CN113631506A - 块状氮化硼粒子、导热树脂组合物和散热构件 - Google Patents

块状氮化硼粒子、导热树脂组合物和散热构件 Download PDF

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Publication number
CN113631506A
CN113631506A CN202080024038.6A CN202080024038A CN113631506A CN 113631506 A CN113631506 A CN 113631506A CN 202080024038 A CN202080024038 A CN 202080024038A CN 113631506 A CN113631506 A CN 113631506A
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boron nitride
nitride particles
bulk
heat
bulk boron
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Chinese (zh)
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竹田豪
田中孝明
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Denka Co Ltd
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Denka Co Ltd
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    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0645—Preparation by carboreductive nitridation
    • C—CHEMISTRY; METALLURGY
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    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2006/90—Other properties not specified above
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

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  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080024038.6A 2019-03-27 2020-03-25 块状氮化硼粒子、导热树脂组合物和散热构件 Pending CN113631506A (zh)

Applications Claiming Priority (3)

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JP2019-060286 2019-03-27
JP2019060286 2019-03-27
PCT/JP2020/013385 WO2020196643A1 (ja) 2019-03-27 2020-03-25 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材

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US (1) US20220154059A1 (https=)
JP (1) JP7145315B2 (https=)
KR (1) KR20210142639A (https=)
CN (1) CN113631506A (https=)
TW (1) TWI838500B (https=)
WO (1) WO2020196643A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
CN114616211A (zh) * 2019-11-21 2022-06-10 电化株式会社 调整氮化硼粉末的粒子压碎强度的方法、氮化硼粉末及其制造方法
US20230017856A1 (en) * 2019-12-17 2023-01-19 Denka Company Limited Resin sheet and manufacturing method thereof
US20240026198A1 (en) * 2021-01-06 2024-01-25 Denka Company Limited Boron nitride powder, heat dissipation sheet, and method for producing heat dissipation sheet
US20240052226A1 (en) * 2021-01-06 2024-02-15 Denka Company Limited Aggregated boron nitride particles, boron nitride powder, heat-conductive resin composition, and heat-dissipation sheet
JP7580273B2 (ja) * 2021-01-06 2024-11-11 デンカ株式会社 窒化ホウ素粉末、熱伝導性樹脂組成物、放熱シート及び電子部品構造体
CN117098721A (zh) * 2021-03-25 2023-11-21 电化株式会社 氮化硼粉末及树脂组合物
US20240158230A1 (en) * 2021-03-25 2024-05-16 Denka Company Limited Boron nitride particles and method for producing same, and resin composition
JP7606926B2 (ja) * 2021-05-20 2024-12-26 デンカ株式会社 窒化ホウ素粉末、及び窒化ホウ素粉末の製造方法、並びに、樹脂組成物
CN117545712B (zh) * 2021-06-16 2026-04-24 电化株式会社 六方晶氮化硼粉末及其制造方法以及化妆品及其制造方法
JP7301920B2 (ja) * 2021-08-31 2023-07-03 デンカ株式会社 特定の窒化ホウ素粒子を含む粉末、放熱シート及び放熱シートの製造方法
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (3)

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CN106029561A (zh) * 2014-02-05 2016-10-12 三菱化学株式会社 氮化硼凝集颗粒、氮化硼凝集颗粒的制造方法、含该氮化硼凝集颗粒的树脂组合物、成型体、和片
JP2017036415A (ja) * 2015-08-12 2017-02-16 三菱化学株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP2017165609A (ja) * 2016-03-15 2017-09-21 デンカ株式会社 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途

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JP3461651B2 (ja) 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
JP3568401B2 (ja) 1998-11-18 2004-09-22 電気化学工業株式会社 高熱伝導性シート
US7494635B2 (en) 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
JP5969314B2 (ja) 2012-08-22 2016-08-17 デンカ株式会社 窒化ホウ素粉末及びその用途
JP2015224264A (ja) 2014-05-26 2015-12-14 株式会社Ｂｎ機能設計 樹脂添加用の複合粒子
JP6612584B2 (ja) 2015-10-28 2019-11-27 デンカ株式会社 エポキシ樹脂組成物、エポキシ樹脂シート、およびそれを用いた金属ベース回路基板
JP6720014B2 (ja) * 2016-08-03 2020-07-08 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及び樹脂組成物とその用途
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
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CN106029561A (zh) * 2014-02-05 2016-10-12 三菱化学株式会社 氮化硼凝集颗粒、氮化硼凝集颗粒的制造方法、含该氮化硼凝集颗粒的树脂组合物、成型体、和片
JP2017036415A (ja) * 2015-08-12 2017-02-16 三菱化学株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP2017165609A (ja) * 2016-03-15 2017-09-21 デンカ株式会社 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途

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WO2020196643A1 (ja) 2020-10-01
TW202102432A (zh) 2021-01-16
JP7145315B2 (ja) 2022-09-30
TWI838500B (zh) 2024-04-11
US20220154059A1 (en) 2022-05-19
KR20210142639A (ko) 2021-11-25

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