CN113707593B - 一种碳纤维晶圆搬运手指的制作方法 - Google Patents

一种碳纤维晶圆搬运手指的制作方法 Download PDF

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CN113707593B
CN113707593B CN202110790516.0A CN202110790516A CN113707593B CN 113707593 B CN113707593 B CN 113707593B CN 202110790516 A CN202110790516 A CN 202110790516A CN 113707593 B CN113707593 B CN 113707593B
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carbon fiber
finger
epoxy resin
wafer
wafer carrying
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CN113707593A (zh
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刘良格
张武雷
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Ningbo Fusheng New Material Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B29C43/206—Making multilayered articles by pressing the material between two preformed layers, e.g. deformable layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
    • B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
    • B29C70/342—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation using isostatic pressure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

一种碳纤维晶圆搬运手指的制作方法，它包括上下两块碳纤维薄片，以及两块碳纤维薄片之间的环氧树脂胶膜，在搬运手指的内部开设有真空气道，在碳纤维薄片上开设有与真空气道相通的吸附孔及抽气孔，吸附孔与抽气孔分别位于真空气道的两端。本发明碳纤维晶圆搬运手指装配在晶圆搬运机器人上，直接接触晶圆片，具有厚度薄，平面度优异，真空气道气密性高的优点，能满足晶圆搬运的苛刻要求。

