铸型部分6的另一对相对置安排的边具有选定的和预定的长度。
对于本发明来说，应注意到以下事实，即铸型部分6和基板2的剥离大多数发生在安排导电型板3的部位上，为防止这样的剥离发生，尽量给与导电型板合适的形状，而给与导电型板合适形状的关键应集中在和基板2相接合的铸型部分6的边上。
按照本发明，铸型部分6的两边6a(下面称作平行边6a)连续平行于分别设置端子部分3a的两基板边，该两平行边6a的两端部E处至少有0.1mm直接接合基板2，而所述平行边6a的其余中央部分连接导电型板3。
更具体地说，所述端子部分3a的两侧面变窄。通过这种方法，基板2两侧面因此显露至少0.1mm，于是安装部分3b和接线部分3c都由于宽度减小而使各自的末端延长。这样，在安装部分3b装配LED芯片4以后，设置铸型部分6时，铸型部分6的平行边6a的侧端部E就直接与基板2接合。
另方面，铸型部分6的其余两边6b(下面称作垂直边6b)，相对分别设置端子部分3a的两基板边连续垂直，该两垂直边6b全部与基板直接连接。换句话说，导电型板3在垂直边6b上没有露出来。
支持上述设计的基础是寻找到由一系列实验结果所获得的数据，这些实验将在下面介绍，实验结果表明，直接与基板2接合的铸型部分6的平行边6a和垂直边6b越长，则剥离的阻力越大，当平行边6a和垂直边6b的角部直接与基板2接合时，剥离的阻力显著增加。
实验中，相对于具有上述构形的本发明发光二极管1中的铸型部分垂直边6b施加垂直力，用以观察基板2和铸型部分之间装置的抗剥离强度。实验证实，施加1.5公斤左右的力，比传统装置(图5和图6)的抗剥离强度提高50％。换句话说，本发明的发光二极管可有效地避免出现在切割作业时产生的剥离现象。
图3显示一个线图，它说明在热循环试验中，本发明的发光二极管1和相比较的传统装置(图5和图6)的发光二极管的性能，线图中参考号T标示的曲线是本发明发光二极管的剥离频率曲线，而线图中参考号C标示的是传统装置的剥离频率曲线。
试验采用多个试样装置，一个循环包括预热(150℃，2分钟)和正常加热(240℃，5秒)，它代表热条件，在这样的热条件下，将发光二极管1固定到电路基板上重复5次，每个循环都要观察产生剥离的数量。
对照剥离频率曲线C的传统装置试样，在第一个循环中，有10％稍多一点的试样产生剥离，但在第2，3，4，和5循环中，试样剥离百分数分别等于60％，82％，90％和95％，由此说明在第5循环中接近全部试样都发生剥离。
与上述情况相反，发明的装置试样在第3循环以前实际上不产生剥离，只在第4循环中仅有11％产生剥离，第5循环中剥离百分数很小为25％。这样，当将发光二极管固定到电路基板上时，本发明与传统装置比较，防止产生剥离的效果是很显著的。
上述试验特别值得注意的是第三循环以前根本不产生剥离，这一事实说明剥离频率惊奇地减少。当把包括发光二极管1的许多电路元件固定到电路基板上时，本发明发光二极管部件的抗剥离性能，从电路基板可承受多个热循环的观点来看是非常重要的。
因此，如果通过选择合适的工序固定本发明发光二极管1，制作本发明发光二极管使其承受3个或更少的热循环，则基板2和铸型部分6之间将不曾产生剥离，于是减少LED芯片的偶然事故，例如通过剥离区侵入水分和异物的现象可完全消除。
图4表示本发明的另一实施例，该实施例中，安装部分3b和接线部分3c直接连接各端子部分3a的时候，一个端子部分3a和安装部分3b以及另一端子部分3a和接线部分3c分别通过窄小的过渡线部分3d进行连接，该过渡线部分被所述铸型部分6的平行边6a交叉。在这个实施例中，如同前一个实施例一样，垂直边6b不与导电型板相交叉。
采用上述第二实施例的结构，本发明人进一步证实实验的结论，即加长平行边6a和基板2直接连接的部分，从而更加减小剥离的危险。如果曾发生过这种剥离，因为该剥离仅只沿着窄小的过渡线部分3a上产生，所以进入铸型部分内部的水分和异物的危险减小，对LED芯片的损害也小。
如上所述，与本发明表面安装型发光二极管基板相接合的铸型部分的边中，连续平行于安设各端部分处的基板边的两个边，直接接合基板至少0.1mm，其余部分接合导电型板，而相对垂直于安设各端子部分处的基板边的另外两个边，则全部与基板直接接合。采用这种结构，发光二极管的机械的和热的阻力较好，减小基板和铸型部分之间的剥离，消除了通过表面安装型发光二极管装置剥离部分使水分和异物侵入的可能性，从而提高装置的可靠性。
本发明表面安装型发光二极管的一个端子部分和相应的接线部分，以及另一个端子部分和安装部分通过窄小的过渡线部分进行连接，采用这种方式，使连续平行于分别安设各端子部分的所送基板边的铸型部分两个边，和所述过渡线部分交叉，则进一步加大剥离阻力，以使发光二极管工作更加可靠。

Claims (2)

1、一种表面安装型发光二极管，其构成是在基板上安装LED芯片，基板具有分别安排在导电型板两对置边的一对端子部分，以及安排在中央的安装部分和接线部分，安装部分和接线部分各自和所述端子部分保持接触，用导线接线所述LED芯片，然后用基本垂直的平行六面体铸型部分覆盖所述LED芯片和所述导线，其特征是：接合所述铸型部分的边中，连接平行于安排所述各端子部分处的所述基板边的两个边，直接接合所述基板至少0.1mm，其余部分接合所述导电型板，而相对垂直于安排所述各端子部分处的所述的基板边的其他两个边，则全部与基板直接接合。
2、根据权利要求1的表面安装型发光二极管，其特征是：所述端子部分和所述安装部分以及和所述接线部分的连接，分别能过宽度窄小的过渡线部分进行连接，连续平行于设置所述端子部分处的所述基板边的铸型部分的两边，与所述过渡线部分相交叉。
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JP4019474B2 (ja) * 1997-12-01 2007-12-12 松下電器産業株式会社 発光装置の製造方法
JP3895086B2 (ja) * 1999-12-08 2007-03-22 ローム株式会社 チップ型半導体発光装置
JP2003179271A (ja) * 2000-03-17 2003-06-27 Matsushita Electric Ind Co Ltd 半導体発光装置，その製造方法及び面発光装置
US7242033B2 (en) 2002-03-08 2007-07-10 Rohm Co., Ltd. Semiconductor device using LED chip
JP3913138B2 (ja) * 2002-08-16 2007-05-09 ローム株式会社 半導体チップを使用した半導体装置
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JP2004266246A (ja) * 2003-02-12 2004-09-24 Toyoda Gosei Co Ltd 発光装置
JP5290543B2 (ja) * 2007-07-20 2013-09-18 スタンレー電気株式会社 発光装置
JP6262816B2 (ja) * 2011-02-16 2018-01-17 ローム株式会社 Ｌｅｄモジュール
JP7029223B2 (ja) * 2016-07-13 2022-03-03 ローム株式会社 半導体発光装置
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