CN113614937A - 带发电功能的半导体集成电路装置 - Google Patents

带发电功能的半导体集成电路装置 Download PDF

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Publication number
CN113614937A
CN113614937A CN202080020554.1A CN202080020554A CN113614937A CN 113614937 A CN113614937 A CN 113614937A CN 202080020554 A CN202080020554 A CN 202080020554A CN 113614937 A CN113614937 A CN 113614937A
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CN
China
Prior art keywords
semiconductor integrated
integrated circuit
electrode portion
thermoelectric element
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202080020554.1A
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English (en)
Chinese (zh)
Inventor
后藤博史
坂田稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GCE Institute Co Ltd
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GCE Institute Co Ltd
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Filing date
Publication date
Application filed by GCE Institute Co Ltd filed Critical GCE Institute Co Ltd
Publication of CN113614937A publication Critical patent/CN113614937A/zh
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J45/00—Discharge tubes functioning as thermionic generators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080020554.1A 2019-03-12 2020-03-02 带发电功能的半导体集成电路装置 Withdrawn CN113614937A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019044971 2019-03-12
JP2019-044971 2019-03-12
PCT/JP2020/008579 WO2020184235A1 (ja) 2019-03-12 2020-03-02 発電機能付半導体集積回路装置

Publications (1)

Publication Number Publication Date
CN113614937A true CN113614937A (zh) 2021-11-05

Family

ID=72427828

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080020554.1A Withdrawn CN113614937A (zh) 2019-03-12 2020-03-02 带发电功能的半导体集成电路装置

Country Status (7)

Country Link
US (1) US20220149022A1 (https=)
EP (1) EP3940800A4 (https=)
JP (1) JPWO2020184235A1 (https=)
KR (1) KR20210136077A (https=)
CN (1) CN113614937A (https=)
CA (1) CA3131406A1 (https=)
WO (1) WO2020184235A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10559864B2 (en) 2014-02-13 2020-02-11 Birmingham Technologies, Inc. Nanofluid contact potential difference battery
JPWO2020071535A1 (ja) * 2018-10-04 2021-10-07 株式会社Ｇｃｅインスティチュート 発電機能付発光装置、照明装置、及び表示装置
US11124864B2 (en) 2019-05-20 2021-09-21 Birmingham Technologies, Inc. Method of fabricating nano-structures with engineered nano-scale electrospray depositions
US11649525B2 (en) 2020-05-01 2023-05-16 Birmingham Technologies, Inc. Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
US12527220B2 (en) 2020-09-30 2026-01-13 Nil Technology Aps Manufacture of thermoelectric generators and other devices that include metastructures
US11417506B1 (en) 2020-10-15 2022-08-16 Birmingham Technologies, Inc. Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods
KR102894753B1 (ko) * 2021-05-06 2025-12-02 삼성전자주식회사 반도체 패키지
US11616186B1 (en) 2021-06-28 2023-03-28 Birmingham Technologies, Inc. Thermal-transfer apparatus including thermionic devices, and related methods
JP7518395B2 (ja) * 2021-12-20 2024-07-18 日亜化学工業株式会社 回路基板、発光装置及びそれらの製造方法
US20240243545A1 (en) * 2023-01-17 2024-07-18 Lawrence Livermore National Security, Llc Systems and methods for cooling high power devices
US12446468B2 (en) * 2024-03-18 2025-10-14 William N Carr Integrated battery comprising a secondary battery with charge maintained by a semiconductor battery

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130192655A1 (en) * 2007-08-29 2013-08-01 Texas Instruments Incorporated Thermoelectric device embedded in a printed circuit board
CN104200864A (zh) * 2014-08-25 2014-12-10 厦门大学 一种基于宽禁带半导体纳米管阵列薄膜结构的同位素电池
US20150229013A1 (en) * 2014-02-13 2015-08-13 Joseph G. Birmingham Nanofluid contact potential difference battery
CN106233454A (zh) * 2014-05-01 2016-12-14 松下知识产权经营株式会社 半导体装置及半导体模组
JP2018019042A (ja) * 2016-07-29 2018-02-01 株式会社Ｇｃｅインスティチュート 熱電素子及び熱電素子の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113833A (en) 1979-02-21 1980-09-02 Kobe Steel Ltd Treating method for cast material by hot hydrostatic press
JPH06147901A (ja) 1992-11-02 1994-05-27 Murata Mfg Co Ltd 圧電振動ジャイロ
JP3252902B2 (ja) * 1998-12-21 2002-02-04 日本電気株式会社 温度制御ユニット
JP2001308395A (ja) * 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd 電子機器における熱エネルギー再生装置
JP5397414B2 (ja) * 2011-05-26 2014-01-22 株式会社デンソー 熱電子発電素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130192655A1 (en) * 2007-08-29 2013-08-01 Texas Instruments Incorporated Thermoelectric device embedded in a printed circuit board
US20150229013A1 (en) * 2014-02-13 2015-08-13 Joseph G. Birmingham Nanofluid contact potential difference battery
CN106233454A (zh) * 2014-05-01 2016-12-14 松下知识产权经营株式会社 半导体装置及半导体模组
CN104200864A (zh) * 2014-08-25 2014-12-10 厦门大学 一种基于宽禁带半导体纳米管阵列薄膜结构的同位素电池
JP2018019042A (ja) * 2016-07-29 2018-02-01 株式会社Ｇｃｅインスティチュート 熱電素子及び熱電素子の製造方法

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Publication number Publication date
EP3940800A1 (en) 2022-01-19
EP3940800A4 (en) 2022-12-21
CA3131406A1 (en) 2020-09-17
WO2020184235A1 (ja) 2020-09-17
US20220149022A1 (en) 2022-05-12
KR20210136077A (ko) 2021-11-16
JPWO2020184235A1 (https=) 2020-09-17

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