KR20210142639A - 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재 - Google Patents

괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재 Download PDF

Info

Publication number
KR20210142639A
KR20210142639A KR1020217030476A KR20217030476A KR20210142639A KR 20210142639 A KR20210142639 A KR 20210142639A KR 1020217030476 A KR1020217030476 A KR 1020217030476A KR 20217030476 A KR20217030476 A KR 20217030476A KR 20210142639 A KR20210142639 A KR 20210142639A
Authority
KR
South Korea
Prior art keywords
boron nitride
bulk
heat
bulk boron
nitride particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020217030476A
Other languages
English (en)
Korean (ko)
Inventor
고 다케다
다카아키 다나카
Original Assignee
덴카 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72608556&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20210142639(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 덴카 주식회사 filed Critical 덴카 주식회사
Publication of KR20210142639A publication Critical patent/KR20210142639A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0645—Preparation by carboreductive nitridation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/76—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by a space-group or by other symmetry indications
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020217030476A 2019-03-27 2020-03-25 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재 Ceased KR20210142639A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019060286 2019-03-27
JPJP-P-2019-060286 2019-03-27
PCT/JP2020/013385 WO2020196643A1 (ja) 2019-03-27 2020-03-25 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材

Publications (1)

Publication Number Publication Date
KR20210142639A true KR20210142639A (ko) 2021-11-25

Family

ID=72608556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217030476A Ceased KR20210142639A (ko) 2019-03-27 2020-03-25 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재

Country Status (6)

Country Link
US (1) US20220154059A1 (https=)
JP (1) JP7145315B2 (https=)
KR (1) KR20210142639A (https=)
CN (1) CN113631506A (https=)
TW (1) TWI838500B (https=)
WO (1) WO2020196643A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
CN114616211A (zh) * 2019-11-21 2022-06-10 电化株式会社 调整氮化硼粉末的粒子压碎强度的方法、氮化硼粉末及其制造方法
US20230017856A1 (en) * 2019-12-17 2023-01-19 Denka Company Limited Resin sheet and manufacturing method thereof
US20240026198A1 (en) * 2021-01-06 2024-01-25 Denka Company Limited Boron nitride powder, heat dissipation sheet, and method for producing heat dissipation sheet
US20240052226A1 (en) * 2021-01-06 2024-02-15 Denka Company Limited Aggregated boron nitride particles, boron nitride powder, heat-conductive resin composition, and heat-dissipation sheet
JP7580273B2 (ja) * 2021-01-06 2024-11-11 デンカ株式会社 窒化ホウ素粉末、熱伝導性樹脂組成物、放熱シート及び電子部品構造体
CN117098721A (zh) * 2021-03-25 2023-11-21 电化株式会社 氮化硼粉末及树脂组合物
US20240158230A1 (en) * 2021-03-25 2024-05-16 Denka Company Limited Boron nitride particles and method for producing same, and resin composition
JP7606926B2 (ja) * 2021-05-20 2024-12-26 デンカ株式会社 窒化ホウ素粉末、及び窒化ホウ素粉末の製造方法、並びに、樹脂組成物
CN117545712B (zh) * 2021-06-16 2026-04-24 电化株式会社 六方晶氮化硼粉末及其制造方法以及化妆品及其制造方法
JP7301920B2 (ja) * 2021-08-31 2023-07-03 デンカ株式会社 特定の窒化ホウ素粒子を含む粉末、放熱シート及び放熱シートの製造方法
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09202663A (ja) 1996-01-24 1997-08-05 Denki Kagaku Kogyo Kk ほう酸メラミン粒子とその製造方法及び用途、並びに六方晶窒化ほう素粉末の製造方法
JP2000154265A (ja) 1998-11-18 2000-06-06 Denki Kagaku Kogyo Kk 高熱伝導性シート
JP2007502770A (ja) 2003-08-21 2007-02-15 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 窒化ホウ素凝集粉末
JP2011098882A (ja) 2009-10-09 2011-05-19 Mizushima Ferroalloy Co Ltd 六方晶窒化ホウ素粉末およびその製造方法
JP2014040341A (ja) 2012-08-22 2014-03-06 Denki Kagaku Kogyo Kk 窒化ホウ素粉末及びその用途

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6493226B2 (ja) 2014-02-05 2019-04-03 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
JP2015224264A (ja) 2014-05-26 2015-12-14 株式会社Ｂｎ機能設計 樹脂添加用の複合粒子
JP6786778B2 (ja) * 2015-08-12 2020-11-18 三菱ケミカル株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP6612584B2 (ja) 2015-10-28 2019-11-27 デンカ株式会社 エポキシ樹脂組成物、エポキシ樹脂シート、およびそれを用いた金属ベース回路基板
JP6704271B2 (ja) * 2016-03-15 2020-06-03 デンカ株式会社 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途
JP6720014B2 (ja) * 2016-08-03 2020-07-08 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及び樹脂組成物とその用途
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
US11577957B2 (en) * 2016-12-28 2023-02-14 Showa Denko K.K. Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09202663A (ja) 1996-01-24 1997-08-05 Denki Kagaku Kogyo Kk ほう酸メラミン粒子とその製造方法及び用途、並びに六方晶窒化ほう素粉末の製造方法
JP2000154265A (ja) 1998-11-18 2000-06-06 Denki Kagaku Kogyo Kk 高熱伝導性シート
JP2007502770A (ja) 2003-08-21 2007-02-15 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 窒化ホウ素凝集粉末
JP2011098882A (ja) 2009-10-09 2011-05-19 Mizushima Ferroalloy Co Ltd 六方晶窒化ホウ素粉末およびその製造方法
JP2014040341A (ja) 2012-08-22 2014-03-06 Denki Kagaku Kogyo Kk 窒化ホウ素粉末及びその用途

Also Published As

Publication number Publication date
JPWO2020196643A1 (https=) 2020-10-01
WO2020196643A1 (ja) 2020-10-01
TW202102432A (zh) 2021-01-16
JP7145315B2 (ja) 2022-09-30
TWI838500B (zh) 2024-04-11
CN113631506A (zh) 2021-11-09
US20220154059A1 (en) 2022-05-19

Similar Documents

Publication Publication Date Title
KR20210142639A (ko) 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재
TWI763709B (zh) 氮化硼塊狀粒子、其製造方法及使用其之熱傳導樹脂組成物
CN112334408B (zh) 块状氮化硼粒子、氮化硼粉末、氮化硼粉末的制造方法、树脂组合物、及散热构件
KR102619752B1 (ko) 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
TWI598291B (zh) Hexagonal boron nitride powder, a method for producing the same, a resin composition and a resin sheet
JP7101871B2 (ja) 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
EP4148091B1 (en) Heat-conductive resin composition and heat dissipation sheet
KR20230156792A (ko) 질화붕소 분말 및 수지 조성물
EP4149226B1 (en) Heat dissipation sheet
JP7124249B1 (ja) 放熱シート及び放熱シートの製造方法
CN120957944A (zh) 氮化硅粉末及使用该氮化硅粉末的树脂组合物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20251114

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2021 7030476

Appeal request date: 20250625

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2025101001128

V15 Decision substituted

Free format text: ST27 STATUS EVENT CODE: A-3-3-V10-V15-CRT-PJ1301 (AS PROVIDED BY THE NATIONAL OFFICE); DECISION IDENTIFIER: 2025101001128; DECISION AUTHORITY: OFFICE APPEAL BOARD, APPEAL KIND CATEGORY : APPEAL AGAINST DECISION TO DECLINE REFUSAL