Description

一种碳纤维晶圆搬运手指的制作方法
技术领域
本发明涉及一种用于搬运晶圆的工具，具体的说是一种碳纤维晶圆搬运手指的制作方法。
背景技术
晶圆（英语：Wafer）是半导体晶体圆形片的简称，其为圆柱状半导体晶体的薄切片，用于集成电路制程中作为载体基片，以及制造太阳能电池；由于其形状为圆形，故称为晶圆。
晶圆是最常用的半导体材料，一片晶圆价值在上千至上万美金，因此半导体工厂对于晶圆的搬运机器人提出了极高的要求。传统晶圆搬运机器人上所用的真空搬运手指，一般使用陶瓷、铝、钢等材料。陶瓷材料易碎，难以做到2mm以下厚度，；钢铝材料易生锈，抗疲劳性能差，长期使用易变形。本专利所述的碳纤维晶圆搬运手指装配在晶圆搬运机器人上，直接接触晶圆片，性能要求高，真空性能优异，能满足晶圆搬运的苛刻要求。
中国专利局于2020年2月28日公开的，申请号为201911132866.7的预真空锁腔室的晶圆加载手指，主体结构由陶瓷材质组成。在主体结构的前端部上设置有晶圆点接触部。晶圆点接触部的顶部表面凸出于主体结构的顶部表面之上，使晶圆和晶圆加载手指呈点接触，以减少晶圆的接触面积。晶圆点接触部的组成材料为硬度小于陶瓷材质的软材质，以减少晶圆震动。晶圆点接触部为可拆卸式设置在主体结构上，以方便对晶圆点接触部进行清洗和更换。这用手指就是由陶瓷材质组成，容易碎，还难以做到2mm以下。
发明内容
本发明的目的在于针对上述现有技术的缺陷和不足，为人们提供一种厚度薄，平面度优异，真空气道气密性高的碳纤维晶圆搬运手指及其制作方法。
为实现上述目的本发明所采取的技术方案是：一种碳纤维晶圆搬运手指，它包括上下两块碳纤维薄片，以及两块碳纤维薄片之间的环氧树脂胶膜，在搬运手指的内部开设有真空气道，在碳纤维薄片上开设有与真空气道相通的吸附孔及抽气孔，吸附孔与抽气孔分别位于真空气道的两端。
所述的碳纤维薄片的厚度为0.4毫米。
所述的环氧树脂胶膜的厚度为0.2毫米。
所述的碳纤维薄片的平面度小于0.05微米。
一种碳纤维晶圆搬运手指的制作方法，
步骤1：将碳纤维预浸料成型放入模具中，然后在热压罐高温固化，制得两块厚度为0.4毫米的碳纤维薄片；
步骤2：利用CNC加工中心在两块碳纤维薄片上分别加工出真空气道的上腔和下腔；
步骤3：在两块碳纤维薄片中间插入一片0.2毫米厚度的环氧树脂胶膜，环氧树脂胶膜在真空气道投影位置镂空，两块碳纤维薄片与环氧树脂胶膜组合后内部形成真空气道；将组合后的两块碳纤维薄片与环氧树脂再次进热压罐高温固化，得到一片1毫米厚度的碳纤维手指毛胚；
步骤4：根据图纸在CNC加工中心加工碳纤维手指外形尺寸，固定孔位，吸附孔位、抽气孔位；
步骤5：去除产品毛刺，所有加工面涂覆环氧树脂，放入烤箱在60℃温度下烘干2小时，制得碳纤维晶圆搬运手指。
在步骤1和步骤3在热压罐内高温固化的温度均为200℃，持续时间均为3小时。
本发明碳纤维晶圆搬运手指装配在晶圆搬运机器人上，直接接触晶圆片，具有厚度薄，平面度优异，真空气道气密性高的优点，能满足晶圆搬运的苛刻要求。
附图说明
图1为本发明的结构示意图。
图2为本发明的剖视示意图。
实施方式
如图1、图2所示，本发明为一种碳纤维晶圆搬运手指，它包括上下两块碳纤维薄片3，碳纤维薄片3的厚度为0.4毫米，碳纤维薄片3的平面度小于0.05微米。在两块碳纤维薄片3之间的环氧树脂胶膜6，所述的环氧树脂胶膜6的厚度为0.2毫米。在搬运手指的内部开设有真空气道4，在碳纤维薄片3上开设有与真空气道4相通的吸附孔5及抽气孔2，吸附孔5与抽气孔2分别位于真空气道4的两端。搬运手指的前端与晶圆接触时，吸附孔5被晶圆遮挡，通过抽气孔2抽气，真空气道4产生负压，因此能将晶圆牢牢吸附。在搬运手指上还开设有固定孔1，通过固定孔1可以将搬运手指安装在晶圆搬运机器人上。
一种碳纤维晶圆搬运手指的制作方法，
步骤1：将碳纤维预浸料成型放入模具中，然后在热压罐高温固化，制得两块厚度为0.4毫米的碳纤维薄片3。高温固化的温度为200℃，持续时间为3小时。
步骤2：利用CNC加工中心在两块碳纤维薄片3上分别加工出真空气道4的上腔4.1和下腔4.2。
步骤3：在两块碳纤维薄片3中间插入一片0.2毫米厚度的环氧树脂胶膜6，环氧树脂胶膜6在真空气道4投影位置镂空4.3，两块碳纤维薄片3与环氧树脂胶膜6组合后内部的上腔4.1、下腔4.2和镂空4.3闭合，形成真空气道4。将组合后的两块碳纤维薄片3与环氧树脂再次进热压罐高温固化，得到一片1毫米厚度的碳纤维手指毛胚。高温固化的温度为200℃，持续时间为3小时。
步骤4：根据图纸在CNC加工中心加工碳纤维手指外形尺寸，固定孔位，吸附孔位、抽气孔位。
步骤5：去除产品毛刺，所有加工面涂覆环氧树脂，放入烤箱在60℃温度下烘干2小时，制得碳纤维晶圆搬运手指。
本发明碳纤维晶圆搬运手指装配在晶圆搬运机器人上，直接接触晶圆片，具有厚度薄，平面度优异，真空气道4气密性高的优点，能满足晶圆搬运的苛刻要求。

Claims (2)

1.一种碳纤维晶圆搬运手指的制作方法，其特征在于，
步骤1：将碳纤维预浸料成型放入模具中，然后在热压罐高温固化，制得两块厚度为0.4毫米的碳纤维薄片；
步骤2：利用CNC加工中心在两块碳纤维薄片上分别加工出真空气道的上腔和下腔；
步骤3：在两块碳纤维薄片中间插入一片0.2毫米厚度的环氧树脂胶膜，环氧树脂胶膜在真空气道投影位置镂空，两块碳纤维薄片与环氧树脂胶膜组合后内部形成真空气道；将组合后的两块碳纤维薄片与环氧树脂再次进热压罐高温固化，得到一片1毫米厚度的碳纤维手指毛胚；
步骤4：根据图纸在CNC加工中心加工碳纤维手指外形尺寸，固定孔位，吸附孔位、抽气孔位；
步骤5：去除产品毛刺，所有加工面涂覆环氧树脂，放入烤箱在60℃温度下烘干2小时，制得碳纤维晶圆搬运手指。
2.根据权利要求1所述的碳纤维晶圆搬运手指的制作方法，其特征在于在步骤1和步骤3在热压罐内高温固化的温度均为200℃，持续时间均为3小时。
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002292591A (ja) * 2001-03-29 2002-10-08 Nippon Oil Corp ロボットハンド部材の製造方法
KR20030004495A (ko) * 2001-07-05 2003-01-15 박성배 복합재료 로보트 암
TWI246149B (en) * 2004-11-10 2005-12-21 Win Semiconductors Corp Thin wafer carrying device and the method thereof
JP2006289591A (ja) * 2005-04-14 2006-10-26 Sankyo Seisakusho:Kk 配管埋め込み型のロボットハンドおよびその成形方法
KR100746135B1 (ko) * 2006-05-16 2007-08-03 (주)넥스컴스 Ｌｃｄ기판 이송용 로봇팔
CN201122586Y (zh) * 2007-06-12 2008-09-24 新日本无线株式会社 真空镊子用吸附片和真空镊子
KR20090070521A (ko) * 2007-12-27 2009-07-01 오에프티 주식회사 스피너 시스템의 트랜스퍼 로봇, 그 이송 핸드 및 그 진공인가 장치
CN212331075U (zh) * 2020-06-29 2021-01-12 昀智科技（北京）有限责任公司 真空吸附式叉形末端夹持器
KR20210034337A (ko) * 2019-09-20 2021-03-30 세메스 주식회사 기판 반송 로봇
CN213583735U (zh) * 2020-12-15 2021-06-29 宁波丽成复合材料制品有限公司 一种半导体晶元真空吸附搬运碳纤维手指

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002292591A (ja) * 2001-03-29 2002-10-08 Nippon Oil Corp ロボットハンド部材の製造方法
KR20030004495A (ko) * 2001-07-05 2003-01-15 박성배 복합재료 로보트 암
TWI246149B (en) * 2004-11-10 2005-12-21 Win Semiconductors Corp Thin wafer carrying device and the method thereof
JP2006289591A (ja) * 2005-04-14 2006-10-26 Sankyo Seisakusho:Kk 配管埋め込み型のロボットハンドおよびその成形方法
KR100746135B1 (ko) * 2006-05-16 2007-08-03 (주)넥스컴스 Ｌｃｄ기판 이송용 로봇팔
CN201122586Y (zh) * 2007-06-12 2008-09-24 新日本无线株式会社 真空镊子用吸附片和真空镊子
KR20090070521A (ko) * 2007-12-27 2009-07-01 오에프티 주식회사 스피너 시스템의 트랜스퍼 로봇, 그 이송 핸드 및 그 진공인가 장치
KR20210034337A (ko) * 2019-09-20 2021-03-30 세메스 주식회사 기판 반송 로봇
CN212331075U (zh) * 2020-06-29 2021-01-12 昀智科技（北京）有限责任公司 真空吸附式叉形末端夹持器
CN213583735U (zh) * 2020-12-15 2021-06-29 宁波丽成复合材料制品有限公司 一种半导体晶元真空吸附搬运碳纤维手指

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